TW441052B - Molding device and manufacturing method of flexible substrate packaging structure - Google Patents

Molding device and manufacturing method of flexible substrate packaging structure Download PDF

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Publication number
TW441052B
TW441052B TW088121727A TW88121727A TW441052B TW 441052 B TW441052 B TW 441052B TW 088121727 A TW088121727 A TW 088121727A TW 88121727 A TW88121727 A TW 88121727A TW 441052 B TW441052 B TW 441052B
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Taiwan
Prior art keywords
substrate
flexible substrate
mold
array
package structure
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TW088121727A
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Chinese (zh)
Inventor
Shih-Chang Lee
Gwo-Liang Weng
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Advanced Semiconductor Eng
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Publication of TW441052B publication Critical patent/TW441052B/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/481—Disposition
    • H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/93—Batch processes
    • H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
    • H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/30—Technical effects
    • H01L2924/35—Mechanical effects
    • H01L2924/351—Thermal stress
    • H01L2924/3511—Warping

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  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)

Abstract

A molding device of flexible substrate packaging structure is disclosed, which comprises several bottles and two flexible substrates disposed on both sides of the bottle, a plurality of chip array units are arranged on the upper surface of the substrate. A plurality of gates extend from both sides of bottle to the side edge of the substrate, the gate openings are connected with the upper mold of the substrate. The feature of the present invention is that there is a first connection way to connect the plural mold cavities on one side of the substrate in front of the gate openings of the molding device, and a second connection way to connect the plural mold cavities on the other side of the substrate. Therefore, after the molded semi-finished of the flexible substrate packaging structure is taken out from the upper mold, both sides of each of the array unit molding body are mutually connected with the first connection part and the second connection part, so that each array unit molding body forms an integrated structure, thereby strengthens the intensity of the whole molded semi-finished product.

Description

五、發明說明（1) 發明領域： 製 之鑄模裝置及製造方法 先前技術： 本發明係有關"；一裡干等菔封裝構造之鑄模裝置及 =方法’特別言之’係有關於一種可撓性基板封裝造 鑄模裝置及製造方法。 隨著更輕更複雜電子裝置需求的日趨強烈，晶片的 度及複雜性相對越來越高，因此需要更高之封裝效率 (packaging efficiency)。於是半導體晶片封裝業界發展 出可撓性基板（flexible substrate)球格陣列（Ball GridV. Description of the invention (1) Field of the invention: Mold device and manufacturing method of the prior art: The present invention is related to the "molding device and method of packaging structure" and "method", in particular, it relates to a kind of Flexible substrate package mold making device and manufacturing method. With the increasing demand for lighter and more complex electronic devices, the degree and complexity of the chip are relatively higher and higher, so higher packaging efficiency is required. Therefore, the semiconductor chip packaging industry has developed a flexible substrate (ball grid array).

Array/封裝技術’以符合其需求e ii圖所示係為目前習用可撓性基板（f lexible substrate)球格陣列（BGA)半導體封裝構造之鑄模裝置， 其包含數個罐2及兩條可撓性基板1〇分別置於該罐2之兩 側’基板1 0分別承載複數個陣列排列之晶片1 2 "該每一晶 片1 2係分別利用複數條連接線與該基板1 〇電性連接。澆道 3分別自罐2之兩側延伸至基板1 〇之角邊緣，由澆道口4與 基板10上之上模具相連接。藉由柱塞15壓擠所產生之壓 力，封膠塑料14從罐2中經由澆道3流向澆道口4進入上模 具11之模穴内。當封膠塑料充滿模穴後，柱塞15保持靜止 且持續一預定時間直至封膠塑料硬化。然後’柱塞1 5上升 且將上模1 1打開，去澆道（degating)而取出模製半成品》 模製丰成品自上模取出後，需再經後硬化（P〇st —cure)， .打印（marking) ’ 植球（ball mounting)及切割（sawing)等 多道加工製程，而完成可撓性基板球格陣列（BGA)半導體Array / Packaging Technology 'meets its needs. Figure ii shows the mold device for the conventional conventional flexible substrate ball grid array (BGA) semiconductor package structure. It includes several cans 2 and two cans. The flexible substrate 10 is placed on each side of the can 2 respectively. The substrate 10 carries a plurality of wafers 1 2 arranged in an array, respectively. Each of the wafers 12 uses a plurality of connecting wires to connect to the substrate 1 electrically. connection. The runner 3 extends from both sides of the tank 2 to the corner edge of the substrate 10, and is connected to the upper mold on the substrate 10 by the runner opening 4. By the pressure generated by the pressing of the plunger 15, the sealant plastic 14 flows from the tank 2 through the runner 3 to the runner opening 4 and enters the cavity of the upper mold 11. After the sealing compound is filled in the cavity, the plunger 15 remains stationary for a predetermined time until the sealing compound hardens. Then the 'plunger 15 rises and opens the upper mold 11 to go to the degating to take out the molded semi-finished product.' After the molded product is taken out from the upper mold, it needs to be post-cured (P0st-cure) . Printing (balling) and ball mounting (sawing) and other processing processes to complete the flexible substrate ball grid array (BGA) semiconductor

第4頁 五、發明說明¢2) 射裝構造。 請一參照第2a圖，其顯示模製半成品自上模^出後之 該晶片12於基板10上構成複數個陣列單元，分 別 視圖 由一陣列單元封膠體5包覆，如第2a圖所示，四個陣列單 元封膠體5個別形成於基板10上’且每一陣列單元封膠體5 係彼此個別獨立，並無相互連接。請參照第2 b圖，當模製 半成品分別進行硬化（P〇st-Cure)，打印（marking)，植球 (ball mounting)及切割（sawing)等加工製程時，通常係 以吸盤7吸取整條模製半成品之陣列單元封膠體5上表面， 以將整條模製半成品從一工作機台移至下一工作及台。然 而因可撓性基板1 〇之厚度相當薄，通常小於〇 21mnj ’其強 度明顯不足以支撐陣列單元封膠體5之重量。當以吸盤7吸 取陣列單元封膠體5上表面時，未被吸盤7吸取陣列單元封 膠體5將因本身重量影響，而使可撓性基板1〇下彎。再 者，如第2c圈所不’當整條模製半成品於工作機台1上移 動時，因可撓性基板10支撐強度不足，易使可撓性基板1〇 部份被榜壓向上翹曲。此等現象皆對後硬化 (post-cure)，打印（marking),植球（baU m〇unting)及 切割（sawing)等製程造成作業及操作不便，而影響各製程 步驟’甚至使陣列單元封膠體5與可撓性基板丨〇剝離 P(peeling)，而損壞晶片12或可撓性基板1〇之佈線 (traces)及其間之連接線，大幅降低產品之製造良率 (yield)。 發明概要：Page 4 V. Description of invention ¢ 2) Shooting structure. Please refer to FIG. 2a, which shows that the wafer 12 after molding the semi-finished product from the upper mold ^ constitutes a plurality of array units on the substrate 10, and each view is covered by an array unit sealing compound 5, as shown in FIG. 2a The four array unit sealing compounds 5 are individually formed on the substrate 10, and each array unit sealing compound 5 is independently independent from each other and is not connected to each other. Please refer to Fig. 2b. When the molded semi-finished products are respectively subjected to processing processes such as hardening (Cost-Cure), printing, ball mounting, and sawing, the suction cup 7 is usually used to absorb the whole. The upper surface of the array unit sealing gel 5 of the strip molding semi-finished product is used to move the entire molding semi-finished product from one work station to the next work station. However, since the thickness of the flexible substrate 10 is relatively thin, it is usually less than 0 21mnj ′ and its strength is obviously insufficient to support the weight of the array unit sealing compound 5. When the upper surface of the array unit sealing gel 5 is sucked by the chuck 7, the array unit sealing gel 5 is not sucked by the chuck 7, and the flexible substrate 10 is bent downward due to the influence of its weight. Furthermore, as described in circle 2c, when the entire molded semi-finished product is moved on the working table 1, because the flexible substrate 10 has insufficient support strength, it is easy for the flexible substrate 10 to be pushed upwards. song. These phenomena all cause post-cure, marking, baU munting, and sawing processes to cause inconveniences to operations and operations, which affects each process step and even seals the array unit. The gel 5 peels P (peeling) from the flexible substrate, thereby damaging the traces of the wafer 12 or the flexible substrate 10 and the connecting wires therebetween, and greatly reducing the yield of the product. Summary of the invention:

