TW386095B

TW386095B - Resin composition to be plated

Info

Publication number: TW386095B
Application number: TW85103064A
Authority: TW
Inventors: Masatoshi Iwafune; Takashi Mizoguchi
Original assignee: Cosmo Sogo Kenkyusho Kk; Cosmo Oil Co Ltd
Priority date: 1996-03-14
Filing date: 1996-03-14
Publication date: 2000-04-01

Description

經濟部中央標準局員工消費合作社印製 A7 __；____B7___ 五、發明説明（1 ) [發明之背景] 〈發明之領域〉本發明係坪於同時具有儍異之鍍敷特性及優異之電學特性之被鍍敷用之樹脂組成物，尤其覼於對電子元件（配線基板、連接器、外殼、絕緣材料等）有用之被鍍敷用之樹脂組成物。更詳細而言*本發明係賭於被镀敷用之樹脂組成物，其為熱塑性樹脂並且具有優異之鍍敷特性及電學特性，因此適於利用射出成形技術之三維電路基板或電子元件（射出成形電路兀件：Molded interconection devices<MID>，射出成形電路基板：Molded circuit boad<MCD>)之製造者0 ，- 〈關聯技術之描述> 鍍敷特性優異之熱塑性樹脂（即，被鍍敷用之樹脂）組成物由於容易施行射出成形、擠壓成形等之成形加工，有可能實現三維成形，而向來被多用於各種之電子電機零件、汽車零件、機械零件、及裝飾品。習知之被鍍敷用之樹脂組成物由於摻配用之無機填料之形狀、粒徑之改善或鍍敷技術之進步，可得到充分之鍍敷特性。另一方面，對於電子元件例如印刷配線基板、連接器、絕緣基板等使用之熱塑性樹腊不僅在鍍敷性，亦在電學特性被要求巌格（規定）之性能。在此，「鍍敷特性J 一詞乃指被鍍之樹脂組成物與施鍍 i紙張尺度適用中國國家標準（CNS ) Μ規格（210X297公釐) ' ' ^~~ 一扃一 -----；IΙΊ—^—,—iT - (請先閲t背'®之注意事項再填寫本頁) A7 B7 經濟部中央標準局員工消費合作社印製五、發明説明：2 ) - 1 1 I 之金属之結合狀態之好壞即樹脂組成物與金屬鍍膜之密合 Γ I 性而言 9 該密合性良好時稱為厂鍍敷特性優異 J 〇 I 再者 P 所謂厂優異之電學特性 J 意指樹脂絕緣材料尤其請先閽 1 1 高頻用絕緣材料被要求之特性即具有低介電常數低介電讀' ，背 1 I 面 I 工切者〇之- 注 1 I 意又按 9 已被報告或市面上出售中之被鍍敷用之樹脂及樹事項 I 脂組成物皆示其介電常數介電正切很高〇再填寫例如曰本專利特願昭 56-136841虢特願平5 -230276號本頁 '—〆 1 1 > 特願平 1- 98637號等所報告之被鍍敷用之樹脂均具有優 1 1 異之鍍敷特性 9 其工業價值極高但其電學特性惡劣〇 1 Ί 因此其用途受到限制 » 例如在高頻帶域使用之電子元 1 訂件等之情況由於其信號損失很大 9 在使用上有团難〇 1 I 另一方面已知 1 樹脂成形品與金羼鍍膜之密合強度對樹 1 1 1 脂表面之物理性質即表面粗糙度有高度之依賴性〇 1 1 尤其在樹脂成形品之表面上均勻形成有適當大小之孔隙 1 (投錨用之孔隙 Μ下稱為「微孔」 ) 時可顧著提高鍍敷密 1 合強度 (錨定效果）〇 1 I 至於樹脂成形品表面上形成微孔之方法 % 藉由酸驗 1 或有機溶劑等所行之化學蝕刻法被用之情況較多〇 1 例如施行一種化學蝕刻法 > 其中藉摻配有指定量之對酸 1 1 鹼水溶液或有機溶劑等可溶之無機填料之樹脂組成物得 1 1 到成彤品後用特定溶劑（酸、鹼水溶液· 、有機溶劑）浸透該 1 I 成形品之表面 Μ 使無機填料溶出或脫離者藉此可容易使 1 1 I 微孔形成於該成形品之表面〇 1 1 本紙張尺度適用中國國家標準（CNS ) A4規格（2丨OX”7公釐） A7 B7 五、發明説明（3 ) 如此，為被鍍敷用之樹脂*使用一種在熱塑性樹脂摻配有對酸、鹼水溶液或有機溶_等可溶之特定無機填料之樹脂組成物。在以往之情形，為上述特定之無機填料使用碳酸縛、玻璃、碳酸鎂、氧化鎂、焦磷酸鈣、硫酸鋇、碳酸鋇、氧化鋅、其他多種無機物。但習知技術所報容之無機填料有使樹脂之電學特性惡化之缺點。具體可舉出如前所逑之介電常數或介電正切之升高等。在利用於電子元件尤其電絕緣材料之場合，尤其是其中之高頻信號用之電子元件之場合，介電常數或介電正切之升高係使信號損失加大或使信號傳輸速度降低者。在此所諝「高頻信號」乃指IGHzM上之頻率帶者，為使用高頻信號之商品可具體舉出，攜帶式電話、PHS、口袋電鈐、衛星末端、導航糸統、無線LAN等。經濟部中央標率局員工消費合作社印製. (請先閱讀背面之注意事項再填寫本頁) 到目前為止，關於同時具有儍異之鍍敷特性及儍異之電學特性（低介電常數、低介電正切）之樹脂組成物，並無任何報告。又按*利用射出成形之電子元件之製造技術由於有可能實規電子元件之小型化、高密度化而在最近受到注目。本發明之目的在考慮Μ上各點下提供一種適於射出成形之熱塑性樹脂組成物且係同時具有優異之鍍敷特性及優異之電學特性之被鍍敷用之樹脂組成物。在此種實情之下，為了達到上述目的，本案發明人潛心本紙張尺度適用中國國家標準YcNS ^Α4規格^^10X297公釐）~ -6 - A7 B7 五、發明説明（4 ) 進行研究結果發現，對熱塑性樹脂摻合特定之無機填料即可得到同時具有優異之鍍敷持性及優異之電學特性之被鍍敷用之樹脂組成物之事實，由是完成本發明。 [發明之概述] 即本發明為覼於同時具有儍異之鍍敷特性及優異之電學特性之被鍍敷用之樹脂組成物，其特徵為，在熱塑性樹脂摻配有硼酸鋁及/或石英玻璃為無機填料者。 [圖式之簡簞說明] 圖1為用Μ說明本發明實施例中進行試片之化學蝕刻之要領之圖。 [較佳態樣之說明] 在本發明中，硼酸鋁及石英玻璃最好能具有長徑比10Μ 下（Μ5Μ下較隹）及平均粒徑0.01〜ΙΟΟβ a。再者，本發明之被鍍1¾用之樹脂組成物最好能具有高頻帶ΙΟΟΚΗζ〜30 0GHz之介電常數4.0M下及該頻帶之介電正切0 , 01 Μ下。經濟部中央標隼局員工消費合作社印製 (讀先閱讀背面之注意事項再填寫本頁) 為本發明中之熱塑性樹腊可舉出市售之熱塑性樹脂類所代表之樹脂。具體可舉出如聚乙烯（ΡΕ)、聚丙烯（ΡΡ)、聚苯乙烯（PS) 、聚甲基丙烯酸甲酯（PMMA)、ABS樹脂、AS樹脂等之通用樹脂，如聚甲醛（Ρ0Μ)、聚碳酸酯（PC)、聚苯醚（PPE)、聚醯胺（PA:耐綸）、聚對酞酸乙二酿（PET)、聚對酞酸丁二酯（PBT)等之工程塑膠，此外可舉出聚苯硫継（PPS)、聚醚碱（PES)、聚醚醢亞胺（PEI)、聚継.醚酮（PEEK)、聚酮本紙張又度適用中國國家標準（CNS ) A4規格（210 X 297公釐） _ 7 _ 經濟部中央標準局員工消費合作社印製 A7 B7_ 五、發明説明（5 ) (PK)、聚釀亞胺（PI)、聚環已综二甲醇對酞酸» (PCT)、聚芳賄（PAR)、各種液晶聚合物（LCP)等。此等樹脂可各別單獨使用之，或者此等樹腊亦得以合併成之高分子多成分糸即二種K上之上述樹腊在物理上或化學上按指定組成比摻合成之聚合物混合驩或聚合物摻合體使用之，或者此等樹脂亦得以變性物使用之。在此所謂「變性物J乃指（合成樹胞）由於在反應或混合時有一部分基本成分被其他成分取化而改變性質之合成樹腊或混合物而言。為高分子多成分系之較佳組合例，在二成分糸可舉出： PPE/PS、PPE/PC、PPE/PA、PPE/PET > PPE/PBT - PPE/PEI 、PPE/PPS 'PPE/PES - PPE/PEEK' PPE/PCT > PPE/LCP > PEI /PC、PEI/PEEK ' PEI/LCP' FEI/FET - PEI/PBT - LCP/PAR 、LCP/PEEK ' LCP/PET' LCP/PBT·、LCP/PC ' LCP/PCT ' LCP /PEEK等〇再者，在其三成分系可舉出PPE/PC/PS、PPE/PEI/PC、 PPE/PEI/PS ' PEI/PPE/LCP、PE I/PC/LCP - PE I/PBEK/LCP 等。上述之聚合物混合體或聚合物摻合體亦可K在提高相容性等之目的下摻配有相容化劑等。為相容化劑之具體例可舉出，環氧變性HMA-MMA共聚物、環氧變性St-St共聚物、環氧變性St-MMA共聚物、環氧變性MMA-St共聚物、St-顒丁烯二酐共聚物、St-MMS共聚物、順丁烯二醉-乙烯系共聚物等。本紙張尺度適用中國國家標準（CNS ) A4規格'(210X.297公釐） „ 一 Ο —. (請先閱讀背面之注意事項再填寫本頁)Printed by A7 __; ____B7___ of the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention (1) [Background of the Invention] <Field of Invention> The present invention is a combination of stupid plating properties and excellent electrical properties. The resin composition for plating is particularly suitable for the resin composition for plating useful for electronic components (wiring boards, connectors, housings, insulating materials, etc.). More specifically * The present invention is a resin composition for plating, which is a thermoplastic resin and has excellent plating characteristics and electrical characteristics. Therefore, it is suitable for three-dimensional circuit boards or electronic components (injection Molded circuit element: Molded interconection devices < MID >, Injection molded circuit board: Molded circuit boad < MCD >) maker 0,-<Description of related technology> Thermoplastic resin with excellent plating characteristics (ie, plated Since the resin) composition is easy to perform injection molding, extrusion molding, and the like, it is possible to realize three-dimensional molding, and it has been widely used in various electronic and electrical parts, automotive parts, mechanical parts, and decorations. The conventional resin composition to be plated can obtain sufficient plating characteristics due to the improvement of the shape and particle size of the inorganic filler used for blending or the advancement of the plating technology. On the other hand, thermoplastic waxes used for electronic components such as printed wiring boards, connectors, and insulating substrates are required to have a performance that is not only specified in terms of plating properties but also electrical characteristics. Here, "The term" plating characteristics J "refers to the resin composition to be plated and the size of the paper to be plated. The applicable Chinese National Standard (CNS) M specification (210X297 mm) '' ^ ~~ 扃一 ---- -； IΙΊ — ^ —, — iT-(Please read the “Notes on tback'® before filling out this page”) A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention: 2)-1 1 The quality of the bonding state of the metal is the adhesion between the resin composition and the metal plating film. Γ I is 9 When the adhesion is good, it is said to be excellent in plant plating characteristics. Refer to resin insulation materials, especially please read 1 1 The characteristics required for high-frequency insulation materials are low dielectric constant and low dielectricity reading, back 1 I surface I cut by 〇-Note 1 I mean press 9 Resin and Tree Matter I Reported or Available on the Market I Grease The finished products all show that their dielectric constants and tangents are very high. Then fill in, for example, Japanese Patent No. 56-136841, No. Heping 5-230276, and this page'—〆1 1 > No. 1-98637 The reported resins used for plating all have excellent 1 1 different plating characteristics 9 extremely high industrial value but poor electrical characteristics 0 1 Ί therefore their use is limited »such as the use of electronic elements in high frequency bands 1 In the case of parts, the signal loss is very large. 9 It is difficult to use. 1 I On the other hand, 1 The strength of the adhesion between the resin molded product and the gold tint coating is known to the tree. 1 1 1 The physical property of the grease surface is the surface. Roughness is highly dependent. 0 1 1 Especially when uniformly formed pores 1 are formed uniformly on the surface of the resin molded product (the pores used for anchoring are hereinafter referred to as "micropores"), the plating density can be improved. Strength (anchoring effect) 〇 1 I As for the method of forming micropores on the surface of the resin molded product, chemical etching methods such as acid test 1 or organic solvents are often used. 1 For example, a chemical etching method is performed. The amount of the resin composition of soluble inorganic fillers such as an aqueous solution of an alkali 1 1 or an organic solvent is 1 1 to a finished product, and the surface of the 1 I molded product is impregnated with a specific solvent (acid, alkali aqueous solution, organic solvent). Μ Those who dissolve or dissolve the inorganic filler can easily form 1 1 I micropores on the surface of the molded product. 0 1 1 This paper size is applicable to the Chinese National Standard (CNS) A4 specification (2 丨 OX "7 mm) A7 B7 V. Description of the invention (3) In this way, for the resin to be plated *, a resin composition in which a thermoplastic resin is mixed with a specific inorganic filler soluble in acid, alkali aqueous solution or organic solvent is used. In the past, carbonic acid, glass, magnesium carbonate, magnesium oxide, calcium pyrophosphate, barium sulfate, barium carbonate, zinc oxide, and various other inorganic substances were used for the above-mentioned specific inorganic fillers. However, the inorganic fillers reported in the conventional technology have the disadvantage of deteriorating the electrical characteristics of the resin. Specific examples include the increase in the dielectric constant or the dielectric tangent as described above. In the application of electronic components, especially electrical insulation materials, especially those of high-frequency signals, the increase of the dielectric constant or the dielectric tangent increases the signal loss or decreases the signal transmission speed. "High-frequency signal" here refers to the frequency band on IGHzM. Examples of products that use high-frequency signals include mobile phones, PHS, pocket phones, satellite terminals, navigation systems, wireless LAN, etc. . Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs. (Please read the precautions on the back before filling out this page.) So far, it has stupid plating characteristics and stupid electrical characteristics (low dielectric constant, Low dielectric tangent) resin composition has not been reported. In addition, the manufacturing technology of electronic components utilizing injection molding has recently attracted attention due to the possibility of downsizing and high density of the conventional electronic components. An object of the present invention is to provide a thermoplastic resin composition suitable for injection molding in consideration of the above points and a resin composition for plating that has both excellent plating characteristics and excellent electrical characteristics. Under such circumstances, in order to achieve the above-mentioned purpose, the inventor of this case has devoted himself to applying the Chinese national standard YcNS ^ Α4 size ^^ 10X297 mm) to this paper size. -6-A7 B7 V. Description of the invention (4) The research results found The invention was accomplished by blending a specific inorganic filler with a thermoplastic resin to obtain a plated resin composition having both excellent plating holding properties and excellent electrical characteristics. [Summary of the Invention] That is, the present invention is a resin composition for plating that has both stupid plating characteristics and excellent electrical characteristics. It is characterized in that a thermoplastic resin is doped with aluminum borate and / or quartz. Glass is an inorganic filler. [Brief description of the drawings] Fig. 1 is a diagram for explaining the method of performing chemical etching of a test piece in the embodiment of the present invention using M. [Explanation of a Preferred Aspect] In the present invention, aluminum borate and quartz glass preferably have an aspect ratio of 10M (more at M5M) and an average particle diameter of 0.01 to 100 β a. In addition, the resin composition for plating 1¾ according to the present invention preferably has a dielectric constant of 4.0M at a high frequency band of 100KΗζ to 300 GHz and a dielectric tangent of the frequency band of 0.01M. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (read the precautions on the back and then fill out this page). The thermoplastic waxes used in the present invention include resins represented by commercially available thermoplastic resins. Specific examples include general resins such as polyethylene (PE), polypropylene (PP), polystyrene (PS), polymethyl methacrylate (PMMA), ABS resin, AS resin, etc., such as polyoxymethylene (POM) , Polycarbonate (PC), Polyphenylene ether (PPE), Polyamide (PA: nylon), Polyethylene terephthalate (PET), Polybutylene terephthalate (PBT), and other engineering plastics In addition, it can include polyphenylene sulfide (PPS), polyether base (PES), polyether sulfide imine (PEI), polyfluorene. Ether ketone (PEEK), polyketone. ) A4 size (210 X 297 mm) _ 7 _ Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 B7_ V. Description of the invention (5) (PK), Polyimide (PI), Polycyclohexylene Dimethoxide Terephthalic acid »(PCT), polyarylate (PAR), various liquid crystal polymers (LCP), etc. These resins can be used individually, or the polymer waxes can also be combined into a polymer multi-component, that is, two kinds of the above-mentioned waxes on the K are physically or chemically blended at a specified composition ratio and mixed with the polymer. Or polymer blends, or these resins can also be used as denaturants. The term “denatured substance J” refers to a synthetic tree wax or mixture whose properties are changed due to a part of the basic components being changed by other components during the reaction or mixing. It is preferably a polymer multi-component system. Combination examples include two components: PPE / PS, PPE / PC, PPE / PA, PPE / PET > PPE / PBT-PPE / PEI, PPE / PPS 'PPE / PES-PPE / PEEK' PPE / PCT > PPE / LCP > PEI / PC, PEI / PEEK 'PEI / LCP' FEI / FET-PEI / PBT-LCP / PAR, LCP / PEEK 'LCP / PET' LCP / PBT ·, LCP / PC 'LCP / PCT 'LCP / PEEK, etc. In addition, the three components include PPE / PC / PS, PPE / PEI / PC, PPE / PEI / PS' PEI / PPE / LCP, PE I / PC / LCP- PE I / PBEK / LCP, etc. The above-mentioned polymer mixture or polymer blend may be blended with a compatibilizer for the purpose of improving compatibility, etc. Specific examples of the compatibilizer include Out, epoxy-modified HMA-MMA copolymer, epoxy-modified St-St copolymer, epoxy-modified St-MMA copolymer, epoxy-modified MMA-St copolymer, St-fluorene butene dianhydride copolymer, St- MMS copolymer, cis-butadiene-vinyl copolymer, etc. Paper size Applicable to China National Standard (CNS) A4 specification '(210X.297mm) „One 〇 —. (Please read the precautions on the back before filling this page)

經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（6 ) 但在此所謂「共聚物」乃指無規共聚物、嵌段共聚物、交互共聚物Μ及接枝共聚物而言。再者，本發明使用之熱塑性樹脂亦可Μ在改進樹脂之基本性能例如機械特性、電學特性、_熱性、成形加工性、流動性、阻燃性、耐紫外線性、耐藥品性、成形品外観等或給與著色、光澤等之目的下摻配有各種添加劑。為添加劑可舉出助塑劑、熱安定劑、氧化安定劑、交聯劑、阻燃劑、紫外線吸收劑、著色劑、光澤賦與劑等。本發明中之無機填料即硼酸鋁及石英玻璃通常各钊g由[ 式1]及[式2]代表之： [式 1] 11AI2O3. ο B 2 0 3 (式中η及m表示1〜1 0 0之整數） [式 2 ] Si02 硼酸鋁在工業上係藉一種mai2o3及B2〇3為原料之稱為外部瑢融法之製造方法製造者。石英玻璃含有二氧化矽（Si02)成分96S!M上，最好能為 99¾以上，其中以熔融一次後之非晶形物質為較佳。在此，若石英玻璃之二氧化砂成分之純度低於96¾，其介電常數及介電正切則會升高。在本發明使用之硼酸鋁及石英玻璃係具有長軸方向之長度與單軸方向之長度之比率即長徑比10K下（K5M下較隹 )又具有平均粒徑0.01〜100w羅（以0.1〜50iu b較佳）之粉末狀或球狀填料。其長徑比（縱横比）愈接近1，易言之，填料形狀愈接近本紙張尺度逋用中國國家標準（CNS ) A4規格（210 X 297公釐） (請先閱讀背面之注意事項再填寫本頁)Printed by A7 B7, Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the Invention (6) However, the term "copolymer" refers to random copolymers, block copolymers, cross copolymers M, and graft copolymers. . Furthermore, the thermoplastic resin used in the present invention can also improve the basic properties of the resin, such as mechanical properties, electrical properties, thermal properties, molding processability, flowability, flame resistance, ultraviolet resistance, chemical resistance, and outer appearance of molded products. Various additives are added for the purpose of coloring and gloss. Examples of the additives include plasticizers, heat stabilizers, oxidation stabilizers, crosslinking agents, flame retardants, ultraviolet absorbers, colorants, and gloss imparting agents. The inorganic fillers in the present invention, namely aluminum borate and quartz glass, are generally represented by [formula 1] and [formula 2]: [formula 1] 11AI2O3. Ο B 2 0 3 (where η and m represent 1 to 1 (Integer of 0 0) [Formula 2] Si02 Aluminum borate is a manufacturer of an external melting method called mai2o3 and B203 as raw materials. Quartz glass contains silicon dioxide (Si02) component 96S! M, preferably 99¾ or more, of which amorphous material after melting once is preferred. Here, if the purity of the sand dioxide component of quartz glass is lower than 96¾, its dielectric constant and dielectric tangent will increase. The aluminum borate and quartz glass used in the present invention have a ratio of the length in the long axis direction to the length in the uniaxial direction, that is, the aspect ratio is 10K (more at K5M), and the average particle diameter is 0.01 to 100w (0.1 to 100w). 50iu b is preferred) powder or spherical filler. The closer the aspect ratio (aspect ratio) is to 1, that is to say, the closer the shape of the filler to the paper size, the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the precautions on the back before filling in (This page)

