:4 ... A7 B7 五、發明説明（1 ) 發明領域 概略而言本發明係關於球柵陣列（BGA)總成之封裝領 域，特別係關於BGA封裝過程辅助容易處理軟帶之軟帶 總成。 發明背景 積體電路（1C)為業界眾所周知。由於1C晶片必需與電 路中的其他1C晶片經由輸入/輸出（I/O)互連系統通訊， 也由於1C晶片及其嵌置之電路精緻，故1C封裝體必需發揮 各種功能。特別電子封裝體必需載運及保護1C晶片；提供 供電給1C晶片電路之電流硌徑；分布信號至及離冗晶片； 去除電路產生之熱；及支持及保護1C晶片不受環境之害。 隨著I/O增高，性能增高及印刷電路板（PCB)製造產率 的不斷增高傾向’球栅陣列（BGA)，晶片規模封裝體（CSP) 及浮動晶片變成上選封裝體。用於此等封裝體，焊料接點 僅為附著其至印刷電路板（PCB)的機械手段。 目前焦點集中於先進1C封裝體。用於長條形boa封 裝體’使用BT樹脂做為基材材料。常用基材厚度為〇36 至0.56毫求。開發另一形材料為軟帶。此種材料為聚醯亞 胺附有銅精油繞徑於該區〇 軟τρ比較目前基材具有多種優點。第一，具有細.間距 能力可達50微米線，而間隔為至少若干軟帶電路的標準間 隔·>第二具有較高I/O密度。第三具有優異電力性質，細 線許可導線黏合指極為緊密的帶入模具内因而減少導線電 感。第四，軟帶之擴充性較高。隨著導線黏合能力的持續 本紙張尺度適用中國國家榇率（CNS ) Α4規格（2丨0X297公釐） (誚先閱讀背面之注意事項再填寫本頁) 訂 耔浐部中"e4,-^H-7·消於仓竹$印^ 441 049 a7 _____________________B7 _ 五、發明説明（2 ) 改良，軟帶電路提供適合細間距黏合所需要的擴充性e第 五，可使導線黏合指更佳接近模具，如此模具製造商可繼 續縮少模具尺寸同時保持導線合理地短。縮小模具可使每 個晶圓產生更多模具因而顯著降低模具成本。最後使用軟 帶可縮小最終封裝體的厚度。 雖然有許多優點，目前使用長條形軟帶之；BGA製造 商所面對的一大困難是處理。由於帶極薄（典型約〇.8〇毫 米）且容易彎柝，翹曲及加熱時變成浪形，故使用目前方 法不容易採用軟帶作為基材來封裝晶月。 發明目的 因此本發明之目的係提供一種軟帶總成，其可用於目 前BGA封裝過程輔助使用軟帶作為基材而無需實質修改 利用BT樹脂或其他基材的現有製程。 發明概述 為了允許目前BGA系統可處理極為柔軟的軟帶，經 由使用剛硬體對軟帶提供剛硬。頂剛硬體長條置於軟帶頂 側及底剛硬體長條置於軟帶底側。剛硬體長條可製作成如 同軟帶長條之相同尺寸及形狀’必需由極為剛性之材料且 較佳具有與軟帶相同物理特徵製成。 · 頂剛硬體長條包括一個外廓開口可容納模具’模具最 終置於軟帶内然後模塑。頂剛硬體也包括一個推桿孔，扣 合嵌合孔及頂前定位孔。推桿孔用於剝除過程，此時底長 條由軟帶去除（容後詳述）。扣合嵌合孔及頂前定位孔用於 疊合過程，此處頂及底長條置於軟帶底側。 本紙張尺度这和中國國家標牟（CNS ) A4规格（21〇\297公釐） i - 11 ----- i - -I I - I -I 1: i I ----11 丁 1^1 HI I- -I In I . _", I HI II If - HI — i·4- --¾ L·'·-i (請先閱讀背面之注意事項再填ic?本頁) 五、發明説明（3 ) 底剛硬體長條包括一個壓紋蓋供於疊合過程扣合扣合 嵌合孔°疊合過程也使用底前定位孔，其連同頂長條之頂 前定位孔妥為對正頂及底長條。 疊合過程通常發生於BGA製程早期，較佳恰於軟帶 切割成長條形之後但於附著模具之前進行◊了員及底前定位 孔對正使頂及底長條頗為匹配。於正確位置，壓紋孔恰位 於扣合嵌合孔下方故當進行疊合時，蓋匹配扣合嵌合孔。 剛硬體長條單純藉匹配壓紋蓋進入扣合嵌合孔及外康開口 嵌合套住模塑封裝體而牢固固定於軟帶。未使用黏著劑來 黏著剛硬體至軟帶。 圖式之簡單說明 第1圖顯示置於軟帶頂側之頂剛硬體長條； 第la圖顯示適合用於本軟帶總成之軟帶； 第2圖顯示置於軟帶底側之底剛硬禮長條； 第3圖顯示已經有模塑封裝體置於其上之本軟帶總成 ) 第4，5及6圖示例說明由軟帶總成移出底剛硬體之剝 脫過程。 本發明之詳細說明 使用剛性PCB或BT樹脂基質處理bga封裝體之過程 為業界人士眾所周知。但此種方法不容易應用於採用軟帶 之BGAs，原因為軟帶無法提供所需剛性且難以處理故。 藉採用本軟帶總成，可使用軟帶基材而大體無需修改目前 BGA系統。 本紙張尺度追用中囤國家標率（CNS ) A4規格（210X297公f ) Λ? ------- Η: 五、發明説明（4 ) 為允許目前BGA系統可處理極為撓性的軟帶，經由 使用如第1及2圖所示之剛硬體對軟帶提供剛性。第1圖顯 不置於軟帶頂側之頂剛硬體長條〗0，及第2圖顯示底剛硬 體長條20其置於軟帶底侧。剛硬體長條之尺寸及形狀必需 如同軟帶長條，且需由具有相當剛性材料且較佳具有軟帶 之類似物理特性之材料製成^顯示鋼合金為作為剛硬體之 良好材料。 現在參照第I圖’頂剛硬體長條丨〇包括外廓開口丨〗供 接納模具，其最終置於軟帶隨後模塑。開σ i ]之尺寸為開 口邊緣11a緊密嵌合套住最終模塑封裝體。頂剛硬體1〇包 括推桿孔12 ’扣合嵌合孔13及頂前定位孔14。相同之孔12 ’ 13及14之集合位於長條兩側之固定間隔。推桿孔12用於 剥除過程，此處底長條2〇由軟帶去除（容後詳述）。扣合嵌 合孔13及頂前定位孔14用於疊合過程，此處頂及底長條1〇 ’ 20分別置於軟帶之頂及底側。當然此等孔僅為達成此處 陳述目的之一種方式。 現在參照第2圖’底剛硬體長條2〇包含壓紋蓋21供於 疊合過程扣合嵌合扣合嵌合孔13。疊合過程也使用底前定 位孔22 ’其連同頂長條1〇之頂前定位孔14妥為對正頂及底 長條。開槽23供用於剝除過程（其目的容後詳述）。 現在參照第la圖’軟帶40於相同位置具有頂剛硬體長 條10之相同孔集合’及發揮頂剛硬體長條孔之相同功能。 故軟帶推桿孔12a對應於推桿孔]2 ;軟帶扣合嵌合孔na對 應於扣合嵌合孔Π ;及軟帶前定位孔14a對應於頂前定位孔14 本紙張尺麵Jf]巾gj财料（⑽）( 2lOx，2Q7,f^l ' 請先閲讀背面之注意事項再访'寫本頁): 4 ... A7 B7 V. Description of the invention (1) Field of the invention In general, the present invention relates to the field of packaging of ball grid array (BGA) assemblies, and in particular, to the assistance of the BGA packaging process to assist the easy handling of soft tapes. to make. BACKGROUND OF THE INVENTION Integrated circuits (1C) are well known in the industry. Since the 1C chip must communicate with other 1C chips in the circuit via an input / output (I / O) interconnection system, and because the 1C chip and its embedded circuits are delicate, the 1C package must perform various functions. Special electronic