423032 4 7 2 2 Ι> Π »c/0 02 A7 B7 五、發明說明（/ ) --------------裝--- (請先閱讀背面之注意事V再填寫本頁) 本發明是有關於一種將LED晶片承載於基板上，作爲 接著時的接著方法及接著裝置’更詳細的說是有關於提供 一種適用於接著方法及接著裝置，目的在使接著於晶片能 緊密接合，所以對上述LED晶片之PN接合面與承載基板 以垂直相交狀態來進行接著。 習知技術 以往此種接著方法與裝置，例如有特開平6-1 77435號 公報所顯示物件。此方法與裝置如第7圖所示型態，把在 承載面上之PN接合面91a成爲平行於LED晶片91，其中 對LED晶片91所附著承載的晶片層92，以導向滾輪81 造成彎曲型態。此被彎曲之晶片層92上之LED晶片91以 90。作爲迴轉時，即從PN接合面91a以90。迴轉時，由收集 器夾盤（Collating chuck)82把LED晶片ς»ΐ吸著。此外，保 持此種吸著狀態於承載基板93上，進行LED晶片91之接 著。 經濟部智慧財產局員工消費合作社印製 由於上述收集器夾盤82吸著的時候，從LED晶片91 之晶片層92上剝落，會有掉落的發生，爲使其不會成爲不 能吸著狀態，進行吸著時以LED晶片91的下面，插送支 架83。而此支架83，若在進行接著時，則從LED晶片91 之下面退出。 然而，上述關於習知接著方法與裝置，本來應該有led 晶片91的拿取時之位置基準，但晶片層92卻有移動且彎 曲情形。因此，以收集器夾盤“所吸著進行時的尺寸精度 會降低，這種結果對承載基板93上所進行lED晶片91之 本紙張尺度適用中國國家標準（CNS)A4規格（2】0 X 297公釐） 經濟部智慧財產局員工消費合作社印製 423032 * 4 7 2 -| i- d / ο η 2 Α7 •_ Β7 五、發明說明（>) 接著的精度降低，會有產生低品質的產品之問題。 由於上述收集器夾盤82吸著時，利用上述支架83從 LED晶片91之下面提供支撐，在此支架83的吸著方向成 爲直角，但在方向上卻無位置決定的功能。例如以收集器 夾盤82在LED晶片91上碰接之應力，即LED晶片91從 晶片層92上分離，此情形之LED晶片91成爲上述的直角， 卻無法防止方向上之移動，使得所製造的產品精度成變 低，此問題的解決成爲重要的課題。 本發明之目的爲解決上述習知得問題，提供接著方'法 和接著裝置，以正確的結合之LED晶片進行實際安裝. 本發明之第一個觀點，係關於一種接著LED晶片的接 著方法，包括下列步驟，在一晶片層上承載一 LED晶片以 90°回轉，此LED晶片之一 PN接合面與一承載基板以垂直 相交狀態； 利用-·收集器夾盤，從該晶片層上將該晶片拿取； 進行拿取該LED晶片時，並對該LED晶片以3面來進行 決定位置，使將相連接2面承載於開放的回轉台上； 該回轉台對該PN接合面是從水平方向到垂直方向來Ε 轉； 再度由該收集器夾盤將LED晶片拿取；以及 以拿取狀態將LED晶片往承載基板接著。 此外’本發明之第二觀點，LED晶片之接著裝置，包 括：--·晶片層；-LED晶片，承載於該晶片層上，並以9〇。 回轉；一承載基板，與該LED晶片之一 PN接合面成爲垂直 I---— I —---- * I f I----— — — — — — — * (請先閱讀背面之注意事V,"填寫本頁} 本紙張尺度適用中固國家標準（CNS)A4規格（2〗0 X 297公釐） MM I tlt.c . !)〇2 A7 MM I tlt.c . !)〇2 A7 經濟部智慧財產局員工消費合作社印製 B7 五、發明說明（彡） 相交狀態；以及一接著裝置，接著LED晶片，並對LED晶 片之3面進行位置決定，同時將2面開放，並具有一可回轉 的回轉台使該PN接合面從水平方向到垂直方向上。 本發明在LED晶片回轉時，由於吸著有LED之3個面 支撐於回轉台，所以不會對回轉時造成位置精度損害，在 承載基板進行接著時，能夠以正確接著來實際安裝，然後 得到極優良的效果之製成品的品質提昇。 此外，若由本發明之方法，收集器夾盤從晶片層到回 轉台，和從回轉台到承載基板以及把LED晶片來移動，使 得收集器夾盤在回轉台的位置時，晶片層上面和承載基板 上面同時成爲開放狀態，例如攝影機等位置確認的裝置可 以成爲兩個真正上面的位置所在，所以對位置確認之精度 提高，得到極優良的效果之製成品的品質提昇。 爲讓本發明之上述和其他目的、特徵、和優點能更明 顯易懂，下文特舉較佳實施例，並配合所附圖式，作詳細 說明如下： 圖式之簡單說明： 第1圖繪示本發明關於LED晶片之接著方法的實施例 中，第一步驟說明圖形； 第2圖繪示相同實施例的第二步驟說明圖形； 第3圖繪示相同實施例的第三步驟說明圖形： 第4圖繪示相同實施例的第四步驟之重要部分說明圖 形； 第5圖繪示相同實施例的第五步驟之重要部分說明圖 I -----------訂--------- (請先閱讀背面之注意事If再填寫本頁) 本紙張尺度適用中國國家標準（CNS)A4規格（210x297公釐） 4722pifl .doc/002 第8S丨06622號說明軎修正頁 A7 修正日期89/9/29 五、發明說明（ 形； 第6圖繪示相同實施例的第六步驟說明圖形； 第7圖繪示習知例子的說明圖形。 圖式之標號說明： 1: LED晶片 la·. PN接合面 2:晶片層 3:承載基板 10:收集器夾盤 H:攝影機 12:回轉台 12a:缺口部 12b:吸著孔 13:步進馬達 81:導向滾輪 82:收集器夾盤 83:支架 91： LED晶片 91a: PN接合面 92:晶片層 93:承載基板 實施例 首先，根據本發明所顯示圖形上的實施例，進行詳細說 明。第1圖〜第6圖係本發明LED之接著方法步驟順序的 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意Ϋ項再填寫本頁> 裝-----r---訂·--— — — — — — 經濟部智慧財產局員工消費合作社印製423032 4 7 2 2 Ι > Π »c / 0 02 A7 B7 V. Description of the invention (/) -------------- Equipment --- (Please read the precautions on the back V before (Fill in this page) The present invention relates to a method and a device for bonding an LED wafer on a substrate as a bonding method. More specifically, it relates to providing a bonding method and a device suitable for bonding. The wafer can be tightly bonded, so the PN bonding surface of the LED chip and the carrier substrate are vertically intersected to perform bonding. Conventional techniques In the past, such bonding methods and devices include objects shown in, for example, Japanese Unexamined Patent Publication No. 6-1 77435. The method and device are as shown in FIG. 7. The PN junction surface 91 a on the bearing surface is made parallel to the LED wafer 91, and the wafer layer 92 attached and carried by the LED wafer 91 is guided to form a curved type by the roller 81. state. The LED wafer 91 on the bent wafer layer 92 is 90 °. In the case of rotation, it is 90 from the PN joint surface 91a. During rotation, the collet chuck 82 sucks the LED chip ς »ΐ. In addition, the LED chip 91 is adhered while the suction state is maintained on the carrier substrate 93. Printed by the Consumer Cooperative of the Intellectual Property Bureau of the Ministry of Economic Affairs. When the above-mentioned collector chuck 82 is sucked, it will peel off from the wafer layer 92 of the LED chip 91, and a drop will occur, so that it will not be unable to be sucked. When the suction is performed, the holder 83 is inserted under the LED chip 91. On the other hand, the holder 83 is withdrawn from below the LED chip 91 when it is adhering. However, as for the above-mentioned conventional method and device for attaching the substrate, the position reference of the LED chip 91 at the time of picking should be originally provided, but the wafer layer 92 may be moved and bent. Therefore, the dimensional accuracy of the "collector chuck" during adsorption will be reduced. This result applies the Chinese National Standard (CNS) A4 specification (2) 0 X to the paper size of the 1ED wafer 91 carried on the carrier substrate 93. 297 mm) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 423032 * 4 7 2-| i- d / ο η 2 Α7 • _ Β7 V. Description of the invention (>) The next reduction in accuracy will result in low quality Because the collector chuck 82 is sucked, the bracket 83 is used to provide support from under the LED chip 91. The suction direction of the bracket 83 becomes right angle, but there is no function to determine the position in the direction. For example, the stress of the collector chuck 82 on the LED wafer 91, that is, the LED wafer 91 is separated from the wafer layer 92. In this case, the LED wafer 91 becomes the above-mentioned right angle, but it cannot prevent the movement in the direction, so that The accuracy of the manufactured product becomes low, and the solution of this problem becomes an important issue. The purpose of the present invention is to provide a bonding method and bonding device to solve the above-mentioned conventional problems. The first aspect of the present invention relates to a bonding method for adhering an LED wafer, including the following steps. A LED wafer is carried on a wafer layer to rotate at 90 °, and a PN junction surface of the LED wafer and a carrier substrate are connected to each other. Vertically intersecting state; Use the collector chuck to pick up the wafer from the wafer layer; When picking up the LED wafer, determine the position of the LED wafer with 3 sides to connect the sides to 2 sides It is carried on the open turntable; the turntable is turned from horizontal to vertical direction to the PN joint surface; the LED chip is taken out by the collector chuck again; and the LED chip is carried in the taken state. The substrate is bonded. In addition, the second aspect of the present invention, the bonding device of the LED wafer includes: --- a wafer layer;-the LED wafer is carried on the wafer layer and rotated at 90 °; a carrying substrate is connected with the One of the LED chip's PN junctions becomes vertical I ----- I ------ * I f I ------------* (Please read the precautions on the back V, fill in this Page} This paper size applies to China Solid State Standards (CNS) A4 (2 〖0 X 297mm） MM I tlt.c.!) 〇2 A7 MM I tlt.c.!) 〇2 A7 Printed by B7 of the Intellectual Property Bureau Employee Consumer Cooperative of the Ministry of Economic Affairs 5. Explanation of the invention (彡) Intersection status; And a bonding device, next to the LED chip, position determination of three sides of the LED chip, at the same time opening two sides, and having a swivel turntable to make the PN joint surface from the horizontal direction to the vertical direction. When the LED chip is rotated, the three surfaces with the LEDs are supported on the turntable, so the position accuracy will not be damaged during the rotation. When the carrier substrate is bonded, it can be actually installed with the correct bonding, and then an excellent Improved quality of finished products. In addition, according to the method of the present invention, the collector chuck is moved from the wafer layer to the turntable, and from the turntable to the carrier substrate and the LED wafer is moved, so that when the collector chuck is in the position of the turntable, the wafer layer is on The upper surface of the substrate becomes open at the same time. For example, a position confirmation device such as a camera can become two true upper positions. Therefore, the accuracy of the position confirmation is improved, and the quality of the finished product with excellent results is improved. In order to make the above and other objects, features, and advantages of the present invention more comprehensible, the following describes the preferred embodiments in detail with the accompanying drawings as follows: Brief description of the drawings: FIG. 1 In the embodiment of the method for bonding LED chips according to the present invention, the first step illustrates the pattern; FIG. 2 illustrates the second step illustrated pattern of the same embodiment; FIG. 3 illustrates the third step illustrated pattern of the same embodiment: FIG. 4 is a diagram illustrating an important part of the fourth step of the same embodiment; FIG. 5 is a diagram illustrating an important part of the fifth step of the same embodiment; FIG. ------- (Please read the notes on the back if you want to fill in this page) This paper size is applicable to Chinese National Standard (CNS) A4 (210x297 mm) 4722pifl .doc / 002 No. 8S 丨 06622 Note 軎Amendment page A7 Amendment date 89/9/29 V. Description of the invention (Figure; Figure 6 shows the sixth step description graphics of the same embodiment; Figure 7 shows the conventional example explanatory graphics. The