TW383904U - Structure improvement for the top cover of static-charge suction cup for semiconductor wafer processing & etching used - Google Patents

Structure improvement for the top cover of static-charge suction cup for semiconductor wafer processing & etching used

Info

Publication number
TW383904U
TW383904U TW87218601U TW87218601U TW383904U TW 383904 U TW383904 U TW 383904U TW 87218601 U TW87218601 U TW 87218601U TW 87218601 U TW87218601 U TW 87218601U TW 383904 U TW383904 U TW 383904U
Authority
TW
Taiwan
Prior art keywords
static
semiconductor wafer
top cover
suction cup
wafer processing
Prior art date
Application number
TW87218601U
Other languages
Chinese (zh)
Inventor
Wen-Bin Jang
Sung-Bin Lin
Original Assignee
Jang Wen Bin
Lin Sung Bin
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Jang Wen Bin, Lin Sung Bin filed Critical Jang Wen Bin
Priority to TW87218601U priority Critical patent/TW383904U/en
Publication of TW383904U publication Critical patent/TW383904U/en

Links

TW87218601U 1998-11-10 1998-11-10 Structure improvement for the top cover of static-charge suction cup for semiconductor wafer processing & etching used TW383904U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW87218601U TW383904U (en) 1998-11-10 1998-11-10 Structure improvement for the top cover of static-charge suction cup for semiconductor wafer processing & etching used

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW87218601U TW383904U (en) 1998-11-10 1998-11-10 Structure improvement for the top cover of static-charge suction cup for semiconductor wafer processing & etching used

Publications (1)

Publication Number Publication Date
TW383904U true TW383904U (en) 2000-03-01

Family

ID=21637512

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87218601U TW383904U (en) 1998-11-10 1998-11-10 Structure improvement for the top cover of static-charge suction cup for semiconductor wafer processing & etching used

Country Status (1)

Country Link
TW (1) TW383904U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113035756A (en) * 2021-03-24 2021-06-25 绍兴同芯成集成电路有限公司 Method for radiating substrate in ultrathin wafer processing by using glass carrier plate

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN113035756A (en) * 2021-03-24 2021-06-25 绍兴同芯成集成电路有限公司 Method for radiating substrate in ultrathin wafer processing by using glass carrier plate

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees