TW429426B - Method for monitoring wafer orientation - Google Patents

Method for monitoring wafer orientation

Info

Publication number
TW429426B
TW429426B TW88100333A TW88100333A TW429426B TW 429426 B TW429426 B TW 429426B TW 88100333 A TW88100333 A TW 88100333A TW 88100333 A TW88100333 A TW 88100333A TW 429426 B TW429426 B TW 429426B
Authority
TW
Taiwan
Prior art keywords
asterisk
thin film
metal thin
mark
shape mark
Prior art date
Application number
TW88100333A
Other languages
Chinese (zh)
Inventor
Shuang-Ming Jeng
Jeng-Hung Chen
Chen-Hua Yu
Original Assignee
Taiwan Semiconductor Mfg
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg filed Critical Taiwan Semiconductor Mfg
Priority to TW88100333A priority Critical patent/TW429426B/en
Application granted granted Critical
Publication of TW429426B publication Critical patent/TW429426B/en

Links

Abstract

The present invention provides a method for monitoring wafer orientation suitable for a physical vapor deposition apparatus having mark shields. The method comprises the steps of: (a) providing a test wafer having an asterisk-shape mark formed on a position to be shielded, the asterisk-shape mark being formed by a plurality of small holes spaced with each other by a predetermined distance; using the robot of the physical vapor deposition apparatus to move the test wafer into a deposition room for performing a metal thin film deposition to form a metal thin film layer while the mark shields cover the asterisk-shape mark; (c) using the robot to move out the test wafer deposited with the metal thin film; and (d) determining the accuracy of the wafer orientation by observing the degree of the asterisk-shape mark covered by the metal thin film. In accordance with monitoring method of the present invention, the stability of the system device can be ensured.
TW88100333A 1999-01-11 1999-01-11 Method for monitoring wafer orientation TW429426B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW88100333A TW429426B (en) 1999-01-11 1999-01-11 Method for monitoring wafer orientation

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW88100333A TW429426B (en) 1999-01-11 1999-01-11 Method for monitoring wafer orientation

Publications (1)

Publication Number Publication Date
TW429426B true TW429426B (en) 2001-04-11

Family

ID=21639362

Family Applications (1)

Application Number Title Priority Date Filing Date
TW88100333A TW429426B (en) 1999-01-11 1999-01-11 Method for monitoring wafer orientation

Country Status (1)

Country Link
TW (1) TW429426B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110581083A (en) * 2019-09-26 2019-12-17 上海华力集成电路制造有限公司 Method and system for monitoring position of shielding ring

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110581083A (en) * 2019-09-26 2019-12-17 上海华力集成电路制造有限公司 Method and system for monitoring position of shielding ring

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