A7 B7 五、發明説明（7 ) 真圓（球），鍍敷特性愈佳。若長徑比太大，具體上若大於10，其微礼之形狀則圼纖維狀，使鍍敷密合強度顯著降低。平均粒徑若小聆0.01«m，其「無電（解）鍍J (electroless Plating)用觸媒之賦與（即，將無電鍍用之觸媒吸附在成形品之表面上）則發生困難*不僅無法得到充分之密合強度，亦無法得到表面均勻之鍍膜。平均粒徑若大於l〇〇M m，其微孔則加大至超過所需程度之大小；無法得到充分之錨定效果，使鍍膜與樹胞間之物理強度轉弱。無機填料即硼酸鋁或石英玻璃之摻配量乃在熱塑性樹脂與無機填料之縴量被設定為1〇〇份（重量 > 之場合較佳的是，以樹脂30〜95份（重量）計*將無機填料設定為5〜70份（重量），最好能Μ樹脂40〜90份（重量）計’將無機填料設定為10〜60份（重量）。經濟部中央標準局員工消費合作社印製無機填料量若少於5份（重量 >，則無法得到實用上充分之鍍敷密合強度。另若多於70份（重量），其流動性則顯著降低，使成形加工性惡化。亦可Κ在改進無機填料之分散性或對樹脂之親合性或提高無機填料之熱安定性或氧化安定性之目的下藉習知方法對無機填料施加表面處理。為表面處理之方法*可舉出摻配偁合劑之方法。為偁合劑之較佳例子可舉出，如乙烯三氯矽烷、乙烯參 (/Θ-甲氧乙氧基）矽烷、乙烯三乙氧基矽烷、乙烯三甲氧基 10 (請先閲讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐）經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（8 ) 矽烧、7 -甲基丙烯醢氧丙基三甲氧基矽燒、環氧環己基）乙基三甲氧基矽烷、縮水甘油氧丙基三甲氧基砂焼、7 -縮水甘油氧丙基甲基二乙氧基矽烷、10-( 胺乙基）_7 -胺丙基三甲氧基矽烷、卜沒“胺乙基）_7 -胺丙基甲基二甲氧基矽烷、7 -胺丙基三乙氧基矽烷、卜苯基-r-胺丙基三甲氧基矽烷、氫硫丙基三甲氧基矽梡、7 -氣丙基三甲氧基矽烷、二（三甲氧矽烷丙基）四硫、 3-氫硫丙基三甲氧基矽烷、2_氮硫乙基三甲氧基矽烷、3-胺丙基三乙氧基矽烷、H-2-(胺乙基）-3-胺丙基三甲氧基矽烷、乙烯三（2-二甲氧基乙氧基）矽烷、3-甲基丙烯釀氧丙基三甲氧基矽烷、3 -縮水甘油氧丙基三甲氧基矽烷等之矽烷系偶合劑，如钛酸三異硬腊醢丙酯、钛酸二（二辛基磷酸釀）.二異丙酯、故酸二（十二基苯磺醢基）二異丙酿、钛酸二異硬脂醢二異丙酯等之鈦酸糸偶合劑等。此等偁合劑之使用量可設定在電學特性或鍍敷特性不致惡化之範圍内，通常Μ無機填料i 〇〇份（重量）基準之 0.0001〜1份（重量）之範圃較佳。本發明之樹脂組成物係在熱塑性樹脂摻配有硼酸鋁或石英玻璃作為無機填料者*而（為該無機填料）亦可Μ使用硼酸鋁與石英破璃之混合物。再者，亦可Κ在不使電學特性及鍍敷特性降低之範圍内採取硼酸鋁或石英玻璃與其他無機填料之合併使用。為可合併使用之無機填料之例子可舉出，玻璃、玻璃短鑛維、玻璃鏘維、玻璃珠、白砂珠、短切纖維、碳繼維、碳、破黑、芳族聚醢胺、鈦酸鉀、礓酸鋁、硼酸鎂、碳酸適用中國國家標隼（CNS ) Α4規格（210X297公釐） 11 ------——-——裝---—訂—I—n—!)y^. ' ' i (請先閲讀背面之注意事項再填寫本頁) A7 B7__^_ 五、發明説明（9 ) 鈣、碳酸鎂、硫酸鎂、硫酸鈣、硫酸鋁、焦播酸播、氮化矽、氮化鋁、氮化硼、碳化矽、氧化鋁、氧化鋁纖維、二氧化矽、雲母、滑石、矽藻土、粘土、火山灰、石灰石、膨土、二氧化鈦、氧化鎂、氧化鈣、二硫化餌等。本發明之樹脂組成物雖然可利用一般之複合材料製造技術來製造，但從生產力、經濟性之觀點上最好能在工業上利用熔融捏合法製造之。具體上可舉出，利用二袖擠出機或單軸擠出機之捏合法之製造，利用分批式加熱熔融捏合機（由LABOPLASTMILL所代表者）所行之製造。本發明之樹脂組成物具有熱塑性而有可能施行射出成形、擠出成形或壓縮成形。再者，亦有可能藉由利用有機溶劑等之溶媒流延法來實現薄膜化及成膜。經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 本發明樹脂組成物之成形品與金鼷鍍膜之密合強度（鍍敷密合強度）乃與前述之習知被鍍敷用樹脂組成物之成形品之場合同樣，對成形品表面（即樹脂組成物表面）之物理性質即表面粗糙度有高度之依賴性，尤其於鏤敷前在成形品¥面上均匀形成適當大小之微孔時可由錨定效果達到鍍敷密合強度之大幅改進。上述微孔之形成，乃與習知被鍍敷用樹脂組成物之成形品之場合同樣，Μ化學蝕刻為有效之方法。化學蝕刻係如前所述，利用與被鍍敷用樹脂組成物中之無機填料有蘭之溶劑（可溶該無機填料者），例如酸、餘水本紙張尺度適用中國國家標準（CNS〉Α4規格（210 X 297公釐） £2 A7 B7 五、發明説明（10 ) 溶液或有機溶劑等，Μ浸透成形品之表面後，使表面之無機填料溶出或脫離*如此施行者。本發明中之硼酸鋁及石英玻璃均可溶於鹼水溶液。因此，用鹼水溶液對本發明樹脂組成物之成形品之表面施加化學蝕刻即可使存在於該成形品表面之硼酸鋁或石英玻璃溶出*脫離，而形成對鍍敷有效之微孔。此項鹼水溶液，在硼酸鋁及石荚玻璃之溶解性及經濟性之觀點上較佳者為例如氫氧化鈉、氫氧化鉀、氫氧化鋰等 ζ水溶液，而此等水溶液可單獨或混合使用之。此等鹼水溶液之鹼澹度之範圍為1〜15Η，私3〜12Η較佳。若此鹼濃度低，珊酸鋁或石荚玻璃之溶出則極費時，而若此鹼濃度高，樹脂則會顯著劣化，结果是引起鍍敷密合強度之降低。又按，在本發明中，已添加有（合併使用）其他無機填料之埸合，不僅對前逑硼酸鋁或石英玻璃施加化學蝕刻，亦可Μ對該等其他無機填料同時施加化學蝕刻。經濟部中央標率局員'X消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 在此場合之蝕刻溶液乃依所併用之無機填料之性質即無機填料之溶解性、腐蝕性等而選擇者，例如在併用碳酸鈣、焦磷酸鹽、硫酸鋇等之場合，通常使用酸（例如硫酸、鹽酸、鉻酸、磷酸、醋酸、硝酸、硼酸等之單獨或混合物或其水溶筱）*而在併用玻璃系或氧化鋁糸之埸合通常使用鹼（例如氫氧化鉀、氫氧化納、氫氧化鋰等之任選濃度钬溶液或其混合溶液>。在i H任一場合，化學蝕刻之溫度最好能在常溫（20 本紙張尺度適用中國國家標準（CNS ) A4規格（210 X 297公釐） A7 B7 五、發明説明（11) 1C)〜120t：之範圍內，M50〜10010之範圍內較佳。若蝕刻之溫度低，無機填料之溶出則極費時，而若此蝕刻溫度高，樹脂則會顯著劣化。又按，在施行化學蝕刻之際，亦可K在提高無機填料之溶解速度之目的下同時利用攪拌、超音波照射、空氣鼓泡等手段。再者*亦可Μ在提高化學蝕刻之效果之目的下，在施行化學蝕刻之前，先行一種溶解樹脂組成物成形品表面（樹脂皮層）之樹脂Μ暴露無機填料之操作（預蝕刻）。對此項預蝕刻，通常使用之方法係有可能適應者。為預蝕刻，通常有可能使用有機溶劑、鹼水溶液、酸等，不過在本發明較佳的是，有機溶液或酸之使用。為預蝕刻使用之有機溶劑之較佳例子可舉出，氯仿、二氯甲烷、苯、甲苯、二甲苯、吡啶、己烷、四氫呋喃、乙腈、醋酸乙酯、Ν,Ν-二甲基甲醯胺、N-甲基呲咯啶酮、二甲亞颯等。經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 為酸之較佳例子可舉出*硫酸、鹽酸、鉻酸、硝酸、磷酸或此等酸混合成之混合酸。藉Κ上之化學蝕刻步驟，或除了預蝕刻步驟外，可對本發明之樹脂組成物所得之成形品，與習知被鍍敷用樹脂所得之成形品同樣，實_無電鍍及電鍍。本發明之樹脂組成物細前所述，最好锥具有頻率帶100 KHz〜300GHz之介電常數4.0Μ下及該頻帶之介電正切0.01 Μ下。本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ29?公釐〉 A7 B7_____；_ 五、發明説明（12 ) 若具有上逑頻率帶之介電常數為大於4.0或該頻帶之介電正切為大於0.01之樹脂被用於電子元件或( 尤其在lGHzK上之高頻帶域使用之該等元件或材料）’則由於其信號損失大，在電路設計等發生不合理，有時（依用途）導致無法使用。 [實施例] K下之實施例及比較例中，為硼酸鋁使用9/Π2〇3· 2Β2〇3所示之斜方晶系晶體，係在Α1203&Βζ〇3為原料之下藉外部熔融法所製成者。再者*為石英玻璃使用由具有二氧化矽（Si〇2)成分99.9 ίΚΜ上之晶狀二氧化矽（石英）一且熔融後被冷卻所製成之非晶形物質。在Μ下之實施例及比較例中所用之樹腊為如下·· 〈所用之樹脂〉 • ΡΕΙ:聚醚豳亞胺（日本GE塑膠公司製品ULTEM1000) 經濟部中央標率局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) .ΡΡΕ:變性聚笨釀（旭化成工業公司製品HYL0H/PXL9102) •LCP:液晶聚合物（住友化學工業公司製品住友 SuperE6000) ，PA:耐綸6(三菱化學公司製品N0BAMID1013C) • Ρ0Η :聚甲醛（旭化成工業公司製品TEHACK3010) • ΡΒΤ :聚對酞酸丁二酯（帝人公司製品/帝人ΡΒΤ樹脂CH- 7000) • PEEK :聚_ · _酮（住友化學工業公司製品VICTREX45C) • PPS :聚苯硫醚（大日本IHK工業公司製品LAIT0H/R-4) 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ' -15- 經濟部中央標準局員工消費合作社印製 A7 ___B7 __ 五、發明説明（13) * PC ··聚碳酸_ (三菱化學公司製品K0BAREX7022A) 實施例1〜5 4 〈被鍍敷用之樹腊組成物之製造〉按表1所示之組成比，使所指定之熱塑性樹脂與硼酸鋁或石英玻璃摻合。其後*使甩定量進料器按20〜60kg/小時之供給速度供給於二軸擠出機（貝耳斯特羅夫公司製品ZE40A)，按表2所示之溫度及轉數予Μ加熱姆私捏合，水冷後，用製粒機將帶條切斷成小粒（成形前之材料）。〈成形加工〉上述小粒藉恒溫器在100〜150*C溫度下乾燥，而用射出成形機（克羅克納公司製品F-85)在表2所示之成形溫度下予K製成鍍敷特性評價用及電學特性評價用之試片。此項試片之形狀為如下·· 〈試片之形狀〉 ‘ ASTM1號畷羚：鍍敷評價用 ♦圓板1$ lOOmraX 1.6mm: 1〜15MHz電學特性評價用 •圓板2决100mfflX0.3nm·* 1〜25 GHz電學特性評價用〈鍍敷〉使用上述之各試片按圔1所示之要領在表3所示之條件下，對試片（在圖1中K”成形品”指示）之平坦表面施加化學蝕刻處理後，依照下述要領及條件施加無電鍍處理，其次施加電鍍（鍍銅）（鍍層厚度40« π)處理。又按，在圖1中K ” L "表示升*而Μ ” mL ”表示毫升。本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐3 _ I—^—〉IJm裝 _ '.tr一 (請先聞讀背面之注意事項再填寫本頁) ... A7 B7 五、發明説明（14 ) 〈鍍敷特性之評價方法〉 •化學蝕刻後之表面狀態之評價在化學蝕刻後*使試片（AS TM1號型唖鈐）乾燥，將賽珞凡膠帶（"NICHIBAH”公司製品，寬度18mm)貼在處理面上，予Μ加壓（約5 OOg) * Μ使與試片表面密合。將該膠帶按90 。角度一口氣剝開，Μ目視判斷該處理面之表層之剝雛性，而如下述予Κ評價。 (表層之剝離） ◎ …表層未發生剝離 Ο …表層幾乎未發生剝離 △ …表層發生局部剝離 X …表層在幾乎附著膠帶面之下剝離 *鍍面外觀之評價在電鍍處理後，Μ目視判定鍍面之外觀（鍍膜之均勻性及鍍膜是杏有膨脹）而如下述予以評價： (鍍膜之均匀性） ◎ …均匀且鏡面性良好經濟部中央標準局員工消費合作社印裝 Ο …均匀且約略達成鏡面 Δ (請先閲讀背面之注意事項再填寫本頁) 部分不均匀 X …全體不均句 (鍍膜之膨脹） ◎ …鍍膜完全未膨臈〇 …鍍膜幾乎完全未膨脹 △…鍍膜一部分膨脹本紙張尺度適用中國國家標隼（CNS〉Α4規格（.210X297公釐） -1?- 經濟部中央標率局員工消費合作社印製 A7 _B7_^___ 五、發明說明(15 ) x …鍍膜全體膨脹 ^ __密合強度之測定在電镀處理後，用切斷機切刀施加寬度len之帶狀切口 ’按9〇。角度翻開該切口之先端部，用弾簧抓住該項翻開之先躪部，以找開之力作為鍍膜密合強度（kg/cm)。 <電學待性之評價〉 ’ &電常數、介電正切之測定測定頻率：1MHz， 10MHz， 1GHz， 10GHz， 20GHz _定溫度：2 5 ΐ! 测定方法：①平行板電棰法（1〜15MHz) ②三板線路共振櫬法（損失分雛法）（1〜 25GHz) 权上之化學蝕刻後之表曆剝雛性之評價結果及鍍敷特性之評價結果均示於表3中，而電學特性之評價结果乃示於表4中。. $比較例1〜14 〈被鍍敷用之樹脂組成物之製造〉 @表5所示之組成比，使所指定之熱塑性樹脂與所指定之無機填料摻合。其後，使用定量進料器按40〜60kg/小時之供給速度供給於二軸擠出機（貝耳斯特羅夫公司製品ZE 40 A)，按表6所示之溫度及轉數予Μ加熱熔融捏合，水冷後，用製粒機將帶條切斷成小粒（成形前之材料}。〈成形加工〉本紙張尺度適用中國國家標準（CNS ) Α4規格（210X297公釐）一 18 - (請先閲讀背面之注意事項再填寫，本頁)A7 B7 5. Description of the invention (7) The true circle (ball), the better the plating characteristics. If the aspect ratio is too large, specifically, if it is greater than 10, the shape of the micro-ceremony is fibrous, which reduces the plating adhesion strength significantly. If the average particle size is less than 0.01 «m, it will be difficult to" provide the use of a catalyst for electroless (electroless) plating (ie, adsorb the catalyst for electroless plating on the surface of a molded product) * Not only can't get sufficient adhesion strength, but also can't get a uniform surface coating. If the average particle size is greater than 100M m, its micropores will increase to a size larger than the required degree; sufficient anchoring effect cannot be obtained, Make the physical strength between the coating and the tree cell weak. The blending amount of the inorganic filler, namely, aluminum borate or quartz glass, is preferably the case where the fiber amount of the thermoplastic resin and the inorganic filler is set to 100 parts by weight. Yes, based on 30 to 95 parts by weight of the resin * Set the inorganic filler to 5 to 70 parts by weight, preferably 40 to 90 parts by weight of the M resin. 'Set the inorganic filler to 10 to 60 parts ( Weight). If the amount of the inorganic filler printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs is less than 5 parts (weight>), a practically sufficient plating adhesion strength cannot be obtained. If it is more than 70 parts (weight), the Significant reduction in flowability Deterioration of the properties. It is also possible to apply a surface treatment to the inorganic filler by conventional methods for the purpose of improving the dispersibility of the inorganic filler or the affinity for the resin, or improving the thermal stability or the oxidation stability of the inorganic filler. Method * can be exemplified by a method of blending a coupler. Preferred examples of the coupler include ethylene trichlorosilane, ethylene ginseng (/ Θ-methoxyethoxy) silane, ethylene triethoxysilane, Ethylene trimethoxy 10 (Please read the notes on the back before filling out this page) This paper size is applicable to China National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Invention Explanation (8) Silicon fired, 7-methacrylic acid oxypropyltrimethoxy silicon fired, epoxycyclohexyl) ethyltrimethoxysilane, glycidyloxypropyltrimethoxy sand, 7-glycidyloxy Propylmethyldiethoxysilane, 10- (aminoethyl) _7-aminopropyltrimethoxysilane, bumin "amineethyl" _7-aminopropylmethyldimethoxysilane, 7-amine Propyltriethoxysilane, phenylphenyl-r-aminopropyltrimethoxy Silane, hydrosulfopropyltrimethoxysilane, 7-plypropyltrimethoxysilane, bis (trimethoxysilylpropyl) tetrasulfide, 3-hydrothiopropyltrimethoxysilane, 2-nitrothioethyl Trimethoxysilane, 3-aminopropyltriethoxysilane, H-2- (aminoethyl) -3-aminopropyltrimethoxysilane, ethylenetri (2-dimethoxyethoxy) silane , 3-methacryloxypropyltrimethoxysilane, 3-glycidyloxypropyltrimethoxysilane, and other silane-based coupling agents, such as triisosuccinate propyl titanate, bis (dioctyl titanate) Diisopropyl ester, diisopropyl ester, di (dodecylbenzenesulfonyl) diisopropyl ester, diisostearyl titanate, diisopropyl titanate, etc. The use amount of these admixtures can be set within a range in which the electrical properties or plating properties are not deteriorated. Generally, the range of 0.0001 to 1 part by weight of the M inorganic filler i is 0.00 parts by weight is preferred. The resin composition of the present invention is one in which a thermoplastic resin is doped with aluminum borate or quartz glass as an inorganic filler *, and (for the inorganic filler) a mixture of aluminum borate and quartz glass can also be used. Furthermore, it is also possible to use a combination of aluminum borate or quartz glass and other inorganic fillers within a range that does not reduce electrical characteristics and plating characteristics. Examples of the inorganic fillers that can be used in combination include glass, glass short dimensional, glass dimensional, glass beads, white sand beads, chopped fibers, carbon carbon, carbon, black breaking, aromatic polyamide, titanium Potassium acid, aluminum gallate, magnesium borate, and carbonic acid are applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) 11 ------——-—— Packing ----- Order—I—n—! ) y ^. '' i (Please read the notes on the back before filling this page) A7 B7 __ ^ _ V. Description of the Invention (9) Calcium, Magnesium Carbonate, Magnesium Sulfate, Calcium Sulfate, Aluminum Sulfate, Pyric Acid, Silicon nitride, aluminum nitride, boron nitride, silicon carbide, alumina, alumina fiber, silicon dioxide, mica, talc, diatomaceous earth, clay, pozzolan, limestone, bentonite, titanium dioxide, magnesium oxide, calcium oxide , Disulfide bait, etc. Although the resin composition of the present invention can be manufactured by general composite material manufacturing technology, it is preferably industrially manufactured by melt-kneading from the viewpoints of productivity and economy. Specific examples include manufacturing by a kneading method using a two-sleeve extruder or a single-shaft extruder, and manufacturing by a batch-type heating-melting kneader (represented by LABOPLASTMILL). The resin composition of the present invention has thermoplasticity, and may be subjected to injection molding, extrusion molding, or compression molding. Furthermore, it is possible to achieve thin film formation and film formation by a solvent casting method using an organic solvent or the like. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page) The adhesion strength (plating adhesion strength) of the molded product of the resin composition of the present invention to the gold-plated coating is the same as that described above. In the case of a conventional molded product of a resin composition to be plated, the physical properties of the surface of the molded product (that is, the surface of the resin composition), that is, the surface roughness are highly dependent. When micropores of appropriate size are uniformly formed on the surface, the anchoring effect can greatly improve the adhesion strength of the plating. The formation of the above-mentioned micropores is the same as that in the case of a conventional molded product of a resin composition for plating, and M chemical etching is an effective method. As mentioned above, the chemical etching system uses solvents (such as those that dissolve the inorganic filler) that have blue with the inorganic filler in the resin composition to be plated. For example, acid and residual water. The paper standards are applicable to Chinese national standards (CNS> Α4). Specification (210 X 297 mm) £ 2 A7 B7 V. Description of the invention (10) Solution or organic solvent, etc. After M penetrates the surface of the molded product, the inorganic filler on the surface will be dissolved or detached *. Both aluminum borate and quartz glass can be dissolved in an alkaline aqueous solution. Therefore, by applying chemical etching to the surface of a molded article of the resin composition of the present invention with an alkaline aqueous solution, aluminum borate or quartz glass existing on the surface of the molded product can be dissolved out *, and Formation of micropores effective for plating. This alkali aqueous solution is preferably a zeta aqueous solution such as sodium hydroxide, potassium hydroxide, lithium hydroxide from the viewpoint of solubility and economical efficiency of aluminum borate and stone pod glass. These aqueous solutions can be used singly or in combination. The alkalinity range of these alkaline aqueous solutions is 1 ~ 15Η, preferably 3 ~ 12Η. If the alkali concentration is low, the solubility of aluminum or stone pod glass It is extremely time-consuming, and if this alkali concentration is high, the resin will be significantly deteriorated, and as a result, the plating adhesion strength will be reduced. Also, in the present invention, a combination of other inorganic fillers has been added (combined), Chemical etching is not only applied to the former aluminum borate or quartz glass, but also to other inorganic fillers at the same time. Printed by the member of the Central Standards Bureau of the Ministry of Economic Affairs' X Consumer Cooperatives (please read the precautions on the back before filling in this Page) The etching solution used in this case is selected according to the nature of the inorganic filler used in combination, that is, the solubility and corrosiveness of the inorganic filler. For example, when calcium carbonate, pyrophosphate, barium sulfate, etc. are used in combination, an acid ( For example, sulfuric acid, hydrochloric acid, chromic acid, phosphoric acid, acetic acid, nitric acid, boric acid, etc. alone or in a mixture thereof or a water-soluble compound thereof) * In the combination of glass system or alumina, alkali is usually used (such as potassium hydroxide, sodium hydroxide And lithium hydroxide or other optional solutions of rhenium or mixed solutions thereof. In any case of i H, the temperature of chemical etching is preferably at room temperature (20 Chinese National Standard (CNS) A4 specification (210 X 297 mm) A7 B7 V. Description of the invention (11) 1C) ~ 120t: In the range of M50 ~ 10010: If the etching temperature is low, the inorganic filler Dissolution is extremely time-consuming, and if this etching temperature is high, the resin will be significantly deteriorated. Also, when performing chemical etching, K can also use stirring, ultrasonic irradiation, and the like for the purpose of increasing the dissolution rate of the inorganic filler. Means such as air bubbling. In addition, for the purpose of improving the effect of chemical etching, before performing the chemical etching, a resin M that dissolves the surface of the resin composition molded product (resin skin layer) is exposed to an inorganic filler ( (Pre-etching). For this pre-etching, the commonly used method is likely to be suitable. For pre-etching, it is usually possible to use organic solvents, alkaline aqueous solutions, acids, etc., but in the present invention, it is preferred that organic solutions or acids Its use. Preferable examples of the organic solvent used for the pre-etching include chloroform, dichloromethane, benzene, toluene, xylene, pyridine, hexane, tetrahydrofuran, acetonitrile, ethyl acetate, N, N-dimethylformamidine Amines, N-methylpyrrolidone, dimethylarsin and the like. Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). Examples of good acids include * sulfuric acid, hydrochloric acid, chromic acid, nitric acid, phosphoric acid or a mixture of these acids. Mixed acid. By using the chemical etching step on K, or in addition to the pre-etching step, the molded product obtained from the resin composition of the present invention can be electroless-plated and electroplated in the same manner as the molded product obtained from a conventional resin for plating. As mentioned earlier, the resin composition of the present invention preferably has a cone having a dielectric constant of 4.0M at a frequency band of 100 KHz to 300GHz and a dielectric tangent of 0.01M at the frequency band. This paper size applies Chinese National Standard (CNS) A4 specification (210 × 29? Mm) A7 B7_____; _ V. Description of the invention (12) If the dielectric constant of the upper frequency band is greater than 4.0 or the dielectric tangent of the frequency band is Resins greater than 0.01 are used for electronic components or (especially those components or materials used in the high-frequency band on lGHzK) 'because of their large signal loss, unreasonable occurrences in circuit design, etc., sometimes (depending on use) cause [Examples] In the examples and comparative examples under K, the orthorhombic crystals shown in 9 / Π2203 · 2B203 are used for aluminum borate, and are under A1203 & Bζ〇3 as the raw material. Manufactured by the external melting method. ** For quartz glass, it is made of crystalline silicon dioxide (quartz) with 99.9 liters of silicon dioxide (Si〇2). Crystalline substance. The waxes used in the examples and comparative examples under M are as follows: 〈Resin used〉 • PEI: Polyetherimide (product of Japan GE Plastic Co., Ltd. ULTEM1000) Employees of the Central Standards Bureau of the Ministry of Economic Affairs Printed by the cooperative (read first Please fill in this page again.) PPPE: Denatured polybenzyl (Asahi Kasei Corporation HYL0H / PXL9102) • LCP: Liquid Crystal Polymer (Sumitomo Chemical Co., Ltd. Sumitomo SuperE6000), PA: Nylon 6 (Mitsubishi Chemical Corporation) Product N0BAMID1013C) • Ρ0Η: polyoxymethylene (product of Asahi Kasei Corporation TEHACK3010) • PBT: polybutylene terephthalate (Teijin Corporation product / Teijin PB resin CH-7000) • PEEK: poly_ · _ ketone (Sumitomo Chemical Industries, Ltd.) Product VICTREX45C) • PPS: Polyphenylene sulfide (product of Dainippon IHK Industrial Co., Ltd. LAIT0H / R-4) This paper size applies to China National Standard (CNS) A4 (210X297 mm) '-15- Employees of the Central Standards Bureau of the Ministry of Economic Affairs Printed by the consumer cooperative A7 _B7 __ V. Description of the invention (13) * PC ·· Polycarbonate _ (Mitsubishi Chemical Corporation K0BAREX7022A) Examples 1 to 5 4 <Manufacturing of wax composition for plating> According to Table 1 The indicated composition ratio is to blend the specified thermoplastic resin with aluminum borate or quartz glass. Thereafter * the throw-in dosing feeder is fed to a two-shaft extruder (Bells) at a supply rate of 20 to 60 kg / hour. Rove's product ZE40A), and kneaded it at the temperature and number of revolutions shown in Table 2 to M heating, and after water cooling, cut the strip into small particles (material before molding) with a granulator. The pellets were dried at a temperature of 100 to 150 * C by a thermostat, and were injection-molded (Krockner Co., Ltd. product F-85) at a molding temperature shown in Table 2 to produce K for plating properties and electrical properties. Test piece for characteristic evaluation. The shape of this test piece is as follows ... << Shape of Test Piece> '' ASTM No.1 Gazelle: Evaluation of plating ♦ Round plate 1 $ 100mraX 1.6mm: For evaluation of electrical characteristics from 1 to 15MHz • Round plate 100mfflX0.3nm · * 1 to 25 GHz evaluation of electrical characteristics <plating> Use the test pieces described above to perform the procedure shown in 圔 1 under the conditions shown in Table 3, and indicate to the test piece ("K" in Fig. 1) After chemical etching treatment is performed on the flat surface, electroless plating is applied in accordance with the following procedures and conditions, followed by electroplating (copper plating) (coating thickness 40 «π). Press again, in Figure 1, K "L " means liter * and M" mL "means milliliter. This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm 3 _ I — ^ —> IJm pack_ ' .tr 一 (Please read the precautions on the back before filling in this page) ... A7 B7 V. Description of the invention (14) <Evaluation method of plating characteristics> • Evaluation of the surface state after chemical etching after chemical etching * Dry the test piece (AS TM1 type 干燥), and attach Saifan tape (" NICHIBAH "company's product, width 18mm) to the treatment surface, and pressurize it (approximately 500g). The surface of the sheet is tightly adhered. The tape is peeled off at a 90 ° angle, and the peelability of the surface layer of the treated surface is visually judged, and evaluated as follows. (Peeling of the surface layer) ◎ ... No peeling of the surface layer 0… The surface layer was hardly peeled △ ... the surface layer was partially peeled X ... the surface layer was peeled under the surface where the tape was almost adhered * Evaluation of the appearance of the plated surface After the electroplating treatment, the appearance of the plated surface was visually judged Swelling) and evaluated as follows: (uniformity of coating )…… Uniform and well mirrored Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 〇… uniform and almost mirror-like Δ (Please read the precautions on the back before filling this page) Partially uneven X… all uneven sentences (coated The expansion) ◎… the coating is completely unexpanded 〇… the coating is almost completely unexpanded △… the coating is partially expanded The paper size is applicable to the Chinese national standard (CNS> A4 specification (.210X297 mm) -1?)-The central standard of the Ministry of Economic Affairs Printed by the Consumer Cooperative of the Bureau A7 _B7 _ ^ ___ V. Description of the invention (15) x… the entire expansion of the coating ^ __ Determination of adhesion strength After plating, apply a band-shaped incision with a width of len using a cutter cutter ' Open the apex of the incision at 90 °, grasp the open apex with a spring, and use the force to find it as the coating adhesion strength (kg / cm). &Lt; Evaluation of electrical properties 〉 '&Amp; Measurement of electric constant and dielectric tangent. Measurement frequency: 1MHz, 10MHz, 1GHz, 10GHz, 20GHz _ Constant temperature: 2 5 ΐ! Measurement method: ① Parallel plate electric method (1 ~ 15MHz) ② Three-plate line resonance Method (1 ~ 25GHz) Table 1 shows the results of the evaluation of the peelability of the calendar after the chemical etching and the evaluation results of the plating characteristics, and the evaluation results of the electrical characteristics are shown in Table 4. $ Comparative Examples 1 to 14 <Production of Resin Composition for Plating> @The composition ratio shown in Table 5 is to mix the specified thermoplastic resin with the specified inorganic filler. Thereafter, a quantitative feeder is used. It was supplied to a two-screw extruder (Berstrom product ZE 40 A) at a supply rate of 40 to 60 kg / hour, and heated and melted and kneaded at a temperature and number of revolutions shown in Table 6. The granulator cuts the strip into small granules (the material before forming). 〈Forming processing〉 This paper size applies Chinese National Standard (CNS) Α4 specification (210X297 mm) 1 18-(Please read the precautions on the back before filling in, this page)

五、發明説明（16 ) 除了設定如表δ所示之條件外，皆按與實施例1〜54同等之方法施行而製成鍍敷特性評價用及電學特性評價用之試片。〈鍍敷，鍍敷特性之評價及電學特性之評價> 基本上與實施例1〜54相同，但其化學蝕刻時之溶劑之種類、溫度、時間等係按習知技術所報答之條件（具艘上如表7所示之條件）者。 Μ上之化學蝕刻後之表曆剝雛性之評價結果及鍍敷特性之評價结果均示於表7中，而電學特性之評價結果乃示於表8中。 -鍍敷特性之評價•比較一實施例1〜54係對市售之樹脂及製備之聚合物混合體摻配指定大小及形狀之硼酸金S或石英玻璃之例子◊ 比較例1〜14係將習知技術所報告之無機填料摻配於樹脂之例子。鍍敷密合強度雖然依用途而不同，但在實用性之觀點上必需為約lkg/cmK上。經濟部中央標準局員工消費合作社印.製 (讀先閲讀背面之注意事項再填寫本頁) 由表3可知，實施例1〜54經過利用KOH水溶液之鹼蝕刻後之表層剝離性試驗之情況所有試Η皆未發生剝雛而得到良好之结果。再者，在實施例1〜54中各試片皆示其密合強度為 lkg/cmM 上0 另一方面由表5、表7可知，使用玻璃纖維之比較例1在化學蝕刻後之剝離性試驗中發生表層之剝離*而其鍍面密本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） A7 B7 五、發明説明（17 ) 合強度低，鍍面之外觀亦惡劣。 (請先閱讀背面之注意事項再填寫本頁) 相對地，由表5、表7可知，比較例2〜14在化學蝕刻後並未發生表層之剝雛，其鍍面密合強度亦為lkg/cmM上，在鍍敷特性方面顯示充分之性能。 -電學特性之評價·比較- 由表4可知，實施例1〜54之摻配有硼酸鋁或石英玻璃之試片之介電常數乃在各頻率帶均示4.0M下，其較佳者顯示3. 0M下之數值。再者，其全部試片皆示介電正切為0.01M下，證實本發明之摻配有硼酸鋁或石英玻璃之樹脂組成物具有儍異之電學特性。相對地，由表8可知，比較例1〜14之各試Η皆示其介電常數及介電正切均高，證實其電學特性比實施例低得多。 [發明之效果] 如上所詳述，依照本發明之被鍍敷用樹脂組成物具有良好之鍍敷特性之同時具有慑異之電學特性，尤其作為高頻帶域用之電子元件等之材料很有效。經濟部中央標準局員工消費合作社印製本紙張尺度適用中國國家操準（CNS ) Α4規格（2丨0X297公釐）V. Description of the invention (16) Except that the conditions shown in Table δ were set, test pieces for evaluation of plating characteristics and evaluation of electrical characteristics were made in the same manner as in Examples 1 to 54. <Evaluation of plating, plating characteristics, and evaluation of electrical characteristics> Basically the same as in Examples 1 to 54, except that the type, temperature, and time of the solvent during chemical etching are the conditions reported by the conventional technology ( With the conditions shown in Table 7 on board). Table 7 shows the results of the evaluation of the peelability of the calendar after the chemical etching and the evaluation results of the plating characteristics. Table 8 shows the evaluation results of the electrical characteristics. -Evaluation of plating characteristics • Comparative Examples 1 to 54 are examples of blending commercially available resins and prepared polymer mixtures with gold borate S or quartz glass of a specified size and shape. Comparative Examples 1 to 14 Examples of blending of inorganic fillers with resins as reported in the prior art. Although the plating adhesion strength varies depending on the application, it must be about 1 kg / cmK in terms of practicality. Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (Read the precautions on the back and then fill out this page). As can be seen from Table 3, the surface peelability test of Examples 1 to 54 after alkali etching with aqueous KOH solution is all None of the trials had peeled off and good results were obtained. In addition, each of the test pieces in Examples 1 to 54 showed that their adhesion strength was 1 kg / cmM and 0. On the other hand, it can be seen from Tables 5 and 7 that the peeling property after chemical etching in Comparative Example 1 using glass fibers In the test, peeling of the surface layer occurred * and the size of the coated paper was in accordance with Chinese National Standards (CNS) A4 (210X297 mm) A7 B7 5. Description of the invention (17) The strength of the coating is low, and the appearance of the coated surface is also poor. (Please read the precautions on the back before filling this page.) In contrast, Tables 5 and 7 show that Comparative Examples 2 to 14 did not peel off the surface layer after chemical etching, and the adhesion strength of the plating surface was also 1 kg. At / cmM, it shows sufficient performance in terms of plating characteristics. -Evaluation and comparison of electrical characteristics- As can be seen from Table 4, the dielectric constants of the test pieces doped with aluminum borate or quartz glass in Examples 1 to 54 are shown at 4.0M in each frequency band, and the better one is shown. 3. Value at 0M. In addition, all of the test pieces showed a dielectric tangent of 0.01M, confirming that the resin composition doped with aluminum borate or quartz glass of the present invention has strange electrical characteristics. In contrast, Table 8 shows that each of the test specimens of Comparative Examples 1 to 14 showed high dielectric constants and dielectric tangents, confirming that their electrical characteristics were much lower than those of the examples. [Effects of the Invention] As described in detail above, the resin composition to be plated according to the present invention has excellent plating characteristics and has surprising electrical characteristics, and is particularly effective as a material for electronic components and the like in a high frequency band. . Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs This paper size applies to China National Standards (CNS) Α4 specifications (2 丨 0X297 mm)

A 五、發明説明（18 ) 〈表1之1> 實施例樹脂無機填料（硼酸鋁） m. 種類 \vL% wt% 平均粒徑μπι 長程比平均 1 PEI 80 20 2.5 1.5 2 PEI .60 40 2. 5 1. 5 3 PEI 50 50 2. 5 1. 5 4 PEI 50 50 4. 0 1_ 5 5 PEI 50 50 7. 0 L 5 6 PEI 50 50 8. 0 1.4 7 PEI 50 50 8-0 3· ϋ 8 PEI 50 50 8. 0 5. 5 9 PEI 50 50 8_ 0 8. 5 10 PEI 50 50 30. 0 1. 5 11 PPE 50 50 2. 5 1. 5 12 POM 50 50 2. 5 1. 5 13 PA 50 50 2. 5 1. 5 14 PBT 50 50 1, 5 L5 15 PEEK 50 50 2. 5 1.5 16 PPS 50 50 2. 5 1. 5 17 LCP 50 ,50 2. 5 1.5 r--— — f : (請先閱讀背面之注項再填寫本頁) 經濟部中央標準局員工消費合作社印製〈表1之2> 實施例樹脂無機填料（石英玻璃） NO. 種類 wt% wt% 平均粒徑μιη 長徑比平均 18 PEI 80 20 5· 2 1.4 19 PEI 70 30 5. 2 1.4 20 PEI 60 40 5. 2 1.4 21 PEI 40 60 5. 2 1.4 22 PEI 60 40 3. 1 1.5 23 PEI 60 40 1. 2 1. 3 24 PEI 60 40 7. 9 1.4 25 PEI 60 40 27. 0 1. 3 26 PEI 60 40 3· 1 3. 0 27 PBI 60 40 3· 1 7, 8 28 PPE 60 40 5. 2 1. 4 29 P0M 60 40 5. 2 1.4 30 PA 60 40 5· 2 1.4 31 PBT 60 40 5. 2 1.4 32 PEEK 60 40 5. 2 1.4 33 PPS 60 40 5. 2 1.4 34 LCP 60 40 5. 2 1. 4 35 PPE 60 40 0. 1 1. 6 36 PPE 60 40 50 1· 2 37 PPE 30 70 5, 2 1.4 38 PPE 90 10 5. 2 1· 4 39 PPE 95 5 5· 2 1. 4 訂 A7 B7 m< I _ 1 _ 五、發明説明（19 ) 〈表l之包實施例樹脂 ▲嬙琅枓（棚酸銘) NO. 種類 Wt% Wt°/o 乎均粒徑μιη 長徑比平均 .— 40 PEI/PPE 25/25 50 8. 0 1. 4 一 41 PEI/PPE 30/20 50 8. 0 1. 4 42 PB1/PPE/LCP 20/20/10 50 8. 0 1. 4 43 PA/PPE 25/25 50 8. 0 1. 4 〈表1之4> 實施例樹脂無機填料 (石英玻璃） Ύο. 種類 wt% Wt% 乎均粒輕μιη 長徑比平均 44 PEI/PPE 25/25 50 5.2 1.4 45 PEI/PPE 30/20 50 5.2 1.4 46 PEI/PPE 20/30 50 5· 2 1. 4 47 pei/ppe/lcp 20/20/10 50 5. 2 1. 4 48 PPE/PA 25/25 50 5· 2 1. 4 49 PPE/PC 25/25 50 5.2 1_4 50 PEI/PC 30/20 50 5· 2 1.4 .51 氺 1 PEI/PPE 18/42 40 5. 2 1.4 5 2水2 PEI/PPE 18/42 1 40 5· 2 1. 4 5 3木3 PEI/PPE 18/42 40 5. 2 Ϊ. 4 ______(硼酸鈕/石英玻璃） 54Λ' 4 .pei/pph 18/42 20/20 8. 0/5.2 1.4 才1 木2 米3 r 4 〈表2之1> S尨化剩之實施例。巧_之_ 合劑之_ ----—,--.--養—— 〆 - (請先閱讀背面之注意事項再填寫本頁) 訂- 經濟部中央標準局員工消費合作社印製張 -紙本A V. Description of the invention (18) <Table 1-1> Example Resin inorganic filler (aluminum borate) m. Type \ vL% wt% Average particle size μπι Long range ratio average 1 PEI 80 20 2.5 1.5 2 PEI .60 40 2 . 5 1. 5 3 PEI 50 50 2. 5 1. 5 4 PEI 50 50 4. 0 1_ 5 5 PEI 50 50 7. 0 L 5 6 PEI 50 50 8. 0 1.4 7 PEI 50 50 8-0 3 · ϋ 8 PEI 50 50 8. 0 5. 5 9 PEI 50 50 8_ 0 8. 5 10 PEI 50 50 30. 0 1. 5 11 PPE 50 50 2. 5 1. 5 12 POM 50 50 2. 5 1. 5 13 PA 50 50 2. 5 1. 5 14 PBT 50 50 1, 5 L5 15 PEEK 50 50 2. 5 1.5 16 PPS 50 50 2. 5 1. 5 17 LCP 50, 50 2. 5 1.5 r ----- f: (Please read the note on the back before filling this page) Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs <Table 2-2> Example Resin inorganic filler (quartz glass) NO. Type wt% wt% Average particle size μιη Average aspect ratio 18 PEI 80 20 5 2 1.4 19 PEI 70 30 5. 2 1.4 20 PEI 60 40 5. 2 1.4 21 PEI 40 60 5. 2 1.4 22 PEI 60 40 3. 1 1.5 23 PEI 60 40 1 . 2 1. 3 24 PEI 60 40 7. 9 1.4 25 PEI 60 40 27. 0 1. 3 26 PEI 60 40 3. 1 3. 0 27 PBI 60 40 3 · 1 7, 8 28 PPE 60 40 5. 2 1. 4 29 P0M 60 40 5. 2 1.4 30 PA 60 40 5 · 2 1.4 31 PBT 60 40 5. 2 1.4 32 PEEK 60 40 5. 2 1.4 33 PPS 60 40 5. 2 1.4 34 LCP 60 40 5. 2 1. 4 35 PPE 60 40 0. 1 1. 6 36 PPE 60 40 50 1 · 2 37 PPE 30 70 5, 2 1.4 38 PPE 90 10 5. 2 1 · 4 39 PPE 95 5 5 · 2 1. 4 Order A7 B7 m < I _ 1 _ V. Description of the invention (19) 〈Example resin of the package in Table l ▲ Lang Lang (shed acid name) NO. Type Wt % Wt ° / o Almost average particle size μιη Length to diameter ratio average.-40 PEI / PPE 25/25 50 8. 0 1. 4-41 PEI / PPE 30/20 50 8. 0 1. 4 42 PB1 / PPE / LCP 20/20/10 50 8. 0 1. 4 43 PA / PPE 25/25 50 8. 0 1. 4 <Table 1 of 4 > Example resin inorganic filler (quartz glass) Ύο. Type wt% Wt% Uniform light μιη Average aspect ratio 44 PEI / PPE 25/25 50 5.2 1.4 45 PEI / PPE 30/20 50 5.2 1.4 46 PEI / PPE 20/30 50 5. 2 1. 4 47 pei / ppe / lcp 20 / 20/10 50 5. 2 1. 4 48 PPE / PA 25/25 50 5 · 2 1. 4 49 PPE / PC 25/25 50 5.2 1_4 50 PEI / PC 30/20 50 5 · 2 1.4 .51 氺 1 PEI / PPE 18/42 40 5. 2 1.4 5 2 Water 2 PEI / PPE 18/42 1 40 5 · 2 1. 4 5 3 Wood 3 PEI / PPE 18/42 40 5. 2 Ϊ. 4 ______ (Borate Button / Quartz Glass) 54Λ '4 .pei / pph 18/42 20/20 8 0 / 5.2 1.4 Only 1 wood 2 meters 3 r 4 <Table 2 1> Example of remaining residue.巧 _ 之 _ 合剂之 _ ----—, --.-- Support—— 〆- (Please read the notes on the back before filling out this page) Order-Printed sheet by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs- Paper

條件轉敫rpm 100 100 100 100 100 100 100 100 100 100 150 150 150 120 100 100 100 300 _射出成形汝 340 350 一360 __ 丨丨丨I __ 360^6? 360 ~360 360 340 30022? 250 250 380 340 340 2. 1^適用中國國家檩準（<^5)^4规格（210><297公釐） -22 - A7 B7 五、發明説明（20 ) 〈表2之2> 〈表2之3> 實施例捏合條件射出成形喷嘴溫度 NO. 溫度。C 轉敗r pin 〇/c 18 300 150 310 19 300 150 310 20 300 150 320 21 300 150 340 22 300 150 320 23 300 150 320 24 300 150 320 25 300 150 320 26 300 150 320 27 300 150 320 28 260 150 290 29 210 150 220 30 250 150 260 31 240 150 260 32 350 150 390 33 320 150 340 34 340 150 340 35 260 140 290 36 260 150 290 37 270 100 300 38 260 150 290 39 260 150 290 耆- (請先閲讀背面之注意事項再填寫本頁) 訂〈表2之4> 實施例捏合條件射出成形喷嘴溫度 NO. 溫度。C 轉敫rpm °c 40 300 100 320 4 41 300 100 330 42 290 100 330 43 320 120 300 經濟部中央標隼局員工消費合作社印製實施例拉合條件射出成形喷嘴溫度 NO. 溫度。C 轉敫r pm °c 44 300 150 320 45 300 150 320 46 300 150 320 47 300 150 330 48 280 150 300 49 250 150 260 50 280 150 300 51 300 150 320 52 300 150 320 53 300 150 ^ 320 54 300 150 320 本紙張尺度適用中國國家標準（CNS ) A4規格（21〇><297公釐） 23 - 23 五、發明説明（21 ) A7 B7 〈表3之1> 實施例化學独刻條件化學蝕刻後表面剝離性塗膜之評償 NO. 落液滚度溫度時間外觏密合強度 °c 分鐘均勻性膨脹 kg/cm 1 K0H水溶液 8N 95 120 〇 ◎ ◎ 1. 21 2 同上同上 95 120 © ◎ ◎ 1. 44 3 同上同上 95 120 ◎ ◎ ◎ L 85 4 同上同上 95 120 ◎ ◎ ◎ 1. 70 5 同上同上 95 120 ◎ ◎ ◎ 1. 71 6 同上同上 95 120 ◎ ◎ ◎ L 66 7 同上同上 95 120 ◎ ◎ ◎ 1. 51 8 同上同上 .95 120 ◎ ◎ ◎ 1. 50 9 同上同上 95 120 ◎ ◎ ◎ 1.42 10 同上同上 95 120 ◎ ◎ ◎ 1. 50 11 同上同上 80 90 © ◎ ◎ 1. 89 12 同上同上 80 90 ◎ ◎ ◎ 1. 77 13 同上. 同上 80 90 ◎ ◎ ◎ 1. 74 14 同上同上 80 60 〇 ◎ ◎ 1.44 15 同上同上 95 120 ◎ ◎ ◎ 1. 80 16 同上同上 95 120 ◎ ◎ ◎ 1. 56 17 同上同上 80 60 〇 ◎ ◎ 1, 63 裝----(請先鬩讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作杜印製〈表3之2> 實施例化學蝕刻條件化學触刻後表面剝雊性塗膜之評償 NO. 溶液滚度溫度時間外觀密合強度 °c 分鐘均勻性膨脹 kg/cm 18 K0H水溶液 8N 90 60 ◎ ◎ © 1. 36 19 同上同上 90 90 ◎ ◎ ◎ 1. 49 20 同上同上 90 90 ◎ ◎ ◎ 1. 88 21 同上同上 90 90 ◎ ◎ ◎ 1. 95 22 同上同上 90 90 ◎ ◎ ◎ 1. 51 23 同上同上 90 90 ◎ ◎ ◎ 1,47 24 同上同上 90 90 ◎ ◎ ◎ 1.48 25 同上同上 90 90 ◎ ◎ ◎ 1. 35 26 同上同上 90 90 ◎ ◎ ◎ 1. 45 27 同上同上 90 120 ◎ ◎ ◎ 1.41 28 同上同上 90 60 ◎ ◎ ◎ 1. 56 29 同上同上 90 90 ◎ ◎ ◎ L 52 30 同上同上 90 90 ◎ ◎ ◎ 1,47 31 同上同上 90 90 ◎ ◎ ◎ 1.48 32 - 同上同上 90 90 ◎ ◎ ◎ 1. 72 33 . 同上同上 90 90 ◎ ◎ ◎ 1. 31 34 同上同上 90 90 ◎ ◎ ◎ 1. 57 35 同上同上 90 90 ◎. ◎ ◎ 1. 21 36 同上同上 90 90 ◎ ◎ ◎ 1. 78 37 同上同上 90 90 ◎ ◎ ◎ 1. 23 38 同上同上 90 90 ◎ ◎ ◎ 1. 10 39 同上同上 90 90 〇〇〇 1. 02Conditional rotation speed rpm 100 100 100 100 100 100 100 100 100 100 150 150 150 120 100 100 100 300 300 _ injection molding Ru 340 350-360 __ 丨丨丨 I __ 360 ^ 6? 360 ~ 360 360 340 30022? 250 250 380 340 340 2. 1 ^ Applicable to China National Standards (< ^ 5) ^ 4 specifications (210 > < 297 mm) -22-A7 B7 V. Description of the invention (20) <Table 2-2> <Table 2 No. 3 > Example Kneading conditions Injection molding nozzle temperature NO. Temperature. C loser pin 〇 / c 18 300 150 310 19 300 150 310 20 300 150 320 21 300 150 340 22 300 150 320 23 300 150 320 24 300 150 320 25 300 150 320 26 300 150 320 27 300 150 320 28 260 150 290 29 210 150 220 30 250 150 260 31 240 150 260 32 350 150 390 33 320 150 340 34 340 150 340 35 260 140 290 36 260 150 290 37 270 100 300 38 260 150 290 39 260 150 290 耆-(Please Read the precautions on the back before filling this page) Order <Table 2 of 4> Example Kneading conditions Injection molding nozzle temperature NO. Temperature. C to rpm ° c 40 300 100 320 4 41 300 100 330 42 290 100 330 43 320 120 300 Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs Example Pulling conditions Injection molding nozzle temperature NO. Temperature. C to pm ° c 44 300 150 320 45 300 150 320 46 300 150 320 47 300 150 330 48 280 150 300 49 250 150 260 50 280 150 300 51 300 150 320 52 300 150 320 53 300 150 ^ 320 54 300 150 320 This paper size applies Chinese National Standard (CNS) A4 specification (21〇 > < 297mm) 23-23 V. Description of the invention (21) A7 B7 <Table 3-1 > Evaluation of surface peeling coating film after etching NO. Falling liquid roll temperature time time 觏 Adhesive strength ° c minutes Uniform expansion kg / cm 1 K0H aqueous solution 8N 95 120 ○ ◎ 1. 21 2 Ibid. 95 120 © ◎ 1. 44 3 Same as above 95 120 ◎ ◎ ◎ L 85 4 Same as above 95 120 ◎ ◎ ◎ 1. 70 5 Same as above 95 120 ◎ ◎ ◎ 1. 71 6 Same as above 95 120 ◎ ◎ L 66 7 Same as above 95 120 ◎ ◎ 1. 51 8 Same as above. 95 120 ◎ ◎ ◎ 1. 50 9 Same as above 95 120 ◎ ◎ ◎ 1.42 10 Same as above 95 120 ◎ ◎ ◎ 1. 50 11 Same as above 80 90 © ◎ ◎ 1. 89 12 Ibid. 80 90 ◎ ◎ 1. 77 13 ibid. Ibid. 80 90 ◎ ◎ ◎ 1. 74 14 ibid. 80 60 〇 ◎ 1.44 15 ibid. 95 120 ◎ ◎ 1. 80 16 ibid. 95 120 ◎ ◎ 1. 56 17 ibid. 80 60 〇 ◎ ◎ 1, 63 units ---- (Please read the precautions on the reverse side before filling out this page) Printed by the Consumer Cooperation Department of the Central Bureau of Standards of the Ministry of Economic Affairs <Table 3-2> Example Chemical Etching Conditions Chemistry Evaluation of peeling coating on the surface after touching NO. Solution roll temperature time appearance adhesion strength ° c minutes uniform expansion kg / cm 18 K0H aqueous solution 8N 90 60 ◎ ◎ © 1. 36 19 ibid. 90 90 ◎ ◎ 1. 49 20 Same as above 90 90 ◎ ◎ ◎ 1. 88 21 Same as above 90 90 ◎ ◎ ◎ 1. 95 22 Same as above 90 90 ◎ ◎ 1. 51 23 Same as above 90 90 ◎ ◎ ◎ 1,47 24 Same as above 90 90 ◎ ◎ ◎ 1.48 25 Same as above 90 90 ◎ ◎ ◎ 1. 35 26 Same as above 90 90 ◎ ◎ ◎ 1. 45 27 Same as above 90 120 ◎ ◎ ◎ 1.41 28 Same as above 90 60 ◎ ◎ ◎ 1. 56 29 Same as above 90 90 ◎ ◎ ◎ L 52 30 Same as above 90 90 ◎ ◎ ◎ 1,47 31 Same as above 90 90 ◎ ◎ ◎ 1.48 32-Same as above 90 90 ◎ ◎ ◎ 1. 72 33. Same as above 90 90 ◎ ◎ ◎ 1. 31 34 Same as above 90 90 ◎ ◎ ◎ 1. 57 35 Same as above 90 90 ◎. ◎ ◎ 1. 21 36 Same as above 90 90 ◎ ◎ 1. 78 37 Same as above 90 90 ◎ ◎ 1. 23 38 Same as above 90 90 ◎ ◎ ◎ 1. 10 39 Ibid. 90 90 〇〇〇〇.02

