TW414968B - Pad cleaning system of semiconductor device fabrication facility and cleaning method thereby - Google Patents

Abstract

There are provided a pad cleaning system of semiconductor device fabrication facility having a brush rotating for removing the residues remaining on the pad, and a method of cleaning the pad using the same. The pad cleaning system comprises: a brush for removing the residues on the pad off the pad contacting with the pad surface and rubbing: a brush rotation means for rotating the brush; a brush moving means for moving the brush to the pad; a deionized water supply means for supplying the deionized water on the pad; and a control means for applying a control signal to the brush rotation means, the brush moving means, and the deionized water supply means. The method of cleaning the pad of the present invention comprises the steps of: moving the brush on the pad, rotating the brush while supplying deionized water so as to clean the pad, and moving back the brush to a waiting area.

Description

414968 A7 —. · ...,. B7 V. Description of the Invention (I) ~ "-: '~' —: —. The present invention relates to a cleaning system for semiconductor device manufacturing equipment and the application thereof. Cleaning method, and more particularly, it relates to a pad cleaning system having a rotating brush 俾 capable of removing residues left on the semiconductor wafer polishing pad and a cleaning method using the same 5 . The wafer processing in the semiconductor read-manufacturing process usually involves a polishing process on the wafer before the patterned surface or the wafer rear surface. In order to flatten the wafer surface, which is very uneven due to the deposition of several layers like different circuit pattern distribution areas and insulating layers on highly integrated semiconductor elements, the polishing of the previous surface of the wafer is Is necessary, and, to achieve the desired thickness of the wafer, or to remove contaminants on the backside of the wafer, etc., a polishing process on the backside of the wafer is necessary. As a planarization method for semiconductor wafers, currently there is a polishing method for polishing the uneven surface of a wafer by polishing the surface of the wafer by a 15- "rotation polishing pad, and a polishing method for A cutting method that rotates a diamond wheel to cut the back side of the wafer. However, due to the trend of miniaturization of semiconductor elements, a chemical mechanical polishing (CMP) system is widely used on the back side of the wafer. Among them, 'A kind of research 20' is a kind of slurry, which is used in the planarization method. It is supplied on a rotary cymbal as described above. In the wafer polishing process, the state of the polishing pad has a great influence on the planarization system of the wafer. Therefore, a cleaning process is performed repeatedly, and the contaminants remaining on the polishing pad can be removed after the wafer surface is polished. Page 4 XII 210X297 Gongchu of this paper-C. Read the first reading on the back of Zhai ii · Matters and Notes *

414968 A7 B7 V. Description of the invention (t) 5 10 15 20 Make the polishing ㈣-the practice of 彳 is f; 5. The legal system uses -brush 'or-㈣ 者 _ deionized water to clean the polishing Potential. The cleaning done by the operator is not efficient from the viewpoint of stable I " because of the operator's technology, and because of the mistake of spraying deionized water on the operator, The puppet caused damage, thereby causing economic loss and loss of time. Furthermore, the Department hopes to have an automatic processing system. Moreover, under-cleaned polishing pads can lead to poor wafers. The present invention is directed to providing a semiconductor device system that allows efficient and stable cleaning operation of the pad, and standardizes and automates the cleaning operation of the pad. &Quot; Clean cleaning system, which substantially avoids the related knowledge One or more problems caused by the limitations and lack of technology. Another object of the present invention is to provide a semiconductor device for preventing damage to a polishing pad and for providing a complete cleaning operation of a polishing pad, thereby preventing a poor wafer from being produced during wafer polishing operation. Pad cleaning system for manufacturing equipment. Another object of the present invention is to provide a pad cleaning method using the pad cleaning system of the present invention. In order to achieve these and other advantages and in accordance with the purpose of the present invention, as implemented and broadly described, the pad cleaning system of the semiconductor device manufacturing apparatus of the present invention includes: a pad surface contacting the pad surface and rubbing the surface; A brush for removing the residue on the pad from the pad; a brush rotating device for rotating the brush to increase the contact friction of the brush; a brush moving device for moving the brush to the pad; For the supply of deionized water. Page 5 Paper Standards Chinese National Car (CNS) A4 Specification (2) 〇 > < 297 mm) (诮 Please read the “Implementation” on the back of Christine before writing this page }-III ϋ ^ ϋ. 414968 A7 B7 V. Description of the invention (弋) (Please read the ^ -back ^ notes before filling in this page) To this pad 去除 can remove the residues removed by the brush A deionized water supply device; and a control device for applying a control signal to the brush rotation device, the brush moving device, and the deionized water supply device. Preferably, the brush rotation device includes: a vertically Connect to this brush 5 A rotating shaft for rotating; and a rotating force transferring section for transferring a rotating force generated by a motor to the rotating shaft. The brush moving device includes: a brush for horizontally moving the brush 俾 to set the brush A right / left moving device for the brush on the pad; and a brush up / down moving device for moving the brush vertically to place the brush on the pad 10 0 best, the right / left moving device for the brush Containing: a rotating arm, one end of the rotating arm has a rotating shaft of the brush, and the other end of the rotating arm has a vertical rotating rod that rotates or reverses, the rotating arm is based on the rotation of the vertical rotating rod Rotating at a certain angle; and a rotating force transfer portion for transferring the rotating force generated by the 15 motor to the vertical rotation lever, which can rotate or reversely rotate the vertical rotation lever. One of the spur gears, Is connected to the vertical rotation lever so that the vertical rotation lever moves up / down and rotates axially, and is installed to surround a hub connected with a keyway, which is formed on the vertical rotation Inside the lever 20, the vertical rotation lever has a spline inserted into the hub, and one side of the hub is fixed on a support, and the vertical rotation lever penetrates the hub, and the vertical rotation lever is rotatably It is supported by a conductor which guides the vertical up / down movement of the vertical rotating rod through a bearing. The brush up / down moving device is preferably used for a connection to a piston. China National Standard (CNS) A4 specification (210 × 297 mm) 5 5 ο 1 414968 A7 B7, description of the invention ί / low pressure / Λ Shenglai supply air pressure or water pressure to vertically rotate the cylinder to move the rod up / down. This: Bu, the deionized water supply device is a nozzle for concentrating the ladle water supplied by the deionized water supply source to the radon through a deionized S line. The deionized fresh water supply « A good technique is to connect to the central cavity part on the axis of rotation of the recorder, and the nozzle is connected to the central cavity part. The nozzle can be rotated with the brush to filter the deionized water, and the nozzle It is integrally formed with one end of the brush. The control device preferably comprises: a sensor mounted on the brush moving device, the sensor sensing the position of the brush; and a control part receiving a position signal from the sensor, The control section selectively applies a control signal to the brush rotating device, the brush moving device, and the deionized water supply device to perform a series of processes. In another feature of the present invention, a method for cleaning a pad of a semiconductor device manufacturing apparatus using a pad cleaning system, the pad cleaning system comprising: a pad contacting the pad surface and rubbing the pad surface; A brush removed from the roller, a brush rotating device for rotating the brush, a brush moving device for moving the brush to the pad, and a deionized water supply device for supplying deionized water to the pad And a control device for controlling these, the method of cleaning the pad includes the steps of: a) using the brush moving device to move the brush to the pad so that the brush comes into contact with the surface of the pad in a waiting area; ; B) when the deionized water supply device supplies deionized water to the pad, the brush is rotated by the brush rotating device to remain on page 7; the paper size is applicable to the national sample (CNS) A4 specification (2i) 〇X297mm) (Please read the "Italy" on the back of Li first and then write the last page)

S1TI-cashmere ---------- ti-4 9 „6l8 _______ B7 V. Description of the invention (7) — '--Residues on the scoop are removed; and c) Use the brush to move the device after cleaning Return the brush to the waiting area.

(Please read the "Impacts on the back" and fill out this page J. In addition, before the step of moving the brush to the pad, the method further includes holding the brush on-waiting when the pad is turned on the rotating plate 5 on the area, and the step of honing the back of the wafer approaching from above. The step of moving the brush to the pad preferably includes the following steps: raising the towel material in the waiting area-several Height; b) horizontally move the brush centered on the axis of rotation and achieve an arcuate movement until the brush reaches the pad; and c) move the brush down to the surface of the pad to be in contact with the pad 10. Furthermore, the step of cleaning is preferably performed so that the brushes in contact with the pad rotate and move along the surface of the pad toward the edge of the pad. It is to be understood that the foregoing general description and the following detailed description are intended as examples and illustrations and are intended to provide further explanation of the invention as claimed. In the drawings: FIG. 1 shows the structure of a pad cleaning system of a semiconductor device manufacturing equipment according to the present invention; better than the Ministry ^ 打 ^ 而 · ^ -1 ^ 1 ^: ^^^^^? ^ 2 Figure 3 shows the bottom side of the brush in Figure 1; Figure 3 is a cross-sectional view along line III-III in Figure 1; and Figures 4 to 6 show the semiconductor element in Figure 1 Operation status of pad cleaning system for manufacturing equipment. The present invention will now be described more fully with these attachments. The 8th paper size of the present invention uses the Chinese National Standard (CNS) A4 specification (210X297 mm) 414968 λ7. V. Description of the invention (6) The preferred embodiment is shown in the drawings. The invention can, however, be embodied in many different forms and should not be construed as limiting the embodiments shown herein; rather, these embodiments are provided so that this disclosure will be thorough and complete , And will fully pass the scope of the present invention to those who are familiar with this technology. Fig. 1 shows the structure of a pad cleaning system of a semiconductor device manufacturing apparatus according to the present invention. Please refer to FIG. 1, the pad cleaning system of the present invention includes: a brush 10 which is in contact with the surface of the pad 1 and rubs the surface of the pad 1; the brush 10 10 removes contaminants remaining on the pad 1 from The pad 1 is removed; a vertically rotating rotating shaft 11 is connected to the brush 10 to increase the contact friction force of the brush 10; and a mechanism for transferring the rotating force generated by the motor 15 to the rotation A rotation force transfer portion of the shaft 11. As shown in FIG. 2, the brush 10 is constructed with a bristle 34 fixed at the center of the bottom of the brush 15 for direct contact with the pad 1; and a nozzle 33 around the bristles 34. The rotational force transfer portion can be formed in various shapes, and is roughly a pair of transmission belts 14 and pulleys 13 connected to the rotation shaft of the motor 15 and the rotation shaft 11 of the brush 10 because they are low Noise is also less limited in terms of distance. Alternatively, the motor 15 may be directly connected to the rotation shaft 11 without installing the rotation force transfer portion, and more preferably, the motor 15 is installed in a place where the weight of the motor 15 does not need to lean (to be The upper part of the vertical turning rod attached to the back) prevents the loss of force. P.9 This paper is about Tongzhou Zhongwei National Standard (0 Difficulty), 64 specifications (210%, 297 mm) 414968 A7 B7 V. Description of the invention Read First Read-Back Note ^ Note items and fill in k. Ί

Therefore, the brush 10 is in contact with the pad 1 and is rotated by the rotational force transferred from the motor 15. The polished fine particles or small pieces of wafers remaining on the pad 1 can be removed from the pad 1 by D In addition, the pad cleaning system of the semiconductor element manufacturing apparatus of the present invention includes 5 a brush right / left moving device for horizontally moving the brush 10, and a brush 10 waiting in a waiting area can be placed on the pad 1; And a brush up / down moving device for vertically moving the brush 10 俾 to place it on the pad 1. That is, the brush right / left moving device includes a rotating arm 16, one end 10 of which has the rotating shaft 11 of the brush 10, and the other end of which has a vertical rotating rod 17 which rotates or reverses. The rotating arm 16 is rotated at a certain angle according to the rotation of the vertical rotation lever 17; and a pair is connected to the rotation shaft of the motor 23 and the vertical rotation lever 17, respectively, for transferring the rotational force generated by the motor 23 The vertical rotation lever 17 俾 can be rotated or 15 can rotate the spur gear 21 of the vertical rotation lever 17 in the reverse direction. In addition, a spur gear 21 is connected to the vertical rotation lever 17 so that the vertical rotation lever 17 can be moved up / down when axially rotated, and is fixed to the hub 22. As shown in FIG. 3, the vertical rotation 20-bar 17 system having a spline 17a is inserted into the hub 22, wherein the hub system is connected to a key groove 17b formed inside the vertical rotation bar 17. In addition, the spur gear 21 is fixedly mounted to surround the outer surface of the hub 22. One side of the hub 22 is fixed on a support 19, and the vertical 10-page paper size follows the China National Standard (CNS) A4 specification (210X29 ·? Mm) 414968 A7 B7 V. Description of the invention A straight rotation rod 17 penetrates the hub 22, and the vertical rotation rod 17 is rotatably supported by a conductor 18, which guides the vertical rotation rod 17 up / down by a bearing 20. At the same time, the hub 22 is a ball-key type, that is, a ball 35 is installed between the hub 22 and the 5 vertical rotation rod 17 to prevent the hub 22 and the vertical rotation rod 17 from moving up / down. Friction. In addition, the brush up / down moving device can apply various kinds of up / down moving devices, and a cylinder 26 is better to prevent particles from being generated. By the cylinder 26, the vertical turning rod 17 series 10 connected to a piston 25 is moved up / down using air pressure or water pressure generated by a pressure generating source. Further, a bearing 24 series is mounted on the piston The upper part of the connection part 25 with the vertical rotation lever 17 can freely rotate the vertical rotation lever 17. The vertical rotation lever 17 is guided by the conductor 15 18 during its upward / downward movement, and further, by the sliding movement of the ball 35 provided inside the hub 22, the vertical rotation lever 17 can be quietly And move up / down accurately, anger: "quote 11 部 屮" ^ '^ B 3 eliminate cooperation " outfit (read the precautions on the back before filling in the i3i page) line. 俾 can rub Force is minimized. If an angle movement of the vertical rotation lever 17 occurs, the motor 23 rotates the spur gear 21 and the hub 22 connected to the spur gear 21 is rotated. The rotation force of the hub 22 is moved to the vertical rotation lever 17 by the rotation 20, and therefore, the brush 10 connected to the rotation arm 16 is horizontally rotated in an arc shape at a certain angle. In addition, the pad cleaning system of the semiconductor device manufacturing equipment of the present invention further includes a nozzle 33 for spraying deionized water on the pad 1 to remove residues removed by the brush 10, the deionized water system Via a connection page 11 This paper is suitable for China® House Standard Car (CNS) A4 size (2) 0 × 297 mm 414968 A7 B7 V. Description of the invention ($) Deionized water to a deionized water supply source 32 The supply line 30 is supplied. In addition, a valve 31 is installed on the deionized water supply line 30. The deionized water supply line 30 can be opened / closed to selectively supply the deionized water. Not shown in the drawing, a pump system is installed at the deionized water supply source 32. The deionized water can be pressurized so that the deionized water moves along the deionized water supply line 30, and is spray. The deionized water supply line 30 is connected to a central hollow portion 12 formed on a rotating shaft of the brush 10 10, and the nozzle 33 is connected to the central hollow portion 12 and can be rotated together with the brush 10. To spray the deionized water, the nozzle 33 is integrally formed with one end of the brush 10. When the brush 10 in contact with the pad 1 is rotated, the nozzle sprays out deionized water to remove the remaining residue. 15 In addition, the pad cleaning system of the semiconductor device manufacturing equipment includes: a motor 15 for rotating the brush 1Ό;-for moving the vertical rotation up / down; cylinder 26 of the moving rod 17;-for rotating the vertical rotation Motor 23 of lever 17;-a control part for applying a control signal to the valve 31 for control; and a sensor 27 for sensing the position of the brush 10. 20 The sensor 2 7 is installed inside the vertical rotation lever 17 and the conductor 18 connected to the vertical rotation lever 17 and senses the position of the brush 10. The control section 28 receives a signal from the sensor 27. Position signal, and optionally supply a control signal to the motor 15 for rotating the brush 10, page 12 of this paper X-speed high-speed® 1 standard (CNS) A4 size (210X297 mm) (" first Read the notes on the back and fill out this page),-° line five, 5 10 15 20 «4968

Description of the invention (I A7 B7 if, f: 合 ίί · 印 ¥ This cylinder 26 for moving the vertical rotation rod 17 up / down, the vertical rotation for rotating at an angle or reverse the upward / downward movement The motor 23 ′ of the rod 17 and a valve 31 ′ installed on the deionized water supply line 30 can be controlled and perform a series of processes. At the same time, 'to remove the pollutants remaining on the pad 1 more efficiently. 'The pad 1 is preferably fixed to a rotating plate 2. The operation of the pad cleaning system of the semiconductor device manufacturing apparatus of the present invention is now described. First, as shown in FIG. 4, the pad 1 When the rotation plate 2 is rotated, the back side of the wafer entering from above is polished, and the brush 10 is on standby in the waiting area. After the polishing of the back side of the wafer is completed, the control unit Part 28 controls the cylinder 26 when the start signal is received, so that the brush 10 on standby in the waiting area contacts the surface on the pad 1, and as shown in FIG. 5, the brush 10 is from the The waiting area rises a few heights, and if the vertical turning lever 1 7 When reaching a certain height, the control part 28 sensing the condition controls the motor 23 to rotate the vertical rotation lever 17, so the brush 10 realizes an arc movement centered on the rotation axis until it reaches the pad 1 If the brush 1Q reaches the upper side of the pad 1, the control part 28 sensing the condition controls the steam ^: 26, and the brush 10 moves down to the position as shown at the 6th time. The surface of the pad 1 is in contact with the pad 1... If the brush 1Q is moved down to the surface of the pad 1, the control part 28 that senses the chemical state will be turned off 31 and the deionized water may be sprayed. Page 13 of the county's standard system ((Dragon first read the precautions on the back before 硪 鞟 this page j

'1T 414968 A7 B7 V. Description of the invention (Ο) A · in M · α \ If: /; tortoise [; to the pad 1, and at the same time, the control section 28 controls the motor 15 to rotate the brush 10, so the The brush 10 rotates and removes residues left on the pad i. At this time, the control part 28 controls the motor 23 to rotate the vertical rotation lever 5 and the vertical rotation lever 17 can be rotated at an angle, and as a result, the brush 10 in contact with the pad 1 rotates, and Move along the surface of the pad 8 If the cleaning process of the residues remaining on the pad 1 is completed, move the brush 10 to the pad i in the reverse order. The control unit 10 copies 28 control the The motor 23 rotates the vertical rotation lever 17 and the cylinder 26. The brush can be moved back to the waiting area and the cleaning operation is completed. In addition, the cleaning process can be started according to an operator's intention, or according to the operation In order to start beforehand, a series of cleaning operations such as 15 described above can be started after polishing of several wafers. As described above, according to the pad cleaning system of the semiconductor element manufacturing equipment and the cleaning method of the pad cleaning system of the semiconductor element manufacturing equipment of the present invention, efficient and stable cleaning of the pad can be performed, and standardized and An automated cleaning operation can be achieved, thereby preventing damage to the pad 'and completely cleaning the pad. It is obvious to those skilled in the art that various changes and modifications to the environmental assessment of the clean room of the present invention can be achieved without departing from the spirit and scope of the present invention. Therefore, the present invention is intended to cover the changes of the present invention within the scope of the appended patent application and the Chinese ruler (CNS) A4 specification (2) 0X297 mm on page i4 of this paper rule. ) Η Read ★ Note on back φ, and then η on page A7 414968 to change and its equivalent structure. Component reference table 1 pad 10 brush 11 rotating shaft 33 nozzle 5 34 bristles 13 pulley 14 drive belt 15 motor 16 rotating arm 17 vertical rotating rod 21 spur gear 23 motor 22 hub 17a spline 10 17b keyway 19 support 18 conductor 20 bearing 35 Sphere 26 Cylinder 25 Piston 24 Bearing 33 Plunging mouth 30 Deionized water supply line 15 32 Deionized water supply source 31 Valve 12 Central cavity part 27 Sensor 28 Control part 2 Rotating plate China National Standard (CNS) A4 specification (210X297 mm)

Claims (1)

414968 ab DO C8 D8 * * · VI. Patent application scope 1. A pad cleaning system for semiconductor device manufacturing equipment, which is used to remove residues remaining on the pad. The pad cleaning system includes: one and the pad The surface contacts and rubs the surface of the pad 俾 a brush that can remove the residue on the pad from the pad; 5 a brush rotating device for rotating the brush 俾 which can increase the contact friction of the brush; a brush rotating device A brush moving device for moving the brush to the pad; a deionized water supply device for supplying deionized water to the pad to remove residues removed by the brush; and 10 a device for applying a control signal to The brush rotating device, the brush moving device, and the control device of the deionized water supply device β 2. The pad cleaning system according to item 1 of the patent application scope, wherein the pad is fixed to rotate on a rotating plate . 3. The pad cleaning system according to item 1 of the scope of patent application, wherein the brush 15 rotation device comprises: a rotating shaft for rotation connected to the brush vertically; and The generated rotation force is transferred to the rotation force transfer portion of the rotation shaft. 4. The pad cleaning system described in item 3 of the scope of patent application, which is printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). 20 The power transfer department contains a pair of A transmission belt and a pulley connected to the rotating shaft of the motor and the rotating shaft of the brush. 5. The pad cleaning system according to item 1 of the scope of the patent application, wherein the brush moving device comprises: a brush for horizontally moving the brush, and the brush can be placed on the pad. Standard (CNS) A4 is now (210 × 297 mm) 414968 as B8 C8 __ D8 6. Patent right / left moving device for brush; and a brush for moving the brush vertically. The brush can be placed on the pad. Brush moves up / down. 6 · The pad cleaning system according to item 5 of the patent application scope, wherein the brush 5 right / left moving device comprises: a rotating arm, one end of the rotating arm has a rotating shaft of the brush and the rotating arm The other end has a vertical or vertical rotation lever 'the rotation arm is rotated at an angle according to the rotation of the vertical rotation lever; and 10-for transferring the rotational force generated by the motor to the vertical The rotation lever 俾 can rotate or reverse the rotation force transfer portion of the vertical rotation lever. 7 • The pad cleaning system as described in item S of the patent application range, wherein the rotating power transfer section includes: a pair of rotating shafts connected to the motor, and a spur gear of the 15 vertical rotating rod. Printed by the Consumer Cooperative of the Central Government Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) -S. The pad cleaning system as described in item 7 of the scope of patent application, where one of the spur gears' Is connected to the vertical rotation rod so that the vertical rotation rod moves up / down and rotates axially, is installed to surround a hub connected with a key slot, and the key slot is formed inside the vertical rotation rod. The vertical rotation lever has a spline inserted into the hub, and one side of the hub is fixed on a support, and the vertical rotation lever penetrates the hub. The vertical rotation lever is rotatably supported by a conductor. The conductor guides the vertical up / down movement of the vertical rotating rod through a bearing. 9. The pad cleaning system as described in item 8 of the scope of patent application, wherein the paper size on page 17 of this round applies to China National Standard Car (CNS) A # Existing (21〇 > < 297 mm) ABICD 414968 6. The scope of patent application The hub system is constructed as a ball-key type, which has a sphere installed between the hub and the vertical rotation rod. It can prevent friction with the hub when the vertical rotation rod moves up / down. force. 10. The pad cleaning system according to item 5 of the scope of the patent application, wherein the brush 5 up / down moving device is a device connected to a piston to utilize air pressure or water pressure supplied from a pressure generating source to The vertical turning lever moves the cylinder up / down. 11. The pad cleaning system according to item 10 of the scope of patent application, wherein a bearing is mounted on the connection between the vertical rotation rod and the piston, so the vertical rotation rod system is free to rotate. 12. The pad cleaning system according to item 1 of the patent application scope, wherein the deionized water supply device is a device for deionized water supplied from a deionized water supply source through a deionized water supply line. Nozzles sprayed onto the pad. 15 13. The pad cleaning system according to item 12 of the scope of patent application, wherein a valve system is installed on the deionized water supply line to open / close the deionized water supply line. 14. The pad cleaning system according to item 13 of the scope of the patent application, wherein a pump system is installed on the deionized water supply source, and the deionized water can be pressurized so that the deionized water flows along the The deionized water supply line is moved and sprayed. 15. The pad cleaning system according to item 12 of the scope of patent application, wherein the deionized water supply line is connected to a central hollow portion formed on a rotating shaft of the brush, and the nozzle is connected to the Page 1S of Central Air China's paper scales quickly use Chinese National Standards (CNS) Α4 ^ # · (2I0X297 mm) (Please note on the back of this page before filling out this page) Printed by the Consumers Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 414968 'Scope of patent application The hole part can be rotated with the brush to pour the deionized water, and the nozzle is integrally formed with one end of the brush. {Please read the "Notes ^^" on the back of the page before filling out this page.) The pad cleaning system according to the item, wherein the control device includes: a sensor mounted on the brush moving device, the sensor sensing the position of the brush; and 'receiving from the sensor A control part of a position signal, the control part selectively applies a control signal to the brush rotating device, the brush moving device, and the deionized water supply device to perform a series of processes. 17. A method for cleaning a pad of a semiconductor device manufacturing equipment using a pad cleaning system, the pad cleaning system comprising: a pad contacting the pad surface and rubbing the pad surface; and the residue on the pad can be removed from the pad. A brush; a brush rotating device for rotating the brush; a brush moving device for moving the brush to the pad; a deionized water supply device for supplying deionized water to the ridge; and a To control these control devices, the method of cleaning the puppet includes the following steps: The policy of the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs a) Use the brush moving device to move the brush to the puppet so that the brush is in a waiting area with The surface of the pad is in contact; b) when the deionized water supply device supplies the deionized water to the pad, the residue remaining on the roller is removed by the brush rotated by the brush rotating device; and c> after the cleaning is completed The brush is then used to return the brush to the waiting area. This paper size is applicable to China National Standard (C.NS) A4 specification (210 × 297 mm) 414968 A8 B8 C8 D8 Patent application scope 18. The method described in item 17 of the patent application scope, in which, the brush is moved Before the step of the pad, the method further includes the step of holding the brush on a waiting area while the pad is rotating on a rotating plate, and polishing the back side of the wafer approached from above. 5 19. The method of assembling as described in item 17 of the scope of patent application, wherein the step of moving the brush to the pad includes the following steps: a) Raise the session in the waiting area. A number of heights; b) horizontally move the brush centered on the axis of rotation and achieve arcuate movement until the brush reaches above the pad ^ and 10 c) move the brush down to the pad's surface to contact the pad. 20. The method according to item 17 of the scope of patent application, wherein the step of cleaning is performed such that a brush in contact with the ginseng is rotated and moved along the surface of the pad toward the edge of the pad. (Please read the "Notes on the back" before filling out this page) Printed by a member of the Central Standards Bureau of the Ministry of Economic Affairs and printed by a consumer cooperative. Page 20 This paper size applies to the Chinese National Standard (CNS) Α4 specification (2Ι0 × 297 mm)