packages must carry and protect 1C chips; provide current paths to power 1C chip circuits; distribute signals to and from redundant chips; remove heat generated by the circuits; and support and protect 1C chips from the environment. With the increase of I / O, higher performance and the increasing tendency of printed circuit board (PCB) manufacturing yield 'ball grid array (BGA), the chip scale package (CSP) and floating chip become the package of choice. For these packages, solder contacts are only a mechanical means of attaching them to a printed circuit board (PCB). The current focus is on advanced 1C packages. For the elongated boa package, BT resin is used as the base material. Common substrate thicknesses are from 0.36 to 0.56 millimeters. Develop another shape material for soft belt. This kind of material is polyimide with copper essential oil around the area. Soft τρ has many advantages compared with current substrates. First, it has a fine pitch capability of up to 50 micron lines, and the standard interval is at least several softband circuits. ≫ Second, it has a higher I / O density. Thirdly, it has excellent electrical properties. The thin wire allows the wire bonding finger to be brought into the mold very tightly, thereby reducing the wire inductance. Fourth, the expandability of the soft band is high. With the continuity of the wire bonding ability, the paper size applies to China's national standard (CNS) Α4 specification (2 丨 0X297 mm) (诮 Please read the precautions on the back before filling this page) In the order department " e4,- ^ H-7 · Yu Cangzhu $ 印 ^ 441 049 a7 _____________________B7 _ V. Description of the invention (2) Improved, the soft-band circuit provides the expandability needed for fine-pitch bonding e. Fifth, it can make the wire bonding fingers better Close to the mold, so the mold maker can continue to reduce the mold size while keeping the leads reasonably short. Shrinking molds can result in more molds per wafer and significantly reduce mold costs. The final use of flexible tape reduces the thickness of the final package. Although there are many advantages, a long strip of soft tape is currently used; a major difficulty faced by BGA manufacturers is handling. Because the tape is extremely thin (typically about 0.8 mm) and easily bends, it becomes wavy when warped and heated, so it is not easy to use a soft tape as a substrate to encapsulate the crystal moon using the current method. OBJECTS OF THE INVENTION Therefore, the object of the present invention is to provide a flexible tape assembly that can be used in the current BGA packaging process to assist the use of flexible tapes as a substrate without substantial modification of existing processes using BT resin or other substrates. SUMMARY OF THE INVENTION In order to allow the current BGA system to handle extremely soft soft bands, rigid bands are provided to the soft bands by using rigid bodies. The top rigid body strip is placed on the top side of the soft belt and the bottom rigid body strip is placed on the bottom side of the soft belt. The rigid body strip can be made to have the same size and shape as the soft strip strip. It must be made of a very rigid material and preferably has the same physical characteristics as the soft strip. • The top rigid body strip includes an outline opening to accommodate the mold ' The mold is finally placed in a soft band and then molded. The top rigid body also includes a pusher hole, a snap-fitting hole and a top front positioning hole. The pusher hole is used for the stripping process, at which time the bottom strip is removed by a soft band (more details later). The snap-fitting hole and the top front positioning hole are used for the lamination process, where the top and bottom strips are placed on the bottom side of the soft belt. The size of this paper is in accordance with China National Standards (CNS) A4 specification (21〇 \ 297 mm) i-11 ----- i--II-I -I 1: i I ---- 11 ding1 ^ 1 HI I- -I In I. _ &Quot;, I HI II If-HI — i · 4- --¾ L · '· -i (Please read the precautions on the back before filling in the ic? Page) 5. Invention Note (3) The bottom rigid body strip includes an embossed cover for the buckling process. The bottom front positioning hole is also used in the folding process, which is properly combined with the top front positioning hole of the top strip. Align the top and bottom bars. The lamination process usually occurs early in the BGA process, preferably just after the soft band is cut into long strips but before the mold is attached. The positioning of the holes and the bottom alignment make the top and bottom strips quite matched. In the correct position, the embossed hole is located just below the snap-fitting hole, so when overlapping, the cover matches the snap-fitting hole. The rigid body strip simply enters the fastening fitting hole and the outer opening through the matching embossed cover, and the fitting is sleeved on the molded package to be firmly fixed to the soft band. No adhesive is used to adhere rigid to soft bands. Brief description of the drawing Figure 1 shows the top rigid body bar placed on the top side of the soft belt; Figure la shows the soft belt suitable for the soft belt assembly; Figure 2 shows the soft belt that is placed on the bottom side of the soft belt The bottom rigidity bar; Figure 3 shows the flexible tape assembly with the molded package on it. Figures 4, 5 and 6 illustrate the removal of the rigid and stripped body from the flexible tape assembly. Take off process. DETAILED DESCRIPTION OF THE INVENTION The process of processing a bga package using a rigid PCB or BT resin matrix is well known to those skilled in the art. However, this method is not easy to apply to BGAs using soft tape because soft tape cannot provide the required rigidity and is difficult to handle. By using this flexible tape assembly, the flexible tape substrate can be used without substantially modifying the current BGA system. This paper is scaled to follow the national standard rate (CNS) A4 specification (210X297 male f) Λ? ------- Η: 5. Description of the invention (4) In order to allow the current BGA system to handle extremely flexible software The belt provides rigidity to the soft belt by using a rigid body as shown in FIGS. 1 and 2. Fig. 1 shows the top rigid body strip which is not placed on the top side of the soft belt, and Fig. 2 shows the bottom rigid body strip 20 which is placed on the bottom side of the soft belt. The size and shape of the rigid body strip must be the same as that of the soft strip, and it must be made of a material that has a relatively rigid material and preferably has similar physical properties as the soft strip ^ It shows that the steel alloy is a good material for the rigid body. Referring now to Figure I ', the top rigid body strip includes a contour opening for receiving a mold, which is finally placed in a soft band and subsequently molded. The size of the opening σ i] is that the opening edge 11a fits tightly around the final molded package. The top rigid body 10 includes a pusher hole 12 ', a snap-fitting hole 13 and a top front positioning hole 14. The set of identical holes 12'13 and 14 are located at regular intervals on both sides of the strip. The pusher hole 12 is used for the stripping process, where the bottom strip 20 is removed by a soft band (more details later). The buckle-embedding holes 13 and the top front positioning holes 14 are used for the lamination process. Here, the top and bottom strips 10 '20 are placed on the top and bottom sides of the soft belt, respectively. Of course these holes are only one way to achieve the purpose stated here. Referring now to FIG. 2 ', the bottom rigid body strip 20 includes an embossed cover 21 for engaging and engaging with the engaging hole 13 in the overlapping process. The overlapping process also uses the bottom front positioning hole 22 ', which together with the top front positioning hole 14 of the top strip 10, properly aligns the top and bottom strips. The slot 23 is provided for the stripping process (the purpose of which is described in detail later). Referring now to FIG. 1a, the 'soft band 40 has the same set of holes of the top rigid body strip 10 at the same position' and performs the same function of the top rigid body strip. Therefore, the soft-belt pusher hole 12a corresponds to the push-rod hole) 2; the soft-belt snap-fitting hole na corresponds to the snap-fitting hole Π; and the soft-belt front positioning hole 14a corresponds to the top front positioning hole 14 of this paper Jf] 巾 gj 财 料 （⑽） (2lOx, 2Q7, f ^ l 'Please read the precautions on the back before visiting' Write this page)
、1T I * 經濟部中央標卑局負工消资合作社印裂 441 049 A7 _________________ B7五'發明说明（5 ) .¾¾.部中夹杖逛而U工消费合作，衫印米 現在參照第3圖，該圖顯示軟帶總成3〇，此處頂及底 剛硬體長條10及20疊合於軟帶40，模塑封裝體5〇置於軟帶 40。疊合過程通常於bga加工早期，較佳恰於軟帶切割 成長條形之後而於附著模具之前（但為了舉例說明之用， 第3圖顯示附有模塑封裝體之總成3〇)。 頂、底及軟帶前定位孔14 , 22及14a對正因此頂及底 長條彼此眩且妹帶他配。於正如^，壓紋蓋叫合 位於扣合嵌合孔13及軟帶扣合嵌合孔〗3a下方，故當進行 疊合時’蓋21緊密匹配扣合衫孔13及軟帶扣合嵌合孔na 。也注意外廓f开1 口 U邊緣Ua緊密嵌合套佐模塑封裝體5〇 。剛硬體長條10及20經由匹配壓紋蓋21進入扣合嵌合孔13 及13a，及嵌合外廓開套住模塑封裝體刈而牢固固定 於軟帶。未使用黏著劑來黏著剛硬體至軟帶。 為了使本軟帶總成最佳應用於現有BGA製程，需滿 足某些尺寸要求。通常底剛硬體加需比頂剛硬體〗〇更厚， 原因為底剛硬體必需約原來使壓紋蓋夠高可達到扣合後合 ^内部。顯㈣^體必需夠厚才能提供若干剛性。較佳 a ， b及‘c”全體合併厚度需於〇36至〇56毫米之 範圍’原因為此為目前使用之訂樹腊基材厚度範圍。經 由保持總厚度盡可能接近目前基材厚度，可使目前bga 處理過程之修改減至最少。但可略微偏離此範圍而無需實 質修改。 、、 於BGA包膠過程之某-點，底剛硬趙必需由軟帶捵 本紙張尺度轉CNS ) A4規格（ (婧先M讀背面之ίΐ·意f.項再填艿本頁)1T I * Central Standards Bureau of the Ministry of Economic Affairs of the Central Bureau of Standards and Consumers Cooperatives 441 049 A7 _________________ B7 Five 'Invention Description (5). This figure shows the flexible tape assembly 30, where the top and bottom rigid body strips 10 and 20 are superposed on the flexible tape 40, and the molded package 50 is placed on the flexible tape 40. The lamination process is usually in the early stage of bga processing, preferably just after the flexible tape is cut into long strips and before the mold is attached (but for illustration purposes, Figure 3 shows the assembly with a molded package 30). The top, bottom and soft belt front positioning holes 14, 22 and 14a are aligned so that the top and bottom strips dazzle each other and the sister leads him. Just as ^, the embossed cover is located below the fastening fitting hole 13 and the soft belt fastening fitting hole 3a, so when the overlap is performed, the 'cover 21 closely matches the fastening shirt hole 13 and the soft belt fastening insert Hop hole na. Note also that the outer profile f opens one mouth and the U edge Ua fits tightly over the molded package 50. The rigid body strips 10 and 20 enter the fastening fitting holes 13 and 13a through the matching embossed cover 21, and the fitting outer contour is sleeved over the molded package body 刈 to be firmly fixed to the soft tape. No adhesive is used to adhere rigid to soft bands. In order to make the flexible tape assembly optimally used in the existing BGA process, certain size requirements must be met. Generally, the bottom rigid body needs to be thicker than the top rigid body. The reason is that the bottom rigid body must be about the original height so that the embossed cover can be high enough to reach the inside of the buckle. The body must be thick enough to provide some rigidity. Preferably, the combined thickness of a, b and 'c' should be in the range of 036 to 056 mm '. The reason is the thickness range of the custom wax substrate currently used. By keeping the total thickness as close as possible to the current substrate thickness, It can minimize the current modification of the BGA processing process. However, it can slightly deviate from this range without substantial modification. At a certain point of the BGA encapsulation process, the rigid bottom must be converted from a soft tape to a paper scale to CNS.) A4 specification ((Jing M reads the ΐ, Italian f. Item on the back, then fill in this page)
-¾.部中头"埤^災工消灸合作；^印5:1 4 d 1 0 4 9 a? _____________«7 五、發明説明（6) 成30去除而將焊料珠置於封裝體上。較佳稱作制除過程的 去除底剛硬體必需恰於焊料珠放置前進行6第4，5及6圖 示例說明剝除過程。 現在參照第4圖’對模塑封裝體50及底剛硬體2〇放置 真空柚取60及61。支持桿65插入開槽23(第2圖最明白顯示 )而支持軟帶40及頂剛硬體10〇衝穿桿66恰置於壓紋蓋21 上方’壓紋蓋已經嵌合於扣合栽合孔13内部^推桿67#免置 於推桿孔12内部。 現在參照第5圖，為了分離底剛硬體2〇與軟帶總成， 抽取61 ’推桿67及衝穿桿66同時向下移動。當壓紋蓋21由 底剛硬體20切斷時’底剛硬體；2〇由軟帶4〇脫離。第6圖顯 示由底剛硬體20去除後之總成。頂剛硬體丨〇保持完整而於 放置焊料珠過程維持所需支持，而於模塑封裝體切割成單 一封裝體時自然去除。 除了對軟帶提供所需剛性以外，底剛硬體扮演另一種 重要功能。軟帶底側具有金墊，其為焊料珠附著的接觸點、 °為了使焊料珠妥為附著，金塾表面不可污.染外來物質。 這點極為重要原因為若附著失敗則整個單元變不良品。底 剛硬體經由遮住軟帶底側輔助減少金墊的污染。 可未悖離本發明之精髓或其他要特點以其他特定形式 具體表現本發明。例如雖然已經參照BCtA封裝體說明本 發明，但軟帶總成可應用於其他類型封裝體例如浮動晶片 及晶片尺寸封裝體。本揭示具體例僅視為舉例說明而非限 制性1本發明之範圍係由隨附之申請專利範圍指示因此屬 本紙張尺度遠/〇中國國家標準（CNS ) A4規格（210x297公楚） (請先閱讀背面之注意"'項再填艿本頁)-¾.Ministry head " 埤 ^ Disaster Moxibustion Cooperation; ^ 印 5: 1 4 d 1 0 4 9 a? _____________ «7 V. Description of the invention (6) Remove the solder beads into the package by 30 on. The removal of the bottom rigid body, which is preferably called the removal process, must be performed just before the solder beads are placed. Figures 4, 5 and 6 illustrate the stripping process. Now referring to FIG. 4 ', vacuum molded pomeloes 60 and 61 are placed on the molded package 50 and the bottom rigid body 20. The support rod 65 is inserted into the slot 23 (shown most clearly in FIG. 2), and the support soft band 40 and the top rigid body 100 are penetrated through the rod 66 just above the embossed cover 21. The inside of the combining hole 13 is not placed inside the putting hole 12. Referring now to FIG. 5, in order to separate the bottom rigid body 20 from the soft belt assembly, the 61 'push rod 67 and the punch rod 66 are drawn down and moved simultaneously. When the embossed cover 21 is cut by the bottom rigid body 20 ', the bottom rigid body; 20 is detached by the soft band 40. Fig. 6 shows the assembly after the bottom rigid body 20 is removed. The top rigid body remains intact and maintains the required support during the placement of the solder beads, and is removed naturally when the molded package is cut into a single package. In addition to providing the required rigidity to the soft belt, the bottom rigid body plays another important function. The bottom of the soft belt has a gold pad, which is the contact point where the solder beads are attached. ° In order for the solder beads to adhere properly, the surface of the gold tincture must not be stained. Contaminated with foreign substances. This is extremely important because if the adhesion fails, the entire unit becomes defective. The bottom rigid body helps to reduce the contamination of the gold pad by covering the bottom side of the soft belt. The invention may be embodied in other specific forms without departing from the spirit or other essential characteristics of the invention. For example, although the present invention has been described with reference to a BCtA package, the flexible tape assembly can be applied to other types of packages such as floating chips and chip-size packages. The specific examples of this disclosure are only to be regarded as illustrative and not restrictive. 1 The scope of the present invention is indicated by the scope of the attached patent application and is therefore far from the paper size / Chinese National Standard (CNS) A4 specification (210x297). (Please (Please read the note on the back "'before filling this page)
A7 B7 4 1 0 4 五、發明説明 於申請專利範圍之定義及相當例範圍之全部變化皆含蓋於 其中。 元件標號對照 10...頂剛硬體長條 23…開槽 11...開口 30...軟帶總成 Π a 緣 40…軟帶 12...推桿孔 50…腐塑封包 13...扣合叙合孔 60，61…真空抽取 14...頂前定位孔 65...支持桿 20...底剛硬體長條 66...衝穿桿 21...壓紋蓋 67...推桿 22...底前定位孔 讀 先 閲 讀 背 之 注， 意 事- 項 再 填 本 頁 訂 本纸張尺度追用中固國家標準（〔奶）六4規格（2】0\297公釐） -10-A7 B7 4 1 0 4 V. Description of the invention All changes in the definition of patent application scope and equivalent scope are covered. Component number comparison 10 ... Top rigid body strip 23 ... Slot 11 ... Opening 30 ... Soft belt assembly Π a Edge 40 ... Soft belt 12 ... Pusher hole 50 ... Rotten plastic package 13 ... fastening holes 60,61 ... vacuum extraction 14 ... top front positioning holes 65 ... support rod 20 ... bottom rigid body strip 66 ... punch through rod 21 ... press Pattern cover 67 ... Push rod 22 ... Front positioning hole Read the back of the note first, Note-item, then fill in this page, the paper size follows the national solid standard ((milk) 6 4 specification ( 2] 0 \ 297 mm) -10-