TW421291U - Device for guiding the distribution of filler at the bottom of a flip-chip by extracting air - Google Patents
Device for guiding the distribution of filler at the bottom of a flip-chip by extracting airInfo
- Publication number
- TW421291U TW421291U TW88215148U TW88215148U TW421291U TW 421291 U TW421291 U TW 421291U TW 88215148 U TW88215148 U TW 88215148U TW 88215148 U TW88215148 U TW 88215148U TW 421291 U TW421291 U TW 421291U
- Authority
- TW
- Taiwan
- Prior art keywords
- flip
- filler
- guiding
- chip
- distribution
- Prior art date
Links
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88215148U TW421291U (en) | 1999-09-04 | 1999-09-04 | Device for guiding the distribution of filler at the bottom of a flip-chip by extracting air |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW88215148U TW421291U (en) | 1999-09-04 | 1999-09-04 | Device for guiding the distribution of filler at the bottom of a flip-chip by extracting air |
Publications (1)
Publication Number | Publication Date |
---|---|
TW421291U true TW421291U (en) | 2001-02-01 |
Family
ID=21653203
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW88215148U TW421291U (en) | 1999-09-04 | 1999-09-04 | Device for guiding the distribution of filler at the bottom of a flip-chip by extracting air |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW421291U (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI703648B (en) * | 2019-06-25 | 2020-09-01 | 力成科技股份有限公司 | Underfill filling method of semicondctor package and filling equipment |
CN113727514A (en) * | 2021-08-26 | 2021-11-30 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
-
1999
- 1999-09-04 TW TW88215148U patent/TW421291U/en unknown
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI703648B (en) * | 2019-06-25 | 2020-09-01 | 力成科技股份有限公司 | Underfill filling method of semicondctor package and filling equipment |
CN113727514A (en) * | 2021-08-26 | 2021-11-30 | 维沃移动通信有限公司 | Circuit board assembly and electronic device |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
GD4K | Issue of patent certificate for granted utility model filed before june 30, 2004 |