TW429735B - Method of making multi-layered circuit board - Google Patents

Method of making multi-layered circuit board Download PDF

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Publication number
TW429735B
TW429735B TW88107480A TW88107480A TW429735B TW 429735 B TW429735 B TW 429735B TW 88107480 A TW88107480 A TW 88107480A TW 88107480 A TW88107480 A TW 88107480A TW 429735 B TW429735 B TW 429735B
Authority
TW
Taiwan
Prior art keywords
copper
bottom layer
circuit board
circuit
board
Prior art date
Application number
TW88107480A
Other languages
Chinese (zh)
Inventor
Shou-Pu Tsung
Original Assignee
Unitech Printed Circuit Board
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Unitech Printed Circuit Board filed Critical Unitech Printed Circuit Board
Priority to TW88107480A priority Critical patent/TW429735B/en
Application granted granted Critical
Publication of TW429735B publication Critical patent/TW429735B/en

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  • Production Of Multi-Layered Print Wiring Board (AREA)

Abstract

A method of making a multi-layered circuit board by an interlayer conductive mask hollow laser welding comprises: providing a board having a copper circuit on the bottom layer thereof and a copper foil on the upper surface thereof; chemically etching the portions of the joint points between the copper foil on the upper surface and the copper circuit on the bottom layer to form an aperture; melting the aperture with a CO2 laser beam having a diameter larger than that of the aperture to form a hole so as to expose the copper circuit on the bottom layer of the board in order to connect the copper foil and the copper circuit on the bottom layer; and chemically etching the surface layer of the copper circuit to prepare a multi-layered circuit board.
TW88107480A 1999-05-07 1999-05-07 Method of making multi-layered circuit board TW429735B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88107480A TW429735B (en) 1999-05-07 1999-05-07 Method of making multi-layered circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88107480A TW429735B (en) 1999-05-07 1999-05-07 Method of making multi-layered circuit board

Publications (1)

Publication Number Publication Date
TW429735B true TW429735B (en) 2001-04-11

Family

ID=21640586

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88107480A TW429735B (en) 1999-05-07 1999-05-07 Method of making multi-layered circuit board

Country Status (1)

Country Link
TW (1) TW429735B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010048653A3 (en) * 2008-10-30 2011-03-03 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for integrating an electronic component into a printed circuit board

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2010048653A3 (en) * 2008-10-30 2011-03-03 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for integrating an electronic component into a printed circuit board
US8914974B2 (en) 2008-10-30 2014-12-23 At & S Austria Technologie & Systemtechnik Aktiengesellschaft Method for integrating an electronic component into a printed circuit board

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Legal Events

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GD4A Issue of patent certificate for granted invention patent
MM4A Annulment or lapse of patent due to non-payment of fees