第5頁 441052 五、發明說明（3) " ' 本發明之主要目的係提供一種可撓性基板封裝構造之 鎮模，置及製造方法，以強化整條模製半成品之強度，使 模製半成品自上模取出後之後，於後硬化（p〇st_cure)， 打印（marking) ’ 植球（ball mounting)及切割（sawing)等 製程’易於操作加工。 本發明之次要目的係提供一種可撓性基板封裝構造之 鑄模裝置及製造方法，避免於製程中封膠塑料與可撓性基 板剝離（peel ing)，而損壞晶片或可撓性基板之佈線 (traces)及其間之連接線，以提升產品之製造良率 (yield)。Page 5 441052 V. Description of the invention (3) " 'The main purpose of the present invention is to provide a mold, setting and manufacturing method for a flexible substrate packaging structure, so as to strengthen the strength of the entire molded semi-finished product and make the molding After the semi-finished product is taken out from the upper mold, post-cure, marking, 'ball mounting, and sawing' processes are easy to handle and process. A secondary object of the present invention is to provide a mold device and a manufacturing method for a flexible substrate package structure, so as to avoid the peeling of the sealing plastic and the flexible substrate during the manufacturing process, thereby damaging the wiring of the wafer or the flexible substrate. (traces) and the connecting lines between them to improve the yield of the product.

根據本發明之可撓性基板封裝構造之鑄模裝置，其包 含數個罐及兩條可撓性基板分別置於該罐之兩側，複數個 晶片陣列單元排列於基板上表面。複數洗道分別自罐之兩 侧延伸至基板之側邊緣，由澆道口與基板上之上模具相連 接。藉由柱塞壓擠所產生之壓力，封膠塑料從罐中經由漁 道流向洗道口進入上模具之模穴内β根據本發明，該鎮模 裝置於澆道口前具有一第一連通道將該複數模穴於基板一 側相連接’及一第二連通道將該複數模六於基板另一側相 連接。因此’本發明之可撓性基板封裝構造之模製半成品 自上模取出後之後’可撓性基板上之每一陣列單元封勝體 之兩侧分別由第一連接件及第二連接件相互連接，使每一 陣列單元封膠體形成一體之結構，因而強化整條模製半成 品之強度。根據本發明之模製半成品，其自上模取出後之 後，於後硬化（post-cure) ’打印（marking)，植球（baUAccording to the mold device of the flexible substrate packaging structure of the present invention, the mold device includes a plurality of cans and two flexible substrates placed on both sides of the can, respectively, and a plurality of wafer array units are arranged on the upper surface of the substrate. The plurality of washing channels respectively extend from the two sides of the tank to the side edges of the substrate, and the sprue mouth is connected with the upper mold on the substrate. By the pressure generated by the squeezing of the plunger, the sealing plastic flows from the tank through the fishing channel to the washing channel and enters the cavity of the upper mold. According to the present invention, the ballast device has a first continuous channel The complex mold cavity is connected to one side of the substrate, and a second connecting channel connects the complex modulus six to the other side of the substrate. Therefore, 'after the molded semi-finished product of the flexible substrate package structure of the present invention is taken out from the upper mold', both sides of each array unit sealing body on the flexible substrate are mutually connected by the first connecting member and the second connecting member, respectively. Connection, so that each array unit sealing gel forms an integrated structure, thereby strengthening the strength of the entire molded semi-finished product. According to the molded semi-finished product of the present invention, after being taken out from the upper mold, it is post-cure 'marked, and baU

441052441052

punting)及切割（sawing)箄製程，皆易於操作加工。此 :卜二，：撓性基板上之每一陣列單元封膠體之兩側分別由 第一連接件及第二連接件相互連接，因而強化整條模製半 成品之強度，而可避免封膠塑料與可撓性基板剝離 (P^Ung)，而損壞晶片或可撓性基板之佈線（traces)及 其間之連接線，以提升產品之製造良率（yield)。 圖示說明： 為了讓本發明之上述和其他目的、特徵、和優點能更 明顯特徵’下文特舉本發明較佳實施例，並配合所附圖 杀’作詳細說明如下。 第1圖：習用可撓性基板球格陣列（BGA)半導體封裝構 造之铸模裝置之上模視圖： 第2a圊：習用可撓性基板球格陣列半導體封裝 構造之模製半成品自上模取出後之上視圖； 第2b及2c圖：習用可撓性基板球格陣列（Bga)半導體 封裝構造之後段製程加工夂側視圖，顯示可撓性基板彎曲 么情形： 第3圖：本發明可撓性基板球格陣列（BGA)半導體封裝 耩造之鑄模裝置之上模視圖； 第4圊：本發明可撓性基板球格陣列（b g A )半導體封裝 媾造之模製半成品自上模取出後之上視圈； 第5圖：本發明沿第4圖5 - 5剖線之剖面圖；及 第6圖：本發明可撓性基板球格陣列（BGA)半導體封裝 構造後段製程加工之側視圖，顯示可撓性基板不易彎曲之Punting and sawing processes are easy to operate and process. This: Bu II: The two sides of each sealant of the array unit on the flexible substrate are connected to each other by the first connection member and the second connection member respectively, thereby strengthening the strength of the entire molded semi-finished product, and avoiding the sealing plastic Peel away from the flexible substrate (P ^ Ung), and damage the traces of the wafer or the flexible substrate and the connecting lines between them to improve the yield of the product. In order to make the above and other objects, features, and advantages of the present invention more obvious, the features hereinafter are described in detail with reference to the preferred embodiments of the present invention and the accompanying drawings. Figure 1: Top mold view of a conventional flexible substrate ball grid array (BGA) semiconductor package structure mold mold view: Part 2a 圊: Molded semi-finished product of a conventional flexible substrate ball grid array semiconductor package structure is removed from the upper mold Top view; Figures 2b and 2c: Conventional flexible substrate ball grid array (Bga) semiconductor package construction process, side view, showing whether the flexible substrate is bent: Figure 3: Flexibility of the present invention Top mold view of the mold device for the fabrication of the substrate ball grid array (BGA) semiconductor package; Part 4: The molded semi-finished product fabricated from the flexible substrate ball grid array (bg A) semiconductor package of the present invention is taken out from the upper mold. Top view; Figure 5: A cross-sectional view of the present invention taken along the line 4-5-5 of the present invention; and Figure 6: a side view of the post-process processing of the flexible substrate ball grid array (BGA) semiconductor package structure of the present invention, Shows that the flexible substrate is not easily bent

第7頁 、發明說明（5) 愔彤。 圖號說明： 1 工作機台 4 凌道口 7 吸盤 12晶片 1 5柱塞 3〇第二連通道 發明說明： 3 澆道 6 模穴 11上模 14 封膠塑料 21第一連接件 P 剝離 2 罐 5陣列單元封膠體 1 0可撓性基板 13連接線 2 0第一連通道 3 1第二連接件 首先請參照第3圖，根據本發明M a也 球格陣列半導體封穿構：：：：：較佳實施例可撓性基板 上表面且ί別以連間線13(示於第5圖） 連i ，由ΐ道口4與基板10上之上模具11相 經由、# 柱塞5壓擠所產生之壓力，封膠塑料14從罐2中 、！由^道3流向洗道口4進入上模具"之模穴内。如圖所 ;:每-基板1。上，設有四個模穴以容納複數個晶片12降 根據本發明之一實施例，該鑄模裝置於澆道口4前具有 —第一連通道20將該上模具11之每一模穴於基板1〇 一側 1 0 1相連接，使模具1 1每一模穴内之封膠塑料1 4得經由第 一連通道20相互連接。根據本發明之另一實施例，該鑄模 裝置於基板10之另一側102具有一第二連通道30將該上模Page 7, the description of the invention (5) Tong Tong. Description of drawing number: 1 Workbench 4 Lingdaokou 7 Suction cup 12 Wafer 1 5 Plunger 3〇 The second connection channel Description of the invention: 3 runner 6 mold cavity 11 upper mold 14 plastic sealant 21 first connection piece P peel 2 cans 5 Array unit sealing gel 1 0 Flexible substrate 13 connection line 2 0 First connection channel 3 1 Second connection member Please refer to FIG. 3 first, according to the present invention, a ball grid array semiconductor sealing structure is also used :::: : The preferred embodiment of the flexible substrate on the upper surface of the flexible substrate and not connected with a line 13 (shown in Figure 5), i, squeezed through the tunnel 4 and the upper mold 11 on the substrate 10 through the # plunger 5 squeeze The resulting pressure, the sealing plastic 14 is removed from the tank 2! Flow from ^ 3 to wash channel opening 4 and enter the cavity of the upper mold. As shown in the figure :: per-substrate 1. There are four mold cavities to accommodate a plurality of wafers. According to an embodiment of the present invention, the mold device has before the runner 4-the first connecting channel 20 places each cavity of the upper mold 11 on the substrate. The 10 side and the 10 side are connected to each other, so that the sealing plastic 14 in each cavity of the mold 11 must be connected to each other through the first connecting channel 20. According to another embodiment of the present invention, the mold device has a second connecting channel 30 on the other side 102 of the substrate 10 to mold the upper mold.

第8頁 441052Page 8 441052

具11之毐一模穴於墓板10之另一侧1G2相連接，使模具" 每一模穴内之封膠塑料得經由第二連通道3〇相互連接 據本發明’第一連通道20及第二連通道3〇主要係用以將該 上模具11之每一模穴相互連通，使模具丨丨每一模穴内之^ 膠塑料14得於基板10之側邊相互連接。因此，第一連通曾 20及第二連通道30可分別或共同達成上述之目的及功效^ 請參照第4圖’本發明之可撓性基板封裝構造之模製半 成品自上模取出後之後，可撓性基板1 〇上之每一陣列單元 封膠禮5之兩側分別由澆道口第一連接件2〗及第二連接件 31相互連接’使每一陣列單元封膠體5形成一體之結構。 因該第一連接件2〗及第二連接件3丨係由封膠塑料搆成其 強度遠大於可撓性基板1〇之強度，且可撓性基板1〇上之每 一陣列單元封膠體5已、由該第一連接件21及第二連接件3 j 相互連接形成一體之結構，因此該模製半成品自上模取出 ，之後’各陣列單元封膠體5並非各自獨立，其整條模製 半成品之強度遠大於習用者之強度，於後硬化 (post-cure) ’ 打印（marking)，植球（baU counting)及 切割（sawing)等製桎，易於操作加工。根據本發明，第一 ，接件21及第二連接件31主要係用以將可撓性基板1〇上之 每一陣列單元封膠體5相互連接形成一體之結構。因此， 第一連接件21及第二連接件31可分別或共同達成上述之目 的及功效。 參照第5圖，本發明之可撓性基板封裝構造之模製半 成时自上模取出後之後，可撓性基板1〇上之每一陣列單元A mold cavity of 11 is connected to 1G2 on the other side of the grave board 10, so that the mold " sealing plastic in each mold cavity must be connected to each other through a second connection channel 30. According to the present invention, the first connection channel 20 The second connecting channel 30 is mainly used to connect each cavity of the upper mold 11 to each other, so that the plastic 14 in each cavity of the mold can be connected to each other on the side of the substrate 10. Therefore, the first communication channel 20 and the second communication channel 30 can achieve the above-mentioned purpose and effect separately or together. ^ Please refer to FIG. 4 after the molded semi-finished product of the flexible substrate packaging structure of the present invention is taken out from the upper mold. The two sides of each array unit sealing glue 5 on the flexible substrate 10 are connected to each other by a sprue first connection 2 and a second connection 31, respectively, so that each array unit sealing glue 5 is integrated. structure. Because the first connecting member 2 and the second connecting member 3 are made of sealing plastic, the strength is much greater than that of the flexible substrate 10, and each array unit sealing glue on the flexible substrate 10 5. The first connecting member 21 and the second connecting member 3 j are connected to each other to form an integrated structure, so the molded semi-finished product is taken out from the upper mold, and then the array element sealing gels 5 are not independent of each other, and the entire mold The strength of the semi-finished product is much greater than that of the user. Post-cure 'marking, baU counting, and sawing are easy to handle and process. According to the present invention, the first, the connecting member 21 and the second connecting member 31 are mainly used to connect each of the array unit sealing glues 5 on the flexible substrate 10 to form an integrated structure. Therefore, the first connecting member 21 and the second connecting member 31 can achieve the above-mentioned purpose and effect separately or together. Referring to FIG. 5, each array unit on the flexible substrate 10 is taken out of the flexible substrate 10 after being removed from the upper mold during molding of the flexible substrate package structure of the present invention.

第9頁 五、發明說明（7) 封膠體5之兩侧分別具有第連接件2〗及第二連接件31。 根據本發明’第一連接件2丨及第二連接件3丨與每一陣列單 元封膠體5之連接處，較佳具有一頸縮部份，該頭縮部份 可減少整條模製半成品之輕曲（warpage)現象。 請參照第6圖，本發明之可撓性基板封裝構造之模製半 成品自上模取出後之後，可撓性基板10上之每一陣列單元 封膠體5之兩側分別具有第一連接件2 1及第二連接件3 1相 互連接，使每一陣列單元封膠體5形成一體之結構。其自 上模取出後之後，於後硬化（post-cure)，打印 (marking)，植球（ball mounting)及切割（sawing)等製 程，皆易於操作加工。此外，本發明之模製半成品可避免 封膠塑料與可撓性基板剝離（peeling)，而損壞晶片或可 撓性基板之佈線（traces)及其間之連接線’以提升產品之 製造良率（yield) ° 雖然本發明已以前述較佳實施例揭示’然其並非用以 限定本發明，任何熟習此技藝者’在不脫離本發明之精神 和範圍内，當可作各種之更動與修改。因此本發明之保護 範圍當視後附之申請專利範圍所界定者為準°Page 9 V. Description of the invention (7) The two sides of the sealing compound 5 are respectively provided with a first connection member 2 and a second connection member 31. According to the present invention, the connection portion of the first connecting member 2 丨 and the second connecting member 3 丨 with each array unit sealing gel 5 preferably has a necked portion, which can reduce the entire molded semi-finished product. Warpage phenomenon. Please refer to FIG. 6. After the molded semi-finished product of the flexible substrate package structure of the present invention is taken out from the upper mold, each side of each of the array unit sealing glues 5 on the flexible substrate 10 has the first connection member 2. 1 and the second connecting member 31 are connected to each other, so that each array unit sealing compound 5 forms an integrated structure. After being removed from the upper mold, it is easy to operate and process in post-cure, marking, ball mounting, and sawing processes. In addition, the molded semi-finished product of the present invention can avoid peeling of the sealant plastic and the flexible substrate, and damage the traces of the wafer or the flexible substrate and the connection lines therebetween to improve the manufacturing yield of the product ( Yield) ° Although the present invention has been disclosed in the foregoing preferred embodiments, 'but it is not intended to limit the present invention, any person skilled in the art' can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be determined by the scope of the attached patent application.

第10頁Page 10

Claims (1)

ο 修正 β __案號 88121727 六、申請專利範圍 1、一種可撓性基板封裝構造之製造方法，以封裝一可撓 ^基板球格陣列（BGA )半導體封裝構造，該球格陣列（BGA) 半導體封裝構造具有複數個晶月陣列單元排列於一基板上 表面’且母一晶月分別與基板電性連接，該方法包含下列 步驟： 提供一轉模裝置，具有至少一罐，以容納封勝塑料，至 少一繞道，分別自罐延伸至待封裝基板之側邊緣，及至少 洗道口位於該待封裝基板之側邊緣’及複數個模穴用以 容納該等晶片陣列單元； 提供一第一連通道，位於該等澆道及澆道口間以將該等 模穴相互導通；及 將罐之封膠塑料注入該等模穴，以形成晶片陣列單元封 夥體，其中該第一連通道内之封膠塑料形成依第一連接 件，以將該等晶片陣列單元封膠體相互連接形成一整體处 構。 2、 依申請專利範圍第1項之可撓性基板封裝構造之製造方 法，其另包含一步驟，提供一第二連通道’位於該等模穴 之另一側邊，以將該模穴相互導通，該第二連接道内之封 膠塑料形成依第二連接件’以將該等晶片陣列單元封勝體 相互連接形成一整體結構。 3、 一種可撓性基板封裝構造之鑄模裝置，用以封裝一 格陣列（BGA)半導體封裝構造，該球格陣列（BGA)半導體5_封 P99-069.ptc 第12頁 4 410 5 2ο Amend β __ Case No. 88121727 VI. Application Patent Scope 1. A method for manufacturing a flexible substrate package structure to package a flexible ^ substrate ball grid array (BGA) semiconductor package structure, the ball grid array (BGA) The semiconductor package structure has a plurality of crystal moon array units arranged on an upper surface of a substrate, and the mother-crystal moon is electrically connected to the substrate, respectively. The method includes the following steps: A mold transfer device is provided, which has at least one can to accommodate Fengsheng. Plastic, at least one detour, extending from the can to the side edge of the substrate to be packaged, and at least a washing channel opening at the side edge of the substrate to be packaged, and a plurality of mold cavities for receiving the chip array units; providing a first connection A channel located between the runners and the gates of the runners to communicate the mold cavities with each other; and injecting the sealing plastic of the can into the mold cavities to form a wafer array unit enclosure, wherein the first connecting channel The sealant plastic is formed according to the first connecting member to connect the wafer array unit sealants to each other to form an integrated structure. 2. The method for manufacturing a flexible substrate package structure according to item 1 of the scope of the patent application, which further includes a step of providing a second connecting channel 'located on the other side of the mold cavities to mutually connect the mold cavities. When conducting, the sealant plastic in the second connection channel is formed according to the second connection piece 'to connect the chip array unit sealing elements to each other to form an integrated structure. 3. A mold device for a flexible substrate package structure for packaging a grid array (BGA) semiconductor package structure, the ball grid array (BGA) semiconductor 5_package P99-069.ptc page 12 4 410 5 2 二構造具有複數個晶片陣列單元排列於一基板上表面，且 每一晶片分別與基板電性連接，該鑄模裝置包含： 至少—罐，以容納封膠塑料； 至少一洗道’分別自罐延伸至待封裝基板之一側邊緣； 至少一澆道口，位於該待封裝基板之側邊緣； 至少兩模穴，位於基板上，用以容納該複數個晶片陣列 單元； 至少一柱塞，位於該罐内以將該封膠塑料擠壓至洗道， 澆道口及該模穴内；及 一第一連通道，位於該等澆道及澆道口間以將該模穴相 互導通》 、 4、 依申請專利範圍第3項之可撓性基板封裝構造之鳍模骇 置，其另包含一第二連通道，位於該等模穴之另一側邊 以將該模穴相互導通》 5、 一種可撓性基板封裝構造之半成品，包含： 一可撓性基板； 複數個晶片陣列單元排列於該可撓性基板之上表面，且 每一晶片分別與基板電性連接； 複數個晶片陣列單元封膠體分別包覆該等晶片陣列單 疋，及 一第一連接件，以將該等晶片陣列單元封膠體於其〜 * 邊將其相互連接形成一整體結構》The second structure has a plurality of wafer array units arranged on an upper surface of a substrate, and each wafer is electrically connected to the substrate. The mold device includes: at least a can to accommodate a plastic sealant; and at least one washing lane extends from the can. To at least one side edge of the substrate to be packaged; at least one sprue located at the side edge of the substrate to be packaged; at least two mold cavities on the substrate to accommodate the plurality of wafer array units; at least one plunger located in the tank The sealant plastic is squeezed into the washing channel, the runner gate and the cavity; and a first connecting channel is located between the runners and the runner gate to communicate the mold cavity with each other. The fin mold of the flexible substrate package structure of the third item includes a second connecting channel located on the other side of the mold cavities to communicate the mold cavities with each other. 5. A kind of flexibility The semi-finished product of the substrate package structure includes: a flexible substrate; a plurality of wafer array units are arranged on the upper surface of the flexible substrate, and each wafer is electrically connected to the substrate separately; a plurality of crystals Array unit encapsulant such individually wrapped single wafer Cloth array, and a first member connected to the other wafer array unit thereon ~ * encapsulant edges joined to each other to form a unitary structure. " P99-069,ptc 第13頁 (105 2 ----1^ 88121727 曰 六、申請專利範圍 修正 V依Λ請Λ利範圍第5項之可撓性基板封裝構造之半成 时，其另包含一第二連接件，以將該等晶片陣列 體於第一連接件之相對邊，將其相互連接形成—整體結 構。 7、 依申請專利範圍第5項之可撓性基板封裝構造之半 品，其中一頸縮部份設於該第一連接件及該等晶片 元封膠體間。 早 8、 依申請專利範圍第6項之可撓性基板封裝構造之半 品’其中一頸縮部份設於該第二連接件及該等晶片陣 元封膠體間。 早P99-069, ptc, page 13 (105 2 ---- 1 ^ 88121727 6) When applying for a revision of the patent scope V According to Λ Please Λ Lee Scope 50% of the flexible substrate package structure, it also contains A second connecting member for connecting the chip array bodies on the opposite sides of the first connecting member to form an overall structure. 7. A half of the flexible substrate package structure according to item 5 of the scope of patent application. One of the necking portions is located between the first connector and the chip element sealing colloids. As early as 8. One of the necking portions of the flexible substrate package structure according to item 6 of the patent application scope. It is located between the second connecting member and the chip array element sealing colloid. P99.069.ptc 第14頁P99.069.ptc Page 14
TW088121727A 1999-12-09 1999-12-09 Molding device and manufacturing method of flexible substrate packaging structure TW441052B (en)

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