TW431898B - Energetic healer-a method and apparatus for improving the well-being of a human body - Google Patents

Energetic healer-a method and apparatus for improving the well-being of a human body Download PDF

Info

Publication number
TW431898B
TW431898B TW86110850A TW86110850A TW431898B TW 431898 B TW431898 B TW 431898B TW 86110850 A TW86110850 A TW 86110850A TW 86110850 A TW86110850 A TW 86110850A TW 431898 B TW431898 B TW 431898B
Authority
TW
Taiwan
Prior art keywords
scope
item
plating bath
patent application
bath
Prior art date
Application number
TW86110850A
Other languages
Chinese (zh)
Inventor
Ones Chin Chou
Original Assignee
Ones Chin Chou
Chen Chia Nan
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ones Chin Chou, Chen Chia Nan filed Critical Ones Chin Chou
Application granted granted Critical
Publication of TW431898B publication Critical patent/TW431898B/en

Links

Classifications

    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/18Applying electric currents by contact electrodes
    • A61N1/32Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/36Applying electric currents by contact electrodes alternating or intermittent currents for stimulation
    • A61N1/36014External stimulators, e.g. with patch electrodes
    • A61N1/36021External stimulators, e.g. with patch electrodes for treatment of pain
    • AHUMAN NECESSITIES
    • A61MEDICAL OR VETERINARY SCIENCE; HYGIENE
    • A61NELECTROTHERAPY; MAGNETOTHERAPY; RADIATION THERAPY; ULTRASOUND THERAPY
    • A61N1/00Electrotherapy; Circuits therefor
    • A61N1/18Applying electric currents by contact electrodes
    • A61N1/32Applying electric currents by contact electrodes alternating or intermittent currents
    • A61N1/326Applying electric currents by contact electrodes alternating or intermittent currents for promoting growth of cells, e.g. bone cells

Landscapes

  • Health & Medical Sciences (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Animal Behavior & Ethology (AREA)
  • General Health & Medical Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Biomedical Technology (AREA)
  • Nuclear Medicine, Radiotherapy & Molecular Imaging (AREA)
  • Radiology & Medical Imaging (AREA)
  • Veterinary Medicine (AREA)
  • Public Health (AREA)
  • Orthopedic Medicine & Surgery (AREA)
  • Cell Biology (AREA)
  • Pain & Pain Management (AREA)
  • Biophysics (AREA)
  • Heart & Thoracic Surgery (AREA)
  • Electrotherapy Devices (AREA)
  • Chemically Coating (AREA)

Abstract

Methods and apparatus are provided for improving the well-being of a human body. For the case of apparatus, such apparatus includes a stimulating mechanism for stimulating a human body with reoccurring bursts of energy. Such apparatus further includes a sensing mechanism for sensing the heartbeat of the human body and a synchronizing mechanism coupled to the stimulating mechanism and to the sensing mechanism for synchronizing the stimulation with the heartbeat of the human body by causing the energy bursts to occur at the same rate as the heartbeat of the human body. The synchronizing mechanism includes adjustable time delay circuitry for causing successive energy bursts to occur at the same relative point in successive heartbeat cycles such point being adjustable so as to occur at a selected position in the heartbeat cycle.

Description

五、新型說明: 【新型所屬之技術領域】 種化學麟裝置,尤其是—種可提升於待 積薄膜的均一性的化學鍍浴裝置。 又 之冰 【先前技術】 化學鍍鎳技術係採用金屬鹽及還原劑,於材料表面 催化反應獲得之紐。化學_層具魏高之 自 馬耐磨性、與基體結合力強、不受製件形狀限制等優點。化與 鑛錦技術廣泛應用於石油、化工、電子、航太、汽車等工業二 化學鍍錄可戦f鍍層由於電流分佈碼_而帶來之厚度 不均勻’電鍍層之厚度於整個零件尤其係形狀複雜之零件= 異車又大’料之邊角及離陽極近之部位,鍍層較厚,而於内表 面或離_遠之地方錄層很薄,甚至鍍不到,採用化學鑛可 免電鍍此不足。 x 影響化學麟厚度均雅之因素健存在。祕受欲鑛物 件表面析出之氫氣流及鍍液濃度差異之影響,外殼之鍍層均勻 度仍有差異。為了保證外殼鍍層之均勻性及理想之鍍速,化學 鎪鎳槽必須配液娜裝置,使具有—定流速,以及時 驅開欲鐘物件表Φ之氣泡,消除鍍麟度差異,並避免鑛液局 部過熱而造成鎳於鍍槽表面析出。 如第一圖所示,習知技術之化學鍍裝置的示意圖。其中化 學鍛裝置10採用有空氣授摔系統,化學鑛裝置1 〇〇包括.主 體110 ’用於谷納鑛液,一設於主體11〇上方之吊臂掛台120, 用於懸掛欲鍍物件130;設於主體11Q内部底端之多孔管道 14^’其外接充氣裝置(圖未示>該充氣裝置向多孔管道充氣, »亥夕孔官道140產生許多氣泡向上運動,氣泡可將欲鍍物件表 面130產生之氫氣微氣泡帶走並向外排放,藉以完成化學鍍。 請參考中國大陸專利公告號第981〇8482 6號之申請案的採 用振動裝置德學鍍裝置。如第二騎示,習知技術之振動裳 置之化學織置的示意圖,化學鍍裝置包括有:主體21〇, 用於容納鍍液,·振動支架22Q,其通過若干支樓彈簧27〇連接 於主體210上端,·振動支架22〇包括兩伸入槽液之振動幅架 220a、220b ;振動棒280連接於兩振動幅架2施、2施,振 動棒28G設有若干振動葉片290 ;振動馬達250連接振動支架 220及重里平衡器260。化學鍍裝置2〇〇通過振動馬達25〇控 制振動支架220及振動棒28〇,使振動葉片290授拌槽液達到 去除氫氣泡之目的。 然而習知技術之缺點在於雖然可透過在化學槽中設置溶液 獅裝置將氣泡去除,但注入於主體21〇中的錢液通常至少要 在50至300公升之間,因此主體的深度及容納空間必需要足 夠大才液攪拌裝置設置,*為了要讓這種數量的鑛液產 生適當的擾流’溶液娜裝置必須要具備相當大的動力才能透 過授拌而產生擾流’但是在搜拌過程中卻會導致溶液中的化學 分子變亂’因此分子不易均勻的沉積於欲鍍物件13上,結果 成奴鑛物件13〇上的薄膜均勻性不一。雖可透過加裝循 %:系統—IS以改善分子過亂的情形,但是循環祕會增加成 本’且實際上其只能稍加改善分子過亂的情形。 有馨於此,提供一種具有結構簡單、能耗低以及鑛膜均勻 性良好之化學鍍裝置實爲必要。 M431898 【新型内容】 提m主f目的在於提供一種化學鍍浴裝置,其係用以 ^升韻讀上所沉積薄膜的均—性,並可大幅降低藥液使用 秘縣,尤其糊條驗浴触面高度 :rrr吏金屬離子正向沉積金屬薄膜於 面上’藉以達成金屬_的_均—化的目的。的表 —為達上述目的’本創作之具體技術手段包含有—容器、一 力;熱裝置,該容器具有一容置空間,該容置空間且 液浴係注人於該容置空間中,該藥液浴具 浴面高度至少低於該容置深度,其中該浴面 ί Τ該藥液浴可置入-待齡該加熱 裝置用以對η亥樂液》谷行加熱作用。 …、 其中當藥液浴的浴面高度在3〇公分以下時,藥液浴的 特別集中於特定區域,而是讓金屬離子平均的散= 液勝裝纖術啊她靖 目的,再糟由適當調整溫度以激化藥液浴中的金屬離子^金 屬離子正向_金屬薄闕於顧元件的表面上,進而 屬溥膜層的_均-化、降低藥液使用量及節省原料成 的0 5 【實施方式】 以下配合圖式及元件符號對本創作之實施方式做更詳細的 說明’俾使熟習該項技藝者在研讀本說明書後能據以實施。 二閱第二圖’本創作之化學祕裳置之示意圖。本創作係 :,、2提升於待鍍元件上之沉積薄_均-性的-種化學鍍 同其中化學鍍浴裝置係包含有容器卜藥液浴3及加熱 裝置(圖面未顯示)。 # m!的内部具有可容納液體的容置空間1卜容置空間11 八二二置木度,較佳的容器1❾容置深度di為大於25 二Γ、ΐ:容器的較佳實施物可以是耐熱的玻璃器孤、塑 •ί::二央盗皿或金屬器皿,其中玻璃器皿可以是玻璃燒瓶 或玻,管,石^器皿可以是石英燒瓶或石英試管。 声,金施例中’金屬11皿咖表面上形成有一塑膠 二學::屬器:熱快且熱傳導性優異的特性,塑膠層可防 藥液浴3係容置於容詈办〗士# n . 】11中,樂液浴3係透過將藥液注入 於奋置空間11裡所形成的 浴面高度Μ至少要低於容置3具有冷面南度I __ H)〜3Q公分之間。‘ 有還原劑之齡浴。 /、巾綠Ή別讀金浴及含 3中可置入欲進行化學沉積 ==:;待鑛元件5雖呈水平狀態,‘元^ 直式或傾顯示的為限’待鍍元件5還能以垂 1中待铲:侔r置於藥液浴3中進行化學沉積鍍膜處理。 八中待鍍讀5可以是印刷電路板(printedc_it M431898 board,PCB)、用於製造太陽能元件的基材、用於製造半導體元 件的基材翻於製造發光二極體元件的基材。加熱裳置(圖^ 未顯示)用以對藥液浴3行加熱作用。 Λ 當待鍍基板5浸入於藥液浴3時,透過加熱農置(圖 ,不)將藥祕3加熱至適當的溫度,要注意的是,本創作的 藥液浴3並不需通電’而是透過待鍍元件5表面之元素與藥液 :谷3的組賴分之間的化學還化,促使藥液浴3中的金^ 離子穩定膽速的正向沉積於待鍍元件3的表面上以形成尸 f均勻的金屬細層。其中加熱裝置可設置於容器的内部: .器的外部。 一 由於本創作將浴面高度hl控制於適#高度範財,& 藥液浴3的藥液量,驗得注意的是,當藥液浴/二 =问度hi只在30公分之内時’藥液浴3的金屬離子的不會 本中於某-塊區域,而是讓金屬離子平均的散佈於藥液浴^ 的各處’因此本創作不需要增設溶液裝置或循環裝置 可達到使金屬離子濃度均勻分佈的目的。 产元件5置入於藥液浴3中時,藉由適當調整溫 ί薄中的金屬離子,使金屬離子正向沉積金 化的㈣件5的表面上,進而達成金屬薄膜的薄膜均一 化的目的’、且還可降健液制量,節省原料成本。 據僅為肋轉梢作之健實_,並非企圖 =對本創作做任何形式上之限制,是以,凡有在相同之創作 二創作之任何修飾或變更,皆仍應包括在本創 7 M431898 【圖式簡單說明】 第一圖為習知技術之化學鍍裝置的示意圖。 第二圖為習知技術之振動裝置之化學鍍裝置的示意圖。 第三圖為本創作之化學鍍浴裝置之示意圖。 【主要元件符號說明】 1槽體 11容置空間 3藥液浴 5待鍍元件 dl容置深度 hi浴面高度 110主體 120吊臂挂卜台 130欲鍍物件 140多孔管道 210主體 220振動支架 260重量平衡器 270支撐彈簧 220a、220b振動幅架 280振動棒 290振動葉片 250振動馬達V. Description of the new type: [Technical field to which the new type belongs] A chemical lin device, in particular, a chemical plating bath device that can improve the uniformity of the film to be deposited. Another ice 【Previous technology】 Electroless nickel plating technology uses metal salts and reducing agents to catalyze reactions on the surface of materials. The chemical layer has the advantages of high wear resistance by Wei Gao, strong bonding with the substrate, and no restrictions on the shape of the product. Chemical and mineral bromide technologies are widely used in petroleum, chemical, electronics, aerospace, automotive and other industries. Electroless plating. The thickness of the plating layer is uneven due to the current distribution code. Parts with complex shapes = large corners of different materials and parts close to the anode, the coating is thicker, but the recording layer is thin on the inner surface or away from the _, and even can not be plated, using chemical ore can avoid This plating is insufficient. x Factors affecting the uniformity of the thickness of chemical substrates are present. Due to the influence of the hydrogen flow and the difference in the concentration of the plating solution on the surface of the desired mineral parts, the coating uniformity of the shell is still different. In order to ensure the uniformity of the coating on the shell and the ideal plating speed, the chemical nickel bath must be equipped with a liquid nano device, which has a constant flow rate and timely drives the air bubbles of the object table to eliminate the difference in plating degree and avoid ore Local overheating of the liquid caused nickel to precipitate on the surface of the plating bath. As shown in the first figure, a schematic view of a conventional electroless plating apparatus. Among them, the chemical forging device 10 adopts an air drop system, and the chemical mining device 100 includes a main body 110 'for Guna mineral liquid, and a boom hanging table 120 provided above the main body 110 for hanging objects to be plated. 130; a porous pipe 14 ^ provided at the inner bottom end of the main body 11Q and its external inflation device (not shown)> the inflation device inflates the porous pipe, »Haixi Kongguan Road 140 generates many bubbles to move upwards, and the bubbles can move the desired The hydrogen micro-bubbles generated on the surface of the plated object 130 are taken away and discharged outward to complete the chemical plating. Please refer to the application of the Chinese Patent Publication No. 981088486 for the morale plating device using a vibration device. The electroless plating device includes: a main body 21o, which is used to receive the plating solution, and a vibrating support 22Q, which is connected to the upper end of the main body 210 through a number of building springs 27o. · Vibration support 22〇Includes two vibration frames 220a and 220b that extend into the tank fluid; the vibration rod 280 is connected to the two vibration frames 2 and 2; the vibration rod 28G is provided with a number of vibration blades 290; the vibration motor 250 is connected to the vibration support 220 and gravity balancer 260. The electroless plating device 200 controls the vibration support 220 and the vibration rod 28 through the vibration motor 25, so that the vibration blade 290 stirs the tank liquid to achieve the purpose of removing hydrogen bubbles. However, the disadvantage of the conventional technology is that Although the bubble can be removed by installing a solution lion device in a chemical tank, the money liquid injected into the main body 21 is usually at least 50 to 300 liters. Therefore, the depth of the main body and the storage space must be large enough to stir the liquid. Device settings, * In order to generate appropriate turbulence for this amount of mineral fluid, the solution must have considerable power to generate turbulence through mixing, but it will cause The chemical molecules are disordered ', so the molecules are not easy to be uniformly deposited on the object 13 to be plated. As a result, the uniformity of the films on the mineral parts 13 is not uniform. However, the circulation secret will increase the cost ', and in fact it can only slightly improve the situation of molecular chaos. There is a good idea here, to provide a simple structure, low energy consumption and a mineral film A good electroless plating device with good uniformity is really necessary. M431898 [New content] The main purpose of raising m is to provide an electroless plating bath device, which is used to read the uniformity of the deposited film and can greatly reduce it. The medicinal solution is used in Mixian County, especially the height of the contact surface of the bath: rrr official metal ions are being deposited on the surface 'to achieve the purpose of _ homogenization of the metal. Table-to achieve the above purpose' this creation The specific technical means include a container, a force, and a thermal device. The container has a containing space, and the containing space is filled with the liquid bath. The bath surface height of the medicated liquid bath is at least low. At the accommodating depth, the bath surface of the medicinal liquid bath can be placed in the heating device to be used for heating the η Haile liquid "guxing". …, When the height of the bath surface of the medicinal solution bath is below 30 cm, the medicinal solution bath is particularly concentrated in a specific area, but the metal ions are evenly dispersed. Properly adjust the temperature to stimulate the metal ions in the liquid bath. The metal ions are forward _ the metal is thin on the surface of the element, and then belongs to the _ homogenization of the film layer, reducing the amount of chemical liquid used and saving raw materials 5 [Embodiment] The following describes the implementation of this creation in more detail with drawings and component symbols, so that those skilled in the art can implement it after studying this manual. Second look at the second picture 'The schematic diagram of the chemical secret dress of this creation. This creative department: The deposition thin layer promoted on the element to be plated is _ homogeneous-a kind of electroless plating. The electroless plating bath device includes a container bath 3 and a heating device (not shown in the figure). # m! The interior has a liquid-accommodating space 1 and an accommodation space 11 222, the preferred container 1 ❾ accommodating depth di is greater than 25 Γ, ΐ: the preferred embodiment of the container can It is a heat-resistant glassware or plastic. :: Eryang pirate or metalware, where glassware can be glass flask or glass, tube, and stoneware can be quartz flask or quartz test tube. Sound, in the golden example, there is a plastic secondary school formed on the surface of the metal 11 dish coffee :: Apparatus: fast heat and excellent thermal conductivity, the plastic layer can prevent the medicinal liquid bath. n.】 11, the bath liquid 3 formed by injecting the medicinal solution into the Fenzhi space 11 has a bath surface height M that is at least lower than that of the storage 3 and has a cold surface south degree I __ H) ~ 3Q cm . ‘Age bath with reducing agent. / 、 Please do not read gold baths and towels containing 3 of them. You can place them for chemical deposition == :; although the element 5 to be mined is in a horizontal state, the 'element ^ vertical or tilt display is limited.' The element to be plated 5 is also Can be shovel in the vertical: 1r is placed in the chemical liquid bath 3 for chemical deposition coating treatment. The 5 to be plated and read 5 can be a printed circuit board (printedc_it M431898 board, PCB), a substrate for manufacturing a solar element, a substrate for manufacturing a semiconductor element, and a substrate for manufacturing a light emitting diode element. The heating clothes (Figure ^ not shown) are used to heat the 3 rows of the medicinal solution bath. Λ When the substrate 5 to be plated is immersed in the medicinal solution bath 3, the medicinal solution 3 is heated to an appropriate temperature by heating the farm (figure, no). It should be noted that the medicinal solution bath 3 of this creation does not need to be energized. It is through the chemical conversion between the elements on the surface of the element 5 to be plated and the composition of the medicinal solution: Valley 3, which promotes the stable deposition of gold ions in the medicinal solution bath 3 to the positive direction of the element 3 to be plated. On the surface to form a thin layer of uniform metal. The heating device can be arranged inside the container: outside of the device. First, because the height of the bath surface is controlled to a proper height in this work, the volume of the liquid medicine in the liquid medicine bath 3, it is noticed that when the liquid medicine bath / 二 = 问 度 hi is only within 30 cm At the time, the metal ions of the medicinal solution bath 3 will not be localized in a certain block area, but the metal ions will be evenly distributed throughout the medicinal solution bath. Therefore, this solution does not require the addition of a solution device or a circulation device. The purpose of making the metal ion concentration uniformly distributed. When the production element 5 is placed in the medicinal liquid bath 3, the metal ions in the thin layer are appropriately adjusted so that the metal ions are deposited on the surface of the metalized piece 5 in a forward direction, thereby achieving a uniform film thickness of the metal thin film. Purpose ', and can also reduce the volume of health solution, saving raw material costs. According to the fact that it is only a sound work, it is not an attempt to restrict the creation in any form. Therefore, any modification or change in the same creation 2 should still be included in this creation 7 M431898 [Schematic description] The first diagram is a schematic diagram of a conventional electroless plating device. The second figure is a schematic diagram of an electroless plating device of a vibration device of the conventional technology. The third picture is a schematic diagram of the chemical plating bath device created. [Description of main component symbols] 1 tank body 11 accommodating space 3 medicinal liquid bath 5 components to be plated dl accommodating depth hi bath surface height 110 main body 120 boom hanging platform 130 object to be plated 140 porous pipe 210 main body 220 vibration support 260 Weight balancer 270 supports springs 220a, 220b vibration web 280 vibration rod 290 vibration blade 250 vibration motor

