TW430204U - Electrical connector having recessed solderball foot - Google Patents

Electrical connector having recessed solderball foot

Info

Publication number
TW430204U
TW430204U TW088201588U TW88201588U TW430204U TW 430204 U TW430204 U TW 430204U TW 088201588 U TW088201588 U TW 088201588U TW 88201588 U TW88201588 U TW 88201588U TW 430204 U TW430204 U TW 430204U
Authority
TW
Taiwan
Prior art keywords
solderball
foot
recessed
electrical connector
connector
Prior art date
Application number
TW088201588U
Other languages
English (en)
Inventor
James P Scholz
James J Cain
Peter P Wilson
Original Assignee
Whitaker Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker Corp filed Critical Whitaker Corp
Publication of TW430204U publication Critical patent/TW430204U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01R—ELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00—Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/50—Fixed connections
    • H01R12/51—Fixed connections for rigid printed circuits or like structures
    • H01R12/55—Fixed connections for rigid printed circuits or like structures characterised by the terminals
    • H01R12/57—Fixed connections for rigid printed circuits or like structures characterised by the terminals surface mounting terminals
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components
    • H05K3/3426—Leaded components characterised by the leads
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H05K3/3478—Applying solder preforms; Transferring prefabricated solder patterns
TW088201588U 1998-02-16 1999-02-01 Electrical connector having recessed solderball foot TW430204U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US09/024,048 US6116921A (en) 1998-02-16 1998-02-16 Electrical connector having recessed solderball foot

Publications (1)

Publication Number Publication Date
TW430204U true TW430204U (en) 2001-04-11

Family

ID=21818601

Family Applications (1)

Application Number Title Priority Date Filing Date
TW088201588U TW430204U (en) 1998-02-16 1999-02-01 Electrical connector having recessed solderball foot

Country Status (5)

Country Link
US (1) US6116921A (zh)
CN (1) CN1205702C (zh)
FR (1) FR2775133B1 (zh)
GB (1) GB2334387B (zh)
TW (1) TW430204U (zh)

Families Citing this family (20)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture
US6431889B1 (en) * 1997-12-23 2002-08-13 Berg Technology, Inc. High density edge card connector
US6371784B1 (en) 1999-12-02 2002-04-16 The Whitaker Corporation Zero insertion force contact for use with a pin grid array
JP3605564B2 (ja) * 2000-12-28 2004-12-22 日本圧着端子製造株式会社 接続用端子及びこの端子の回路基板への取付け方法
US7115986B2 (en) * 2001-05-02 2006-10-03 Micron Technology, Inc. Flexible ball grid array chip scale packages
SG122743A1 (en) 2001-08-21 2006-06-29 Micron Technology Inc Microelectronic devices and methods of manufacture
US6488513B1 (en) 2001-12-13 2002-12-03 Intercon Systems, Inc. Interposer assembly for soldered electrical connections
SG104293A1 (en) 2002-01-09 2004-06-21 Micron Technology Inc Elimination of rdl using tape base flip chip on flex for die stacking
SG115455A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Methods for assembly and packaging of flip chip configured dice with interposer
SG115456A1 (en) 2002-03-04 2005-10-28 Micron Technology Inc Semiconductor die packages with recessed interconnecting structures and methods for assembling the same
US6975035B2 (en) 2002-03-04 2005-12-13 Micron Technology, Inc. Method and apparatus for dielectric filling of flip chip on interposer assembly
SG111935A1 (en) 2002-03-04 2005-06-29 Micron Technology Inc Interposer configured to reduce the profiles of semiconductor device assemblies and packages including the same and methods
SG115459A1 (en) * 2002-03-04 2005-10-28 Micron Technology Inc Flip chip packaging using recessed interposer terminals
SG121707A1 (en) 2002-03-04 2006-05-26 Micron Technology Inc Method and apparatus for flip-chip packaging providing testing capability
US20040018773A1 (en) * 2002-07-29 2004-01-29 Fci Americas Technology, Inc. Printed circuit board assembly having a BGA connection
US20040036170A1 (en) 2002-08-20 2004-02-26 Lee Teck Kheng Double bumping of flexible substrate for first and second level interconnects
US6780028B1 (en) * 2002-12-06 2004-08-24 Autosplice Systems Inc. Solder reserve transfer device and process
US7479020B2 (en) * 2004-11-22 2009-01-20 Visteon Global Technologies, Inc. Electronic control module having an internal electric ground
US9142932B2 (en) * 2010-04-20 2015-09-22 Hon Hai Precision Industry Co., Ltd. Socket connector with contact terminal having oxidation-retarding preparation adjacent to solder portion perfecting solder joint
FR3021814B1 (fr) * 2014-08-08 2018-06-15 Commissariat Energie Atomique Connecteur pour la connexion en matrice entre un boitier et un support, comportant un corps principal plie

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4605278A (en) * 1985-05-24 1986-08-12 North American Specialties Corporation Solder-bearing leads
US4767344A (en) * 1986-08-22 1988-08-30 Burndy Corporation Solder mounting of electrical contacts
US5030144A (en) * 1990-04-13 1991-07-09 North American Specialties Corporation Solder-bearing lead
US5199884A (en) * 1991-12-02 1993-04-06 Amp Incorporated Blind mating miniature connector
US5442852A (en) * 1993-10-26 1995-08-22 Pacific Microelectronics Corporation Method of fabricating solder ball array
SG47417A1 (en) * 1993-11-15 1998-04-17 Connector Systems Tech Nv Solderable connectors for high density electronic assemblies
US5593322A (en) * 1995-01-17 1997-01-14 Dell Usa, L.P. Leadless high density connector
KR0157284B1 (ko) * 1995-05-31 1999-02-18 김광호 솔더 볼 장착홈을 갖는 인쇄 회로 기판과 이를 사용한 볼 그리드 어레이 패키지
TW267265B (en) * 1995-06-12 1996-01-01 Connector Systems Tech Nv Low cross talk and impedance controlled electrical connector
US5823801A (en) * 1996-08-05 1998-10-20 The Whitaker Corporation Electrical connector having thin contacts with surface mount edges
TW406454B (en) * 1996-10-10 2000-09-21 Berg Tech Inc High density connector and method of manufacture

Also Published As

Publication number Publication date
US6116921A (en) 2000-09-12
FR2775133A1 (fr) 1999-08-20
FR2775133B1 (fr) 2001-06-22
CN1205702C (zh) 2005-06-08
GB2334387A (en) 1999-08-18
GB2334387B (en) 2002-03-20
GB9903118D0 (en) 1999-04-07
CN1226756A (zh) 1999-08-25

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees