TW430125U - Improved structure of the electronic device packaging mold - Google Patents

Improved structure of the electronic device packaging mold

Info

Publication number
TW430125U
TW430125U TW88217979U TW88217979U TW430125U TW 430125 U TW430125 U TW 430125U TW 88217979 U TW88217979 U TW 88217979U TW 88217979 U TW88217979 U TW 88217979U TW 430125 U TW430125 U TW 430125U
Authority
TW
Taiwan
Prior art keywords
electronic device
improved structure
device packaging
packaging mold
mold
Prior art date
Application number
TW88217979U
Other languages
Chinese (zh)
Inventor
Jr-Yan Lin
Original Assignee
Jin Ji Prec Industry Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jin Ji Prec Industry Co Ltd filed Critical Jin Ji Prec Industry Co Ltd
Priority to TW88217979U priority Critical patent/TW430125U/en
Publication of TW430125U publication Critical patent/TW430125U/en

Links

TW88217979U 1999-10-22 1999-10-22 Improved structure of the electronic device packaging mold TW430125U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88217979U TW430125U (en) 1999-10-22 1999-10-22 Improved structure of the electronic device packaging mold

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88217979U TW430125U (en) 1999-10-22 1999-10-22 Improved structure of the electronic device packaging mold

Publications (1)

Publication Number Publication Date
TW430125U true TW430125U (en) 2001-04-11

Family

ID=21655155

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88217979U TW430125U (en) 1999-10-22 1999-10-22 Improved structure of the electronic device packaging mold

Country Status (1)

Country Link
TW (1) TW430125U (en)

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