label description of the drawings: 1: LED wafer la .. PN junction surface 2: Wafer layer 3: Carrier substrate 10: Collector Chuck H: Camera 12: Turntable 12a: Notch 12b: Suction hole 13: Stepper motor 81: Guide roller 82: Collector chuck 83: Holder 91: LED chip 91a: PN junction surface 92: Wafer layer 93 : Example of the carrier substrate First, the detailed description will be given based on the embodiment of the figure displayed in the present invention. Figures 1 to 6 are the order of steps of the method of the LED of the present invention. The paper size of this paper applies the Chinese National Standard (CNS) A4. Specifications (210 X 297 mm) (Please read the note on the back first and then fill out this page.) -------- r --- Order · ------ — — — — — Consumption by the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by a cooperative
4722ρίΠ .doc 002 五、發明說明（$ ) 顯示圖形。首先在第1圖上顯示關於第一步驟，在晶片之 行列上作切割以形成LED晶片1，接著附著於晶片層2上， 一個LED晶片1以收集器夾盤1〇吸著並進行拿取。 此時，上述晶片層2上設有包含攝影機11等適當的位 置確定裝置，在進行拿取時應該對LED晶片1之位置進行 演算，使得收集器夾盤10對位置控制較佳。此外，關於第 一步驟，所進行半導體晶片之接著爲一般所使用的方法。 因此，由上述收集器夾盤10進行吸著狀態時，LED晶 片1之PN接合面la與上述晶片層2之承載面爲平行之狀 態。在此，本發明在第2圖繪示回轉台12所使用情形。此 回轉台Π在橫斷面上形成方形之略爲棒狀，以X軸來看， 例如由步進馬達（Stepping motor)13在固定角度內自由的回 此外，在前面的一個角落部分設有計與LED晶片丨外 型規格相合之缺口部12a。在此缺口部12a之內部角落，以 排氣裝置來連接吸著孔12b。而上述收集器夾盤10從晶片 層2所拿取LED晶片1，在回轉台12之缺口部12a載入放 置。 這樣進行的結果，如第2圖所顯示的樣子，LED晶片1 由吸著孔〗2b來進行吸引附著。由於在缺口部12a以3面 密接來支撐，所進行確實位置的決定。此時LED晶片1利 用收集器夾盤10，使晶片層2上移動到缺口部12a，不會 過度的移動，所以PN結合面la在晶片層2維持原有之狀 態。 接著，在第3圖中箭號所顯示爲回轉台12以X軸爲中 本紙張尺度適用中國國家標準（CNS)A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁) ill· — — I 訂 經濟部智慧財產局員工消费合作社印製 0 A7 B7 五、發明說明（6) 心來作90°回轉。此回轉以步進馬達13等來進行驅動。接 著，此種轉動如第4圖所繪示的型態，LED晶片1之PN 接合面la也在晶片層2上從原來狀態到90°回轉。 此外，此時設定回轉台12之X軸，並設定給予通過 LED晶片〗之中心，而關於所形成的回轉台12在進行回 轉，也不會在LED晶片1之中心位置產生移動，以下對繼 續步驟所能夠達到的好處作說明。 接著，在第5圖繪示從所進行回轉台12上回轉，再度 以收集器夾盤10來進行吸引而作拿取。如在第6圖繪示在 承載基板3上的所定位置進行接著。此時，LED晶片1對 PN結合面la與承載基板3之面成爲垂直相交方向。即LED 晶片1之到正負兩極的配線，成爲可以在導線性接著劑下 進行接著’把接線板(Wire board)方式廢除，而達到高密度 化之目的<= 雖然本發明已以較佳實施例揭露如上，然其並非用以 限定本發明，任何熟習此技藝者，在不脫離本發明之精神 和範圍內，當可作各種之更動與潤飾，因此本發明之保護 範圍當視後附之申請專利範圍所界定者爲準。 -----------I!裝—--—訂 ---I---•線 (請先閱讀背面之注意事J再填寫本頁) 經濟部智慧財產局員工消費合作社印製 本纸張尺度適用中國國家標準（CNS)A4規格（21〇χ 297公复）4722ρίΠ.doc 002 5. Description of the invention ($) Display graphics. First, the first step is shown in FIG. 1. The wafer is cut to form the LED wafer 1, and then attached to the wafer layer 2. An LED wafer 1 is sucked and picked up by a collector chuck 10. . At this time, the above-mentioned wafer layer 2 is provided with an appropriate position determination device including a camera 11 and the like, and the position of the LED wafer 1 should be calculated during picking, so that the collector chuck 10 has better position control. In addition, as for the first step, the semiconductor wafer to be carried out is a method generally used. Therefore, when the collector chuck 10 is in the suction state, the PN bonding surface 1a of the LED chip 1 and the bearing surface of the wafer layer 2 are parallel. Here, the present invention illustrates the use of the turntable 12 in FIG. 2. This turntable Π is formed in a square and slightly rod shape on the cross section, viewed from the X axis, for example, stepping motor 13 can freely return within a fixed angle. In addition, it is provided at a corner portion in the front. The notch portion 12a conforming to the external specifications of the LED chip is calculated. At the inner corner of this notch portion 12a, the suction hole 12b is connected by an exhaust device. On the other hand, the above-mentioned collector chuck 10 takes the LED chip 1 from the wafer layer 2 and puts it in the notch portion 12a of the turntable 12. As a result, as shown in FIG. 2, the LED wafer 1 is attracted and attached by the suction hole 2b. Since the notch portion 12a is supported in close contact on three sides, the exact position is determined. At this time, the LED wafer 1 uses the collector chuck 10 to move the wafer layer 2 to the notch portion 12a without excessive movement. Therefore, the PN bonding surface 1a remains in the original state on the wafer layer 2. Next, the arrow shown in Figure 3 shows the turntable 12 with the X axis as the medium paper size. The Chinese National Standard (CNS) A4 specification (210 X 297 mm) is applicable. (Please read the precautions on the back before filling in this. Page) ill · — — I order 0 A7 B7 printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs V. Description of the invention (6) 90 ° rotation. This rotation is driven by a stepping motor 13 or the like. Next, as shown in FIG. 4, the rotation of the PN joint surface 1a of the LED chip 1 is also rotated from the original state to 90 ° on the wafer layer 2. In addition, at this time, the X axis of the turntable 12 is set, and the center given to the LED chip is set. Regarding the formed turntable 12 being rotated, the center position of the LED chip 1 will not be moved. The benefits that the steps can achieve are explained. Next, in Fig. 5, the rotating table 12 is shown to be rotated, and the collector chuck 10 is again used for suction and picking. As shown in FIG. 6, the bonding is performed at a predetermined position on the carrier substrate 3. At this time, the pair of PN bonding surfaces 1a of the LED chip 1 and the surface of the carrier substrate 3 intersect at right angles. That is, the wiring from the LED chip 1 to the positive and negative poles can be performed under a conductive adhesive, and the 'wiring board (Wire board) method is abolished to achieve the purpose of high density. ≪ = Although the present invention has been implemented in a better way The example is disclosed as above, but it is not intended to limit the present invention. Any person skilled in the art can make various modifications and retouches without departing from the spirit and scope of the present invention. Therefore, the scope of protection of the present invention shall be attached as the following. The ones defined in the scope of patent application shall prevail. ----------- I! Outfit ----- Order --- I --- • Line (Please read the note on the back J before filling out this page) Employees ’Cooperatives, Intellectual Property Bureau, Ministry of Economic Affairs Printed paper size is applicable to Chinese National Standard (CNS) A4 (21〇χ 297 public reply)