TW383631U - Jet flow welding trough tank - Google Patents

Jet flow welding trough tank

Info

Publication number
TW383631U
TW383631U TW87213502U TW87213502U TW383631U TW 383631 U TW383631 U TW 383631U TW 87213502 U TW87213502 U TW 87213502U TW 87213502 U TW87213502 U TW 87213502U TW 383631 U TW383631 U TW 383631U
Authority
TW
Taiwan
Prior art keywords
jet flow
flow welding
trough tank
welding trough
tank
Prior art date
Application number
TW87213502U
Other languages
Chinese (zh)
Inventor
Itsusaku Satou
Original Assignee
Senju Metal Industry Co
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Senju Metal Industry Co filed Critical Senju Metal Industry Co
Publication of TW383631U publication Critical patent/TW383631U/en

Links

TW87213502U 1997-10-30 1998-08-18 Jet flow welding trough tank TW383631U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31289397A JP3197856B2 (en) 1997-10-30 1997-10-30 Jet solder bath

Publications (1)

Publication Number Publication Date
TW383631U true TW383631U (en) 2000-03-01

Family

ID=18034724

Family Applications (1)

Application Number Title Priority Date Filing Date
TW87213502U TW383631U (en) 1997-10-30 1998-08-18 Jet flow welding trough tank

Country Status (3)

Country Link
JP (1) JP3197856B2 (en)
CN (1) CN1126629C (en)
TW (1) TW383631U (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7905382B2 (en) * 2006-04-26 2011-03-15 Senju Metal Industry Co., Ltd. Wave soldering tank
DE102012013209A1 (en) * 2012-07-04 2014-01-09 Erwin Quarder Systemtechnik Gmbh Soldering nozzle for soldering device for soldering components having a number of solder joints to be soldered, comprises nozzle chamber and a device with which solder flow in flow area and contour of exiting soldering wave is influenced

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4463891A (en) * 1981-11-18 1984-08-07 Rca Corporation Wave soldering apparatus and method
JPH0645744A (en) * 1992-07-21 1994-02-18 Matsushita Electric Ind Co Ltd Jet system soldering device
FR2727044A1 (en) * 1994-11-23 1996-05-24 Electrovague DEVICE FOR INJECTING NEUTRAL GAS, IN PARTICULAR NITROGEN, FOR WAVE-WELDING MACHINE AND WAVE-WELDING MACHINE PROVIDED WITH SUCH A SYSTEM
JPH08309520A (en) * 1995-05-17 1996-11-26 Tamura Seisakusho Co Ltd Jet type soldering device

Also Published As

Publication number Publication date
JPH11135933A (en) 1999-05-21
CN1126629C (en) 2003-11-05
JP3197856B2 (en) 2001-08-13
CN1216726A (en) 1999-05-19

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Legal Events

Date Code Title Description
GD4K Issue of patent certificate for granted utility model filed before june 30, 2004
MM4K Annulment or lapse of a utility model due to non-payment of fees