TW389429U - Method of establishing electrical connector - Google Patents

Method of establishing electrical connector

Info

Publication number
TW389429U
TW389429U TW087204273U TW87204273U TW389429U TW 389429 U TW389429 U TW 389429U TW 087204273 U TW087204273 U TW 087204273U TW 87204273 U TW87204273 U TW 87204273U TW 389429 U TW389429 U TW 389429U
Authority
TW
Taiwan
Prior art keywords
electrical connector
establishing electrical
establishing
connector
electrical
Prior art date
Application number
TW087204273U
Other languages
Chinese (zh)
Inventor
Dimitry Grabbe
Iosif Korsunsky
Donald W Milbrand
Original Assignee
Whitaker Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Whitaker Corp filed Critical Whitaker Corp
Publication of TW389429U publication Critical patent/TW389429U/en

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3431Leadless components
    • H05K3/3436Leadless components having an array of bottom contacts, e.g. pad grid array or ball grid array components
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01RELECTRICALLY-CONDUCTIVE CONNECTIONS; STRUCTURAL ASSOCIATIONS OF A PLURALITY OF MUTUALLY-INSULATED ELECTRICAL CONNECTING ELEMENTS; COUPLING DEVICES; CURRENT COLLECTORS
    • H01R12/00Structural associations of a plurality of mutually-insulated electrical connecting elements, specially adapted for printed circuits, e.g. printed circuit boards [PCB], flat or ribbon cables, or like generally planar structures, e.g. terminal strips, terminal blocks; Coupling devices specially adapted for printed circuits, flat or ribbon cables, or like generally planar structures; Terminals specially adapted for contact with, or insertion into, printed circuits, flat or ribbon cables, or like generally planar structures
    • H01R12/70Coupling devices
    • H01R12/71Coupling devices for rigid printing circuits or like structures
    • H01R12/712Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit
    • H01R12/714Coupling devices for rigid printing circuits or like structures co-operating with the surface of the printed circuit or with a coupling device exclusively provided on the surface of the printed circuit with contacts abutting directly the printed circuit; Button contacts therefore provided on the printed circuit
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10007Types of components
    • H05K2201/10189Non-printed connector
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/04Soldering or other types of metallurgic bonding
    • H05K2203/041Solder preforms in the shape of solder balls
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341Surface mounted components
    • H05K3/3421Leaded components
    • H05K3/3426Leaded components characterised by the leads
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y02TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
    • Y02PCLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
    • Y02P70/00Climate change mitigation technologies in the production process for final industrial or consumer products
    • Y02P70/50Manufacturing or production processes characterised by the final manufactured product

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)
  • Combinations Of Printed Boards (AREA)
  • Multi-Conductor Connections (AREA)
TW087204273U 1997-03-26 1998-03-24 Method of establishing electrical connector TW389429U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US82501097A 1997-03-26 1997-03-26

Publications (1)

Publication Number Publication Date
TW389429U true TW389429U (en) 2000-05-01

Family

ID=25242892

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087204273U TW389429U (en) 1997-03-26 1998-03-24 Method of establishing electrical connector

Country Status (4)

Country Link
JP (1) JPH10275662A (en)
GB (1) GB2325354A (en)
IE (1) IE980209A1 (en)
TW (1) TW389429U (en)

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000277885A (en) * 1999-03-25 2000-10-06 Berg Technol Inc Electrical connector and its manufacture
KR100675703B1 (en) * 1999-03-25 2007-02-01 커넥터 시스템즈 테크놀로지 엔.브이. Connector set
US6352437B1 (en) * 1999-10-20 2002-03-05 John O. Tate Solder ball terminal
US6774310B1 (en) * 2000-10-27 2004-08-10 Intel Corporation Surface mount connector lead
CN2598184Y (en) * 2003-01-29 2004-01-07 莫列斯公司 Conducting terminal and electric connector using same
US7005742B2 (en) * 2004-02-05 2006-02-28 Texas Instruments Incorporated Socket grid array
US7285018B2 (en) 2004-06-23 2007-10-23 Amphenol Corporation Electrical connector incorporating passive circuit elements
JP4493101B2 (en) * 2006-03-29 2010-06-30 ヒロセ電機株式会社 Electrical connector
US20110287663A1 (en) 2010-05-21 2011-11-24 Gailus Mark W Electrical connector incorporating circuit elements
US8382524B2 (en) 2010-05-21 2013-02-26 Amphenol Corporation Electrical connector having thick film layers
JP5869282B2 (en) * 2011-10-03 2016-02-24 タイコエレクトロニクスジャパン合同会社 Electrical connector
US8591257B2 (en) 2011-11-17 2013-11-26 Amphenol Corporation Electrical connector having impedance matched intermediate connection points
DE102016220379A1 (en) * 2016-10-18 2018-04-19 Robert Bosch Gmbh Plug pin with concave recess in the contact surface, plug and plug contact spring system

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB8424041D0 (en) * 1984-09-22 1984-10-31 Smiths Industries Plc Electrical contact assemblies and components
CA2034700A1 (en) * 1990-01-23 1991-07-24 Masanori Nishiguchi Substrate for packaging a semiconductor device
US5261155A (en) * 1991-08-12 1993-11-16 International Business Machines Corporation Method for bonding flexible circuit to circuitized substrate to provide electrical connection therebetween using different solders

Also Published As

Publication number Publication date
GB9806429D0 (en) 1998-05-20
IE980209A1 (en) 1998-10-07
GB2325354A (en) 1998-11-18
JPH10275662A (en) 1998-10-13

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees