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Priority claimed from US08/877,270external-prioritypatent/US5873511A/en
Application filed by Tzeng Jung TingfiledCriticalTzeng Jung Ting
Application grantedgrantedCritical
Publication of TW430582BpublicationCriticalpatent/TW430582B/en
The placement of solder ""balls"" in a Ball Grid Array is accomplished by placing a solder strip in contact with the top surface of the ball grid array carrier. The pulsing of a laser directed at the solder in discrete positions permits the transfer of the solder to the gold dot, of the array of dots, on the carrier in registry with the laser output when activated. Selective solder placement is possible and increasingly higher throughput is achieved by the use of laser diode bars or optical fiber fans to effect solder transfer to a plurality of dots of the array simultaneously. The entire process can be automated by making the solder strip continuous through a recycling station arranged along a path along which the solder strip moves to the position where the carrier and the solder strip are moved into juxtaposition. The use of a transparent strip with a pattern of holes filled with solder paste permits easy transfer of the solder to the gold dots or islands on the carrier in registry with laser beam.
TW87115756A1997-06-171998-09-22Apparatus and method for forming solder bonding pads
TW430582B
(en)
Improved methods for wire-scribing filament circuit patterns with planar and non-planar portions; improved wire-scribed boards, interconnection cards, and smart cards made by these methods