TW438904B - Leak-detecting apparatus of semiconductor process - Google Patents

Leak-detecting apparatus of semiconductor process Download PDF

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Publication number
TW438904B
TW438904B TW87120709A TW87120709A TW438904B TW 438904 B TW438904 B TW 438904B TW 87120709 A TW87120709 A TW 87120709A TW 87120709 A TW87120709 A TW 87120709A TW 438904 B TW438904 B TW 438904B
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Taiwan
Prior art keywords
leak detection
detection device
reaction chamber
semiconductor process
leak
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TW87120709A
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Chinese (zh)
Inventor
Jiue-Sheng Yang
San-An Lin
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United Microelectronics Corp
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Priority to TW87120709A priority Critical patent/TW438904B/en
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Publication of TW438904B publication Critical patent/TW438904B/en

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Abstract

In the leak-detecting apparatus of semiconducor process, a O-shape ring combined with the chamber lid closely, and a pressure gauge is mounted on the detecting hole of the leak-detecting apparatus. After drawn the air out in the entire chamber lid and the leak-detecting apparatus. In case that it's provided an certain pressure of helium by the outside, the air pressure detected by the pressure gauge should be approach to vacuum.

Description

438904 3956uv,J〇c/00B A7 B7 五、發明説明(I ) 本發明是有關於一種半導體製程機台的檢測裝置,且 特別是有關於一種測漏裝置,用以查驗反應室頂蓋 (Chamber Lid)各部份是否結合良好而於製程進行時不會產 生漏氣現象。 半導體製程上,幾乎每一個製程都需要各種不同的氣 體,比如化學氣相沉積製程常用的3旧4、3#6、^>13與H2 ; 乾蝕刻製程裏的CF4、CHF3、02與SF6 :濺鍍裏的Ar或 N2 ;離子植入機裏的PH3和BF3,及其他廣爲各種製程設 備與儀器所使用的惰性氣體等。半導體製程上,常需要藉 由儲存於反應室頂蓋總成中的氣體來對製程反應室 (Chamber)提供所需之製程氣體。 爲確保製程能順利進行,反應室頂蓋總成與反應室再 經過拆解(Disassemble)、淸洗、烘烤(Bake)、組裝(Assemble) 和測漏(Leak Check)等的復機程序後,方能通氣並使用。 詳細步驟如下: 步驟1 :預處理(使反應室容易淸理) 步驟2 ‘·抽風(使殘存的氣體反應物不外洩) 步驟3 :製程零件(Process Kits)拆解 步驟4 :製程零件淸洗(使反應殘留物完全去除) 步驟5 :反應室內壁淸理(使反應殘留物完全去除) 步驟6 :製程零件烘烤(使各零件所含的水氣完全去除) 步驟7 :製程零件組合 步驟8 :氦氣防漏測試(測試是否漏氣) 首先,進行步驟1,對機台進行預處裡,例如降溫等, 3 本紙张尺廋璉川中國囚家樣蜱(ΓΝ5 ) Λ4規格(210X297公釐) (諳先間讀背面之注意事項再填'fiT本頁) 装· ^"•^屮^-打^^^^消货合竹私印繁 4389 0 4 3^6twf'd〇c/008 A? _ B7 五、發明説明(> ) 使機台便於淸理,再進行步驟2,對機台進行一抽風步驟, 使殘存於機台內的氣體不至於因爲開啓機台而外洩。之 後,爲了使後續反應室、製程零件與反應室頂蓋結合後得 以正確地進行漏氣測試,製程零件需完全拆卸與淸洗,因 此進行步驟3,將製程零件(Process Kits)分解以利後續之 淸洗,製程零件則配置於存放反應氣體的反應室頂蓋內 部,各種處理反應氣體的零件如加熱器(Heater)、噴頭 (Showerhead)、區隔板(Blocker Plate)、混和區塊(Mixer Block)和石英管(Quartz Tube)等各種製程零件,皆須拆卸 然後,進行步驟4,製程零件淸洗,使反應殘留物完 全由製程零件上去除,進行步驟5,反應室內壁淸理,使 反應室內壁之殘留物完全去除。此二步驟爲防止先前製程 進行時,於零件與反應室內部殘留任何的殘留物,影響後 續製程的進行。 接著,進行步驟6,製程零件烘烤,使各製程零件所 含的水氣完全去除,再進行步驟7,製程零件組合,組合 所有製程零件,準備進行漏氣測試。 胃再進行步驟8,氦氣防漏測試,以確保反應室各部位 結合良好,並且與與反應室頂蓋間無任何漏氣現象。 .然後,進行校正、反應室加熱、軟體漏率查驗、試機 %步驟' 以完成復機之程序。 在習知的復機程序須經過繁雜的手續,消耗了大量的 時間與人力,影響了整體產能,且製程零件的拆裝頻率過 高,可能因人爲組裝之不確實而造成安裝後發生漏氣現 4 本紙张尺度诚川.K國家標碑(('NS ) ( 21〇X297^vf ) --------裝------訂-------^ ("先閱讀背而之注意事項再填寫本頁) 438904 3956nv,d〇c/0〇S A? B7 五、發明説明($ ) 象。 因此,本發明的目的就是在提供一種測漏裝置,透過 測漏裝置對裝置進行漏氣與否之測試,可以簡化習知側漏 之程序。 有鑑於此,本發明提供一種測漏裝置,利用本測漏裝 置可以很容易地用查驗製程機台是否漏氣,使復機之程序 大大簡化。 爲達上述之目的,本發明提洪一個測漏裝置及一 〇 環,測漏裝置上含有〇環槽,將〇環置入〇環槽後,測 漏裝置可透過0環與其它裝置緊密結合。進行測漏時,首 先對機台進行預處裡,再進行抽風步驟。接著,於拆卸反 應室頂蓋,淸理反應室內壁之同時,將測漏裝置的〇環槽 中置入一 〇環,測漏裝置透過0環與反應室頂蓋緊密結 合,於測漏裝置之量測孔裝設一壓力計,並對整個測漏裝 置與反應室頂蓋進行抽真空後,如於外部提供一特定壓力 之氦氣,則壓力計所量得之氣壓應仍趨近於真空。 透過此測漏裝置來對應室頂蓋進行測漏,則可以省下 製程零件拆卸的繁雜步驟 > 大大簡化習知測漏之程序。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂,下文特舉一較佳實施例,並配合所附圖式,作詳 細說明如下: 圖式之簡單說明: 第1圖係根據本發明之一較佳實施例,一種測漏裝置 之俯視圖;以及 5 本紙银尺政诚州中KS家椋呤((’NS ) Λ4規格(2彳0X297公釐) ----------裝------訂------斌 (誚先閱讀背而之注意事項再瑣寫本頁) 43890 4 A7 3956twt doc/008 __ B7 五、發明説明(b) 第2圖係根據本發明之一較佳實施例,一種測漏裝置 之側視圖。 圖式之標記說明: 100 :主體結構 104 :凹槽 106 : Ο環槽 110 :孔洞 1 1 2 :量測孔 貫施例 第1圖係根據本發明之一較佳實施例,一種測漏裝置 之俯視圖;以及 第2圖係根據本發明之一較佳實施例,一種測漏裝置 之側視圖。 請同時參照第1圖與第2圖。由於習知爲查驗反應室 頂蓋之漏氣與否,須拆解反應室頂蓋總成內部諸多製程零 件,因此本發明提供一種測漏裝置,用以量測反應室頂蓋 是否漏氣,而反應室頂蓋例如屬於AMAT ' WCVD與HTF 機台,反應室頂蓋與測漏裝置相結合,透過測漏裝置之輔 助,可檢查反應室頂蓋各部份是否結合良好。 測漏裝置包含一主體結構,材質例如爲鋁(A1), 主體結構1〇〇有一凹槽104,於凹槽周圍有一 〇環槽106, 主體結構100具有一量測孔112以使凹槽104與壓力計相 通(未顯示)。 利用本發明之測漏裝置可使製程減化爲 6 本紙張尺度诚川中國K家標彳(( NS ) Λ4規袼(210X 297公釐) ---------t衣------11------A ("先閱讀背15之注意事項再填寫本頁) 4389 0 4 A7 395 6twt'.doc/008 B7 五、發明説明(t) 步驟1 :預處理(使反應室容易淸理) 步驟2 :抽風(使殘存的氣體反應物不外洩) 费驟5 :反應室內壁淸理(使反應殘留物完全去除) 首先,進行步驟1,對機台進行預處裡,例如降溫等, 使機台便於淸理,再進行步驟2,對機台進行一抽風步驟, 使殘存於機台內的氣體不至於因爲開啓機台衙外洩。 於拆卸反應室頂蓋之後,進行步驟5,反應室內壁淸 理之同時,將測漏裝置的0環槽106中置入一 Ο環,測 漏裝置透過〇環,並栓入螺絲,與反應室頂蓋緊密結合。 基本上,欲測試一裝置是否漏氣,係將裝置結合後, 將其連結至壓力計,量得裝置內部之氣壓値,對內部抽真 空後,再配合外在提供一氣壓,讀取壓力計之氣壓變化, 便可判斷裝置是否漏氣。 因此,於測漏裝置之孔洞110裝設一壓力計,對整個 測漏裝置與反應室頂蓋進行抽真空後,壓力計量得一接近 真空之氣壓値,再於外部提供一特定壓力之氦氣,理論上 如果反應室頂蓋與測漏裝置緊密結合,則壓力計所量得之 氣壓値應仍因接近真空,而不會因爲外部提供一特定壓力 之氦氣而改變。如此,則得以確定反應室頂蓋之各部份結 合良好,並且與測漏裝置間並無任何間隙,不會有漏氣之 現象。 然後,進行校正、反應室加熱、軟體漏率查驗、試機 等步驟,以完成復機之程序。然而,由於後續步驟爲習知 技藝者所熟知故此處不另贅述。 7 本紙张尺度適州中國1¾家標々ί (1 NS ) Λ4規格(210X 297公釐) ^ --------装-------訂--------/. (誚先閲讀背而之注意事項再填寫本頁) 438904438904 3956uv, Joc / 00B A7 B7 V. Description of the Invention (I) The present invention relates to a detection device for a semiconductor process machine, and in particular, to a leak detection device for inspecting the top cover of a reaction chamber (Chamber Lid) Whether all parts are well combined and no air leakage will occur during the process. In the semiconductor process, almost every process requires a variety of different gases, such as 3, 4, 3 # 6, ^ > 13 and H2 commonly used in chemical vapor deposition processes; CF4, CHF3, 02, and SF6 in dry etching processes : Ar or N2 in sputtering; PH3 and BF3 in ion implanter, and other inert gases widely used in various process equipment and instruments. In the semiconductor process, it is often necessary to provide the required process gas to the process reaction chamber (Chamber) through the gas stored in the reaction chamber top cover assembly. In order to ensure the smooth progress of the manufacturing process, the top cover assembly of the reaction chamber and the reaction chamber are subjected to the re-installation procedures such as disassemble, rinsing, baking, assembly, and leak check. Before you can ventilate and use. The detailed steps are as follows: Step 1: Pretreatment (make the reaction chamber easy to handle) Step 2 '· Ventilation (so that the remaining gas reactants are not leaked out) Step 3: Disassembly of process kits Step 4: Process parts 淸Washing (to completely remove the reaction residues) Step 5: The inner wall of the reaction chamber (to completely remove the reaction residues) Step 6: Process parts baking (to completely remove the moisture contained in each part) Step 7: Process parts combination Step 8: Helium leak-proof test (test whether there is a leak) First, go to step 1 to pre-treat the machine, such as cooling, etc. 3 paper ruler Chuanchuan Chinese prison-like ticks (ΓΝ5) Λ4 specification ( 210X297 mm) (谙 Please read the precautions on the back first and then fill in the 'fiT page') Packing ^ " • ^ 屮 ^-打 ^^^^ Consumer Goods Private Printing 4389 0 4 3 ^ 6twf'd 〇c / 008 A? _ B7 V. Description of the invention (>) To make the machine easy to manage, then go to step 2 and perform a ventilation step on the machine so that the gas remaining in the machine will not be caused by turning on the machine. And leaked. Then, in order to properly perform the leak test after the subsequent reaction chamber, process parts are combined with the reaction chamber top cover, the process parts need to be completely disassembled and cleaned, so step 3 is performed to disassemble the process kits to facilitate subsequent For cleaning, the process parts are arranged inside the top of the reaction chamber where the reaction gas is stored. Various parts for processing the reaction gas such as heater, showerhead, blocker plate, and mixed block Block) and quartz tube (Quartz Tube) and other process parts must be disassembled, and then proceed to step 4, process parts cleaning, so that the reaction residues are completely removed from the process parts, proceed to step 5, the reaction chamber wall cleaning, so that The residue on the inner wall of the reaction chamber was completely removed. These two steps are to prevent any residues from remaining inside the parts and reaction chamber during the previous process, which will affect the subsequent process. Next, go to step 6 to bake process parts to completely remove the moisture contained in each process part. Then go to step 7 to combine process parts and combine all process parts to prepare for a leak test. The stomach is then subjected to the step 8 helium leak test to ensure that the various parts of the reaction chamber are well bonded and that there is no air leakage between the reaction chamber and the top of the reaction chamber. Then, perform the calibration, reaction chamber heating, software leak rate check, and test machine% steps' to complete the restart process. The conventional resumption procedure must go through complicated procedures, consume a lot of time and manpower, affect the overall production capacity, and the frequency of disassembly and assembly of process parts is too high, which may cause leakage after installation due to inaccurate artificial assembly. Qixian 4 paper sizes Chengchuan.K National Monument (('NS) (21〇X297 ^ vf) -------- Installation ------ Order ------- ^ ( " Read the precautions before filling in this page) 438904 3956nv, doc / 0〇SA? B7 V. Description of the invention ($). Therefore, the object of the present invention is to provide a leak detection device. The leak detection device tests the device for gas leakage or not, which can simplify the process of knowing side leaks. In view of this, the present invention provides a leak detection device, which can be used to easily check whether a process machine is leaking. Gas, greatly simplifies the process of resuming the machine. In order to achieve the above-mentioned purpose, the present invention provides a leak detection device and a 10 ring. The leak detection device contains a 0 ring groove. After the 0 ring is placed in the 0 ring groove, the leak test is performed. The device can be tightly integrated with other devices through the 0 ring. When performing leak detection, first pre-treat the machine. The air extraction step is performed. Next, while removing the reaction chamber top cover and cleaning the reaction chamber wall, place a 10-ring groove in the leak detection device, and the leak detection device is tightly combined with the reaction cover top through the 0 ring. A pressure gauge is installed in the measurement hole of the leak detection device, and the entire leak detection device and the top of the reaction chamber are evacuated. If a specific pressure of helium is provided externally, the pressure measured by the pressure gauge should be Still approaching vacuum. By using this leak detection device to perform leak detection corresponding to the roof of the room, the complicated steps of disassembling process parts can be saved > the conventional leak detection process is greatly simplified. In order to make the above and other purposes of the present invention , Features, and advantages can be more obvious and easy to understand, a preferred embodiment is given below, and in conjunction with the accompanying drawings, the detailed description is as follows: Brief description of the drawings: Figure 1 is a preferred implementation according to the present invention For example, a top view of a leak detection device; and 5 paper silver ruler Cheng Chengzhou KS Jiaxuanling (('NS) Λ4 size (2 彳 0X297 mm) ---------- install ------- --- Order ------ Bin (I read the precautions first and then write this page trivially ) 43890 4 A7 3956twt doc / 008 __ B7 V. Description of the invention (b) Figure 2 is a side view of a leak detection device according to a preferred embodiment of the present invention. Marking description of the drawing: 100: main structure 104 : Groove 106: Ο ring groove 110: hole 1 1 2: measuring hole penetration example 1 is a top view of a leak detecting device according to a preferred embodiment of the present invention; and FIG. 2 is a plan view according to the present invention A preferred embodiment is a side view of a leak detection device. Please refer to FIG. 1 and FIG. 2 at the same time. As it is conventional to check the leak of the reaction chamber cover, the reaction chamber cover assembly must be disassembled. There are many process parts inside, so the present invention provides a leak detection device for measuring whether the reaction chamber top cover leaks, and the reaction chamber top cover belongs to, for example, AMAT 'WCVD and HTF machines. The reaction chamber top cover is related to the leak detection device. With the help of leak detection device, you can check whether all parts of the reaction chamber cover are well combined. The leak detection device includes a main body structure, for example, aluminum (A1). The main body structure 100 has a groove 104 and a ring groove 106 around the groove. The main body structure 100 has a measuring hole 112 to make the groove. 104 communicates with a pressure gauge (not shown). The leak detection device of the present invention can be used to reduce the manufacturing process to 6 paper sizes. Chengchuan China K House Standard ((NS) Λ4 gauge) (210X 297 mm) --------- t-shirt-- ---- 11 ------ A (" Read the precautions of the back 15 before filling this page) 4389 0 4 A7 395 6twt'.doc / 008 B7 V. Description of the invention (t) Step 1: Pre- Treatment (make the reaction chamber easy to handle) Step 2: Air extraction (so that the remaining gaseous reactants are not leaked) Step 5: The inside of the reaction chamber (to completely remove the reaction residues) First, go to step 1, Perform pre-treatment, such as cooling, to make the machine easier to manage, and then proceed to step 2 to perform a ventilation step on the machine so that the gas remaining in the machine will not leak due to turning on the machine. After the top cover of the chamber, proceed to step 5. While the interior wall of the reaction chamber is being cleaned, insert 0 loops into the 0 ring groove 106 of the leak detection device. The leak detection device passes through the 0 ring and bolts are connected with the reaction chamber top cover Tightly binding. Basically, to test whether a device is leaking, connect the device and connect it to a pressure gauge to measure the air pressure inside the device. After evacuating the inside, and then providing an external air pressure and reading the pressure change of the pressure gauge, you can determine whether the device is leaking. Therefore, a pressure gauge is installed in the hole 110 of the leak detection device to measure the entire leak. After the device and the reaction chamber cover are evacuated, the pressure is measured to a pressure close to the vacuum, and then a helium gas of a specific pressure is provided externally. In theory, if the reaction chamber cover is tightly combined with the leak detection device, The measured pressure 値 should still be close to the vacuum, and will not be changed by the external supply of helium at a specific pressure. In this way, it can be confirmed that the various parts of the reaction chamber cover are well bonded and there is no connection with the leak detection device There will be no air leakage at any gap. Then, perform the steps of calibration, heating of the reaction chamber, software leak rate check, and test machine to complete the process of resuming the machine. However, the subsequent steps are well known to those skilled in the art No further details here. 7 The size of this paper is 1¾ house mark in Shizhou China (1 NS) Λ4 size (210X 297 mm) ----- /. (Please read the back of the note first (Fill in this page again) 438904

3956t\vf.doc/00S --_ B7 ' ------ I _ 五、發明説明(G) ^ 一一 但依照本發明則可以省卻習知如下之步驟: 步驟3 :製程零件拆解 歩驟4 :製程零件淸洗(使反應殘留物完全去除) 步驟6 :製程零件烘烤(使各零件所含的水氣完全去除) 步驟7 :製程零件組合 步驟8 :氦氣防漏測試(測試是否漏氣) 由上述本發明較佳實施例可知,應用本發明具有下列 優點。 (1) 省卻繁雜的復機程序,同時節省了時間與人力, 提高整體產能。 (2) 製程零件不需拆解,可以防止人爲阻裝之不確實 或安裝後的漏氣現象。 雖然本發明已以一較佳實施例揭露如上,然其並非用 以限定本發明,任何熟習此技藝者,在不脫離本發明之精 神和範圍內,當可作各種之更動與潤飾,因此本發明之保 護範圍當視後附之申請專利範圍所界定者爲準。 -- I Hr - I 1 I— - -- , 1 - i - - -- I n J— *J (誚先閲讀背面之注意事項再填寫本頁) "^•部屮女找"局卩T-消汾合竹"印4,'!不 r !. - ——----- | 一 __ _ — 本紙張尺度適州中國囤家標碑(HMS ) Λ4现格公t )3956t \ vf.doc / 00S --_ B7 '------ I _ V. Description of the invention (G) ^ One but according to the present invention, the following steps can be omitted: Step 3: Dismantling of process parts Step 4: Rinse the process parts (to completely remove the reaction residues) Step 6: Bake process parts (to completely remove the moisture contained in each part) Step 7: Process part combination Step 8: Helium leak proof test ( Test for air leakage) From the above preferred embodiments of the present invention, it can be known that the application of the present invention has the following advantages. (1) Eliminates the complicated resumption procedures, saves time and manpower, and improves overall productivity. (2) The process parts do not need to be disassembled, which can prevent the artificial obstruction or air leakage after installation. Although the present invention has been disclosed as above with a preferred embodiment, it is not intended to limit the present invention. Any person skilled in the art can make various modifications and decorations without departing from the spirit and scope of the present invention. The scope of protection of the invention shall be determined by the scope of the attached patent application. -I Hr-I 1 I—--, 1-i---I n J— * J (诮 Please read the precautions on the back before filling this page) " ^ • 部 屮 女 找 " Bureau卩 T-xiaofenhezhu " Ink 4, '! 不 r!.-——----- | __ _ — This paper size Shizhou China Storehouse Marker (HMS) Λ4 )

Claims (1)

438904 3 95 6twf 1.d oc/00 2 第Κ·712〇7〇9號專利範園修正本438904 3 95 6twf 1.d oc / 00 2 Amended version of Patent Model Park No. K712120079 年 月 修正曰期S9M2 ~g9.12. 5 修煩 手請 ί委f i 無明 更 容、i多月 否/ 修所 正遂 c之 經濟部智慧財產局員Η消費合作社印製 申請專利範圍 1‘一種半導體製程之測漏裝置,可裝設在一半導體機 台的反應室頂蓋,並透過一·壓力計量測氣壓,該半導體製 程之測漏裝置包括: 一主體結構’該主體結構上含有一凹槽,及-量測 孔’該凹槽經由該量測孔與壓力計相互接通。 2. 如申請專利範圍第1項所述之半導體製程之測漏裝 置,其中該凹槽周圍包含一 0環槽。 3. 如申請專利範圍第1項所述之半導體製程之測漏裝 置,其中該半導體製程測漏裝置之材質包括鋁。 4. 一種反應室頂蓋測漏方法,該方法使用一壓力計來 量測一反應室頂蓋之氣壓,該方法至少包括: 提供一半導體製程之測漏裝置; 將該半導體製程之測漏裝置與該反應室頂蓋相結 合; 將該半導體製程之測漏裝置連接至一壓力計; 對該反應室頂蓋抽真空; 於外部提供一氦氣:以及 讀取該壓力計之一壓力値。 5. 如申請專利範圍第4項所述之測漏方法,其中結合 該半導體製程之測漏裝置與該反應室之方法包括栓入複數 個螺絲。 6. 如申請專利範圍第5項所述之測漏方法,其中將該 半導體製程之測漏裝置與該反應室頂蓋相結合之方法包 括: 本紙張尺度適用中國國家標準(CNS)A4規格(210 X 297公釐) f琦先閱讀背面之注意事項再填寫本頁) 訂---------線 88895 ABCD 六、申請專利範圍 提供一 〇環; 將該0環置入該0環槽;以及 將該半導體製程之測漏裝置透過該〇環與該反應室 頂蓋緊密結合。 7. 如申請專利範圍第4項所述之測漏方法,其中將該 半導體製程之測漏裝置連接至一壓力計之方法包括將該壓 力計與該量測孔相互連結。 8. 如申請專利範圍第4項所述之測漏方法,其中該半 導體製程測漏裝置之材質包括鋁。 9. 如申請專利範圍第4項所述之測漏方法,其中該壓 力値應如趨近於零,則表該反應室頂蓋沒有漏氣。 (請先閱讀背面之注意事項再填寫本頁) 11-----訂---------線 經濟部智慧財產局員工消費合作社印製 本紙張又度適用中國國家標準(CNS)A4規格(210 X 297公釐)Year and month revision date S9M2 ~ g9.12. 5 Repair troubles, please ask 委 fi ignorance, more than a month no / repair institute is correct c member of the Intellectual Property Bureau of the Ministry of Economic Affairs Η consumer cooperatives printed application scope 1 'a A leak detection device for a semiconductor process can be installed on the top cover of a reaction chamber of a semiconductor machine, and the air pressure can be measured through a pressure measurement. The leak detection device for the semiconductor process includes: a main structure. The main structure contains a Groove, and -Measuring hole 'The groove is connected to the pressure gauge via the measuring hole. 2. The leak detection device for a semiconductor process as described in item 1 of the scope of patent application, wherein the groove includes a 0-ring groove. 3. The leak detection device for a semiconductor process as described in item 1 of the scope of patent application, wherein the material of the leak detection device for a semiconductor process includes aluminum. 4. A method for leak detection of a reaction chamber cover, which uses a pressure gauge to measure the pressure of a reaction chamber cover, the method at least comprises: providing a leak detection device for a semiconductor process; and a leak detection device for the semiconductor process Combined with the top cover of the reaction chamber; connecting the leak detection device of the semiconductor process to a pressure gauge; evacuating the top cover of the reaction chamber; providing a helium gas to the outside: and reading a pressure gauge of the pressure gauge. 5. The leak detection method as described in item 4 of the scope of the patent application, wherein the method of combining the leak detection device of the semiconductor process with the reaction chamber includes bolting a plurality of screws. 6. The leak detection method as described in item 5 of the scope of patent application, wherein the method of combining the leak detection device of the semiconductor process with the top cover of the reaction chamber includes: This paper size applies the Chinese National Standard (CNS) A4 specification ( 210 X 297 mm) f Qi first read the precautions on the back and then fill out this page) Order --------- line 88895 ABCD VI. Patent application scope provides a 10 ring; put the 0 ring into the 0 A ring groove; and the leak detection device of the semiconductor process is tightly combined with the top cover of the reaction chamber through the 0 ring. 7. The leak testing method as described in item 4 of the scope of patent application, wherein the method of connecting the leak testing device of the semiconductor process to a pressure gauge includes interconnecting the pressure gauge and the measuring hole. 8. The leak detection method described in item 4 of the scope of patent application, wherein the material of the semiconductor process leak detection device includes aluminum. 9. The leak test method as described in item 4 of the scope of the patent application, wherein if the pressure 値 should approach zero, it means that there is no air leakage in the top cover of the reaction chamber. (Please read the precautions on the back before filling out this page) 11 ----- Order --------- The paper printed by the Consumers' Cooperative of the Intellectual Property Bureau of the Ministry of Online Economics is in compliance with Chinese national standards (CNS ) A4 size (210 X 297 mm)
TW87120709A 1998-12-14 1998-12-14 Leak-detecting apparatus of semiconductor process TW438904B (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023004865A1 (en) * 2021-07-29 2023-02-02 长鑫存储技术有限公司 Leak detection trolley and leak detection method

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2023004865A1 (en) * 2021-07-29 2023-02-02 长鑫存储技术有限公司 Leak detection trolley and leak detection method

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