JPH11135933A - Jet solder bath - Google Patents
Jet solder bathInfo
- Publication number
- JPH11135933A JPH11135933A JP31289397A JP31289397A JPH11135933A JP H11135933 A JPH11135933 A JP H11135933A JP 31289397 A JP31289397 A JP 31289397A JP 31289397 A JP31289397 A JP 31289397A JP H11135933 A JPH11135933 A JP H11135933A
- Authority
- JP
- Japan
- Prior art keywords
- jet
- floating body
- floating
- solder bath
- solder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Molten Solder (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
【０００１】[0001]
【発明の属する技術分野】本発明は、自動はんだ付け装
置に設置される噴流はんだ槽に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a jet solder bath installed in an automatic soldering apparatus.
【０００２】[0002]
【従来の技術】自動はんだ付け装置には、フラクサー、
プリヒーター、噴流はんだ槽、冷却機、等の処理装置が
設置されている。プリント基板は、フラクサーでフラッ
クス塗布、プリヒーターで予備加熱、噴流はんだ槽では
んだの付着、冷却機で冷却が行われて、はんだ付けされ
る。2. Description of the Related Art Automatic soldering machines include fluxers,
A processing device such as a preheater, a jet solder bath, and a cooler is installed. The printed circuit board is soldered by applying flux with a fluxer, preheating with a preheater, applying solder in a jet solder bath, and cooling with a cooler.
【０００３】自動はんだ付け装置でプリント基板のはん
だ付けを行うと、はんだ付け部にツララ、ブリッジ、未
はんだ、等のはんだ付け不良が発生することがある。When a printed circuit board is soldered by an automatic soldering apparatus, defective soldering such as icing, bridging, unsoldering, or the like may occur in a soldering portion.
【０００４】ツララとは、ディスクリート部品のリード
の先端に、はんだが角状に付着するもので、ツララが発
生すると、高電圧がかかるようなところでは、ツララの
先端から放電が起こって電子部品やプリント基板を破壊
してしまうばかりでなく、電子機器の組み立て時に鋭く
尖った角状のはんだが作業者の手を傷つけることがあ
る。[0004] A vignetting is a solder in which a solder adheres to a tip of a lead of a discrete component in a corner shape. When a vignetting is generated, a discharge occurs from a front end of the vignetting in a place where a high voltage is applied to an electronic component or the like. Not only will the printed circuit board be destroyed, but also sharp and sharp corner-shaped solder may hurt the hands of the operator when assembling the electronic device.
【０００５】ブリッジとは、隣接したはんだ付け部間
に、はんだが跨がって付着するものであり、プリント基
板でブリッジが発生すると、導体の不要な箇所が短絡と
なってしまうため、これを組み込んだ電子機器は機能を
全く損なうようになってしまう。[0005] A bridge is a bridge in which solder is straddled between adjacent soldering portions. When a bridge occurs on a printed circuit board, unnecessary portions of conductors are short-circuited. The built-in electronic device loses its function at all.
【０００６】未はんだとは、はんだ付け部にはんだが全
く付着しなかったり、或はプリント基板のランドや電子
部品のリードにはんだが付着しても、ランドとリード間
のはんだが離れていたりするものである。プリント基板
に未はんだが発生すると、ランドとリード間の導通がな
くなって、電子機器が全く機能を果たさず、さらにはラ
ンドとリード間が接触不良になって、この間の電気抵抗
が大きくなり、ついには火災を発生させてしまうという
重大事故につながるものである。[0006] The term "unsoldered" means that no solder adheres to a soldered portion, or even if solder adheres to a land of a printed circuit board or a lead of an electronic component, the solder between the land and the lead is separated. Things. If unsoldering occurs on the printed circuit board, conduction between the land and the lead will be lost, the electronic device will not function at all, and furthermore, the land and the lead will have poor contact, the electrical resistance between them will increase, and finally Is a serious accident that could cause a fire.
【０００７】これらのはんだ付け不良は、自動はんだ付
け装置の処理装置が適正な状態になっていないと発生す
る。たとえばフラクサーでのフラックスの塗布時に塗布
ムラができたり、プリヒーターでの予備加熱時にプリン
ト基板全体が均一温度に加熱されていなかったりした場
合に、はんだ付け不良が発生するが、特に噴流はんだ槽
での噴流状態如何がはんだ付け不良に大いに関係してい
る。[0007] These soldering defects occur when the processing equipment of the automatic soldering apparatus is not in an appropriate state. For example, poor soldering occurs when the flux is applied with a fluxer or when the entire printed circuit board is not heated to a uniform temperature during preheating with a pre-heater. The state of the jet is greatly related to poor soldering.
【０００８】噴流はんだ槽には、荒れた波を噴流する一
次噴流ノズルと、溶融はんだを静かに噴流する二次噴流
ノズルが設置されている。一次噴流ノズルからの荒れた
波は、はんだ付け部の隅部やスルーホール等、はんだが
付着しにくい部分に侵入して未はんだをなくす作用を有
している。しかしながら一次噴流ノズルからの波は荒れ
ているため、そのままではツララやブリッジが発生して
しまう。そこで一次噴流ノズルで発生したツララやブリ
ッジを二次噴流ノズルの静かな噴流で修正するのであ
る。In the jet solder bath, a primary jet nozzle for jetting a rough wave and a secondary jet nozzle for jetting molten solder gently are installed. The rough wave from the primary jet nozzle has a function of penetrating into a portion where solder does not easily adhere, such as a corner portion of a soldered portion or a through hole, to eliminate unsolder. However, since the waves from the primary jet nozzle are rough, icicles and bridges are generated as they are. Therefore, the icicles and bridges generated by the primary jet nozzle are corrected by the quiet jet of the secondary jet nozzle.
【０００９】このようにプリント基板のはんだ付け時に
未はんだをなくすためには、一次噴流ノズルは必要不可
欠なものであり、荒れた波を作るために色々な手段が講
じられていた。その手段とは、ノズル内やノズル上部に
動体を設置し、該動体を外部の駆動装置で動かすことに
よりノズルから噴流する波を荒らすものであったり（特
公昭６２−３５８５７、特公平５−８５２６２）、ノズ
ルに穴のあいたプレートを設置して、穴から吹き上げる
溶融はんだを荒らしたり（特公昭６３−１５０６３）す
るものであった。As described above, in order to eliminate unsoldering at the time of soldering a printed circuit board, a primary jet nozzle is indispensable, and various measures have been taken to create a rough wave. The means may be a method in which a moving body is installed in the nozzle or above the nozzle, and the moving body is moved by an external driving device to roughen the waves jetted from the nozzle (Japanese Patent Publication No. 62-35857, Japanese Patent Publication No. 5-85262). ), A plate having a hole in the nozzle was provided to roughen molten solder blown up from the hole (Japanese Patent Publication No. 63-15063).
【００１０】ところで動体を駆動装置で動かす噴流はん
だ槽では、モーターのような駆動装置が必要であるため
高価となり、しかもモーターをノズルの近傍、即ち高温
となった噴流はんだ槽の近傍に設置しなければならない
ため、熱の影響でモーターの回転が安定しなかったり、
モーターの寿命が短くなったりするという問題があっ
た。また穴のあいたプレートを用いた噴流はんだ槽は、
穴の周囲にはんだの酸化物が付着しやすく、長期間経過
するうちに穴からの噴流状態を変えてしまうことがあっ
た。A jet solder bath in which a moving body is moved by a driving device is expensive because a driving device such as a motor is required, and the motor must be installed near the nozzle, that is, near the hot solder bath. The rotation of the motor may not be stable due to heat,
There was a problem that the life of the motor was shortened. In addition, a jet solder bath using a plate with holes
Oxide of the solder easily adhered to the periphery of the hole, and the state of the jet from the hole was sometimes changed over a long period of time.
【００１１】このような問題に鑑み、本特許出願人は駆
動装置を使用せず、しかもはんだの酸化物が付着しにく
い噴流はんだ槽を発明し、既に特許（特許第１５７１２
４２号）として確立した。この噴流はんだ槽は、ノズル
内に棒状の遊動体を設置し、該遊動体の両端をバネで支
持したり、遊動体の両端にストッパを着装して支持した
りするものである。この遊動体を設置した噴流はんだ槽
は、駆動装置を全く使用していないため安価であるばか
りでなく、酸化物が付着しにくい構造であるため長期間
安定した噴流状態を得ることができるという特長を有し
ている。In view of such a problem, the present applicant has invented a jet solder bath which does not use a driving device and to which solder oxide is less likely to adhere, and has already filed a patent (Patent No. 15712).
No. 42). This jet solder bath has a rod-shaped floating body installed in a nozzle, and supports both ends of the floating body with springs, or mounts and supports stoppers at both ends of the floating body. The jet solder bath in which the floating body is installed is not only inexpensive because it does not use any driving device, but also has a structure in which oxides are unlikely to adhere, so that a stable jet state can be obtained for a long time. have.
【００１２】[0012]
【発明が解決しようとする課題】遊動体を用いたはんだ
槽は、このように優れた特長を有しているが、遊動体の
両端をバネで支持した噴流はんだ槽（以下、バネ式遊動
体はんだ槽という）は噴流の圧力を非常に高くしたとき
に、ノズル全域にわたって噴流頂部が一定高さとならな
いことがあった。一般のプリント基板のはんだ付けで
は、噴流圧力を非常に高くすることはないが、積層プリ
ント基板のようにスルーホールの深いものでは、スルー
ホールの中迄も充分溶融はんだを侵入させなければなら
ないため、噴流圧力を高くすることがある。このように
噴流圧力を高くすると、バネ式遊動体はんだ槽では、噴
流頂部の高さが一定とならないことがあった。A solder bath using a floating body has such excellent features as described above, but a jet solder bath (hereinafter referred to as a spring-type floating body) in which both ends of the floating body are supported by springs. When the pressure of the jet was extremely increased, the top of the jet did not always have a constant height over the entire area of the nozzle. In general soldering of printed circuit boards, the jet pressure is not extremely high, but in the case of deep through holes such as multilayer printed circuit boards, the molten solder must penetrate sufficiently into the through holes. , The jet pressure may be increased. When the jet pressure is increased in this manner, the height of the jet top may not be constant in the spring-type floating solder bath.
【００１３】[0013]
【課題を解決するための手段】本発明者は、従来のバネ
式遊動体はんだ槽が噴流圧力を強くすると波の噴流高さ
が一定とならないことについて鋭意研究を重ねた結果、
図６に示すように遊動体５の端部がそれぞれ単独に上下
方向（矢印方向）に動いてしまうためであることが判明
した。つまり遊動体の一端だけが上方に持ち上げられる
と、持ち上げられた遊動体にともなって溶融はんだも上
方に高くなり、遊動体の他端の噴流よりも高くなってし
まうからである。そこで本発明者は、遊動体が上下方向
に動かないようにすれば噴流高さが一定となることに着
目して本発明を完成させた。Means for Solving the Problems The present inventor has conducted intensive studies on the fact that the height of the jet of a wave is not constant when the jet pressure of the conventional spring-type floating solder is increased.
As shown in FIG. 6, it has been found that the ends of the floating bodies 5 individually move in the vertical direction (the direction of the arrow). That is, when only one end of the floating body is lifted upward, the molten solder also rises upward with the lifted floating body, and becomes higher than the jet at the other end of the floating body. Therefore, the present inventor has completed the present invention by noting that the height of the jet is constant if the floating body is not moved in the vertical direction.
【００１４】本発明は、溶融はんだを噴流させる噴流口
内に噴流口の長手方向平行に遊動体が設置された噴流は
んだ槽において、遊動体の両端がバネで保持されてお
り、遊動体は横方のみの遊動が可能となっているととも
に縦方への遊動が拘束された構造となっていること特徴
とする噴流はんだ槽である。According to the present invention, there is provided a jet soldering bath in which a floating body is installed in a jet port through which a molten solder is jetted in a direction parallel to the longitudinal direction of the jet port, wherein both ends of the floating body are held by springs, and This is a jet soldering bath characterized in that it has a structure in which only free movement is possible and vertical movement is restricted.
【００１５】[0015]
【発明の実施の形態】本発明では、遊動体の両端をバネ
で保持するものであるが、遊動体の遊動方向を横方だけ
にして縦方の遊動を拘束したものである。DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS In the present invention, both ends of a floating body are held by springs, but the floating direction of the floating body is restricted to a horizontal direction, and a vertical floating is restricted.
【００１６】遊動体の縦方の遊動を拘束する一つの手段
としては、板バネを使用することである。つまり板バネ
は、板の面に対して直角方向には容易に振れるが、板の
面に対して平行方向には決して振れるようなことはな
い。そこで遊動体の縦方の遊動を拘束するために、遊動
体の両端に板バネを立設させて板バネを横方だけに振ら
すようにする。One means for restraining the floating body from moving in the vertical direction is to use a leaf spring. That is, the leaf spring easily swings in a direction perpendicular to the plane of the plate, but never swings in a direction parallel to the plane of the plate. Therefore, in order to restrain the floating of the floating body in the vertical direction, leaf springs are erected at both ends of the floating body so that the leaf spring is swung only horizontally.
【００１７】その第１の実施の形態としてしては、板バ
ネを複数箇所で互い違いに屈曲させて波状にし、該波状
の板バネを立設した状態で一端を遊動体の端部に固定
し、他端をホルダーに固定する。このように波状の板バ
ネを用いると、遊動体は縦方の遊動が拘束され、横方に
自由に遊動することができる。In the first embodiment, a leaf spring is bent alternately at a plurality of locations to form a wave, and one end is fixed to an end of a floating body in a state where the wave spring is erected. Then, fix the other end to the holder. When the wavy plate spring is used, the floating body is restricted from moving in the vertical direction, and can freely move in the horizontal direction.
【００１８】また第２の実施の形態としては、平らな板
バネの一端を遊動体の端部に固定し、板ばねの他端をホ
ルダーに自由状態で保持するようにする。遊動体に固定
した平らな板バネの端部を自由状態に保持すると、遊動
体は横方には遊動するが縦方には遊動しなくなる。In the second embodiment, one end of a flat leaf spring is fixed to the end of a floating body, and the other end of the leaf spring is held in a holder in a free state. When the end of the flat leaf spring fixed to the movable body is held in a free state, the movable body floats horizontally but does not move vertically.
【００１９】そして第３の実施の形態として、遊動体の
両端をコイルバネで保持し、遊動体の両端内側部分を隔
壁の横長穴で保持するようにする。この第３の実施の形
態では遊動体は、隔壁の横長穴に沿って遊動するため、
縦方の遊動が拘束されるものである。As a third embodiment, both ends of the floating body are held by coil springs, and inner portions of both ends of the floating body are held by horizontally long holes of the partition. In the third embodiment, since the floating body moves along the horizontally long hole of the partition,
Vertical movement is restricted.
【００２０】[0020]
【実施例】以下図面に基づいて本発明を説明する。図１
は第１実施例の斜視図、図２は同要部拡大斜視図、図３
は第２実施例の要部拡大斜視図、図４は第３実施例の要
部拡大斜視図、図５は本発明噴流はんだ槽における噴流
状態を説明する正面断面図である。BRIEF DESCRIPTION OF THE DRAWINGS FIG. FIG.
FIG. 2 is a perspective view of the first embodiment, FIG.
FIG. 4 is an enlarged perspective view of a principal part of the second embodiment, FIG. 4 is an enlarged perspective view of a principal part of the third embodiment, and FIG. 5 is a front sectional view for explaining a jet state in the jet solder bath of the present invention.
【００２１】先ず第１実施例の噴流はんだ槽について説
明する。噴流はんだ槽は、噴流口１が一対のノズル板
２、２と側板３、３から形成されている。側板３、３は
ノズル板２、２よりも高さが高くなっている。これは噴
流口から噴流した溶融はんだをノズル板から流出させる
ためである。First, the jet solder bath of the first embodiment will be described. The jet solder bath has a jet port 1 formed by a pair of nozzle plates 2 and 2 and side plates 3 and 3. The side plates 3 and 3 are higher than the nozzle plates 2 and 2. This is to cause the molten solder jetted from the jet port to flow out of the nozzle plate.
【００２２】噴流はんだ槽には、図示しないポンプとモ
ーターが設置され、ポンプの稼働により溶融はんだが下
方から送られて、噴流口から噴流するようになってい
る。側板３、３には穴４、４が穿設されており、該穴を
通して遊動体５が設置されている。穴４、４は遊動体５
の直径よりも大径となっており、遊動体の自由な遊動を
妨げない大きさとなっている。A pump and a motor (not shown) are installed in the jet solder bath, and the molten solder is sent from below by the operation of the pump, and is jetted from the jet port. Holes 4, 4 are formed in the side plates 3, 3, and a floating body 5 is installed through the holes. Holes 4 and 4 are floating bodies 5
Is larger than the diameter of the moving body, and is a size that does not prevent free movement of the moving body.
【００２３】遊動体５の両端には板バネ６、６が固定さ
れている。第１実施例の板バネは複数箇所で屈曲した波
状であり、屈曲方向は縦方となっている。該板バネは、
一端が遊動体５の端部に固定され、他端がホルダー７、
７に固定されている。ホルダー７は図示しないはんだ槽
本体に固定されている。板バネ６は立設した状態、即ち
板バネは溶融はんだの噴流方向と平行した状態に設置さ
れている。従って、板バネは横方（矢印Ｘ）には振れる
が縦方には全く振れない。The leaf springs 6 are fixed to both ends of the floating body 5. The leaf spring of the first embodiment has a wavy shape bent at a plurality of positions, and the bending direction is vertical. The leaf spring is
One end is fixed to the end of the floating body 5 and the other end is the holder 7,
7 is fixed. The holder 7 is fixed to a solder bath body (not shown). The leaf spring 6 is set upright, that is, the leaf spring is set in a state parallel to the direction of jet of the molten solder. Therefore, the leaf spring swings horizontally (arrow X) but does not swing vertically.
【００２４】次に上記噴流はんだ槽における溶融はんだ
の噴流状態について説明する。図示しないポンプを稼働
させると、図５に示すように溶融はんだ８は下方から送
られて、噴流口１から噴流し、一対のノズル板２、２か
ら流出する。このとき下方から流動してくる溶融はんだ
中に遊動体５が設置されているため、遊動体の後部（図
中上部）の流れに所謂カルマンの渦流が発生し、流れが
乱されるとともに、勢いのある溶融はんだの流れにより
遊動体が上下左右方向ランダムに揺らされようとする。
しかしながら、遊動体は両端が立設した板バネ６、６で
保持されているため、左右方向には遊動するが上下方向
の遊動は拘束される。従って、噴流口１から噴流する溶
融はんだ８は、カルマンの渦流による乱れと、遊動体の
左右方向の遊動により荒れた波となる。このとき噴流口
１から噴流する溶融はんだの頂部は遊動体の上下方向へ
の遊動が全くないため、常に一定高さを保っている。こ
のように一定高さとなった噴流波に、図示しないプリン
ト基板が接触して、プリント基板全域にはんだが付着さ
れる。Next, the state of the jet of molten solder in the jet solder bath will be described. When a pump (not shown) is operated, the molten solder 8 is sent from below, jets from the jet port 1 and flows out from the pair of nozzle plates 2 and 2 as shown in FIG. At this time, since the floating body 5 is provided in the molten solder flowing from below, a so-called Karman vortex is generated in the flow of the rear part (upper part in the drawing) of the floating body, and the flow is disturbed and the momentum is increased. The floating body is likely to be randomly shaken in the vertical and horizontal directions due to the flow of the molten solder having the problem.
However, since the floating body is held by the plate springs 6, both ends of which are erected, the floating body moves in the left-right direction but is restricted in the vertical direction. Therefore, the molten solder 8 jetted from the jet port 1 becomes a turbulent wave due to the turbulence of the Karman vortex and the movement of the moving body in the left-right direction. At this time, the top of the molten solder jetted from the jet port 1 always keeps a constant height because the floating body does not move up and down at all. The printed circuit board (not shown) comes into contact with the jet wave having a constant height as described above, and solder is attached to the entire printed circuit board.
【００２５】第２実施例の噴流はんだ槽は、図３に示す
ように遊動体５の両端に平らな板バネ９が立設して固定
されている。平らな板バネ９は他端がホルダー１０に摺
動自在に保持されている。ホルダー１０は図示しないは
んだ槽本体に固定されており、内部が空洞の箱形であ
る。ホルダー１０は板バネ９を保持する部分がスリット
１１となっていて、板バネ９が自由に出入りできるよう
になっている。従って、第２実施例の噴流はんだ槽で
も、遊動体５が左右方向（矢印Ｘ）に遊動するときは、
板バネ９が屈曲しながらホルダー１０のスリット１１を
出入りし、上下方向の遊動を拘束するようになってい
る。In the jet solder bath of the second embodiment, as shown in FIG. 3, flat leaf springs 9 are erected at both ends of a floating body 5 and fixed. The other end of the flat leaf spring 9 is slidably held by the holder 10. The holder 10 is fixed to a solder bath main body (not shown) and has a hollow box shape inside. The holder 10 has a slit 11 for holding the leaf spring 9 so that the leaf spring 9 can freely enter and exit. Therefore, even in the jet solder bath of the second embodiment, when the floating body 5 moves in the left-right direction (arrow X),
The leaf spring 9 moves in and out of the slit 11 of the holder 10 while bending, thereby restraining play in the vertical direction.
【００２６】第３実施例の噴流はんだ槽は、図４に示す
ように遊動体５の両端がコイルバネ１３で保持されてい
るものである。コイルバネの他端は、ホルダー１５に係
合されている。側板３、３には縦寸法が遊動体５の直径
よりも僅かに大きく、横方に充分長い横穴１４が穿設さ
れている。従って、遊動体５が溶融はんだの流れで遊動
するときに、縦方の遊動が横長穴１４によって拘束さ
れ、横方の遊動（矢印Ｘ）のみが可能となるようになっ
ている。In the jet solder bath of the third embodiment, both ends of a floating body 5 are held by coil springs 13 as shown in FIG. The other end of the coil spring is engaged with the holder 15. The side plates 3 and 3 are provided with a lateral hole 14 whose vertical dimension is slightly larger than the diameter of the floating body 5 and is sufficiently long laterally. Therefore, when the floating body 5 moves by the flow of the molten solder, the vertical movement is restricted by the horizontally long hole 14, so that only the horizontal movement (arrow X) is possible.
【００２７】なお実施例では、遊動体の形状を断面が円
状の丸棒で示したが、本発明に使用する遊動体は断面が
円状に限らず、断面が楕円、二等辺三角形、菱形、矩
形、等如何なる形状でも使用できることは言うまでもな
い。In the embodiment, the shape of the floating body is shown by a round bar having a circular cross section. However, the floating body used in the present invention is not limited to a circular cross section, but may have an elliptical cross section, an isosceles triangle, or a rhombic cross section. It goes without saying that any shape such as a rectangular shape can be used.
【００２８】[0028]
【発明の効果】以上説明したように、本発明の噴流はん
だ槽は、噴流口内に設置された遊動体が横方には自由に
遊動するが縦方の遊動が拘束されているため、非常に高
い圧力の噴流であっても、遊動体が決して縦方に遊動す
ることがない。従って、噴流頂部が常に一定高さとな
り、プリント基板のはんだ付け時、プリント基板に対し
て均一な接触状態を保つことができ、はんだ付け不良が
皆無となるという信頼性に優れたはんだ付けが行えるも
のである。As described above, in the jet solder bath according to the present invention, the floating body installed in the jet port freely moves in the horizontal direction, but the floating in the vertical direction is restrained. Even with a high pressure jet, the floating body never moves vertically. Therefore, the top of the jet is always at a constant height, and when soldering the printed circuit board, it is possible to maintain a uniform contact state with the printed circuit board, and it is possible to perform soldering with excellent reliability that there is no soldering failure. Things.
【図１】第１実施例の斜視図FIG. 1 is a perspective view of a first embodiment.
【図２】第１実施例の要部拡大斜視図FIG. 2 is an enlarged perspective view of a main part of the first embodiment.
【図３】第２実施例の要部拡大斜視図FIG. 3 is an enlarged perspective view of a main part of the second embodiment.
【図４】第３実施例の要部拡大斜視図FIG. 4 is an enlarged perspective view of a main part of a third embodiment.
【図５】本発明噴流はんだ槽における噴流状態を説明す
る正面断面図FIG. 5 is a front sectional view for explaining a jet state in the jet solder bath of the present invention.
【図６】従来のバネ式遊動体はんだ槽における噴流状態
を説明する正面断面図FIG. 6 is a front cross-sectional view illustrating a state of a jet in a conventional spring-type floating solder bath.
１ 噴流口 ２ ノズル板 ３ 側板 ４ 穴 ５ 遊動体 ６ 板バネ ７ ホルダー DESCRIPTION OF SYMBOLS 1 Spout 2 Nozzle plate 3 Side plate 4 Hole 5 Floating body 6 Leaf spring 7 Holder
Claims (4)
口の長手方向平行に遊動体が設置された噴流はんだ槽に
おいて、遊動体の両端がバネで保持されており、遊動体
は横方のみの遊動が可能となっているとともに縦方への
遊動が拘束された構造となっていること特徴とする噴流
はんだ槽。In a jet soldering bath in which a floating body is installed in a jet port through which a molten solder is jetted in parallel with a longitudinal direction of the jet port, both ends of the floating body are held by springs, and the floating body has only a horizontal side. A jet solder bath characterized in that it has a structure capable of floating and restraining vertical movement.
立設した状態で一端が遊動体の端部に固定され、他端が
ホルダーに固定されていて、しかも縦方に複数箇所で屈
曲した波状となっていることを特徴とする請求項１記載
の噴流はんだ槽。2. The spring is a leaf spring, and one end of the leaf spring is fixed to an end of the floating body in an upright state, and the other end is fixed to a holder. 2. The jet solder bath according to claim 1, wherein the jet solder bath has a wavy shape.
立設した状態で一端が遊動体の端部に固定され、他端が
ホルダーに摺動自在に保持されていることを特徴とする
請求項１記載の噴流はんだ槽。3. The spring is a leaf spring, and one end of the leaf spring is fixed to an end of the movable body in an upright state, and the other end is slidably held by a holder. The jet solder bath according to claim 1, wherein:
ルバネは一端が遊動体の端部に固定され、他端がホルダ
ーに固定されていて、しかも遊動体の両端内側部分が側
板に穿設された横長穴で保持されていることを特徴とす
る請求項１記載の噴流はんだ槽。4. The spring is a coil spring, one end of which is fixed to an end of the movable body, the other end of which is fixed to a holder, and the inside of both ends of the movable body is formed in a side plate. 2. The jet solder bath according to claim 1, wherein said solder bath is held by said oblong hole.
Priority Applications (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31289397A JP3197856B2 (en) | 1997-10-30 | 1997-10-30 | Jet solder bath |
| TW87213502U TW383631U (en) | 1997-10-30 | 1998-08-18 | Jet flow welding trough tank |
| CN98123561A CN1126629C (en) | 1997-10-30 | 1998-10-29 | Trough for soldering by jetting molten solder |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP31289397A JP3197856B2 (en) | 1997-10-30 | 1997-10-30 | Jet solder bath |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH11135933A true JPH11135933A (en) | 1999-05-21 |
| JP3197856B2 JP3197856B2 (en) | 2001-08-13 |
Family
ID=18034724
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP31289397A Expired - Lifetime JP3197856B2 (en) | 1997-10-30 | 1997-10-30 | Jet solder bath |
Country Status (3)
| Country | Link |
|---|---|
| JP (1) | JP3197856B2 (en) |
| CN (1) | CN1126629C (en) |
| TW (1) | TW383631U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012013209A1 (en) * | 2012-07-04 | 2014-01-09 | Erwin Quarder Systemtechnik Gmbh | Soldering nozzle for soldering device for soldering components having a number of solder joints to be soldered, comprises nozzle chamber and a device with which solder flow in flow area and contour of exiting soldering wave is influenced |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7905382B2 (en) * | 2006-04-26 | 2011-03-15 | Senju Metal Industry Co., Ltd. | Wave soldering tank |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4463891A (en) * | 1981-11-18 | 1984-08-07 | Rca Corporation | Wave soldering apparatus and method |
| JPH0645744A (en) * | 1992-07-21 | 1994-02-18 | Matsushita Electric Ind Co Ltd | Jet system soldering device |
| FR2727044A1 (en) * | 1994-11-23 | 1996-05-24 | Electrovague | DEVICE FOR INJECTING NEUTRAL GAS, IN PARTICULAR NITROGEN, FOR WAVE-WELDING MACHINE AND WAVE-WELDING MACHINE PROVIDED WITH SUCH A SYSTEM |
| JPH08309520A (en) * | 1995-05-17 | 1996-11-26 | Tamura Seisakusho Co Ltd | Jet type soldering device |
-
1997
- 1997-10-30 JP JP31289397A patent/JP3197856B2/en not_active Expired - Lifetime
-
1998
- 1998-08-18 TW TW87213502U patent/TW383631U/en not_active IP Right Cessation
- 1998-10-29 CN CN98123561A patent/CN1126629C/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102012013209A1 (en) * | 2012-07-04 | 2014-01-09 | Erwin Quarder Systemtechnik Gmbh | Soldering nozzle for soldering device for soldering components having a number of solder joints to be soldered, comprises nozzle chamber and a device with which solder flow in flow area and contour of exiting soldering wave is influenced |
Also Published As
| Publication number | Publication date |
|---|---|
| TW383631U (en) | 2000-03-01 |
| CN1126629C (en) | 2003-11-05 |
| JP3197856B2 (en) | 2001-08-13 |
| CN1216726A (en) | 1999-05-19 |
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