TW429735B - Method of making multi-layered circuit board - Google Patents
Method of making multi-layered circuit board Download PDFInfo
- Publication number
- TW429735B TW429735B TW88107480A TW88107480A TW429735B TW 429735 B TW429735 B TW 429735B TW 88107480 A TW88107480 A TW 88107480A TW 88107480 A TW88107480 A TW 88107480A TW 429735 B TW429735 B TW 429735B
- Authority
- TW
- Taiwan
- Prior art keywords
- copper
- bottom layer
- circuit board
- circuit
- board
- Prior art date
Links
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
A method of making a multi-layered circuit board by an interlayer conductive mask hollow laser welding comprises: providing a board having a copper circuit on the bottom layer thereof and a copper foil on the upper surface thereof; chemically etching the portions of the joint points between the copper foil on the upper surface and the copper circuit on the bottom layer to form an aperture; melting the aperture with a CO2 laser beam having a diameter larger than that of the aperture to form a hole so as to expose the copper circuit on the bottom layer of the board in order to connect the copper foil and the copper circuit on the bottom layer; and chemically etching the surface layer of the copper circuit to prepare a multi-layered circuit board.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88107480A TW429735B (en) | 1999-05-07 | 1999-05-07 | Method of making multi-layered circuit board |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88107480A TW429735B (en) | 1999-05-07 | 1999-05-07 | Method of making multi-layered circuit board |
Publications (1)
Publication Number | Publication Date |
---|---|
TW429735B true TW429735B (en) | 2001-04-11 |
Family
ID=21640586
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88107480A TW429735B (en) | 1999-05-07 | 1999-05-07 | Method of making multi-layered circuit board |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW429735B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010048653A3 (en) * | 2008-10-30 | 2011-03-03 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for integrating an electronic component into a printed circuit board |
-
1999
- 1999-05-07 TW TW88107480A patent/TW429735B/en not_active IP Right Cessation
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2010048653A3 (en) * | 2008-10-30 | 2011-03-03 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for integrating an electronic component into a printed circuit board |
US8914974B2 (en) | 2008-10-30 | 2014-12-23 | At & S Austria Technologie & Systemtechnik Aktiengesellschaft | Method for integrating an electronic component into a printed circuit board |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4A | Issue of patent certificate for granted invention patent | ||
MM4A | Annulment or lapse of patent due to non-payment of fees |