TW404157B - Thick size printed circuit board and the manufacture method thereof - Google Patents

Abstract

This invention discloses a thick size printed circuit board and the manufacture method thereof, said thick size printed circuit board comprises an upper board of forming the circuit layout and a lower board with enough mechanical strength. The manufacture method is to form the upper board of forming the circuit layout and the lower board with enough mechanical strength respectively; then press both boards into the thick-size printed circuit board. Among which, the welding point of the lower board corresponding to the upper board forms a hole to proceed the installation of the electronic device on the surface of the upper board.

Description

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V. Description of the Invention (1) 1 · Field of the Invention The present invention relates to a printed circuit board, a special θ brush circuit board, and a manufacturing method thereof. '' 疋 refers to the thick size of the print 2 · Background of the invention Probe card (Probe Card) in current electronics, which includes a printed circuit board and surface mounted ^ _ one of the uses of the card is used to detect chips The electrical characteristics ^ in the inspection genus, needle. The stylus probe card is subjected to the high pressure of the testing machine to contact the wafer. The process board of the Inna wafer must have a considerable thickness to avoid deformation. It is difficult to make printed circuit boards. The board thickness of a printed circuit board produced by such a printed circuit board manufacturer is equal to 剐 一 (mn〇, if it is necessary to produce a circuit with a thickness greater than 3 mm (mm)): $ 生产 production line Adjusting the allowable plate thickness of the machine is quite labor-intensive, and it is impossible to produce during this period, which also causes a considerable loss. Τ machine and 'printed circuit board manufacturing process must go through electrodeless electricity ore, that is, —General = weighing electroless metal plating, which uses a metal plating solution to penetrate the printed circuit board ^ Vias connect several layers of circuits. The thickness of the thick printed circuit board makes it difficult for the metal plating solution to penetrate the through holes, affecting printing The production yield of circuit boards. Therefore, 'it is necessary to improve the technology for making thick printed circuit boards to improve it. 3 · Purpose and Overview

^ 04157 V. Description of the invention (2) The purpose of the invention is to achieve # in the present invention, and propose-a thick printed circuit board ^ manufacturing method 'to improve the lack of conventional skills. -Today ’The main purpose of the present invention is to propose a method for manufacturing a printed circuit board without stopping the machine to adjust the size, which is a thick size: brush! The circuit wiring required for the circuit board is concentrated on the original allowable board of the production machine.

Li under the board press 纟 ’so you can make a thick printed circuit board. B. Allow the board of the original circuit board production machine # to avoid losses that cannot be produced during downtime. The production method of the second objective of the present invention is to produce a __θ board yield method, which is to increase the thickness of the printed circuit ^ ρ ^ ^ L. Then the upper board and the board with a sufficient mechanical strength are thinner, so that the chemical liquid of the mineral metal can complete the thick-sized printed circuit board, because of the natural yield of the P 剐 circuit board. Can effectively improve

Another aspect of the invention—θ AA A -bv 2θ I The printed circuit board includes a variety of thick printed circuit boards, wires, and the lower board has enough i :: two boards, and the upper board is formed with a circuit cloth and an inner: Drawings and detailed descriptions, so that you can better understand the features of the present invention 4 _ Brief description of the drawings 4 · 1 Schematic description The first (a) to the first-η) is a sectional view illustrating an embodiment of the present invention

5. Description of the invention (3) Excessive production of thick printed circuit boards. The second figure is a production flow chart of the present invention. 4.2 Description of drawing number 1 0 Base material 12 Conductive layer 1 6 Circuit 2 〇 Intermediate bonding board 3 2 Through hole 3 5 Anti-plating layer 3 7 Solder resist 4 0 Lower plate 5 2 Positioning hole detailed description 14 18 3 0 3 4 3 6 3 8 5 0 Insulation substrate corrosion inhibitor oxide layer multilayer circuit board first metal layer second metal layer tin layer thick size printed circuit board According to the present invention, the thick size printed circuit board is mainly divided into two stages. The required circuit wiring is concentrated in a thin upper board, and then this upper board is pressed to a lower board with sufficient mechanical strength. Step 5f: (n) The figure describes the detailed steps of the embodiment of the present invention. The plate 1 1 does not first provide a substrate 10, which includes a substrate, a soil plate 11 and a tomb covering the surface. Carry out meaeh), ^ conductive layer 1 2. Next, for the conductive layer 1 2 ㈣Π (such as the line 1 of the 6 ′-^^-⑷ diagram, an oxide layer 18 is formed on the surface of the line 16 as shown in the -⑷

/ r V. Description of the invention (4) As shown in the figure, the oxide layer 18 is formed. / Production, cutting edge and protection are important, which is because it is next to the important point # 线 1 6 A must. ^ (e) « ^ # 1 # 1 〇Μ ^

Intermediate agency J 中间 U was inserted between J 搞 U (B-stage material or called L-door, ..., board ZU after dust-multilayer circuit board 3 ^ bQndingSheet) 'heated and heated nm3: after drilling Then, the through-hole 32 as shown in the figure-形成 is formed, and the purpose of forming the through-hole 32 is to provide an electrical circuit; electricity: the internal circuit of each layer of the board 30 constitutes a connection, and the multi-layer = upper open electrode electricity mine and electricity The processing of the bell metal causes the through-hole 32 to form the first-metal layer 34 as shown in the first (g) figure. μΛ is applied to the first metal layer 34 for anti-corrosion metal plating, such as the -5: use :, / Λ on the surface of the first metal layer 34 to apply the anti-mine layer 3 ::: square plating layer 3 5 will not be needed The first metal layer 3 4 is partially covered (1), and the circuit portion and the through hole 32 are exposed, and then the first metal layer 3 6 is plated on the surface of the multilayer circuit board 30 and the through hole 32 as shown in the first-Λ. As an anti-lead metal β such as lead, nickel, or gold for subsequent etching, the surface of the multilayer circuit board 3 is formed after the 疋 = ^ layer 35. The second metal layer has been mentioned as an anti-name agent in many cases. Because the i I road board 30 is etched, as shown in the first figure (J), only the circuit part and the through hole 32 of Tai Yao are left. g is passed down to perform a tin spray operation on the multi-layer circuit board 30. The purpose of the spray kick is to prevent the security of the ri electronic components. First, a red-proof layer 3 7 is formed on the surface of the multilayer circuit board 30 to cover the circuit portion. ≫ The first (shown in Figure 10 *, only V. Description of the invention (5) through-hole 32. Since the solder-proof layer 37 has Anti-soldering characteristics, the multilayer circuit board 30 will not have a tin layer attached to its surface after being sprayed with tin, and will become the first (d state shown in 'd', only the tin layer 3 8 is added to the hole wall and peripheral edge of the through hole 32 ° At this point, the circuit part of the multilayer circuit board 30 is almost completed. 'Next, the multilayer circuit board 3 is cut according to the required shape, and then the multilayer circuit board 30 is etched' to understand whether its internal circuit is In the end, the multilayer circuit board 30 is used as the upper board, and it is laminated with the lower board 40 as shown in the first (m) diagram. The lower board 4 has sufficient mechanical strength. The second brigade applies high pressure from the outside to press the lower board 40 and the multilayer circuit board 30 to form a thick printed circuit board 50, and then drills to form a positioning hole 5 2 'as shown in the first (η) diagram. In the above process, 'before the lower board 40 is laminated with the multilayer circuit board 30, it can be preceded by the lower board 4'. A number of perforations (not shown in the figure) should be provided at the soldering points of the multilayer circuit board 30 to facilitate the mounting of electronic components on the thick printed circuit board 50. Among them, the lower board 40 is preferably FR4, The direct action is to enable the thick printed circuit board 50 to withstand large external forces. ”, Shi Shuzhi's production steps to briefly describe the flowchart shown in the second figure, a hundred first production-upper board, formed on it There are through holes for circuit wiring and power supply element installation, that is, step sio, and then step S20 is performed. The lower board has sufficient mechanical strength to be pressed against the upper board, and the circuit board is brushed, wherein the lower board corresponds to The soldering position J can be ^ = 2 for the mounting of electronic components on a thick printed circuit board: = a positioning hole is formed on the thick printed circuit board, that is, step 3 〇

Page 8 40 5 7 Circuit board 5 The current production of the circuit, the production of thick-sized printing machine without the machine, the thickness is thinner 3 2 to complete the natural higher strength, but also the board and board manufacturing technology has not yet The examples show that the present invention is not changed, and the technical idea of the invention should be the first stage. A person with sufficient skills should first leave the content of the present invention and deviate from the present invention. (6) In the above process, thick-layer printing is completed on the multilayer circuit board 30, so that the demand for 15-20 layers of printed circuit boards can be made at a thickness of 3 mm, which means that the current general printed circuit board factory The production and finishing allow the thickness of the board, so it can avoid stopping and contribute to the improvement of productivity. If the present invention is applied to the multi-layer circuit board 50 of the test card circuit board 30, the metal plating solution of the multi-layer circuit board 30 can penetrate the through-holes, so the yield rate of the produced test card for the test card 50 has sufficient mechanical k The external force is pressed without deformation. From the above, when you can understand that this section makes a thick printed circuit board, it is completed on an upper board, and the lower stage is combined with the lower board. For the familiar circuit, the above embodiments and spirit can be easily modified. Therefore, the above description is an equivalent modification or application made by the actual purpose of enabling the person skilled in the art to understand rather than limit the scope of the patent of the present invention. Patent scope. ☆ The circuit wiring of 0 is all based on the technology of multi-layer circuit boards. It can meet the general thick rule brush circuit board. 50 can extend the board thickness without the need to stop the adjustment. The production loss is due to the thick printed electricity. The connection, and furthermore, the thick print can withstand the mechanical strength of the test wafer with two-stage wiring, which is very revealing.

Claims (1)

404157 6. Scope of Patent Application 1. A thick printed circuit board includes: an upper board 'on which circuit wiring is formed; and a lower board' which is a rigid board with sufficient mechanical strength ', and the lower board is bonded to the upper board. 2 The circuit board according to item 1 of the scope of patent application, wherein the circuit formed by the upper board is a pin test card circuit. 3. The circuit board described in item 1 of the scope of patent application, wherein the upper board is a multilayer printed circuit board "4. The circuit board described in item 1 of the scope of patent application, wherein the lower board is FR 4 0 5 The circuit board according to item 1 of the scope of the patent application, wherein the lower board corresponds to a soldering portion of the upper board and is provided with a perforation for soldering. 6. A method for manufacturing a thick printed circuit board 'includes: forming an upper board having circuit wiring; forming a lower board having sufficient mechanical strength; and pressing the upper board and the lower board together. 7. The manufacturing method according to item 6 of the scope of patent application, wherein the circuit wiring formed on the upper board is a pin test card circuit. 8. The manufacturing method as described in item 6 of the scope of patent application, further comprising, before pressing, 'perforating a welding place on the lower plate corresponding to the upper plate. Page 10