.—.訂-------X 24.--. Order ------- X 24

A· B 五、發明説明（22 ) 〈表3之3> 實施例化李蝕刻條件化學蝕刻後表面剝離性塗膜之評償 N0. 溶液滚度溫度時間外觀密合強度 °C 分鐘均句性膨脹 kg/cm 40 Κ0Η水溶液 8N 95 120 〇 ◎ © 1. 89 41 同上同上 95 120 ◎ ◎ ◎ 1. 89 42 同上同上 80 90 ◎ ◎ © 1.48 43 同上同上 80 90 ◎ ◎ ◎ 1.41 〈表3之4> 實施例化學蝕刻條件化學蝕刻後表面剝雊性塗膜之評償 NO. 溶液滚度溫度時間外觀密合強度 °C 分鐘均句性膨脹 kg/cm 44 K0H水溶液 8N 90 90 ◎ ◎ ◎ 1. 71 45 同上同上 90 90 ◎ ◎ ◎ 1. 63 46 同上同上 90 90 ◎ ◎ ◎ 1. 69 47 同上同上 90 90 ◎ ◎ ◎ 1. 53 48 同上同上 90 90 ◎ ◎ ◎ 1.41 49 同上同上 90 90 ◎ ◎ ◎ 1. 54 50 同上同上 90 90 ◎ ◎ ◎ 1. 63 51 同上同上 90 90 © ◎ ◎ 1. 63 52 同上同上 90 90 ◎ ◎ 1. 65 53 同上同上 90 90 ◎ ◎ ◎ 1.42 54 同上同上 90 90 ◎ ◎ ◎ 1. 77 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製〈表4之1> 實施例 (各頻率欄中，左行所列者為其介電常敫，而右行所列者為其介電正切） NO. 1MHz 10MHz 1GHz 10GHz 20GHz 1 3· 25 0 004 3· 24 0· 004 3· 15 0, 005 3. 14 0. 006 3. 12 0. 007 2 3. 30 0. 004 3. 30 0 005 3. 29 0. 007 3. 24 0. 007 3. 22 0· 007 3 3. 31 0· 005 3. 30 0. 005 3. 30 0. 006 3. 26 0. 007 3. 24 0. 007 4 3. 31 0. 005 3. 29 0. 006 3. 29 0. 007 3. 28 0· 007 3. 26 0_ 008 5 3. 30 0. 004 3. 30 0_ 004 3. 28 0. 006 3. 28 0. 007 3. 26 0· 007 6 3. 30 0‘ 006 3. 29 0. 006 3. 28 0. 006 3. 28 0· 007 3. 27 0. 008 7 3. 31 0. 005 3. 30 0· 005 3. 28 0. 006 3. 28 .0· 007 3· 28 0. 007 8 3. 29 0. 005 3.28 0. 006 3. 26 0. 006 3. 26 0. 006 3. 26 0. 007 9 3. 30 0. 005 3. 30 0. 006 3. 29 0. 007 3. 26 0· 007 3. 26 0.007 10 3. 23 0. 002 3_ 23 0. 002 3. 22 0. 003 3. 22 0· 003 3. 20 0· 003 11 2· 44 0. 001 2. 44 0. 001 2. 43 0. 001 2. 42 0. 001 2· 41 0· 001 12 3. 65 0. 005 3. 65 0· 006 3. 61 0. 006 3· 60 0· 007 3. 58 0· 007 13 3. 41 0. 009 3. 41 0. 009 3. 38 0_ 009 3· 36 0. 009 3. 35 0. 009 14 3. 23 0· 001 3. 22 0_ 001 3. 20 0· 001 3. 18 0. 001 3, 18 0. 001 15 3. 10 0. 003 3. 10 0. 003 3. 07 0. 003 3. 07 0. 004 3. 04 0. 004 16 3_ 52 0_ 004 3. 52 0. 004 3. 50 0· 004 3. 50 0. 004 3. 48 0. 006 17 3. 61 0. 008 3. 60 0· 008 3. 58 0· 00« 3. 55 0. 009 3. 55 0· 009 本紙張尺度適用中國國家標準（CNS ) A4規格（210X29»釐） -25 - 經濟部中央襟準局員工消費合作社印製恥⑽5 五、發明説明（23A · B V. Description of the invention (22) <Table 3 of 3> Example Evaluation of the surface peeling coating film after chemical etching of Li etching conditions No. Solution roll temperature time appearance adhesion strength ° C minutes even sentence Expansion kg / cm 40 Κ0Η aqueous solution 8N 95 120 〇 ◎ © 1. 89 41 Ibid. 95 120 ◎ ◎ ◎ 1. 89 42 Ibid. 80 90 ◎ ◎ © 1.48 43 Ibid. 80 90 ◎ ◎ ◎ 1.41 <Table 4 of 4 & gt Example Chemical Etching Conditions Evaluation of Exfoliative Coating Film on Surface after Chemical Etching NO. Solution Roll Temperature Time Appearance Adhesive Strength ° C Minute Sentential Expansion kg / cm 44 K0H Aqueous Solution 8N 90 90 ◎ ◎ ◎ 1. 71 45 Same as above 90 90 ◎ ◎ ◎ 1. 63 46 Same as above 90 90 ◎ ◎ ◎ 1. 69 47 Same as above 90 90 ◎ ◎ 1. 53 48 Same as above 90 90 ◎ ◎ 1.41 49 Same as above 90 90 ◎ ◎ ◎ 1. 54 50 Same as above 90 90 ◎ ◎ ◎ 1. 63 51 Same as above 90 90 © ◎ ◎ 1. 63 52 Same as above 90 90 ◎ ◎ 1. 65 53 Same as above 90 90 ◎ ◎ ◎ 1.42 54 Same as above 90 90 ◎ ◎ ◎ 1. 77 (Please read the precautions on the back before filling out this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs <Table 4-1> Examples (for each frequency column, the left row Those listed are their dielectric constants, and those listed on the right are their dielectric tangents) NO. 1MHz 10MHz 1GHz 10GHz 20GHz 1 3 · 25 0 004 3 · 24 0 · 004 3 · 15 0, 005 3. 14 0 . 006 3. 12 0. 007 2 3. 30 0. 004 3. 30 0 005 3. 29 0. 007 3. 24 0. 007 3. 22 0 · 007 3 3. 31 0 · 005 3. 30 0. 005 3. 30 0. 006 3. 26 0. 007 3. 24 0. 007 4 3. 31 0. 005 3. 29 0. 006 3. 29 0. 007 3. 28 0 · 007 3. 26 0_ 008 5 3. 30 0. 004 3. 30 0_ 004 3. 28 0. 006 3. 28 0. 007 3. 26 0 · 007 6 3. 30 0 '006 3. 29 0. 006 3. 28 0. 006 3. 28 0 · 007 3. 27 0. 008 7 3. 31 0. 005 3. 30 0 · 005 3. 28 0. 006 3. 28 .0 · 007 3 · 28 0. 007 8 3. 29 0. 005 3.28 0. 006 3. 26 0. 006 3. 26 0. 006 3. 26 0. 007 9 3. 30 0. 005 3. 30 0. 006 3. 29 0. 007 3. 26 0 · 007 3. 26 0.007 10 3. 23 0. 002 3_ 23 0. 002 3. 22 0. 003 3. 22 0 · 003 3. 20 0 · 003 11 2 · 44 0. 001 2. 44 0. 001 2. 43 0. 001 2. 42 0. 001 2 · 41 0 · 001 12 3. 65 0. 005 3. 65 0 · 006 3. 61 0. 006 3 · 60 0 · 007 3. 58 0 · 007 13 3. 41 0. 009 3. 41 0. 009 3. 38 0_ 009 3 · 36 0. 009 3. 35 0. 009 14 3. 23 0 · 001 3. 22 0_ 001 3. 20 0 · 001 3. 18 0. 001 3, 18 0. 001 15 3. 10 0. 003 3. 10 0. 003 3. 07 0. 003 3. 07 0. 004 3. 04 0 . 004 16 3_ 52 0_ 004 3. 52 0. 004 3. 50 0 · 004 3. 50 0. 004 3. 48 0. 006 17 3. 61 0. 008 3. 60 0 · 008 3. 58 0 · 00 «3. 55 0. 009 3. 55 0 · 009 This paper size applies to the Chinese National Standard (CNS) A4 specification (210X29»%) -25-Printing of shame by employees' cooperatives of the Central Commission of the Ministry of Economic Affairs 5 V. Description of the invention (twenty three

本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 26 - 3BS095 五、發明説明（24 ) A7 B7 經濟部中央標準局員工消費合作社印製〈表5> 比較例樹脂無機填料 NO. 種類 wt°/〇種類 wt% 平均粒徑μηι 長徑比平均 1 PEI 50 玻璃織維 50 ! 一 80 2 PEI 50 戴鱗酸4¾ 50 10 ’ 1. 2 3 PEI 50 碳酸鈣 50 8 1. 3 4 PEI 50 碳酸鋇 50 5 1. 4 5 PEI 50 玻璃珠 50 10 1. 1 6 PEI 50 氧化鋁 50 15 1. 3 7 LCP 50 焦磷酸鈣 50 10 1. 2 8 PPE 50 碳酸鈣 50 8 1. 3 9 PPE 50 焦磷酸鈣 50 10 1. 2 10 PA 50 焦磷酸鈣 50 10 L 2 11 PEI/PPE 25/25 焦磷酸鈣 50 10 1. 2 12 PEI/PPE 30/20 焦磷酸鈣 50 10 1· 2 13 PEI/PPE/LCP 20/20/10 焦.嶙酸鈣 50 10 1. 2 14 PA/PPE 25/25 焦磷酸鈣 50 10 1.2 〈表6> 比較例捏合條件射出成形喷嘴溫度 NO. 溫度。C 轉敗rpm °c 1 320 100 340 2 320 100- 340 3 320 100 340 4 320 100 340 5 320 100 330 6 320 100 340 7 330 100 340 8 290 150 300 9 290 150 300 10 250 150 250 11 300 100 330 12 300 100 330 13 310 100 330 14 290 100 300 (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度逋用中國國家標準（CNS ) A4規格（210父297公釐） -27 - 經濟部中央標準局員工消費合作社印製 386C95 . A7 B7 五、發明説明（25 ) 〈表7> 比較例化學蝕刻條件化季蝕刻後.：表層剝維性. 塗膜之評償 NO· 溶液滚度N 溫度時間外觏密合強度 °c 分鐘均勻性膨脹 kg/cm 1 NaOH水溶液10N 80 120 X X X 0-23 2 滚 H2S04 25 15 ◎ ◎ ◎ 1. 85 3 同上 25 15 〇〇〇 1. 46 4 同上 25 15 〇〇〇 1. 50 5 NaOH水溶液10N 80 120 △ 〇〇 1. 30 6 同上 80 120 〇〇〇 1. 19 7 ilH2so4 25 15 ◎ ◎ ◎ 1. 86 8 同上 25 15 △ 〇〇 1. 10 9 同上 25 15 ◎ 〇〇 1. 26 10 同上 25 15 ◎ ◎ ◎ 1. 36 11 同上 25 15 ◎ ◎ ◎ 1. 45 12 同上 25 15 ◎ ◎ ◎ 1. 65 13 同上 25 15 ◎ ◎ ◎ 1. 80 14 同上 25 15 ◎ ◎ ◎ 1. 47 <表8> 比較例 (各頻率攔中，左行所列者爲 _其介電常敫，而右行所列者為其介電正切） NO. 1MHz 10MHz 1GHz 10GHz 20GHz 1 4. 51 0. 032 4. 44 0. 033 4. 41 0, 035 4. 40 0. 039 4_ 28 0· 042 2 4, 48 0. 028 4. 42 0. 028 4. 36 0_ 029 4. 35 0. 030 4. 35 0. 033 3 3. 99 0· 015 3· 97 0· 015 3. 96 0· 016 3. 96 0. 016 3. 95 0 018 4 4. 15 0 019 4. 14 0. 018 4. 10 0. 022 4. 10 0. 021 4. 09 0. 021 5 4· 49 0 035 4. 43 0· 034 4· 42 0· 036 4. 41 0· 036 4. 35 0· 036 6 4. 20 0. 022 4. 20 0, 022 4. 18 0· 024 4. 18 0· 025 4. 15 0· 025 7 4. 69 0. 033 4_ 67 0. 034 4. 65 0· 035 4. 61 0. 035 4. 60 0. 038 8 4. 15 0· 018 4. 15 0. 018 4. 14 0. 020 4. 12 0· 021 4. 12 0· 024 9 4. 28 0. 009 4. 26 0· 010 4. 25 0_ 012 4. 25 0. 012 4. 24 0· 013 10 4· 59 0. 033 4. 58 0· 033 4. 52 0· 032 4. 50 0. 034 4.48 0. 035 11 4. 39 0. 029 4. 38 0· 029 4. 35 0 031 4. 31 0· 033 4. 30 0· 034 12 4. 45 0. 031 4. 41 0, 035 4. 39 0‘ 036 4. 38 0· 037 4. 38 0. 037 13 4. 50 0'， 033 4. 46 0, 035 4. 42 0_ 036 4. 41 0. 036 4. 40 0. 037 14 4. 40 0· 030 4. 40 0. 031 4. 38 0· 033 4_ 32 0. 035 4_ 30 0. 036 (請先閲奢背面之注意事項再填寫本頁) ----This paper size applies the Chinese National Standard (CNS) A4 (210X297 mm) 26-3BS095 V. Description of the invention (24) A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs <Table 5> Comparative Example Resin Inorganic Filler NO. Type wt ° / 〇Type wt% Average particle size μηι Length-to-diameter ratio average 1 PEI 50 Glass weaving dimension 50!-80 2 PEI 50 Dalamic acid 4¾ 50 10 '1. 2 3 PEI 50 Calcium carbonate 50 8 1. 3 4 PEI 50 barium carbonate 50 5 1. 4 5 PEI 50 glass beads 50 10 1. 1 6 PEI 50 alumina 50 15 1. 3 7 LCP 50 calcium pyrophosphate 50 10 1. 2 8 PPE 50 calcium carbonate 50 8 1. 3 9 PPE 50 calcium pyrophosphate 50 10 1. 2 10 PA 50 calcium pyrophosphate 50 10 L 2 11 PEI / PPE 25/25 calcium pyrophosphate 50 10 1. 2 12 PEI / PPE 30/20 calcium pyrophosphate 50 10 1 · 2 13 PEI / PPE / LCP 20/20/10 Coke.Calcium gallate 50 10 1. 2 14 PA / PPE 25/25 Calcium pyrophosphate 50 10 1.2 <Table 6> Comparative Example Kneading conditions Injection molding nozzle temperature NO. Temperature . C rpm ° c 1 320 100 340 2 320 100- 340 3 320 100 340 4 320 100 340 5 320 100 330 6 320 100 340 7 330 100 340 8 290 150 300 9 290 150 300 10 250 150 250 11 300 100 330 12 300 100 330 13 310 100 330 14 290 100 300 (Please read the notes on the back before filling in this page) This paper uses China National Standard (CNS) A4 size (210 mm 297 mm) -27-Economy Printed by the Consumers' Cooperative of the Ministry of Standards, Ministry of Standards, 386C95. A7 B7 V. Description of the Invention (25) <Table 7> Comparative Example After Chemical Etching, Seasonal Etching: Surface Peelability. Evaluation of Coating Film NO · Solution Rolling N Temperature time outside contact adhesive strength ° c minutes Uniform expansion kg / cm 1 NaOH aqueous solution 10N 80 120 XXX 0-23 2 Roll H2S04 25 15 ◎ ◎ ◎ 1. 85 3 Ibid. 25 15 〇〇〇 1. 46 4 Ibid. 25 15 〇〇〇 1. 1. 5 5 NaOH aqueous solution 10N 80 120 △ 〇〇 1. 30 6 Ibid 80 120 〇〇〇 1.19 7 ilH2so4 25 15 ◎ ◎ ◎ 1. 86 8 Ibid 25 15 △ 〇〇 1. 10. 9 Ibid. 25 15 ◎ 〇〇1. 26 10 Ibid. 25 15 ◎ ◎ 1. 36 11 Ibid. 25 15 ◎ ◎ 1. 45 12 Ibid. 25 15 ◎ ◎ 1. 65 13 Ibid. 25 15 ◎ ◎ 1. 80 14 Ibid. 25 15 ◎ ◎ 1. 47 < Table 8 > Compare Example (In each frequency block, the one listed on the left is _ its dielectric constant, and the one listed on the right is its dielectric tangent) NO. 1MHz 10MHz 1GHz 10GHz 20GHz 1 4. 51 0. 032 4. 44 0 . 033 4. 41 0, 035 4. 40 0. 039 4_ 28 0 · 042 2 4, 48 0. 028 4. 42 0. 028 4. 36 0_ 029 4. 35 0. 030 4. 35 0. 033 3 3. 99 0 · 015 3 · 97 0 · 015 3. 96 0 · 016 3. 96 0. 016 3. 95 0 018 4 4. 15 0 019 4. 14 0. 018 4. 10 0. 022 4. 10 0. 021 4. 09 0. 021 5 4 · 49 0 035 4. 43 0 · 034 4 · 42 0 · 036 4. 41 0 · 036 4. 35 0 · 036 6 4. 20 0. 022 4. 20 0 , 022 4. 18 0 · 024 4. 18 0 · 025 4. 15 0 · 025 7 4. 69 0. 033 4_ 67 0. 034 4. 65 0 · 035 4. 61 0. 035 4. 60 0. 038 8 4. 15 0 · 018 4. 15 0. 018 4. 14 0. 020 4. 12 0 · 021 4. 12 0 · 024 9 4. 28 0. 009 4. 26 0 · 010 4. 25 0_ 012 4 .25 0. 012 4. 24 0 · 013 10 4 · 59 0. 033 4. 58 0 · 033 4. 52 0 · 032 4. 50 0. 034 4. 48 0. 035 11 4. 39 0. 029 4. 38 0 · 029 4. 35 0 031 4. 31 0 · 033 4. 30 0 · 034 12 4. 45 0. 031 4. 41 0, 035 4. 39 0 '036 4. 38 0 · 037 4. 38 0. 037 13 4. 50 0', 033 4. 46 0, 035 4. 42 0_ 036 4. 41 0. 036 4. 40 0. 037 14 4. 40 0 · 030 4. 40 0. 031 4. 38 0 · 033 4_ 32 0. 035 4_ 30 0. 036 (Please read the precautions on the back of the luxury before filling this page) ----

1T 本紙張尺度適用t國國家操準（CNS ) A4規格（210 X 297公釐）。 -I 〇1T This paper size is applicable to National Standards (CNS) A4 (210 X 297 mm). -I 〇

Claims

Public book 386095 A8 B8 C8 D8 January Iycr amended the scope of this application patent 1. A resin composition used for plating * characterized by * in the thermoplastic tree L Λ. 'Grease mixed with [Formula 1] shown Aluminum borate and / or quartz glass represented by [Formula 2] as the inorganic filler: [Formula 1] ηΑ1ζ〇3 * βιΒζ〇3 I .. (where η and m represent integers from 1 to 100) [Formula 2 i S i〇z 〇2. For example, the resin composition of the scope of patent application, wherein the inorganic filler has an aspect ratio of 10K and an average particle diameter of 0.01 to 100 «m. 0 3. The resin composition according to item 1 of the fU range, wherein 5 to 70 wU of the dagger hybrid filler is blended. 4. The resin composition according to item 1 of the scope of the patent application, wherein the thermoplastic resin and the resin are polymer polymer composed of polyether, imine and polyphenylene ether. (Please read the precautions on the reverse side before filling out this page) ------ ^ '1 subscription --- II line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 This paper size applies to Chinese national standards (CNS ) A4 size (210 X 297 mm) male 386095 A8 B8 C8 D8 month female Iycr amended the scope of this application patent 1. A resin composition used for plating * characterized by * in the thermoplastic tree L Λ. ' The grease is mixed with aluminum borate represented by [Formula 1] and / or quartz glass represented by [Formula 2] as the inorganic filler: [Formula 1] ηΑ1ζ〇3 * βιΒζ〇3 I .. (where η and m (Indicates an integer from 1 to 100) [Formula 2 i S i〇z 〇2. The resin composition according to item 1 of the patent application scope, wherein the inorganic filler has an aspect ratio of 10K and an average particle diameter of 0.01 to 100 «m is 0 3. If the application of the resin composition of the first fU range of the item, wherein the dagger mixed with filler 5 ~ 70w U 者。 4. The resin composition according to item 1 of the scope of the patent application, wherein the thermoplastic resin and the resin are polymer polymer composed of polyether, imine and polyphenylene ether. (Please read the precautions on the reverse side before filling out this page) ------ ^ '1 subscription --- II line · Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs 1 This paper size applies to Chinese national standards (CNS ) A4 size (210 X 297 mm)