Claims (1)

98 六、申凊專利範圍: 1.=化學鍍浴裝置,係包含有: 一該容轉有—容置空間,該容置空 :贼:,係注入於該容置空間中,該藥液浴具有 二面^該容置深度,其中該浴面高度須於二 樂液/合可置入一待鍍元件;以及 一加紐置,用崎祕行加熱作用。 2.依據申請專利範圍第1 可以是耐熱的一坡璃器盟 |§皿的至少其中之—。 項所述之化學鍍浴裝置,其中該容器 、一塑膠器皿、一石英器皿及一金屬 3. :依據申請專利範圍第2項所述之化學鍍浴裳置,其中該玻璃 器皿可以是玻璃燒瓶及玻璃試管之至少其中之一。 4. 依據申請專利範圍第2項所述之化學鍍浴裝置,其中該石英 态皿可以是石英燒瓶及石英試管之至少其中之一。 5. 依據申請專利範圍第2項所述之化學鍍浴裝置,其中該金屬 器皿的内表面上形成有一顰膠層。 6·依據申請專利範圍第1項所述之化學鍍浴裝置,其中該待鍵 元件能以水平狀態、垂直狀態及傾斜狀態之至少其中之一而放 置於該藥液浴中。 7. 依據申請專利範圍第1項所述之化學鍍浴裝置,其中該待鍍 元件可以是印刷電路板、用於製造太陽能元件的基材、用於製 造半導體元件的基材及用於製造發光二極體元件的基材的至少 其中之一。 8. 依據申請專利範圍第1項所述之化學鍍浴裝置,其中該藥液 洛可以是一鐘金浴及含有還原劑之一鍵金浴之至少其中之一。98 VI. Application scope of patent: 1. = Electroless plating bath device, which includes:-the container should be transferred-containing space, the container is empty: thief: it is injected into the container space, the liquid medicine The bath has two sides ^ the accommodation depth, wherein the height of the bath surface must be placed in an element to be plated in Erle solution / coupling; 2. According to the scope of the patent application, the first one may be at least one of the heat-resistant glassware. The chemical plating bath device described in the item, wherein the container, a plastic vessel, a quartz vessel, and a metal 3: according to the chemical plating bath set described in the second item of the patent application scope, wherein the glass vessel may be a glass flask And at least one of glass test tubes. 4. The electroless plating bath device according to item 2 of the scope of the patent application, wherein the quartz state dish may be at least one of a quartz flask and a quartz test tube. 5. The electroless plating bath device according to item 2 of the scope of the patent application, wherein the inner surface of the metal vessel is formed with an adhesive layer. 6. The chemical plating bath device according to item 1 of the scope of the patent application, wherein the element to be bonded can be placed in the chemical bath in at least one of a horizontal state, a vertical state, and an inclined state. 7. The chemical plating bath device according to item 1 of the scope of patent application, wherein the element to be plated may be a printed circuit board, a substrate for manufacturing a solar element, a substrate for manufacturing a semiconductor element, and a light emitting element. At least one of the substrates of the diode element. 8. The chemical plating bath device according to item 1 of the scope of the patent application, wherein the chemical solution can be at least one of a gold bath and a bond gold bath containing a reducing agent.
TW86110850A 1996-08-01 1997-10-02 Energetic healer-a method and apparatus for improving the well-being of a human body TW431898B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US69109396A 1996-08-01 1996-08-01

Publications (1)

Publication Number Publication Date
TW431898B true TW431898B (en) 2001-05-01

Family

ID=24775130

Family Applications (1)

Application Number Title Priority Date Filing Date
TW86110850A TW431898B (en) 1996-08-01 1997-10-02 Energetic healer-a method and apparatus for improving the well-being of a human body

Country Status (3)

Country Link
CN (1) CN1101707C (en)
TW (1) TW431898B (en)
WO (1) WO1998005379A1 (en)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6450942B1 (en) * 1999-08-20 2002-09-17 Cardiorest International Ltd. Method for reducing heart loads in mammals
US8032207B2 (en) * 1999-08-20 2011-10-04 Cardiola Ltd. Counter pulsation electrotherapy apparatus for treating a person or a mammal
WO2002066112A1 (en) * 2001-02-20 2002-08-29 Cardiorest Ltd. Apparatus for treating a living organism to achieve a heart load reduction, and a method of achieving a heart load reduction
IL166571A (en) 2002-08-05 2012-05-31 Japan Government Medical treatment system using native biological regulatory function and cardiac pacing system, blood pressure regulating system and cardiac disease treatment system based on the medical system
FR2869808B1 (en) * 2004-05-04 2012-02-03 Marc Pujo MUSCLE NEURO STIMULATION APPARATUS FOR LEGS WITH EQUIVALENT HEART RHYTHM FREQUENCY
CN101073083B (en) 2004-11-12 2012-04-25 皇家飞利浦电子股份有限公司 Message integrity for secure communication of wireless medical devices
AT10617U1 (en) 2007-04-20 2009-07-15 Szeles Jozsef Constantin Dr DEVICE FOR PUNCTUAL STIMULATION
CN103127612A (en) * 2013-03-04 2013-06-05 任国祚 Pain-relief instrument for critical patient
CN103432685A (en) * 2013-08-20 2013-12-11 任国祚 Drug rehabilitation device
CN106552319A (en) * 2015-09-28 2017-04-05 赵信荣 Electrizer structure-improved and its control method
CN111035554A (en) * 2019-12-30 2020-04-21 上海开司绫纺织科技有限公司 Medical physiotherapy method based on heartbeat synchronization
CN111939423B (en) * 2020-06-29 2022-07-12 杨铭轲 Sleep-in guiding method and device based on self-heartbeat rhythm and computer equipment
US20230293900A1 (en) * 2022-03-15 2023-09-21 Imutec SAS Device for cardiologic magnetic and optical stimulation
WO2024163005A1 (en) 2023-01-30 2024-08-08 The Procter & Gamble Company Aerosol dispenser containing a hairspray composition and a nitrogen propellant
CN118011932A (en) * 2024-02-26 2024-05-10 重庆宁来科贸有限公司 Selection determination type control circuit

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4038976A (en) * 1975-03-14 1977-08-02 Hardy Frank M Pulse indicator
JPS5578935A (en) * 1978-12-12 1980-06-14 Saito Iwao Heart beat bioofeedback device

Also Published As

Publication number Publication date
CN1101707C (en) 2003-02-19
CN1207948A (en) 1999-02-17
WO1998005379A1 (en) 1998-02-12

Similar Documents

Publication Publication Date Title
TW431898B (en) Energetic healer-a method and apparatus for improving the well-being of a human body
CN1223702C (en) Plating method of metal film on surface of polymer
JP2734269B2 (en) Semiconductor manufacturing equipment
US8622020B2 (en) Simultaneous electroless plating of two substrates
CN105296977B (en) A kind of method for entering row metal electroless deposition based on lysozyme two-dimensional nano-film
TW200946217A (en) Microfluidic self-sustaining oscillating mixers and devices and methods utilizing same
TW200811940A (en) Substrate cleaning equipment
CN111910242B (en) Electroplating method and device for printed circuit board
CN106672897A (en) Array type silver nano-pillar coated with gold film at its surface and preparation method thereof
Kolasinski Bubbles: A review of their relationship to the formation of thin films and porous materials
TWM431898U (en) Electroless plating bath device
CN209478731U (en) Micropin mold
TWI690620B (en) Electroless plating device and manufacturing method of metallized substrate
CN205249520U (en) Coil panel and electromagnetic heating equipment
CN108486552A (en) A kind of preparation method of surface of polymer substrates high quality chemical coating
TW202136593A (en) Plating apparatus and plating method
CN209478729U (en) Micropin mold and mold
CN104593257A (en) Three-dimensional cell assembly device and method based on movable electrode
CN105798306B (en) 3D metal printing system and method
CN207176107U (en) A kind of electroplate liquid preparation facilities
CN207996309U (en) A kind of facilitate inhales fair baby bottles
CN1114718C (en) Method of electromolding tridimensional metal structure directly on silicon substrate and the special fixture thereof
CN208031563U (en) Ultrasonic atomization decontamination system and comprising its activity disinfection board house
JPS59501633A (en) Processing method of electroless plating solution and electroless plating method
JP2004059985A (en) Wafer plating apparatus and wafer plating method

Legal Events

Date Code Title Description
GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees