經濟部中央橾準局貝工消費合作.社印製 孔；在其前面則形成有具有小鬭口面稹之两口部25,且， 在其背面形成有具有大照口面稹之两口部（M下，插入 口 >26。閭口部25之面稹係作成小於CCD晶片所具備之面積 ;且，在颶口部25與揷入口 26之段差部背面，露出K置有 内引線22,藉此輿設在CCD晶片27之«極憨28上之凸起29 霣接。 其次，說明本資施例之製造方法。第2_侏本發明第 一實施例之固醱搌彩装置之斷面鼷。即，於配萱有由磺青 銅等所成之引線框的金颶棋中，注入混合有無機質《料之 環氧樹脂；以高湛內鑄棋後從金饜棋取出而切两[引線框24 之框髅；然後，将外引線向插入口 26之方向折彎Μ裂成封 装21。一方面，用安装夾具（未示）來保持一在霣極螫 28上形成有凸起29之CCD晶片之背面，然後将凸起29Κ接 連接内引纗22。此内引線22俤從封装21之揷入口 26揷入封 装內而配置成S出於封裝21之两口部25輿插入口 26之段差 部背面者。在壓接作鬌中，將位置倍51從一配置CCD晶片 27前面之光學位置調S裝置回授至安装夾具，藉此一面徼 調整CCD晶片27之方位，一面將CCD晶片27配置在封装21之 段差部背面*同時從設置在壓接夾具侧部之分配器射出一 定曇之紫外線硬化型黏合劑30,藉Μ黏合固定CCD晶片27 四邊舆封裝21*使CCD驀片27正礒地装載在封裝21» 第3·係本發明第二實嫌例之固跚擬彩裝置之断面圏 ，其輿第一實施例不同之酤在於，内引》22之前媾部22a 係從封装21之臞口部25向内部稍微突出之黏，從而可藉内 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂 11 經濟部中央標準局負工消費合作社印掣 A7 ^---------------------------------------------- 五、發明説明（1 ) 本發明W於一棰，将固鼹摄彩元件（以下，稱爲CCD 晶片）裝載在使用合成樹脂、陶瓷或玻瑱之封裝（M下稱 做封裝）的固鼸摄影裝置，特別用於電視摄像機之固體摄 彩装置及其製迪方法。該電視撮像機等係使用要求鼗格的 光學位置精度的三値CCD晶片者。 〔技術背景〕 近幾年，霣視搌像檐、特別作爲家庭用等方便於搬邇 之小型且輕重量之霣視摄像機已進步到高機能化，尤其是 消费者之對於忠實之色彩再現性或撤細淸晰度之表示等高 圔像品質之要求，最近顯著地高度化起來。随着此棰趙向 ，闋於霣視摄像機之諸多構成零件之技術水準亦顯箸地提 升，尤其是對於可言之爲霣視摄像機心_部的固龌摄影元 件、邸所謂CCD之像素數之擴大等之性能提升，著實令人 驚異者。一方面，以往，以使用一張CCD晶片之一眼式電 視摄像機爲主醱之家庭用之領域，也開姶使用具有分別對 醮於三眼式即R,G,B之三張CCD晶片的霣視搌像機。此昂貴 之三眼式電視擬像檐，以往，乃專用於業務者。 三眼式電視摄像檐，較之一眼式者*理所笛然地要求 棰高度之位置精度，K便在光學上將三張CCD晶片配置於 正確之位置；而今，在為了小型化及鏞帶性而将大部分之 構成零件高密度地安裝到最大限度之家庭用電視撮像機方 面，則要求固齷播影装置構造本身之改革。 第9圔，第10醒係顯示習知之固髏摄彩裝置例，其中 第9圃係成爲主滾之藉肋於陶瓷封裝的固騣搌影装置之斷 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） --------裝----^---訂------線 (請先閲讀背面之注意事項再填寫本頁) 5 P> η .一，-.* 猫充: A7 B7 五、發明説明（14 ) 經濟部中央橾準局貝工消费合作社印製 二實施例中，就凸起29設在CCD晶片27之《極fi上之情況 作了說明，但將此凸起29設在内引線22之前端而舆CCD棋 植46之霣極鱸47接合也可。 再者，於上述第五至第八實施例中，典前述本發明第 四實施例之情況一樣，透«僅上下方向具有導霣性之各異 向性導體，替代凸起29來進行CCD棋塊46之霣極贫47輿内 引線端子之連接也可》 〔產業上之利用可能性〕 如上所逑*如依本發明之固臛搌影裝置及其製迨方法 ，由於其固鼸摄彩裝置及製造方法俤於内部設置貢穿孔Μ 用來密封由内引線及外引》所成之引纗框的封裝内，裝戴 CCD晶片或周邊霣路元件者，而其特撖在於：在封装之兩 蟵面，分別具有不同颶口面積之開口部，且從具有大两口 面積之两口部装填固跚搌彩装置，使其貫穿孔作為密閉構 造，因此可使工程顏著地簡略化》再者，由於将CCD晶片 之安装夾具配置在CCD晶片之背面以便從CCD晶片之前面進 行光學性位置對準，所以可連成極离精度之位置對準，從 而可廉價地製造一装載於能取得鮮明色彩之再現或鐵維圈 像等离_像品質之電視搌像檐的固讎摄影裝置。 (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度逍用中國國家揉準（CNS ) Α4规格（210Χ 297公釐） 18 經濟部中央標準局員工消费合作社印製 A7 份 五'發明説明（2) 面画。圖中，1為其表面形成有金屬喷鍍導體2的陶瓷封 裝；在其中央部分設有凹部3。在凹部3，藉由導電性黏 合剤5片接合一 CCD晶片4，並藉由金羼線7將CCD晶片之 霣極墊6線接合於金屬喷鍍導體2。又，8係沈積於金羼 嗔鍍2之端面的引線端子，該金羼噴鎪2之端面即露出於 陶瓷封装1之側面。 第10圏係藉肋樹脂封裝之固匾摄影裝置之斷面國。内 塑棋有由内引線9及外引線10所構成之引線框11的樹脂封 裝12,有其中央所設凹部13內Μ導霄性漿膏（焊期 > 片接合 CCD晶片4 j舆第9園所示之陶瓷封裝的情況同樣地，在 CCD晶片4之上的霣棰墊6係藉金羼線7而線接合於内引 線9。 然而》依照上述習知之固體摄影裝置及其製造方法， 無論陶瓷封裝1或樹脂封裝12,均將CCD晶片4片接合於凹 部3或凹部13之底面上，因此為了將具有此棰習知構谊之 固鼸撮彩裝置裝載在三眼式電視摄像機Μ進行光學上之位 置對準，而必箱將片接合CCD晶片4之陶瓷封器1或樹脂封 裝12之凹部3或凹部13底面作成極高之加工精度，同時將 其底面輿陶瓷封装1或與樹脂封裝12之上面的平行度作成 極為正確者，從而存在著招致陶瓷封裝1或樹脂封裝12之 高價，且，造成CCD晶片4安装工程之成本上升之原因等課 題。又，由於将CCD晶片4之霣極墊6與金屬噴鍍導醱2或 該霣極墊6輿内引線9之連接，藉由结接合工程透過金屬 線7來進行之方法，係經長年熟化的製造技術，所以生產 時之不良品之比率少，晶片之替換也容易，但其反面卻有 本紙張尺度適用中國國家標準（CNS ) Α4規招^ ( 210X 297公釐） -f,- --------.•裝--------訂------線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作社印製 A7 ------------- B?---------------：----- 五、發明説明（3 ) 在固匾嫌影裝置之小型化方面有限度，且無法因應家庭用 霣視搌像機領域之小型化要求等問題。 〔發明之掲s〕 於是》本發明之目的係在於提供一棰固«撮影裝置及 其製造方法，Μ便可裝載在可獲得鮮明色彩之再現或缕細 國像等之高圈像品質電視摄像機中，而且可廉價製谊。 而爲了達成此目的*本發明之固«搌彩裝置，係於一 内部設置貢穿孔以用來密封由内引線及外引線所成之引線 框的封裝内，裝載CCD晶片者，其待街[在於：前述封裝備 有分別在兩端面具有不同開口面積之两口部；且從具有大 閭口面稹之闋口部，裝填CCD晶片Μ密封貫穿孔。 又，透過内引線連接CCD晶片之霣極墊的封裝之開口 部面積，係小於CCD晶片全匾之面積。 又，將載置有CCD晶片及周邊霣路元件之基板，從備 有開口部（具有不同開口面積）之封裝中具有大開口面積 之開口部，裝《於一在内部設置貢穿孔Μ用來密封由内引 線及外引線所成之引線框的封装内；且，将基板之霣極墊 m 連接至一霉出於封裝中具有小两口面積之開口部的周邊端 部之内引線。 又，於包含有具有不同開口面稹的樹脂封裝中，從具 有大照口面稹之開口部*将一把周鎵《路元件載置於半導 鼸基板（形成有CCD晶片）之前述CCD晶片形成面除外之上 面而成的基板，裝燠於其内部設置貢通孔Μ用來密封由前 述内引線及外引線所成之引線框的封裝内；且，將基板之 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐〉 ---------餐------,訂------0 (請先閱讀背面之注意事項再填寫本頁) A 7 A 7 經濟部中央標準局貝工消費合作杜印製 ............... fr? 五、發明説明（4 ). 霣棰塾連接於一《出於封裝中具有小開口面積之開口部之 周邊鳞部的内引線。 又，本發明之固體播彩裝置，係於一内部設置貫穿孔 以用來密封由内引線及外引線所成之引線框的封裝内，裝 載CCD晶片及其周鎵霣路元件者，其特徽在於：該CCD晶片 係連接固定在一S出於封装第一段差部之第一引線，而該 馬邊轚路元件則連接固定在一露出於封裝第二段差部之第 二内引鎳。 又，本發明爲一種固薩搌影裝置之製造方法，係於一 内部設置貫穿孔Μ用來密封由内引線及外引線所成之引線 框的封装内，裝載CCD晶片之方法者，其特微在於：將CCD 晶片從封装中具有大開口面積之開口部，装填在封装之貫 穿孔内；透遇凸起或各異向性導齷將固體撮影裝置之霣棰 墊連接至内引線，Μ進行光學性位置對準之後，用黏合劑 固定CCD晶片之背面與封裝。The Ministry of Economic Affairs Central Bureau of Quasi-Bureau Consumption Cooperation. Printed holes; in front of it are formed two mouth portions 25 with small mouth openings, and on the back side are two mouth portions with large exposure openings ( Under M, the insertion port> 26. The face of the mouth 25 is made smaller than the area provided by the CCD chip; and, on the back of the step between the mouth 25 and the mouth 26, K is provided with an inner lead 22, With this, the bumps 29 provided on the «pole 28 of the CCD chip 27 are connected. Next, the manufacturing method of this embodiment will be described. The second 2_ the breaking of the solid color device of the first embodiment of the present invention Noodles. That is, in a golden hurricane chess with a lead frame made of sulphur bronze, etc., an inorganic epoxy resin mixed with an inorganic material is injected; [The frame of the lead frame 24; then, the outer lead is bent in the direction of the insertion port 26 and cracked into the package 21. On the one hand, a mounting jig (not shown) is used to hold a protrusion formed on the pole 28. 29 the back of the CCD chip, and then connect the bump 29K to the inner lead 22. The inner lead 22 俤 is inserted from the entrance 26 of the package 21 The inside is configured as S, which is located on the back of the step 25 of the two mouths 25 and the insertion opening 26 of the package 21. In the crimping operation, the position multiplier 51 is returned from the optical position adjustment S device in front of the CCD chip 27. To the mounting jig, while adjusting the orientation of the CCD wafer 27, the CCD wafer 27 is arranged on the back of the step 21 of the package 21 * At the same time, a certain amount of ultraviolet curing adhesive is emitted from a distributor provided on the side of the crimping jig. 30. The CCD chip 27 is fixed by the M adhesive 27. The four-sided package 21 * enables the CCD chip 27 to be mounted on the package 21 squarely. The third section is a cross section of a solid color device according to the second example of the present invention. The difference between the first embodiment and the first embodiment is that the inner part 22a before the internal guide 22 is a sticky sticking from the mouth part 25 of the package 21 to the inside, so that the Chinese national standard (CNS) A4 specification can be applied to the internal paper size. (210 X297 mm) (Please read the notes on the back before filling out this page) Order 11 Printed by the Central Standards Bureau of the Ministry of Economic Affairs, Consumer Cooperatives A7 ^ ---------------- ------------------------------ V. Description of the invention (1) The present invention will be consolidated in the first instance. Photographic elements (hereinafter referred to as CCD chips) are mounted in solid-state photography devices using a synthetic resin, ceramic, or glass-encapsulated package (M is referred to as a package), and are particularly used in solid-state color-imaging devices for television cameras and their manufacture. Di method. This TV camera and others are those who use three-dimensional CCD chips that require precise optical position accuracy. [Technical background] In recent years, contempt for eaves, especially for home use, etc. Lightweight contempt cameras have advanced to high functionality, especially consumer demand for high image quality, such as faithful color reproducibility or fine-grained sharpness expressions, which have recently been significantly heightened. Along with this, Zhao Xiang, the technical level of many components of the camera is also significantly improved, especially for the solid-state photography components that are considered to be the heart of the camera, and the so-called CCD The increase in the number of pixels is really amazing. On the one hand, in the past, home-use TV cameras using one CCD chip as an eye-type TV camera have also been developed. The use of three CCD chips with three eyes, namely, R, G, and B, has been developed. Despise the camera. This expensive three-eye TV eaves was previously dedicated to business people. The three-eye TV camera eaves requires the position accuracy of the height of the eye better than the one-eye type. K will optically arrange the three CCD chips at the correct position. Now, in order to miniaturize and carry In order to install most of the component parts with high density to the maximum for home-use television cameras, it is required to reform the structure of the broadcasting device. The ninth and tenth lines show the conventional solid-color photographic device example. Among them, the ninth garden is the main roll of the ceramic-encapsulated solid-film device. The paper standards are applicable to Chinese national standards (CNS). A4 specification (210X 297 mm) -------- installation ---- ^ --- order ------ line (please read the precautions on the back before filling this page) 5 P > η First,-. * Cat charger: A7 B7 V. Description of the invention (14) In the second embodiment printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, the protrusion 29 is provided on the CCD chip 27 of The situation has been described, but it is also possible to provide the protrusion 29 at the front end of the inner lead 22 and to join the bass bass 47 of the CCD chess plant 46. Furthermore, in the above fifth to eighth embodiments, as in the case of the aforementioned fourth embodiment of the present invention, the anisotropic conductor having conductivity only in the up and down direction is used to perform the CCD chess instead of the protrusion 29. The connection of the lead terminals in block 46 to 47 is also very poor. [Industrial use possibility] As above * As in the solid-state imaging device and its manufacturing method according to the present invention, due to its solid-state photography The device and manufacturing method are provided with internal holes M for sealing the package formed by the inner lead and the outer lead, and those who wear a CCD chip or a peripheral circuit component. The special feature is that: On the two sides, openings with different hurricane areas are respectively installed, and the staggering device is filled from the two parts with large areas, so that the through-holes are used as closed structures, so the project can be simplified. In addition, since the mounting fixture of the CCD wafer is arranged on the back of the CCD wafer so as to perform optical position alignment from the front surface of the CCD wafer, it can be connected with extremely accurate position alignment, so that it can be cheaply manufactured. Get vibrant colors Reproduction or Tiewei circle image plasmon _ image quality of the television 搌 image eaves solid photography device. (Please read the notes on the back before filling in this page) The size of the paper used for this edition is not applicable to the Chinese National Standard (CNS) Α4 size (210 × 297 mm) 18 A7 copies of the five 'invention printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Explanation (2) Face painting. In the figure, 1 is a ceramic package with a metal-sprayed conductor 2 formed on the surface thereof; and a recess 3 is provided at a central portion thereof. In the recess 3, a CCD chip 4 is bonded by 5 pieces of conductive adhesive 剤, and the 垫 pad 6 of the CCD chip is bonded to the metal-sprayed conductor 2 by a gold wire 7. In addition, 8 is a lead terminal deposited on the end face of the gold-plated gadolinium plate 2, and the end surface of the gold-plated gadolinium plate 2 is exposed on the side surface of the ceramic package 1. Section 10 is a section of a solid plaque photographic device encapsulated with a ribbed resin. The inner plastic board has a resin package 12 of a lead frame 11 composed of an inner lead 9 and an outer lead 10, and has a conductive paste (welding period) in a recess 13 provided in the center thereof. In the case of the ceramic package shown in Fig. 9, the pad 6 on the CCD chip 4 is wire-bonded to the inner lead 9 by a gold wire 7. However, the solid-state imaging device and its manufacturing method according to the above-mentioned conventional method Regardless of the ceramic package 1 or the resin package 12, four CCD wafers are bonded to the bottom surface of the recessed portion 3 or the recessed portion 13. Therefore, in order to mount a solid color picking device with this conventional structure, it is mounted on a three-eye television camera. The machine M performs optical position alignment, and the box must be bonded to the ceramic sealer 1 of the CCD wafer 4 or the concave portion 3 or the concave portion 13 of the resin package 12 to make a very high processing accuracy, and the bottom surface of the ceramic package 1 Or, the parallelism with the upper surface of the resin package 12 is extremely accurate, which causes problems such as causing the high cost of the ceramic package 1 or the resin package 12 and causing the cost of the CCD chip 4 mounting process to increase. Also, the CCD Chip pad 6 of wafer 4 and metal The method of spraying the guide wire 2 or the electrode pad 6 and connecting the inner leads 9 through a metal wire 7 through a junction bonding process is a manufacturing technology that has been matured for many years, so the ratio of defective products during production is small. The replacement of the chip is also easy, but the reverse side has the paper size applicable to the Chinese National Standard (CNS) A4 ^^ (210X 297 mm) -f,---------. • equipment ---- ---- Order ------ line (please read the notes on the back before filling this page) Printed by A7, Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs ------------- B? --------------- ： ----- 5. Description of the invention (3) There is a limit in miniaturization of the plaque-like device, and it cannot cope with domestic contempt. Issues such as miniaturization requirements in the field of video cameras. [Inventions] Therefore, the object of the present invention is to provide a solid-state «photographing device and a method for manufacturing the same. In the high-circle image quality television cameras such as fine national portraits, it can also be made cheaply. In order to achieve this purpose * the solid «搌 彩 device of the present invention is provided with a perforation for sealing In the package of the lead frame formed by the inner and outer leads, the CCD chip is mounted on the street [the above package is provided with two mouths having different opening areas at both end faces; The mouth part is filled with a CCD wafer M to seal the through hole. The area of the opening of the package connected to the 霣 pad of the CCD wafer through the inner lead is smaller than the area of the entire CCD wafer plaque. The CCD wafer and the periphery are placed The circuit board of the circuit element has an opening with a large opening area in a package provided with an opening (having a different opening area), and is provided with an internal hole M for sealing the inner and outer leads. Inside the package of the lead frame; and, connecting the electrode pad m of the substrate to an inner lead of a mold out of the peripheral end of the opening having a small two-port area in the package. Furthermore, in a resin package containing a different opening surface area, a peripheral gallium circuit element is placed on the semi-conducting substrate (the CCD chip is formed) from the opening portion * with a large opening area surface area. The substrate formed on the top surface other than the wafer formation surface is installed in a package provided with a through hole M for sealing the lead frame formed by the aforementioned inner and outer leads; and, the paper size of the substrate is applicable to China National Standard (CNS) Α4 Specification (210X 297mm) --------- Meal --------, Order ------ 0 (Please read the precautions on the back before filling this page ) A 7 A 7 Printed by Shellfish Consumer Cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs ............... fr? V. Description of Invention (4). The inner lead in the peripheral scale portion of the opening with a small opening area in the package. In addition, the solid broadcasting device of the present invention is provided with a through hole inside to seal the lead frame formed by the inner lead and the outer lead. In the package, the CCD chip and its peripheral gallium circuit elements are loaded with a special feature: the CCD chip is connected and fixed at the first stage of the package. The first lead wire is connected to the second side, and the horse-side loop circuit element is connected and fixed to a second internal lead nickel exposed at the second step of the package. In addition, the present invention is a method for manufacturing a Gosaic shadow device. A through hole M is provided inside to seal the lead frame formed by the inner lead and the outer lead, and a method for loading a CCD chip is characterized in that the CCD chip has a large opening area from the package and is filled. In the through hole of the package; through the bumps or anisotropic guides, connect the pad of the solid imaging device to the inner leads, and after the optical position alignment is performed, fix the back of the CCD chip and the package with an adhesive. .
又本發明之固髏摄彩裝置之製造方法，係於一内部設 置貫穿孔Μ用來密封由内引線及外引線所成之引線框的封 袋內，裝載CCD晶片及周邊«路元件之方法者，其特撖在 於：将CCD晶片及配線群形成於由半導S基板所成之基板 上之後，在基板之CCD晶片除外之面上載置周邊霣路元件 使之舆配線群連接；接著從封裝中具有大開口面積之颸口 部把其基板装缜於封裝之貫穿孔內；透遇凸起或各異向性 導髏，將設在基板上面周线的霄棰墊連接至内引線Μ進行 光學性位置對準及霣接之後，用黏合劑來固定一備有CCD 本紙杀尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） --------d------IT------^ (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 A7 ........ ^ 五、發明説明（5 ) 晶片及周邊霣路元件之基板的背面舆封装。 又，本發明之固驩摄影裝置之製造方法，係於一内部 設置貫穿孔Μ用來密封由内引線及外引線所成之引線框的 封裝内，装載ccd晶片及周邊霣路元件之方法者，其特m 在於：將CCD晶片及周邊霣路元件載置於設有配線群之基 片上Μ便輿K線群連接；接著，從封装中具有大開口面積 之開口部把其基板装燠於封装之貫穿孔內；透遇凸起或各 異向性導艚，將設在基板上面周邊之霣極墊連接至内引線 以進行光學性位置對準輿霣接之後*用黏合爾來固定一備 有CCD晶片及周邊霄路元件之基板的背面舆封装。 又，本發明之固β搌彩裝置之製造方法，係於一内部 設置貫穿孔Μ用來密封由内引線及外引線所成之引線框的 封裝內，裝載CCD晶片及周邊霣路元件之方法者，其特擻 在於：從封裝中具有大開口面積之開口部，将CCD晶片裝 填於封裝之貫穿孔内，Μ便透遇凸起或各異向性導鼸將CCD 晶片之«棰墊連接至第一內引線，進行光學性位置對準及 霣接後，用黏合劑來固定CCD晶片之背面與封裝；然後， 同樣從封裝中具有大開口面積之開口部，將周邊霣路元件 裝缜在封装之貫穿孔内，Κ便透遇凸起或各異向性導餿将 霣極塾連接於第二内引線*進行霣接之後，用黏合劑來固 '定周邊霣路元件之背面與封装。 因此，如依本發明*在封裝内部設有貫穿孔，因此可 從封裝之底面俩，即，從具有大閭口面積之開口部裝琪CCD 晶片*且露出於封裝中具有小開口面積之開口部底面的内 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） —裝 I I 訂 線 (請先閲讀背面之注意事項再填寫本頁) Α7五、發明説明（6 引線及CCD晶片之霣極墊，由於可透過凸緣或各異向性導 體來進行電接同時，可進行光學性位置對準，所Μ不需要 像習知一般將CCD晶片之片接合及電極墊之線接合用二工 程來進行，其工程可簡輅化。又，由於可將CCD晶片之安 裝工棋配置在CCD晶片之背面，所以來自CCD晶片之光學性 位置對準變成極容易，進而可進行高箱度之位置調整。 〔圏式之籣單說明〕 第1醒係本發明一資施例之固體嫌彩裝置的一部分切 两斜視圔； 第2匾係本發明第一實施例的固膿撮影裝置之斷面圈 經濟部中央標準局員工消費合作社印掣 第3圓係該第二實施例的固髅摄彩裝置之斷面圔； 第4圜係該第三貢施例的固醱攝影装置之斷面圖 第5圔俤該第四實施例的固體摄彩裝置之斷面圔 第6_係該第五實施例的固鼸撮影裝置之斷面圓 第7鼷係該第六實施例的固體撮影裝置之斷面園 第8圏係該第七實施例的固體撮影裝置之斷面圖 第9匾偁習知固體摄彩裝置之斷面匾；及 第10圏係其他習知固釀搌影装置之斷面圃。 〔用Μ實施發明之最佳形態〕 Μ下一面參照圖式一面說明本發明之一實施例。第1 匾係本發明第一實施例之固醴摄影裝置的部分切開斜視β 。21，係將由内引線22及外引線23所成之引線框24加Μ内 鑄棋的封裝。由臞可知，在封裝21之中央部分開穿有貫穿 ---------^ i----^---ΐτ------^ (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） 10The manufacturing method of the solid-color photographic device according to the present invention is a method for loading a CCD chip and peripheral circuit components in a sealed bag provided with a through-hole M inside to seal a lead frame formed by inner leads and outer leads. Specifically, after forming a CCD wafer and a wiring group on a substrate made of a semiconducting S substrate, a peripheral circuit element is placed on the surface of the substrate except for the CCD wafer to connect the wiring group; The mouth of the package with a large opening area mounts its substrate in the through hole of the package; the bumps or anisotropic guides are exposed, and the cymbal pad provided on the upper periphery of the substrate is connected to the inner lead Μ After performing optical position alignment and bonding, use an adhesive to fix a paper with a CCD. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) -------- d-- ---- IT ------ ^ (Please read the notes on the back before filling out this page) Printed by A7, Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs .............. ^ V. Description of Invention ( 5) The back surface of the substrate of the chip and the peripheral circuit components is packaged. In addition, the manufacturing method of the Guhuan photography device of the present invention is a method for loading a CCD chip and a peripheral circuit element in a package provided with a through hole M inside to seal a lead frame formed by inner leads and outer leads. The feature is that the CCD chip and peripheral circuit elements are placed on a substrate provided with a wiring group, and the K line group is connected; then, the substrate is mounted from an opening having a large opening area in the package. In the through hole of the package; through bumps or anisotropic guides, connect the 霣 electrode pads located on the upper periphery of the substrate to the inner leads for optical position alignment. After bonding, fix them with adhesive. A backside package of a substrate provided with a CCD chip and peripheral short circuit elements. In addition, the manufacturing method of the solid β color device of the present invention is a method for loading a CCD chip and peripheral circuit components in a package provided with a through-hole M inside to seal a lead frame formed by inner leads and outer leads. The special feature is that the CCD chip is filled into the through hole of the package from the opening with a large opening area in the package, and the M is exposed to the protrusion or anisotropic guide to connect the «棰 pad of the CCD chip. After the first inner lead is optically aligned and bonded, the adhesive is used to fix the back surface of the CCD chip and the package; then, the opening of the package with a large opening area is also used to mount the peripheral circuit element. In the through hole of the package, K is exposed to bumps or anisotropic conductors. The electrode is connected to the second inner lead *. After bonding, the adhesive is used to fix the back surface of the peripheral circuit element and Package. Therefore, if a through-hole is provided inside the package according to the present invention, the CCD chip * can be mounted from both the bottom surface of the package, that is, the opening having a large opening area and exposed to the opening having a small opening area in the package. The inner paper size of the bottom surface of the paper applies the Chinese National Standard (CNS) Α4 specification (210 × 297 mm) — Packing II (please read the precautions on the back before filling this page) Ⅴ 7. Description of the invention (6 leads and CCD chip Since the electrode pad can be electrically connected through a flange or an anisotropic conductor, it can also be optically aligned. Therefore, it is not necessary to bond the CCD wafer sheet and the electrode pad wire as usual. The two processes are used to simplify the process. In addition, since the CCD chip installation process can be arranged on the back of the CCD chip, the alignment of the optical position from the CCD chip becomes extremely easy, and a high box can be performed. The position adjustment of the degree. [Explanation of the style of the style] The first awakening is a part of the solid color device according to an embodiment of the present invention, and the two plaques are cut obliquely; Section 3 of the circle printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economy of the People's Republic of China is the third section of the solid skull photography device of the second embodiment; the fourth section is the section of the solid photography device of the third embodiment. Plan view No. 5: Cross section of the solid-state photographing device of the fourth embodiment; No. 6_ is a cross section of the solid-state imaging device of the fifth embodiment; No. 7: is the solid-state imaging of the sixth embodiment; Section 8 of the device is a cross-sectional view of the solid photographing device of the seventh embodiment. The 9th plaque is a cross-section plaque of a conventional solid-color photography device. Sectional garden. [The best form of implementing the invention with M] Next, one embodiment of the present invention will be described with reference to the drawings. The first plaque is a partially cut-out squint β of the solid-state photographing device of the first embodiment of the present invention. .21, is a package made of inner lead 22 and outer lead 23 plus M inner cast chess. As can be seen from the figure, the central part of package 21 is penetrated with a through hole --------- ^ i ---- ^ --- ΐτ ------ ^ (Please read the notes on the back before filling in this page) The paper size applies to Chinese national standards (C NS) Α4 size (210 × 297 mm) 10
經濟部中央橾準局貝工消費合作.社印製 孔；在其前面則形成有具有小鬭口面稹之两口部25,且， 在其背面形成有具有大照口面稹之两口部（M下，插入 口 >26。閭口部25之面稹係作成小於CCD晶片所具備之面積 ;且，在颶口部25與揷入口 26之段差部背面，露出K置有 内引線22,藉此輿設在CCD晶片27之«極憨28上之凸起29 霣接。 其次，說明本資施例之製造方法。第2_侏本發明第 一實施例之固醱搌彩装置之斷面鼷。即，於配萱有由磺青 銅等所成之引線框的金颶棋中，注入混合有無機質《料之 環氧樹脂；以高湛內鑄棋後從金饜棋取出而切两[引線框24 之框髅；然後，将外引線向插入口 26之方向折彎Μ裂成封 装21。一方面，用安装夾具（未示）來保持一在霣極螫 28上形成有凸起29之CCD晶片之背面，然後将凸起29Κ接 連接内引纗22。此内引線22俤從封装21之揷入口 26揷入封 装內而配置成S出於封裝21之两口部25輿插入口 26之段差 部背面者。在壓接作鬌中，將位置倍51從一配置CCD晶片 27前面之光學位置調S裝置回授至安装夾具，藉此一面徼 調整CCD晶片27之方位，一面將CCD晶片27配置在封装21之 段差部背面*同時從設置在壓接夾具侧部之分配器射出一 定曇之紫外線硬化型黏合劑30,藉Μ黏合固定CCD晶片27 四邊舆封裝21*使CCD驀片27正礒地装載在封裝21» 第3·係本發明第二實嫌例之固跚擬彩裝置之断面圏 ，其輿第一實施例不同之酤在於，内引》22之前媾部22a 係從封装21之臞口部25向内部稍微突出之黏，從而可藉内 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X297公釐） (請先閱讀背面之注意事項再填寫本頁) 訂 11 經濟部中央標準局貝工消費合作社印製 • A7 __ --------------------——------—-------------- 五、發明説明（8 ) 引線22a之镡性更輕易地進行光學性位置對準或跟凸起29 之接合。 又，雖於第一及第二實施例中，躭在CCD晶片27之電 棰憝28上設置凸起29之情況作了說明，但將此凸起29設在 内引線22之前端，使之與CCD晶片27之霣極墊28接合也可 Ο 第4鼷将本發明第三實施例之固鐮搌影裝置切斷成可 Μ顯示一内引線22係排列成並列狀之斷面圈。如圔所示， 本實施例係透遇僅在上下方向具有導電性之各異向性導體 31，替代凸起29,來進行CCD晶片27之霣極墊28與内引線 22之連接者。依照本實施例之情形，其在由導《性橡膠等 所成之各異向性導體31所具之彈性下，具有舆第二實施例 同樣的，CCD晶片27之光學性位置對準變爲容易等優黏。 如此，如依上述實施例，由於「在封裝内部設置貫通 孔，從封裝之底面供，即，從設在外引線拥之插入口裝镇 CCD晶片，透過凸起或各異向性導髏，霣接露出於封裝開 口部舆插入口之段差部背面的內引線與CCD晶片之霣棰墊 ，同時進行光學性位置對準J ，所K較之習知可顯著地使 工程籣略化。再者，由於可將CCD晶片之安装夾具配置在 CCD晶片之背面，故來自CCD晶片前面之光學性位置對準變 '成極容易，進而可達成离精度之位置調整。 第5_係本發明第四實施例之固鳗摄彩裝置之斷面圔 ，其與第一實施例之情形一樣，於配置有由磷青鋦等所成 之引線框24之金臛棋中，注入混合有無檐質填料之環氧樹 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） I I I n ~~ 訂 . 線 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作衽印袋 A7 丑 7 Γ_ ~~ 五、發明説明（9 ) 脂，Μ高温内塑棋後從金羼模取出，割斷引線框24之框體 ;然後，将外引線向插入口 26之方向彎折，以製成封裝21 。一方面，於由矽晶片等之半導鼸基板（其表面形成有配 線群及CCD晶片41) 42表面之一部分，以面朝下地配置有 由別工程所製成之周邊霣路元件43;把連接凸起29 (設在 其周邊霣路元件43之霣極墊44上）與基板42上之配線群之 霣極憝45而獲得之檐能装置<Μ下稱CCD模塊）46之背面， 使用安裝夾具（未醒示）來保持着；然後，將凸起29壓接 於一設在CCD棋塊46周邊之霣極塾47, Μ便連接至露出於 封装21之開口部25與插入口 26之段差部背面的內引線22。 在此壓接作業中，從設在CCD晶片41前面之光學位置調整 装置（未圔示），將位置信號回授至安装夾具，一面撤調 整CCD晶片41之方位一面将CCD模塊46配置在封袋21之段差 部背面；同時從設在Κ接夾具之傷部的分配器，射出一定 置之紫外錄硬化型黏合爾30, Κ接合固定CCD棋塊46之四 邊與封裝21，藉此將CCD晶片41裝載在封装21之正確位置 Ο 其次，第6匾係本發明第五實施例之固體摄影裝置之 斷面釅，是前述第四實施例之實施形態的一變形例者。其 從封装21之插入口 26裝滇CCD棋塊46 (形成或載置有CCD晶 '片、周邊電路元件及配線群）後一面徹調整CCD晶片41之 光學位置一面固定封裝之黏，不論在其櫞造或製造方法上 ，均與第一實施相同，但其舆上逑第四實施例不同之點在 於：於第四實施例中，CCD晶片係經遇直接攒散工程等之 本紙張尺度適用中國國家標準（CNS ) Α4現格（210X 297公釐） --------i------IT-----線 (請先閱讀背面之注意事項再填寫本頁) -13 - A7 A7 經濟部中央標準局貝工消費合作·杜印製 ..... -—---------------------------fr?---- 五、發明説明（1Q ) 電路晶片形成工程而形成在CCD模塊46之基板42 (半導體 基板）之上面：反觀，本資施例，其CCD晶片41也與周邊 «路元件43同揉，為由別工程所預先製成之CCD晶片，而 且，將此周邊電路元件43及CCD晶Η配置在形成有配線群 之基板42上，進行«接以作為CCD棋塊46。 因此，在本資施例之場合，可使半導體基板以外之材 料作爲基板42。由第6函顧示 > 如按照本實施例将在別工 程所18成之CCD晶片41載置於基板42上時，CCD晶片41之霄 極與基板42上之配線群之霣捶端子，乃使用金屬線47a， 藉線接合法來連接。 第7團係本發明第六實施例之固饈摄彩裝置之斷面圈 ;本實施例也是上述第五寶施例之實施形態的另一變形例 者。本實施例與第五實施例之不同貼在於：於第五實施例 中，周邊霣路元件43係舆第四實施例之情況一樣，以面朝 下之方式透過凸起29而連接於基板42;反觀，本實施例， 其周邊霣路元件43也與第五實施例中CCD晶片41一樣，將 其電路形成面朝上方設在基板42上，且，周邊電路43之電 捶也使用基板42上之配線群之電搔端子舆金屬線47a，藉 線接合法來連接。 如此，本發明之第四、五、六實施例之構成中，具有 構造上之類似黏與相異點，今就逭些各實施例之固賸摄彩 装置之優點說明如下。 首先，在第四實施例方面，由於可將CCD晶片41跟其 他配線群一同同時形成在基板42(半導體基板）上，所Μ 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ297公釐） ------------^---1T------ ^ (請先閣讀背面之注意事項再填寫本頁) A7 -m- 經濟部中央標準局員工消費合作社印製 五、發明説明（11 CCD晶片41之電極與配線群之霣極端子之«接極為容易之 同時可確實地進行，且，對於固體搌影裝置之小型化也有 效。接著，在第五實施例方面，由於通常被認為成品良率 極低之多像素數且高精度之CCD晶片可由別工程來製成， 所以可藉著僅使用良品來減低全醱成本。再者，在第六實 施例方面，其將CCD晶片41及周邊霣路元件43之電極與基 板42上ί配線群之霣棰，藉一檷備有高可靠性（因爲根據 安裝技術或自動安裝檐之長年實»)之線接合法來進行， 故雖将周邊電路元件43配置成其霄路形成面朝向而需要遮 光膜48,但即使CCD晶片41或周邊電路元件43發生故障也 可輕易更換，因而具有可再利用構成零件之優點。又，第 7圔中，49為藉金屬等之蒸鍍或級射來形成遮光膜48之玻 璃基板。 如上所說明，此等第四、第五、第六實施例之固驩搌 彩装置，可按照其所需性能、價格及最佳用途*取得可適 宜使用的形態。 其次，第8匾係顯示本發明第七實施例之固體摄彩裝 置之斷面圖。本實施例舆上述各實施例之相異點在於將CCD 晶片或周邊電路元件作成叠層構造裝缜在封裝內一事，因 此封裝與上述各實施例之構造不同，CCD晶片及周邊霣路 元件乃從揷入孔（封裝內之貫穿孔係由具有不同開口面積 之開口部所成），裝《入封裝内。 接著，就本實施例之構造，說明其製造方法。於第8 圓中，50係具有本實施例所使用的特別構造之封裝；其一 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） ---------裝----^---訂------線 (請先閲讀背面之注意事項再填寫本頁) 15 Α7 Α7 經濟部中央標準局貝工消費合作社印製 五、發明説明（12 ) 端面設有具有小開口面稹之第一開口部51，而另一端面則 設有具有大開口面積之第三開口部52及具有大於第二两口 部2之大開口面稹的第三開口部53。又，封装50,其上部 框駸50a設有第一開口部51及第二開口部52，其内部則備 有配置成彎曲狀之内引線54;此内引線54之一端係露出於 第一開口部51輿第二開口部52之第一段差部而形成第一内 引線嫌子54a。又，在封装50之上部框鱧5〇3内«曲而向下 方延伸之内引嫌54之另一端54b，係被密封在封裝50之下 部框體50b與上部框鼸50a間，其一端則在封装内連接於第 二引線端子54c舆外引線55之連接點。該第二引線端子54c 係露出於第二两口部52舆第三開口部53之段差部，而該外 引線55則從封裝50向外部伸出而向下鸞曲形成。 如第8園所示，其製造方法為：首先，與第一實施例 之情況一樣*於配置有一由磷青鋦等之内引線54及外引線 及外引線55所成之引線框的金靨模中，注入混合有無機質 缜料的環氧樹脂* Μ离溫內塑模後從金靥棋取出，割斷引 線框之框龌；然後將外引線55向一由第三開口部53所成之 插入口之方向彎折Μ製成封裝50。 其次，從封装50中具有大開口面積之第三開口部53， 用安裝夾具（未圈示）來保持一在電極墊28上形成有凸起 29的CCD晶片27之背面；然後，将凸起29壓接於一插入封 裝50内且設在第一段差部（位於封裝50之上部框鳢）之第 —内引線端子54a，藉此予Μ連接著。在此作業中，從設 在CCD晶片27前面之光學位位置調整裝置（未_示），回 本紙張尺度通用中國國家標準（CNS ) Λ4規格（210Χ297公釐） 16 ---------裝------訂-----·, 银 (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局貝工消費合作社印掣 A7 m- 五、發明説明（13 ) 授位置信號至安裝夾具，一面微調整CCD晶片27之方位一 面將CCD晶片27位置調整於封裝50之第一段差部；同時從 設在壓接夾具侧部之分配器射出一定量之紫外線硬化型黏 合劑30，以黏合固定CCD晶片27之四邊舆封裝50，將CCD晶 片27正確地装載於封装50中。 其次，同樣，從第三開口部53之插入孔，将周邊霣路 元件43插入封裝50之下部框體50b內；然後，透過凸起29 ，將露出於第二開口部52與第三開口部53之段差部的第二 内引線端子54c，壓接連接於周邊電路元件43之電極墊44 。同時，從設在K接夾具之供部的分配器射出一定量之紫 外線硬化型接合劑30, Μ黏合固定周邊電路元件43之四邊 與封裝50,將周邊電路元件43正確地裝載於封裝50。 逭搛，如依本實施傅，由於可将CCD晶Μ 27與周邊電 路元件43MJI層構造、亦邸立«地配置在封裝50内，所Μ 可藉著将固體摄影裝置輿驅動霣路作成一鱧化而滅低基板 上之安裝面稹*可高密度地安裝在小型霣視撮像檐等。 又，於第8圃中，56雖是由用以保護固體摄彩裝置之 玻瑱等透明醱所成之保護板，但於本發明之上述各實施例 中，不論其利用之有無，均不會對於作爲本發明之目的的 機能及效果有何變化。 又，於上述第五至第八實施例中，與前述本發明第三 實施例之愴況一樣，可使内引線之前端部從封装之開口部 稍撤突出於内部，在内引線前端部之揮性下，光學性位置 對準或典凸起之接合成為更爲容易。再者，雖於第一、第 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X 297公釐） II -裝 I I I 訂 I I I I I 線 (請先閲讀背面之注意事項再填寫本頁) P> η .一，-.* 猫充: A7 B7 五、發明説明（14 ) 經濟部中央橾準局貝工消费合作社印製 二實施例中，就凸起29設在CCD晶片27之《極fi上之情況 作了說明，但將此凸起29設在内引線22之前端而舆CCD棋 植46之霣極鱸47接合也可。 再者，於上述第五至第八實施例中，典前述本發明第 四實施例之情況一樣，透«僅上下方向具有導霣性之各異 向性導體，替代凸起29來進行CCD棋塊46之霣極贫47輿内 引線端子之連接也可》 〔產業上之利用可能性〕 如上所逑*如依本發明之固臛搌影裝置及其製迨方法 ，由於其固鼸摄彩裝置及製造方法俤於内部設置貢穿孔Μ 用來密封由内引線及外引》所成之引纗框的封裝内，裝戴 CCD晶片或周邊霣路元件者，而其特撖在於：在封装之兩 蟵面，分別具有不同颶口面積之開口部，且從具有大两口 面積之两口部装填固跚搌彩装置，使其貫穿孔作為密閉構 造，因此可使工程顏著地簡略化》再者，由於将CCD晶片 之安装夾具配置在CCD晶片之背面以便從CCD晶片之前面進 行光學性位置對準，所以可連成極离精度之位置對準，從 而可廉價地製造一装載於能取得鮮明色彩之再現或鐵維圈 像等离_像品質之電視搌像檐的固讎摄影裝置。 (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度逍用中國國家揉準（CNS ) Α4规格（210Χ 297公釐） 18The Ministry of Economic Affairs Central Bureau of Quasi-Bureau Consumption Cooperation. Printed holes; in front of it are formed two mouth portions 25 with small mouth openings, and on the back side are two mouth portions with large exposure openings ( Under M, the insertion port> 26. The face of the mouth 25 is made smaller than the area provided by the CCD chip; and, on the back of the step between the mouth 25 and the mouth 26, K is provided with an inner lead 22, With this, the bumps 29 provided on the «pole 28 of the CCD chip 27 are connected. Next, the manufacturing method of this embodiment will be described. The second 2_ the breaking of the solid color device of the first embodiment of the present invention Noodles. That is, in a golden hurricane chess with a lead frame made of sulphur bronze, etc., an inorganic epoxy resin mixed with an inorganic material is injected; [The frame of the lead frame 24; then, the outer lead is bent in the direction of the insertion port 26 and cracked into the package 21. On the one hand, a mounting jig (not shown) is used to hold a protrusion formed on the pole 28. 29 the back of the CCD chip, and then connect the bump 29K to the inner lead 22. The inner lead 22 俤 is inserted from the entrance 26 of the package 21 The inside is configured as S, which is located on the back of the step 25 of the two mouths 25 and the insertion opening 26 of the package 21. In the crimping operation, the position multiplier 51 is returned from the optical position adjustment S device in front of the CCD chip 27. To the mounting jig, while adjusting the orientation of the CCD wafer 27, the CCD wafer 27 is arranged on the back of the step 21 of the package 21 * At the same time, a certain amount of ultraviolet curing adhesive is emitted from a distributor provided on the side of the crimping jig. 30. The CCD chip 27 is fixed by the M adhesive 27. The four-sided package 21 * enables the CCD chip 27 to be mounted on the package 21 squarely. The third section is a cross section of a solid color device according to the second example of the present invention. The difference between the first embodiment and the first embodiment is that the inner part 22a before the internal guide 22 is a sticky sticking from the mouth part 25 of the package 21 to the inside, so that the Chinese national standard (CNS) A4 specification can be applied to the internal paper size. (210 X297 mm) (Please read the notes on the back before filling out this page) Order 11 Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs • A7 __ --------------- ------------------------------- 5. Description of the invention (8) The nature of the lead 22a is more Easily perform optical position alignment or bonding with the bump 29. Also, in the first and second embodiments, the case where the bump 29 is provided on the electric pad 28 of the CCD chip 27 has been described. However, it is also possible to provide the protrusion 29 at the front end of the inner lead 22 so as to be bonded to the electrode pad 28 of the CCD chip 27. The fourth step is to cut the solid film device of the third embodiment of the present invention It is shown that an inner lead 22 is a side-by-side cross-section ring. As shown by 圔, in this embodiment, an anisotropic conductor 31 having conductivity only in the up-down direction is used instead of the bump 29 to perform a CCD chip. The connector of the 27 pad 28 and the inner lead 22. According to the situation of this embodiment, under the elasticity of the anisotropic conductor 31 made of conductive rubber or the like, the same as the second embodiment, the optical position alignment of the CCD chip 27 becomes Easy to wait for sticky. As such, according to the above-mentioned embodiment, since "through-holes are provided inside the package, they are supplied from the bottom surface of the package, that is, from the inserted CCD chip mounted on the outer lead holder, through the protrusions or anisotropic guides, 霣The inner lead exposed on the back of the stepped portion of the package opening and the insertion opening of the package and the pad of the CCD chip, and the optical position alignment J is performed at the same time, so K can significantly simplify the engineering compared with the conventional. Since the mounting fixture of the CCD wafer can be arranged on the back of the CCD wafer, the optical position alignment from the front of the CCD wafer becomes extremely easy, and the position adjustment of the accuracy can be achieved. The cross section of the solid eel photography device of the embodiment is the same as that of the first embodiment. In the golden chess game equipped with a lead frame 24 made of phosphor green and the like, a mixture of non-eave filler is injected. Epoxy tree paper size is applicable to Chinese National Standard (CNS) A4 specification (210X 297mm) III n ~~ Order. Line (Please read the precautions on the back before filling this page) Central Bureau of Standards, Ministry of Economic Affairs, Shellfish Consumer Cooperation衽 印 袋 A7 Ugly 7 Γ_ ~~ V. Description of the invention (9) Grease, M is removed from the gold mold after the high-temperature inner plastic chess, and the frame of the lead frame 24 is cut; then, the outer lead is bent toward the insertion port 26 to make the package 21. 1 On the other hand, on a part of the surface of a semiconducting substrate (a wiring group and a CCD chip 41) 42 formed of a silicon wafer or the like, a peripheral circuit element 43 made by another process is disposed face down; The rear surface of the eaves device (hereinafter referred to as a CCD module) 46 obtained from the projection 29 (provided on the electrode pad 44 of the peripheral circuit element 43) and the electrode 45 of the wiring group on the substrate 42 is used. Install a fixture (not shown) to hold it; then, crimp 29 is crimped to a pole 47 on the periphery of the CCD chess piece 46, and M is connected to the opening 25 and the insertion opening 26 exposed on the package 21. The inner lead 22 on the back of the step portion. In this crimping operation, the position signal is fed back to the mounting jig from an optical position adjustment device (not shown) provided in front of the CCD chip 41, and the orientation of the CCD chip 41 is adjusted while being removed. On one side, the CCD module 46 is arranged on the back of the step portion of the sealing bag 21; The distributor of KK connected to the injured part of the fixture shoots out a certain set of ultraviolet recording hardening adhesive 30, and KK joins and fixes the four sides of the CCD chess piece 46 with the package 21, thereby loading the CCD chip 41 in the correct position of the package 21. Next The sixth plaque is a cross section of a solid-state imaging device according to the fifth embodiment of the present invention, and is a modification of the foregoing embodiment of the fourth embodiment. It mounts the Yunnan CCD chess piece 46 from the insertion opening 26 of the package 21 ( After forming or placing the CCD crystal chip, peripheral circuit components and wiring groups), the adhesiveness of the package is fixed while thoroughly adjusting the optical position of the CCD chip 41, no matter in its fabrication or manufacturing method, it is the same as the first implementation. However, the difference between the fourth embodiment and the fourth embodiment is that in the fourth embodiment, the paper size of the CCD chip is directly applicable to the Chinese standard (CNS) A4 (210X 297 mm) ) -------- i ------ IT ----- line (please read the notes on the back before filling this page) -13-A7 A7 Shellfish Consumer Cooperation of Central Standards Bureau, Ministry of Economic Affairs · Du printed ..... ---------------------------- fr? ---- 5. Description of the invention (1Q ) Electricity The wafer formation process is formed on the substrate 42 (semiconductor substrate) of the CCD module 46. In contrast, in this example, the CCD wafer 41 is also kneaded with the peripheral «road element 43», which is a CCD made in advance by another process. The peripheral circuit element 43 and the CCD crystal chip are arranged on a substrate 42 on which a wiring group is formed, and are connected as a CCD block 46. Therefore, in the case of this embodiment, a material other than a semiconductor substrate can be used as the substrate 42. From the sixth letter > According to this embodiment, when 18% of the CCD wafer 41 in another project is placed on the substrate 42, the terminals of the CCD wafer 41 and the terminals of the wiring group on the substrate 42, The wires 47a are connected by wire bonding. The seventh group is a cross-section ring of the solid-color photography device according to the sixth embodiment of the present invention; this embodiment is also another modification of the embodiment of the fifth treasure embodiment described above. The difference between this embodiment and the fifth embodiment is that in the fifth embodiment, the peripheral loop path element 43 is the same as that of the fourth embodiment, and is connected to the substrate 42 through the protrusion 29 in a face-down manner. In contrast, in this embodiment, the peripheral circuit element 43 is the same as the CCD chip 41 in the fifth embodiment, and its circuit formation face is provided on the substrate 42 upward, and the circuit of the peripheral circuit 43 also uses the substrate 42. The electric terminals 47a of the above wiring group are connected by a wire bonding method. Thus, the structures of the fourth, fifth, and sixth embodiments of the present invention have similar stickiness and dissimilarity in structure. Now, the advantages of the solid color photography device of each embodiment will be described below. First of all, in the fourth embodiment, since the CCD chip 41 can be formed on the substrate 42 (semiconductor substrate) together with other wiring groups, the paper size applies to the Chinese National Standard (CNS) A4 specification (210 × 297 mm). ------------ ^ --- 1T ------ ^ (Please read the notes on the back before filling out this page) A7 -m- Staff Consumer Cooperatives, Central Standards Bureau, Ministry of Economic Affairs Printing 5. Description of the Invention (11 The connection between the electrodes of the CCD chip 41 and the terminals of the wiring group is extremely easy and reliable, and it is also effective for the miniaturization of solid-state imaging devices. Next, in the fifth In the embodiment, since a CCD chip with a large number of pixels and a high precision which is generally considered to have a very low yield can be manufactured by other processes, it is possible to reduce the overall cost by using only good products. Furthermore, the sixth implementation For example, the CCD chip 41 and the electrodes of the peripheral circuit element 43 and the substrate 42 are connected to each other through a wiring group, which has high reliability (because of the long-term experience of the installation technology or automatic installation of the eaves »). Wire bonding method, so although peripheral circuit elements 43 The light-shielding film 48 is required to face the side of the road, but it can be easily replaced even if the CCD chip 41 or the peripheral circuit element 43 fails, so it has the advantage of reusable components. In the seventh, 49 is borrowed. The glass substrate of the light-shielding film 48 is formed by vapor deposition or sputtering of metal or the like. As explained above, the solid color devices of the fourth, fifth, and sixth embodiments can be manufactured according to their required performance, price, and maximum performance. Best use * to obtain a suitable form. Second, the eighth plaque is a cross-sectional view showing the solid-state photographic device of the seventh embodiment of the present invention. The difference between this embodiment and the above-mentioned embodiments lies in the CCD chip or The peripheral circuit elements are stacked in a package and installed in the package. Therefore, the package is different from the above embodiments. The CCD chip and peripheral circuit elements are inserted through the hole (the through-holes in the package are formed by different opening areas. It is formed in the opening), and is enclosed in a package. Next, the manufacturing method of the structure of this embodiment will be described. In the eighth circle, 50 is a package having a special structure used in this embodiment; Zhang scale is applicable to China National Standard (CNS) A4 specification (210X 297 mm) --------- installation ---- ^ --- order ------ line (please read the note on the back first) Please fill in this page again for details) 15 Α7 Α7 Printed by the Shellfish Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (12) The end face is provided with a first opening 51 having a small opening face, and the other end face is provided with The third opening portion 52 having a large opening area and the third opening portion 53 having a large opening surface 大于 larger than the second two opening portions 2. Further, in the package 50, the upper frame a50a is provided with the first opening portion 51 and the second opening. A portion 52 is provided with an inner lead 54 arranged in a curved shape. One end of the inner lead 54 is exposed at a first step portion of the first opening portion 51 and the second opening portion 52 to form a first inner lead suspect. 54a. In addition, the other end 54b of the upper portion 54 of the package 50 in the upper frame 503, which is curved and extends downward, is sealed between the lower frame 50b and the upper frame 50a of the package 50, and one end is A connection point of the second lead terminal 54c and the outer lead 55 is connected within the package. The second lead terminal 54c is exposed at a stepped portion of the second two-portion portion 52 and the third opening portion 53, and the outer lead 55 protrudes outward from the package 50 and is bent downward. As shown in the eighth circle, the manufacturing method is as follows: first, as in the case of the first embodiment * in a gold mold equipped with a lead frame made of inner lead 54 and outer lead 55 ， Inject the epoxy resin mixed with the inorganic material into the mold. Take out the inner mold and take it out of the golden chessboard. Cut off the frame of the lead frame. Then, move the outer lead 55 to an insertion opening formed by the third opening 53. Bend M in the direction to make a package 50. Next, from the third opening 53 having a large opening area in the package 50, a mounting jig (not shown) is used to hold a back surface of the CCD wafer 27 having the bump 29 formed on the electrode pad 28; 29 is crimped into a first inner lead terminal 54a inserted in the package 50 and provided in the first step difference portion (located on the upper frame of the package 50) to thereby connect the M. In this operation, from the optical position adjustment device (not shown) provided in front of the CCD chip 27, the paper size is common Chinese National Standard (CNS) Λ4 specification (210 × 297 mm) 16 ------- --Installation ------ Order ----- ·, Silver (Please read the precautions on the back before filling out this page) Printed by the Central Standards Bureau of the Ministry of Economy, Shellfish Consumer Cooperative, A7 m- 5. Description of the invention ( 13) Give the position signal to the mounting fixture, while adjusting the position of the CCD wafer 27 slightly, adjust the position of the CCD wafer 27 to the first step of the package 50; at the same time, emit a certain amount of ultraviolet rays from the distributor provided on the side of the crimping fixture The hardening adhesive 30 is used to adhere and fix the four sides of the CCD chip 27 to the package 50, and the CCD chip 27 is correctly mounted in the package 50. Next, similarly, from the insertion hole of the third opening portion 53, the peripheral routing element 43 is inserted into the lower frame 50b of the package 50; then, the second opening portion 52 and the third opening portion are exposed through the protrusion 29. The second inner lead terminal 54c of the step 53 is crimped to the electrode pad 44 of the peripheral circuit element 43. At the same time, a certain amount of ultraviolet curing adhesive 30 is injected from a dispenser provided in the supply part of the K-connecting jig, and the four sides of the peripheral circuit element 43 and the package 50 are bonded and fixed, and the peripheral circuit element 43 is correctly mounted on the package 50. For example, according to this implementation, since the CCD crystal M 27 and the peripheral circuit elements 43MJI layer structure can be arranged in the package 50, the M can be made into a solid-state imaging device by driving the circuit. The mounting surface on the substrate is reduced, and it can be mounted on a small-scale camera eaves with high density. Also, in the eighth garden, although 56 is a protective plate made of transparent glass such as glass to protect the solid-color photography device, in the above-mentioned embodiments of the present invention, no matter whether it is used or not, What changes will be made to the functions and effects which are the object of the present invention. In addition, in the fifth to eighth embodiments, as in the case of the third embodiment of the present invention described above, the front end portion of the inner lead can be slightly withdrawn from the opening portion of the package to protrude inside, and Under the volatility, the optical position alignment or the bonding of the classic bumps becomes easier. In addition, although the first and the first paper sizes apply the Chinese National Standard (CNS) A4 specification (210X 297 mm) II-Pack III and III II line (please read the precautions on the back before filling this page) P > η First,-. * Cat charger: A7 B7 V. Description of the invention (14) In the second embodiment printed by the Shellfish Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs, the protrusion 29 is provided on the CCD chip 27 of The situation has been described, but it is also possible to provide the protrusion 29 at the front end of the inner lead 22 and to join the bass bass 47 of the CCD chess plant 46. Furthermore, in the above fifth to eighth embodiments, as in the case of the aforementioned fourth embodiment of the present invention, the anisotropic conductor having conductivity only in the up and down direction is used to perform the CCD chess instead of the protrusion 29. The connection of the lead terminals in block 46 to 47 is also very poor. [Industrial use possibility] As above * As in the solid-state imaging device and its manufacturing method according to the present invention, due to its solid-state photography The device and manufacturing method are provided with internal holes M for sealing the package formed by the inner lead and the outer lead, and those who wear a CCD chip or a peripheral circuit component. The special feature is that: On the two sides, openings with different hurricane areas are respectively installed, and the staggering device is filled from the two parts with large areas, so that the through-holes are used as closed structures, so the project can be simplified. In addition, since the mounting fixture of the CCD wafer is arranged on the back of the CCD wafer so as to perform optical position alignment from the front surface of the CCD wafer, it can be connected with extremely accurate position alignment, so that it can be cheaply manufactured. Get vibrant colors Reproduction or Tiewei circle image plasmon _ image quality of the television 搌 image eaves solid photography device. (Please read the notes on the back before filling out this page.) Revision of the paper size is in accordance with China National Standard (CNS) Α4 size (210 × 297 mm) 18