TW382819B - Nanoscale mott-transition molecular field effect transistor - Google Patents

Nanoscale mott-transition molecular field effect transistor Download PDF

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TW382819B
TW382819B TW087112893A TW87112893A TW382819B TW 382819 B TW382819 B TW 382819B TW 087112893 A TW087112893 A TW 087112893A TW 87112893 A TW87112893 A TW 87112893A TW 382819 B TW382819 B TW 382819B
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Taiwan
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transistor
patent application
scope
array
gate
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TW087112893A
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Chinese (zh)
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Gupta Arunuba
Anthony Mizevich James
Melton Newns Dennis
Albert Scott Bruce
Chi Tsuei Chan
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Ibm
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    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • H01L21/823807Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the channel structures, e.g. channel implants, halo or pocket implants, or channel materials
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • H01L21/823828Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate conductors, e.g. particular materials, shapes
    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/70Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
    • H01L21/77Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
    • H01L21/78Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
    • H01L21/82Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components
    • H01L21/822Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices to produce devices, e.g. integrated circuits, each consisting of a plurality of components the substrate being a semiconductor, using silicon technology
    • H01L21/8232Field-effect technology
    • H01L21/8234MIS technology, i.e. integration processes of field effect transistors of the conductor-insulator-semiconductor type
    • H01L21/8238Complementary field-effect transistors, e.g. CMOS
    • H01L21/823857Complementary field-effect transistors, e.g. CMOS with a particular manufacturing method of the gate insulating layers, e.g. different gate insulating layer thicknesses, particular gate insulator materials or particular gate insulator implants

Abstract

There is disclosed the use of the Mott transition to effect a metal-insulator transition in the form of a practical three-terminal device with the function of a field effect transistor. The device uses as the conducting channel an array of molecules, in which charge carriers (holes or electrons) are strongly corre-lated. The Mott transition determines metal-insulator switching and has been shown to be controlled by an external gale electrode. Otherwise, the device appears to have electrical characteristics comparable with conventional silicon-based FETs. The 'ON' state has a typical conductance of about 10 e2/h. The device performance, in terms of 'ON' conductance and breakdown voltage of the 'OFF' state, are satisfactory in the circuit context. The device can be built down to smaller dimensions, about one order of magnitude smaller linear dimension, than the conventional FET. The device can be manufactured using self-assembly technology, enabling the key step of rnultilayer structures. Thus, large numbers of transistors per chip can be assembled without the require-ment of an extremely small design rule. This is facilitated by the low voltage and power requirements of the device. Hence the Molt transition field effect transistor (MTFET) is expected offer solutions to the problems arising when existing silicon technology is scaled to extremely high transistor densities.

Description

經濟部中央標準局員工消贽合作社印製 五、發明説明(1 ) 本專利申請是於〖"6年5月22曰歸檔之專利申請第 08/652,286號之部份延續。 發明背景 本案所揭示之發明概言之係關於半導體開關,尤其是場 效4日3 a豆’且更明確地説係關於一種新奇之奈米級開關, 而該莫奈米級開關是基於特別設計之雙穩態分子之單層或 多層薄膜的莫特金屬-絕緣體轉移。 背景 現有之電腦電路,邏輯及動態随機存取記憶體(Dram) 主要疋%效電晶體(F E T )開關。市場上之每—晶片之電 晶體數目是時間之指數型遞增函數(摩爾定律,M〇〇re,s Law)因此,根據摩爾定律,每一 DRAM晶片之儲存位元 之數目也是指數型遞增。摩爾定律具有許多表達型式,例 如,電晶體密度每5年增加10倍,計算時間每8年降低6倍 ,且計算成本每8年增加1〇倍。摩爾定律之主要成因是設 計量度隨著時間而呈現指數型遞減。設計量度之降低最終 似乎江足要與矽技術之固有物理限制產生衝突。就技術而 言,矽之最重要物理,相對於材料,特性之二物理特性是 在極小量度之重要性會大爲降低:長載子平均自由行程,與 捧雜質之能力,因爲前者變爲相當於或大於裝置尺寸,且 雜質間隔也相當於或大於裝置尺寸,到目前爲止,4〇奈米 數量、'及之最小通道長度已在實驗室中獲得展示,且據信爲 接近可達成之最小通道長度。因此,當設計量度趨近於4〇 奈米之限制時,而此預期會在未來1〇_2〇年以後發生,則 •4- CNS ) ( 210x77?^^-------- ---------裝------訂—-------線—, (請先閱讀背面之>i_意事項尽填寫本頁) 五、發明説明(2 ) 品要新的技術。 同時當矽之這些優點逐漸消失時,—項缺點,受限於二 維t電路陣列,正使得高成本無法避免,因爲記憶體容量 I摩爾定律也意謂設計量度之摩爾定律,且因此道致尸資 成本之摩爾定律。一種能夠實現多屬建構之技術了而^如 同梦晶1]技術受限於二維,將可藉由使得摩敎律對於每 —晶片之電晶體數目之影響與設計量度解耦合來克服投資 成本之此項驅動力。 在這些考量之下,物理性質似乎趨向於選擇具有較短平 均自由行程及較高載子濃度之系統,亦即金屬,接著:屬 之切換問題就變成一項議題。本案所揭示之發明提出一趕 精由建造一具有高載予濃度之三終端裝置來解決該問題之 方案,且當該三終端裝置處於其之,0N,狀態時其是金屬。 該裝置之切換是藉由一相關電子系統之莫特金屬-絕緣體轉 移之概念來實現。同時,藉由延伸現在相當標準之自我絮 配理念,所製造之結構具有某種程度之三維性似乎是可朽 的’該裝置似乎具有相容於現有F E T型電路之預測電氣拍 性’亦即,零靜態閘極電流,高,〇 F F,阻抗,與低,〇 N |四 抗。 … 經濟部中央標準局員工消费合作社印製 該等特性,且最重要的是,其在極小尺寸之功能可行姐 ’使得所提議之裝置成爲一些基本問題之一可能解決方案 而电私業預期在未來1 〇 _ 2 〇年以後將遭遇該等基本問題。 附圖簡短説明 圖1A是一具有單一閘極之三終端單發色團單層莫特轉移 本紙浪尺度適州中_家標準(CNS )八4規格(2丨0 乂 2(;7公处) ίΓ 五、發明説明( 場效電晶體之側視示意圖。 圖⑺是一具有雙重閘極之三終端單發色圑單層 %效電晶體之示意圖。 ^ ^ 圖2是·一具有單一閘極之二故迪留故& m _* 一,、响早發色團多層莫特轉移埸 效電晶體(FET)之側視示意圖。 另 圖3是-雙重閘極四終端雙發色圑單層莫特轉移阳 視示意圖。 1則 圖4乂示圖i所示之裝置之能量圖。尤其,圖4八展示p型 立曰強模恐裝置之穩態之分子能階. _ 土 # 囷4 B展不η型增強槿能 裝置之穩態之分子能階;且圖4 . 曰強杈悲 ® Y '、在/及接_源極偏 气下’p型裝置沿通道之分子能階之能量變化, 極視爲無限大之下來加以計算。及通道視罐而將間 圖5藉由一連續層之電容來展示—陣列之八中— ,其中實線是針對單一閉極之情形,(均勾電介質;二:二 ε ),而虛線是針對雙重閘極之情形。 。χ 圖6展示沿源極-汲極通道之電位分佈 子分佈(虛線)之圖形,且圖6 奶/5 情形,R ν 疋針對汲極梵到微弱偏壓之 二/止Γ1·5 伏特 0 7 V ::’且 V-UV,VDS-二且:寬度是2奈米之夹止區接近沒極。 圖7疋通迢之電流Ids與及極_ 圖,在對應於利用方程式(決:,Vds卜V)之關係 種閘極電壓之下。 )斤決疋疋源極端雜質化之各 本紙張尺心⑽㈣m彳 (2;〇χ2(π公犮 ----------裝-- f請先閱讀背面之注_意事項耳填寫本頁} .ί----線---- 經漓部中央標準局員工消費合作社印製 ΙΓ 五、發明説明(4 ) ~~~~~ 圖8展示通道之電位分佈,在閘極電壓VG=iv且載子、 度爲零之下,其中假設通道長度爲L=100奈米,而氧彳匕勒^ 間隔層之寬度爲dDX = 20埃(A) ' 圖9是(ye/d)相對於VG/VT之相圖,且該相圖展示分子芦 之絕緣("OFF”)邊緣區,其中d是分子層及閘極間之距離。 圖1 0是本發明之裝置之一堆疊陣列的示意橫剖面圖。 圖11是原型莫特轉移場效電晶體之示意圖。 圖1 2展示原型莫特轉移場效電晶體之效能特性。 發明詳細説明 在一些種類之導體中,導通帶是利用界定良好之原子或 分子軌道來成。在銅酸鹽(cuprate)超導體中,此種角色是 由銅位置之dx2 _y 2對稱執道來擔任。在另一範例κη c 6。, Cw之三重退化組之最低未受佔用分子軌道(LUMO)擔任類 似之角色。描述此種材料之最簡單模型是J. Hubbard於Proc.Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs. 5. Description of Invention (1) This patent application is a continuation of part of Patent Application No. 08 / 652,286 filed on May 22, 2006. BACKGROUND OF THE INVENTION The generality of the invention disclosed in this case is related to semiconductor switches, especially field-effect 4a 3 'beans, and more specifically to a novel nanometer-level switch, which is based on a special Mott metal-insulator transfer of monolayer or multilayer films of designed bistable molecules. Background Existing computer circuits, logic and dynamic random access memory (Dram) are mainly 疋% efficiency transistor (F E T) switches. The number of transistors per chip on the market is an exponential increasing function of time (Moore's Law). Therefore, according to Moore's Law, the number of storage bits per DRAM chip is also exponentially increasing. Moore's Law has many expressions. For example, the density of transistors increases 10 times every 5 years, the calculation time decreases 6 times every 8 years, and the calculation cost increases 10 times every 8 years. The main reason for Moore's Law is to set the measure to decrease exponentially over time. The reduction in design metrics ultimately seems to conflict with the inherent physical limitations of silicon technology. In terms of technology, the most important physical property of silicon, compared to materials, is that the second physical property is greatly reduced in the importance of a small measure: the long free carrier average travel, and the ability to hold impurities, because the former becomes equivalent The device size is equal to or greater than the device size, and the impurity interval is also equal to or greater than the device size. So far, the number of 40 nanometers and the minimum channel length have been demonstrated in the laboratory and are believed to be close to the achievable minimum. Channel length. Therefore, when the design measure approaches the limit of 40 nanometers, and this is expected to occur in the future 10-20 years, then • 4- CNS) (210x77? ^^ -------- --------- install ------ order -------- line-(Please read the > i_notes on the back first and fill in this page) V. Description of the invention ( 2) New technology is required. At the same time, when these advantages of silicon are gradually disappearing, a disadvantage, which is limited by the two-dimensional t circuit array, is making high costs unavoidable, because the memory capacity I Moore's law also means design measurement. Moore ’s Law, and therefore the Moore ’s Law of the cost of corpse costs. A technology that can achieve multi-general construction and ^ like Meng Jing 1] technology is limited to two-dimensional, will make Capricorn ’s law for every chip The effect of the number of transistors is decoupled from the design metric to overcome this driving force of investment cost. Under these considerations, the physical properties seem to tend to choose a system with a shorter mean free path and a higher carrier concentration, that is, Metal, then: the problem of switching the genus becomes an issue. The invention disclosed in this case proposes a process of building a precision There is a solution with a high load concentration of three terminal devices to solve this problem, and when the three terminal devices are in the state of 0N, it is a metal. The switching of the device is through a related electronic system of Mott metal- This is achieved by the concept of insulator transfer. At the same time, by extending the now fairly standard self-flocculation concept, the structure produced has a certain degree of three-dimensionality that seems to be 'fatal'. The device appears to be compatible with existing FET-type circuits. Predicting electrical characteristics' that is, zero static gate current, high, 0FF, impedance, and low, 0N | quaternary antibodies.… These characteristics are printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, and most importantly Its functional feasibility in a very small size makes the proposed device one of the possible solutions to some basic problems, and the electronics industry is expected to encounter these basic problems in the next 10-20 years. Brief description of the drawings 1A is a three-layer single-chromophore single-layer Mott transfer paper with a single gate. The scale of this paper is in the state of Shizhou, China Standard (CNS) 8-4 specifications (2 丨 0 乂 2 (; 7 public places). ΓΓ Description (Side view of a field effect transistor. Figure ⑺ is a schematic diagram of a three-terminal single-color 圑 single-layer% efficiency transistor with dual gates. ^ ^ Figure 2 is a two-gate with a single gate Di Liu Gu & m _ * First, a schematic diagram of the side view of a multi-layer Mott transfer transistor (FET) with early chromophore. Figure 3 is a dual-gate four-terminal dual-color Mott single-layer Mott Schematic diagram of the transfer of positive views. Fig. 4 shows the energy diagram of the device shown in Fig. I. In particular, Fig. 4 shows the steady-state molecular energy level of the p-type standing mode fear device. _ 土 # 囷 4 B 展Steady-state molecular energy levels of non-n-enhanced hibinron devices; and Figure 4. Energy changes of the molecular energy levels of the p-type device along the channel under / and _ source bias It is considered as the calculation of the infinite. And the channel is viewed as a tank. Figure 5 is shown by a continuous layer of capacitance—the eighth in the array—where the solid line is for a single closed pole case (both dielectrics; two: two ε), and the dotted line is For the case of double gates. . χ Figure 6 shows the graph of the potential distribution sub-distribution (dotted line) along the source-drain channel, and in the case of Figure 5, R ν 疋 for the drain pole V to the weak bias two / stop Γ1 · 5 Volts 0 7 V :: 'and V-UV, VDS-two and: the width of the clamping zone of 2 nm is nearly infinite. Fig. 7 shows the current Ids and the sum of the poles, corresponding to the gate voltage corresponding to the relationship using the equation (determined by: Vds and V). ) The size of each paper that has been extremely contaminated by the source of 斤 ⑽㈣ m⑽㈣ (2; 〇χ2 (π 公 犮 --------—— 装-f) Please read the note on the back _ Fill out this page} .ί ---- 线 ---- Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Lithology 5. Description of the invention (4) ~~~~~ Figure 8 shows the potential distribution of the channel at the gate The voltage VG = iv and the carrier and degree are below zero, where the channel length is assumed to be L = 100 nanometers, and the width of the spacer layer is dDX = 20 Angstroms (A) 'Figure 9 is (ye / d) A phase diagram relative to VG / VT, and the phase diagram shows the " OFF " edge region of molecular reed, where d is the distance between the molecular layer and the gate. Figure 10 is the device of the present invention A schematic cross-sectional view of a stacked array. Figure 11 is a schematic diagram of a prototype Mott transfer field effect transistor. Figure 12 shows the performance characteristics of a prototype Mott transfer field effect transistor. Detailed description of the invention In some types of conductors, conduction Bands are formed using well-defined atomic or molecular orbitals. In cuprate superconductors, this role is performed by the dx2 _y 2 symmetry of the copper position. One example κη c 6., the lowest triplet set of Cw degradation of unprotected occupied molecular orbital (LUMO) as similar to the role. Describe the simplest model of such materials is J. Hubbard in Proc.

Roy. Sci.(倫敦)A276, 238(1963),A277,237 (1963), A281, 401 (1963)所描述之哈伯(Hubbard)模型,且在此提及該等論 文以供參考。 在一本質上有序之系統,例如銅酸鹽之二氧化銅平面, 吾人已發現該系統存在至少二可能之總體狀態,絕緣體及 金屬。該等狀態是藉由莫特轉移來分隔,且莫特轉移説明 於 N. Mott 所著之書:Metal-Insulator Transition, Taylor & Francis,倫敦,1 990,而在提及該書以供參考。 如果在每一銅位置正好有一電子(充填因素η = 1 ),則該等 電子可局限於該等銅位置,而造成絕緣表現。此種局限化 本紙張尺度適用中國國家標隼(CNS ) /\4现格(210 X 297a ) ---------t------’玎----.—i (讀先間讀背面之"意事項#填寫本頁) 五 經濟部中央標準局員工消费合作社印裝 發明説明(5 ) 主要是起因於位於相同軌道之二電子間之強烈位置際庫侖 斥力U。自每一位置具有一電子之組態開始,單—跳躍過 程涉及一能量損失u,且在該跳躍過程中一電子轉移至一 鄰接位置。因此,電子有效地受限於深度爲U之電位井中 ,而使得電子局限化。此種絕緣體稱爲莫特絕緣體。其就 能帶結構而言並非絕緣體’因爲其事實上具有一半受到充 填之導通帶’但就相互作用u而言且因爲其之特殊充填因 素爲1,其是絕緣體。應可明瞭局限化在高於U之溫度傾向 於崩潰。除此之外,U通常需要大於跳躍常數t,而t是用以 轉移單一電子至最近之鄰近位置之矩陣元素(此種簡單之二 維方形晶格存在一例外,其中此不等式涉及通往下一最近 之鄰近位置之矩陣元素)。 如果佔用情形大幅偏離一半受到充填,n = 1 土 d,其中d 大於大約0 . 1 - 〇 . 1 5,以來自銅酸鹽之資料爲基堤,則一解 局限化’金屬狀態會出現,即使在U很大之下。 在絕緣狀態中,在U很大之下,能量頻譜存在一數量級 爲U之間隙('高1及,低'哈伯帶間之間隙)。在導通狀態中, 則無間隙’如同在金屬中一樣。因爲導通狀態是一眞正金 屬,所以在二維系統中電導不會落至,最小金屬電導,以下, 而取小金屬電導’是以e2/h來表示。此數字對應於20千歐 姆敦量級之二維表面電阻。 ,結構可製造成爲具有三終端,而該三終端分別是以源 極,及接,及閘極來表示,且包含一連接源極及汲極之通 道’以致構成該通道之材料處於莫特絕緣狀態或金屬導通 木纸张尺度邊州屮國國家榡苹(CNS ) Λ4規格(211), 裝 訂-----.--'線!r (請先閲讀背面之注·意事項#-填寫本頁) ΙΓ 五、發明説明u ) …一 — 狀怨,視間極終端之電壓而定。因此,閘極控制源極及没 極終端之間是否存在一導通路徑,而使得該裝置成爲一種 閘控裝置。 在第一實例中’單發色團單層组態-增強模態,通道是利 用刀子單層來加以製造,而該分子單層位於yz平面。構 成該單層之分子Μ包含氧化還原核心(也稱爲發色團或輔因 子),且該等氧化還原核心包含—不穩定之電子(或電洞)。 更明確地説,氧化還原核心之特徵是具有至少一活性構件 ’且該至少一活性構件參與該等電子過程(亦即莫特絕緣體 •金屬變遷及嚅流流動)。 鲈"'部中央標準局負工消費合作社印裳 二終端裝置之單一閘極型態之簡圖展示於圖1 A,而該簡 圖顯示忒二终端裝置之基本組件。首先是導通通道丨〇,而 通道1 0包含一 2 -維陣列之分予1 2,且該等分子必須強烈相 關於電子系統,而此意謂參數U具有一很大値。通道分別 接觸位於其之左側及右側之源極丨4及汲極丨6引線。金屬閘 極2 0藉由絕緣間隔層或閘極絕緣層i 8來與分子層或通道1〇 分離。間隔層1 8之適當材料包含氧化物,例如$ ^ τ j 〇 3與 Ba!_xSrxTi〇3。基本之裝置參數是通道長度[及寬度评,間隔 層厚度dQX,分子半徑RmcI,平面内分子間隔A·!,間隔層 之電介力#數ε αχ與充填物及該層本身之電介質常數(前述 二者皆設爲ε ),分子相對於源極/汲極費米能階之能量£ ,垂直於通道10之距離是定義成爲χ方向(自通道至閘極), 平行於通道10之距離是定義成爲y方向(自源極至汲極),且 Z方向是通道内之方向(亦即進入圖1A之平面之方向)。 本紙张尺度適用々丨SK標隼(CNS ) μ规格(2丨公筇) 五、發明説明(7 ) 孩裳置也可具有一雙重閘極組態,如圖1 B所示,其中假 °又通道I —側之絕缘體使用相同之材料,且該材料之電介 質常數爲ε。符號d是用於表示絕緣體厚度,且該厚度是自 通道層之中央量起。 絕緣體之材料可爲無機或有機,但是,單一閘極型態較 相容於間隔層之氧化技術(,場氧化物')。雖然並非必要,雙 重閘極組態之絕緣層1 8及1 8 '可爲不同之材料’且該等材料 包含有機物,例如,聚亞胺。 孩陣列(可使用通道及分子層這些同義術語)可處於導通 或絕緣狀態*決定於移動電荷(載子)之可用性。施加電位 至閉極傾向於吸引相反極性之載子進入通道。通道之載子 法、度決定於閘極電位及載子間靜電斥力間之平衡。下文將 推導載子濃度及閘極電壓VG間之關係。 在增強模態裝置中,在無閘極電壓之下分子能階使得他 們與源極及汲極處於平衡狀態,且每一分子具有奇數個電 子。在此種帶電狀態之下,該層之電子由於莫特轉移而受 到局限化;(假設跳躍常數t及溫度T之條件獲得滿足)。就 源極及没極間之導通而言,該裝置處於,〇 F F,狀態。 經濟部中央標準局員工消費合作社印製 如果現在施加一電壓至該單一(或雙重)閘極,則該電壓 將在該層感應產生一相反極性之電荷。如果該極性是適當 之極性且超過一臨限値(通常是每—分子有〇1_〇〗5電子或 電洞),則分子層將切換至導通狀態,該裝置現在處於l〇N, 狀態。 增加模態裝置之,ON,狀態之一特徵是在通道之二邊緣皆 -10- 本紙張尺度適用山國國苯標準(CRsT^j^T( 21Dx 297公垃) ---— Λ Λ 經濟部中央標隼局員工消费合作社印袈 五、發明説明(8 ) 存在一短(一或數分子寬)非導通區。載子必須隧道貫穿該 等邊緣區。 孩裝置可利用二形態來加以製造,用以藉由正或負電壓 來切換成爲1 〇 N |狀態,根據該等載子是電子或電洞型。該 等形怨類似於η或p型通道Μ 〇 s F E T裝置,且可以類似方式 來運用於C Μ 0 S電路組態。 孩裝置之第二實例,單發色團單層組態-耗盡模態,類似 於耗盡模態半導體FET。該裝置之分子特徵使得。在無閘 極電壓之下’具有奇數個電子之電子組態是不穩定的,但 疋分子層離子化以產生〇1_〇15電洞(p型)或電子^型)數 量級之載子濃度。接著該裝置是處於,〇Νι狀態。 施加一適當正負號(P型使用正電壓,而η型使用負電壓) 及大小之閘極電壓接著可去除固有載子濃度,且該層回復 至莫特絕緣1 0 F F ’狀態,而每一分子有奇數個電子。因此此 裝置固有是處於,0Ν,,而需要一閘極電壓方可切換成爲 'OFF’,類似於耗盡模態FET。耗盡模態裝置不相容於 C Μ 0 S,但是相容於各種〇 RAM記憶體細胞電路。耗盡模 態裝置之一可能技術優點是當其處於,0N,狀態時在導通通 道之邊緣沒有絕緣區。相對地,當其處於,〇 F ρ1狀態時,在 通道之邊緣有導通區,而導通區除了縮短通道以外沒有實 體影響。 第三實例,單發球團多層組態_只有增加模態,展示於圖 2,通道可包含結晶或非結晶多層分子組配,而非單声。在 此增強模態裝置中,閘極電壓在分子固體之表面會感應產 -11 - i纸张尺度適用中國國家標準(CNS ) Λ4現) —---- ---------t------IT--Γ-----i (請先間讀背面之注意事項再填寫本頁) Λ' ΙΓ 經濟部中央標準局員工消费合作社印製 五、發明説明(9 ) _ '—-" 生-導通廣,而該導通層之寬度是一單層之數量級。因此 ,此導通通道相當類似於在單層情形中所構成之導通通道 。關於崩潰電壓,,亦即自,0FF,切換至,_狀態所需之問 極電壓’,0N,電導,無論是在線性或非線性區,通道邊緣 之絕緣區之寬度,與穿過此邊緣區之隧道貫穿率的詳細结 果應類似於單層增加模態裝置之詳細結果7多層耗盡模= 裝置是無法達成的,因爲多層導體之所有層通常無法皆切 換至絕緣狀態。但是,如果因爲製造過程,例如,介面層( 鄰接絕緣間隔層1 8之層)是處於導通狀態,而主體層(位於 鄰接絕緣間隔層18之層以下之該等層)是處於絕緣狀態,則 該裝置將是多層耗盡模態裝置。 第四實例,多發色團單層组態-增強模態,有利地運用具 有二或更多發色團或氧化還原核心之分子。此多發色團裝 置是以雙發色團或二構件分子之型態來展示於圖3。此多發 色團裝置本負上是四終端裝置,且具有二獨立之閘極電壓 。簡而言之’此雙發色圓裝置運作如下。構成分子之二發 色團形成一氧化還原對。最簡單之假設是—分子,稱爲v ,相對於源極-汲極費米能階之能階是_ ε丨,而另一分予, 稱爲C,之能階是ε i。 如果二閘極電壓連接在—起,(共閘極模態運作_常見於 雙重閘極裝置中),則此裝置以一類似於單發色圈mtfer 運作足方式來運作。ε l/e或_ ε〖/6之閘極電壓將使分子層 分別達到用以取得η型或Ρ型載子之臨限値。達到每一分子 〇. 1-0. 電子之電導臨限値所需之閉極電壓決定於c —之 -12- 本紙張尺度適/fp!,國國家標準(CNS ) Λ4^_格(21〇x2y7公鎿 (请先間讀背而之泣意事項真填寫本莨 裝--The Hubbard model described by Roy. Sci. (London) A276, 238 (1963), A277, 237 (1963), A281, 401 (1963), and these papers are mentioned here for reference. In an essentially orderly system, such as a copper dioxide plane of copper salts, we have found that there are at least two possible general states of the system, insulators and metals. These states are separated by Mott transitions, which are described in a book by N. Mott: Metal-Insulator Transition, Taylor & Francis, London, 1 990, and the book is mentioned for reference . If there is exactly one electron at each copper position (filling factor η = 1), these electrons can be confined to these copper positions, causing insulation performance. This limitation is applicable to the Chinese paper standard (CNS) / \ 4 present grid (210 X 297a) --------- t ------ '玎 ----.— i (Read the first reading on the back of "" 意 事 #Fill in this page") 5. Description of the invention printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (5) It is mainly due to the strong Coulomb repulsion of the two electronics rooms located in the same orbit. . Starting from the configuration with one electron at each position, the single-jump process involves an energy loss u, and an electron is transferred to an adjacent position during the jump. Therefore, the electrons are effectively confined to the potential well with a depth of U, which limits the electrons. This type of insulator is called a Mott insulator. It is not an insulator in terms of a band structure because it actually has a conduction band half filled, but it is an insulator in terms of interaction u and because of its special filling factor of 1. It should be clear that limiting to temperatures above U tends to collapse. In addition, U usually needs to be greater than the jump constant t, and t is a matrix element used to transfer a single electron to the nearest neighboring position (there is an exception to this simple two-dimensional square lattice, where this inequality involves the way to the next A nearest neighbor matrix element). If the occupancy situation deviates significantly from half to be filled, n = 1 soil d, where d is greater than about 0.1-0.15, based on the data from the copper salt, a solution to the limitation 'metal state will appear, Even under U is big. In the insulation state, under U is very large, there is a gap of the order of magnitude in the energy spectrum (a gap between 'High 1 and, Low' Hubble band). In the ON state, there is no gap 'as in metal. Because the conduction state is a positive metal, the conductance will not fall to the minimum metal conductance in the two-dimensional system, below, and the small metal conductance is taken as e2 / h. This number corresponds to a two-dimensional surface resistance of the order of 20 kiloohms. , The structure can be manufactured to have three terminals, and the three terminals are represented by the source, and ground, and the gate, respectively, and include a channel connecting the source and the drain, so that the material constituting the channel is in Mott insulation State or metal conductive wood paper scale border state 屮 country country 榡 Apple (CNS) Λ4 specification (211), binding -----.-- 'line! r (please read the note on the back of the page # -fill this page first) ΙΓ 5. Description of the invention u)… a — complaints, depending on the voltage at the terminal of the pole. Therefore, whether there is a conduction path between the gate control source and the terminal of the gate, so that the device becomes a gate control device. In the first example, the single-chromophore single-layer configuration-enhanced mode, the channel is manufactured using a single layer of a knife, and the molecular single layer is located in the yz plane. The molecules M constituting this monolayer contain redox cores (also called chromophores or cofactors), and these redox cores contain—unstable electrons (or holes). More specifically, the redox core is characterized by having at least one active member ′ and the at least one active member participates in these electronic processes (ie, Mott insulators • metal transitions and flow flow). A simple diagram of the single gate type of the terminal device of the Central Bureau of Standards and Consumers ’Cooperatives in Changsha is shown in Figure 1A, and the diagram shows the basic components of the second terminal device. The first is to turn on the channel, and the channel 10 contains a 2-dimensional array divided by 12 and these molecules must be strongly related to the electronic system, which means that the parameter U has a large value. The channel contacts the source 4 and drain 6 on the left and right sides thereof, respectively. The metal gate 20 is separated from the molecular layer or the channel 10 by an insulating spacer layer or a gate insulating layer i 8. Suitable materials for the spacer layer 18 include oxides, such as $ ^ τj03 and Ba! _XSrxTi03. The basic device parameters are channel length [and width evaluation, spacer layer thickness dQX, molecular radius RmcI, molecular interval A ·! In the plane, the dielectric force #number of the spacer layer ε αχ, and the dielectric constant of the filler and the layer itself ( Both of the foregoing are set to ε), the energy of the molecule relative to the source / drain Fermi level £, the distance perpendicular to the channel 10 is defined as the χ direction (from the channel to the gate), and the distance parallel to the channel 10 Is defined as the y direction (from the source to the drain), and the Z direction is the direction within the channel (that is, the direction into the plane of FIG. 1A). This paper size is suitable for 々SK standard (CNS) μ specifications (2 丨 public). 5. Description of the invention (7) The child clothes can also have a double gate configuration, as shown in Figure 1B, where false ° The same material is used for the insulator on the channel I side, and the dielectric constant of the material is ε. The symbol d is used to indicate the thickness of the insulator, and the thickness is measured from the center of the channel layer. The material of the insulator can be inorganic or organic. However, the single gate type is more compatible with the oxidation technology (, field oxide ') of the spacer layer. Although not necessary, the insulating layers 18 and 18 'of the double-gate configuration may be different materials' and these materials include organics such as polyimide. Arrays (synonyms such as channels and molecular layers can be used) can be in a conducting or insulating state * depending on the availability of mobile charges (carriers). Applying a potential to the closed pole tends to attract carriers of opposite polarity into the channel. The carrier method and degree of the channel depend on the balance between the gate potential and the electrostatic repulsive force between the carriers. The relationship between the carrier concentration and the gate voltage VG will be derived below. In the enhanced modal device, the molecular energy level keeps them in equilibrium with the source and the drain without a gate voltage, and each molecule has an odd number of electrons. In this state of charge, electrons in this layer are limited due to Mott transfer; (assuming the conditions for the jump constant t and temperature T are met). As far as the conduction between source and non-electrode is concerned, the device is in a state of 0 F F. Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs If a voltage is now applied to the single (or double) gate, the voltage will induce a charge of opposite polarity at this layer. If the polarity is a proper polarity and exceeds a threshold (usually 0-1_0 5 electrons or holes per molecule), the molecular layer will switch to the on state, and the device is now in the 10N, state . One of the characteristics of adding a modal device, ON, is that it is on the edge of the second channel. -10- This paper standard applies to the Shan Guoguo benzene standard (CRsT ^ j ^ T (21Dx 297)) ----- Λ Λ Economy Employees' Cooperatives of the Ministry of Standards and Technology of the People's Republic of China Seal 5. Coincident with the invention (8) There is a short (one or a few molecular width) non-conducting area. Carriers must tunnel through these marginal areas. The device can be manufactured using the two forms To switch to a 1 〇N state by a positive or negative voltage, according to whether the carriers are electron or hole type. This form is similar to η or p-type channel MOS device and can be similar The second example of a device is a single-chromophore single-layer configuration-depletion mode, similar to a depletion mode semiconductor FET. The molecular characteristics of the device make The electron configuration with an odd number of electrons under no gate voltage is unstable, but the plutonium molecular layer is ionized to produce a carrier concentration on the order of 0-1_15 holes (p-type) or electron ^ -type. The device is then in the ON state. Applying a proper sign (P type uses a positive voltage and η type uses a negative voltage) and a gate voltage of the magnitude can then remove the intrinsic carrier concentration, and the layer returns to the Mott insulation 1 0 FF 'state, and each Molecules have an odd number of electrons. Therefore, this device is inherently at ON, and requires a gate voltage to switch to 'OFF', similar to a depletion mode FET. Depletion mode devices are not compatible with C M 0S, but are compatible with various 0 RAM memory cell circuits. One possible technical advantage of a depletion mode device is that when it is in the 0N state, there is no insulation region on the edge of the conducting channel. In contrast, when it is in the state of 0 F ρ1, there is a conduction region at the edge of the channel, and the conduction region has no physical influence except shortening the channel. The third example, a single-shot multi-layer configuration—only added modalities are shown in Figure 2. The channel can contain crystalline or amorphous multi-layer molecular assemblies, rather than monophonic. In this enhanced modal device, the gate voltage will be induced on the surface of the molecular solid. -11-i Paper size is applicable to Chinese National Standard (CNS) Λ4 now) ------ --------- t ------ IT--Γ ----- i (Please read the precautions on the back before filling in this page) Λ 'ΙΓ Printed by the Consumers' Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (9) _ '—- " Broad-conduction is wide, and the width of the conductive layer is on the order of a single layer. Therefore, this conduction channel is quite similar to the conduction channel formed in the single-layer case. Regarding the breakdown voltage, that is, the voltage required to switch from 0FF to _state, '0N, conductance, whether in the linear or non-linear region, the width of the insulation region at the edge of the channel, and the width across this edge The detailed results of the tunnel penetration rate of the zone should be similar to the detailed results of a single-layer increase mode device. 7 Multi-layer depletion mode = device cannot be achieved, because all layers of a multilayer conductor cannot usually be switched to an insulated state. However, if, for example, the interface layer (the layer adjacent to the insulating spacer layer 18) is in a conducting state due to the manufacturing process, and the main body layer (the layers below the layer adjacent to the insulating spacer layer 18) is in an insulated state, then The device will be a multilayer depletion mode device. The fourth example, a single layer configuration of multiple chromophores-enhanced mode, advantageously uses molecules with two or more chromophores or redox cores. This polychromophore device is shown in Figure 3 as a dual chromophore or two-component molecule. This multi-chromophore device is a four-terminal device by itself and has two independent gate voltages. In short ', this dual-color circular device operates as follows. The two chromophores that make up the molecule form a redox pair. The simplest assumption is that the molecule, called v, has an energy level _ ε 丨 relative to the source-drain Fermi level, and the other element, called C, has an energy level ε i. If the two gate voltages are connected together (common gate modal operation_common in dual gate devices), this device operates in a manner similar to the single-shot color circle mtfer operation foot. The gate voltage of ε l / e or _ε 〖/ 6 will make the molecular layer reach the threshold 値 for obtaining n-type or P-type carriers, respectively. The closed-circuit voltage required to reach the threshold of each molecule's conductance is determined by c — -12 — The paper size is appropriate / fp !, National Standard (CNS) Λ4 ^ _Grid (21 〇x2y7 public address (please read the sobbing matter first and fill out this outfit--

.1T 線丨 五、發明説明(10 ) 計算,如同單發色團之情形。 但是’對於差動模態之運作而言,當二閘極相對於源極 及;及極(視爲處於相同之零電壓)是處於相反之極性時,在 能量上推動C氧化還原核心向上,及推動V氧化還原核心向 下之極性會使得該層變成絕緣。但是’推動C及V能階趨向 於彼此之該相反極性’在通常大於2 ε 1之整合電壓之臨限 値,將開始注入η型載子自ν至C核心,且注入ρ型載子自c 至V核心。再一次電導臨限値是由電容考量來加以控制。 此雙發色團裝置具有一較豐富之相空間來控制其之,〇 Ν, 及’ Ο F F1狀態《—主要潛在優點是,在差動模態中, CMOS電路可只藉由連接該等閘極之模態來實現;而無需 分別之η型及ρ型裝置。 分子Μ可具有許多型態且具有各種化學性質。在最簡單 之型態中,他們是眞正之分子,例如血紅素(Heme)族(例如 切換於F e 2 +及F e3 +狀態間之F e)。更複雜之分子"包含帶 電轉移複體,例如(X + TCNQ-),其中X是鹼金屬,而 TCNQ是有機四氰基-對-喳二甲烷,其中TCNQ是藉由電 洞注入來切換於T C N Q-及T C N Q間之活性構件)。 更廣義地説,用於增強模態裝置之複體可包含. 經濟部中央標準局員工消費合作社印製 1) 電洞型系統Χ + Α·,其中A是一種有機受體(其中TCNq及 C60是範例)且X是一鹼金屬; 2) 電子型系統D + Y·,其中D是一有機施體(例如是四硫富瓦 烯之TTF),且Y是一鹵素;及 3) 電洞或電子型系統E) + A-,其中D是一有機施體(例如是雙 -13- 本紙張尺度適用中國财標準(⑽)Λ4現格(2丨公位) — 經濟部中央標準局K工消费合作社印製 -----—_____ ίΓ五、發明説明㈠l ) •… … -乙缔二硫之BEDT_TTF及是N, N N,,N,,-四甲莶_對- 々伸苯—胺之TMPD),且A是一有機受體(例如TCNQ) a /又有任何已知之原因需要排除導電型聚合物來做爲分子M 之有用材料。 爲進—步展示本發明之裝置,考慮圖i A之p型增強模態 $置。在無閘極電壓之下,層丨〇之分子是處於莫特絕緣狀 態。在此種P型增強模態裝置中,如果施加足夠之負電壓至 =極,則分子會帶正電,且自莫特絕緣體切換成爲金屬狀 .態,且因此允許源極及汲極間之導通。在此種裝置中,層 10之適§材料包含一驗金屬及TCNQ間之電荷轉移複體。 如果,另一方面,圖1A之裝置增強模態裝置,則, 在無閘極電壓之下,層10之分子也是處於莫特絕緣狀態。 現在,如果施加足夠之正電壓至閘極,則分子會帶負電, 且自莫特絕緣體切換至金屬狀態,且因此允許源極及汲極 間足導通。在此種裝置中,層1〇之適當材料包含TTF及一 鹵素間之電荷轉移複體。 現在,如果圖丨八之裝置是卩型耗盡模態裝置,則,在盔 問極電壓之下,層10之分子也是處於金屬導通狀態,且如 果施加足夠之正電壓至間極,則分子會帶正電,且切換至 絕緣狀態。 下列情形將用以闡明本原創性裝置之特性,其中此裝置 在無外加電壓之下是處於|〇FF,狀態,且其中電洞,而非電 子,是導通狀態(亦即,0N,狀態)之帶電·載子。此裝置在絕 緣及導通狀態之特性,以及允許帶雷載子受到外加問極電 -14- 本纸張尺/1適财咖轉準(CNS ) Λ4ίΐ^ΤΤΐ〇Χ297公你.1T line 丨 V. Description of the invention (10) The calculation is like the case of a single chromophore. But 'for the operation of the differential mode, when the second gate is opposite to the source and the; and the poles (considered to be at the same zero voltage) are at opposite polarities, the C redox core is pushed up in energy, And pushing down the V-redox core's polarity will make this layer insulating. However, at the threshold of the integration voltage that usually pushes the C and V energy levels towards each other's threshold 値, it will start to inject n-type carriers from ν to the C core, and inject p-type carriers from c to V core. Once again the conductance threshold is controlled by capacitance considerations. This dual chromophore device has a richer phase space to control it, ΝΝ, and 〇 F F1 states-the main potential advantage is that in the differential mode, CMOS circuits can only be connected by these The gate modal is realized; no separate η-type and ρ-type devices are needed. The molecule M can have many types and have various chemical properties. In the simplest form, they are positive molecules, such as the Heme family (eg, F e switching between F e 2+ and F e3 + states). More complex molecules include charged complexes, such as (X + TCNQ-), where X is an alkali metal, and TCNQ is an organic tetracyano-p-pyrene dimethane, where TCNQ is switched by hole injection Active component between TCN Q- and TCNQ). More broadly, the complex used to enhance the modal device can include. Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs 1) Hole-type system X + Α ·, where A is an organic receptor (of which TCNq and C60 Is an example) and X is an alkali metal; 2) an electronic system D + Y ·, where D is an organic donor (eg, TTF of tetrathiafulvalene), and Y is a halogen; and 3) hole Or electronic system E) + A-, where D is an organic donor (for example, double-13) This paper size applies Chinese financial standards (⑽) Λ4 present grid (2 丨 common) — Central Bureau of Standards, Ministry of Economic Affairs K Printed by the Industrial and Consumer Cooperatives --------_______ ίΓ V. Description of the Invention ㈠) •…… -BEDT_TTF of Ethylene Disulfide and N, NN ,, N ,,-Tetramethylamidine_p TMPD) of amines, and A is an organic acceptor (such as TCNQ) a / For any known reason, it is necessary to exclude conductive polymers as useful materials for molecule M. To further illustrate the device of the present invention, consider the p-type enhanced modal of Figure i A. In the absence of a gate voltage, the molecules of the layer 0 are in a Mott insulation state. In such a P-type enhanced modal device, if a sufficient negative voltage is applied to the = pole, the molecules will be positively charged and switch from the Mott insulator to a metallic state, and therefore allow a gap between the source and the drain. Continuity. In such a device, a suitable material for layer 10 includes a metal transfer charge transfer complex between TCNQ. If, on the other hand, the device of FIG. 1A enhances the modal device, the molecules of layer 10 are also in the Mott insulation state without a gate voltage. Now, if a sufficient positive voltage is applied to the gate, the molecules will be negatively charged and switched from the Mott insulator to the metallic state, thus allowing full conduction between the source and the drain. In such devices, suitable materials for layer 10 include a charge transfer complex between TTF and a halogen. Now, if the device of Fig. 8 is a 卩 -type depletion mode device, the molecules of layer 10 are also in a metal conduction state under the helmet interrogation voltage, and if a sufficient positive voltage is applied to the interelectrode, the molecules It will be positively charged and switched to the insulated state. The following situations will be used to clarify the characteristics of this original device, in which the device is in the state of 0FF, without an applied voltage, and in which the holes, but not the electrons, are on (ie, 0N, state) Charged carrier. The characteristics of this device in the insulated and conductive state, as well as to allow lightning carriers to be subjected to externally charged electricity -14- This paper rule / 1 suitable financial coffee conversion standard (CNS) Λ4ίΐ ^ ΤΤΐ〇 × 297

--J (請先間讀背面之注意事項再填寫本頁 -裝· 訂 線 H '五、發明説明(12 ) 經濟部中央搮準局貞工消费合作社印装 壓之調變之機制將受到説明。此裝置之金屬-絕緣體轉移使 得可在’ON1及'OFF'狀態之間切換。 爲首先展示此裝置之,OFF1狀態是處於莫特絕緣狀態,此 裝置是設計成爲,在穩態之下,陣列之每—位置平均具有 一電子,假設下面之方程式1獲得滿足。如果忽略動能,則 所有電子皆佔用單一退化能階,且該退化能階定義成爲位 於引線之鄰近費米海之費米能階以下的能量£〗,如圖4 A 所示。由於該層分子之電子強烈相關,因此當該等電子趨 近於彼此時會遭受強大之庫侖斥力。尤其,一允許二電子 處於單一位置之狀態具有極高之能量11(1]>>“丁,或任何 其他能量量度)。因此,此種狀態實際上不允許任何雙重佔 用,且引線之電予無法滲入或穿過陣列。換句話説,與允 許每一位置具有任何雙重佔用之狀態間形成一數量級u之 能隙(圖4 A) °在熱平衡之下,此系統繼續保持是—莫特絕 緣體’只下列條件獲得滿足: . T << ε ] jl κΒτ«υ… ⑴ 施加-没極-源極電I無法輕易驅動此系辣至金屬狀態。 圖4°展示在具有負偏SVf V之下此系統之電子能;圖 應:所感興趣的是正負號)。的確,負及極-源極 二 端之該等阵列電子之能量。在接近没極 處圖4C之靜電能量之變化大約遵循下列解析形態·· E(<5y) = eV-e(VG- ν)/(2/η)δν/ύ 其中V。是問極電壓…是寒極之距離,上及極( -15 - (請先閱讀背面之注意事項再填寫本頁) 裝· 訂 線--J (Please read the precautions on the back before filling in this page-Binding · Binding H 'V. Description of the invention (12) The adjustment mechanism of the printing pressure of the Zhengong Consumer Cooperative of the Central Government Bureau of the Ministry of Economic Affairs will be subject to Explanation. The metal-insulator transfer of this device allows switching between the 'ON1' and 'OFF' states. To show the device first, the OFF1 state is in the Mott insulation state, and the device is designed to be under steady state Each position of the array has one electron on average, assuming that the following Equation 1 is satisfied. If the kinetic energy is ignored, all electrons occupy a single degraded energy level, and the degraded energy level is defined as the Fermi at the adjacent Fermi sea on the lead. Energy below the energy level, as shown in Figure 4A. Because the electrons in this layer of molecules are strongly related, they will experience strong Coulomb repulsion when they approach each other. In particular, one allows two electrons to be in a single position. The state has a very high energy 11 (1) > " " D, or any other energy measure). Therefore, this state does not actually allow any double occupation, and the electricity of the lead cannot penetrate or Pass through the array. In other words, an energy gap of an order of magnitude u is formed between a state that allows each position to have any dual occupancy (Figure 4 A) ° Under thermal equilibrium, this system continues to be-Mott insulators' only the following The conditions are met:. T < < ε] jl κΒτ «υ… 施加 The applied-inverted-source voltage I cannot easily drive this system to a metallic state. Figure 4 ° shows that under the negative bias SVf V this The electronic energy of the system; the figure should be: the sign of interest is the sign). Indeed, the energy of these array electrons at the negative and pole-source terminals. The change of the electrostatic energy of Figure 4C near the poles follows approximately the following analysis Form ·· E (< 5y) = eV-e (VG- ν) / (2 / η) δν / ύ where V. is the voltage at the pole ... is the distance of the cold pole, and the upper pole (-15-(Please (Read the precautions on the back before filling out this page.)

卜紙张尺度適用中國國家標隼((:NS )Λ4現格(2|()y :',、淖) Λ 經濟部中央標準局負工消费合作社印製 克、發明説明(13 ) '…—-- 視爲半^艮長薄片)及Μ極(視爲無限長薄片)間之間隔電 介質常數是視爲!。此種近似之平方根特殊性明顯地展二見: 圖4 C之數値解。 前述計算假設電介質常數爲卜如果採用―均句之電介質 常敦ε,則圖4C之絕緣體以内之電壓變化會降低^倍,而 電極表面會出現電位陡升。此種經過修改之圖像不會變更 下列d論。 雖然接近汲極之分子能階會提升,在滿足下列條件之下: £ I^dsI^U- ε j (3) (圖4C所示之參數滿足上述條件),但是陣列及汲極或源極 間之電子轉移不會發生,因爲存在系統之哈伯阻障。對於 處於離予能階之電子而言,轉移任何電子自陣列至位於左 側之源極必須在中間過程啓始一具有雙重佔用之狀態,而 此需要U數量級之能量。電子也不可能自汲極隧道貫穿至 陣列之親和力能階(上哈伯能帶),因爲汲極費米能階仍位 於上哈伯能帶以下。因此’只要方程式(3 )之條件獲得滿足 ’則此系統仍將維持成爲一絕緣體。利用一不連續模型來 取代該層之連續模型在定性上將不會改變前述之結果。 藉由施加負電壓於覆蓋閘極及基質之間,一旦離子化能 階(下哈伯能帶)偏移至引線之費米能階以上,則該陣列將 傾向於切換至金屬狀態。在一给定之閘極電賡之下,該陣 列之可用帶電載子之實際密度也決定於該陣列以内之庫侖 交互作用。 假設現在施加負閘極電壓_ VG,VG> 〇,於該裝置,且系 -16- m 氏張尺度適( (請先閱讀背面之注意事項再填ΪΪ?本頁) 裝 、11 線 五、發明説明(l4 ) 統繼續處於平衡。〆旦相對於源極_汲極費米能階之零載子 密度的層離子化能階e( VG_ ε [)變爲正,則該陣列之電子傾 向於注入引線,而充電該層爲正。此充電趨勢受到該層以 内之靜電能量之累積的抗拒。每一分子之總電能可寫爲: E〇 = (eVG _ f|)(1 + 62e2/Cm〇|, (4) 其中d是每—分子之邵份正電荷(〇<(J<1),。丨是藉由 下列等式來定義:The paper scale is applicable to the Chinese national standard ((: NS) Λ4 present grid (2 | () y: ',, 淖) Λ Printed gram, invention description (13)… --- Think of the dielectric constant between the half-length sheet) and M-pole (think of an infinitely long sheet)! . The square root particularity of this approximation is clearly seen in Figure 4: the number solution of C. The foregoing calculation assumes that the dielectric constant is 如果 If the dielectric constant ε of the uniform sentence is used, the voltage change within the insulator of FIG. 4C will be reduced by ^ times, and the potential on the electrode surface will rise sharply. This modified image will not change the following discussion. Although the energy level of molecules close to the drain will be increased, under the following conditions: £ I ^ dsI ^ U- ε j (3) (the parameters shown in Figure 4C meet the above conditions), but the array and the drain or source Interelectron transfer does not occur because there is a systematic Hubble barrier. For electrons at the off-energy level, transferring any electrons from the array to the source on the left must start with a dual occupancy state in the middle process, and this requires energy on the order of U. It is also impossible for electrons to pass from the drain tunnel to the affinity level (upper Hubble band) of the array, because the drain Fermi level is still below the upper Hubble band. Therefore, as long as the condition of equation (3) is satisfied, the system will remain an insulator. Using a discontinuous model to replace the continuous model of the layer will not qualitatively change the aforementioned results. By applying a negative voltage between the covering gate and the substrate, once the ionization level (lower Hubble band) shifts above the Fermi level of the lead, the array will tend to switch to a metallic state. Under a given gate voltage, the actual density of available charged carriers in the array is also determined by the Coulomb interactions within the array. Suppose now that the negative gate voltage _ VG, VG > 〇 is applied to the device, and the scale is -16- m scale ((Please read the precautions on the back before filling out this page)) DESCRIPTION OF THE INVENTION The (l4) system continues to be in equilibrium. Once the layer ionization energy level e (VG_ε [) of the zero carrier density of the source-drain Fermi level becomes positive, the electron tendency of the array The injection lead is charged and the layer is positively charged. This charging trend is resisted by the accumulation of electrostatic energy within the layer. The total electrical energy of each molecule can be written as: E〇 = (eVG _ f |) (1 + 62e2 / Cm〇 |, (4) where d is the positive charge per molecule (0 < (J < 1) ,.) is defined by the following equation:

Cm〇i = ^Vtot(|r0 ~ rj). (5) 在(5)中,vtct是位於ri之一分子對於位於r。之分子所造成的 總(直接+感生)電位。 位於r〇之分子所引起之感生電位本身未包含於(5);此.電 位,得ε !再正規化(該電位使得ε〖自其之氣相値降低), 但是未包含於(4)之第二項。假設此再正規化效應是定義於 ε 1之値。 如果孩二區域之電介質常數是相等,等於圖丨Α所展示之 單—閘極情形之ε ,則(5)可窝成Cm〇i = ^ Vtot (| r0 ~ rj). (5) In (5), vtct is a molecule located at ri for located at r. The total (direct + induced) potential caused by the molecules. The induced potential caused by the molecule located at r0 itself is not included in (5); this. Potential is obtained by ε! Renormalization (this potential makes ε 〖decreased from its gas phase 値), but it is not included in (4 ) Of the second item. Suppose this renormalization effect is defined as 値 1. If the dielectric constants in the second region are equal to ε in the single-gate situation shown in Figure 丨 A, then (5) can be formed

C 經濟部中央標準局員工消費合作社印製 m〇f 其中八:J 、刀層是定義成爲位於yz平面,jLRmQl是該層之分子 之半徑。 則了、刀子與分子之間隔a m。|遠低於分子與表面之距離, 可達到Cmuli連續極限c。。"。接著,可獲得下列之標準 1Vi 1 , , ⑹ -17- 五、發明説明(is 結果: α ,咖r 4_ox + Rm〇丨), 其中η是每一單位面積之分子濃度 ⑺ 方程式(6)也可用於另一極限,在高電介質函數氧化物之 情形中,其中ε QX>> ε。dQX + Rm(3l這個量現在降低至分子 半徑Rm。,本身,且方程式(6)變成 、-1 — 1 yf 1___1_ f i9t〇l ΙΓ〇 - ril ΙΓ〇 ~ ri + 2iRmo|l ⑻ 利用下列數値來取代方程式(6)之dQX可獲得方程式(6)及方 程式(8)間之一近似内插公式: d^£d〇x/£ox, ⑼ 經濟部中央標準局員Η消f合作钍印製 且該近似内插公式只有在極限11„1。1>>(1(^之情形下方爲非 常準確,且該公式使得可針對圖1 A之dQX之任何値來近似 估計C m。1。 圖5展示Cmol之値分別與d = dox + Rmol或d = Rmol&am(5l之 比値的函數關係,當分子陣列是一緊密堆積之單層時,在 方程式(8)之情形中,比値d/am。〖可低於1/2,以展示cm(3l 可遠高於方程式(7 )之連續極限。 對於圖1 B所展示之雙重閘極组態而言,用於每一分子之 總靜電能之方程式(4)仍然適用,除了每一分子之電容現在 必須如下受到修改以外: -18- 本紙乐尺度適用中國國家標準(CNS )八4規格(210X 297H ) ---------姑衣------ΪΤ-----.—i (請先閱請背面之注_愈事項#填寫本頁) 五 (10) I之値 '發明説明(16 °-ΗΣΣι 1—丨 ,>opUr〇~ri+i4pdf 也所有整數以相加纽數目之鏡像電荷。C L掩繪於圖5 ^ % W L n 相斜於夕來使方程式⑷最小化可產生: 、,博_, ⑴) ::爲連接閉極電恩V'與每一分子之部份载浏表示式 ,VT = e 1 ε 1定義在分子層具有一非零濃度之帶電 所需心最低閘極電壓。如果d =〇 15是視爲適當處於 N (至屬)狀悲所需之典型部份載子(以銅酸鹽資料爲基礎 ),則,藉由使用方程式(11)以及圖5,與方程式(6)_(1〇) ,針對各種參數集合之所需’ON1閘極電壓可獲確定。25電 子伏特(e V )數量級之ε i値(在絕對溫度3 〇 〇度之下是大約 .1 〇1ίΒΤ)党到預留。針對單一及雙重閘極组態之該等結果展 示於表I及表II。 表I (距離是以埃爲單位) d Rmol 9 mol ε 艺ΟΧ δ V萨(V) VG(V) 濟 部 中 k 20 5 10 4 20 0.15 0.428 0.678 標 準 為 20 5 10 4 100 0.15 0.228 0.478 員 X 20 5 15 4 10 0.15 0.271 0.521 消 費 20 10 20 4 10 0.15 0.214 0.464 合 社 20 10 20 4 100 0.15 0.103 0.353 印 製 20 10 30 4 10 0.15 0.080 0.330 -19- 本紙張尺度適用中國國家標準(CNS ) Λ4说格(2Ι0Χ21;7公筇) . - - I- - -- - I - II >^ϋ til -- — 士X、 : I |> - - 1— . . - tn ----. —r I · HI i - 、τΛ^, (請先閱讀背面之注意事項再填寫本頁) 五、發明説明(17 表11 (距離是以埃爲單位) d ε δ ν_ Vg(V) 20 10 4 0.15 0.488 0.738 20 15 4 0.15 0.187 0.437 20 20 4 0.15 0.085 0.335C Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs m0f Among them: J, the knife layer is defined to be located on the yz plane, and jLRmQl is the radius of the molecules of this layer. Then, the distance between the knife and the molecule is a m. | Much lower than the distance between the molecule and the surface, the Cmuli continuous limit c can be reached. . ". Then, the following standards 1Vi 1,, ⑹ -17- V. Description of the invention (is result: α, r 4_ox + Rm〇 丨), where η is the molecular concentration per unit area ⑺ Equation (6) also It can be used at another limit, in the case of high-dielectric-function oxides, where ε QX > > ε. dQX + Rm (3l is now reduced to the molecular radius Rm., itself, and equation (6) becomes, -1 — 1 yf 1___1_ f i9t〇l ΙΓ〇- ril ΙΓ〇 ~ ri + 2iRmo | l ⑻ Use the following numbers値 Instead of dQX of equation (6), one can obtain an approximate interpolation formula between equation (6) and equation (8): d ^ £ d〇x / £ ox, Η Member of the Central Standards Bureau of the Ministry of Economic Affairs And the approximate interpolation formula is only very accurate in the case of limit 11 „1. 1 > (1 (^), and this formula makes it possible to approximate C m for any 値 of dQX in Figure 1 A. 1 Figure 5 shows the function of 値 of Cmol as a function of d = dox + Rmol or d = Rmol & am (5l ratio 値). When the molecular array is a tightly packed single layer, in the case of equation (8), Ratio 値 d / am. 〖Can be lower than 1/2 to show that cm (3l can be much higher than the continuous limit of equation (7). For the double gate configuration shown in Figure 1B, it is used for each The equation (4) of the total electrostatic energy of the molecule still applies, except that the capacitance of each molecule must now be modified as follows: -18- The paper scale is applicable National Standards (CNS) 8 4 specifications (210X 297H) --------- Gu Yi -------- ΪΤ -----.- i (Please read the note on the back first_ more matters #Fill this page) Five (10) I of the 値 'invention description (16 ° -ΗΣΣι 1— 丨,> opUr〇 ~ ri + i4pdf Also all integers are mirrored by the number of additions. CL is plotted in Figure 5 ^% WL n phase obliquely to minimize the equation ⑷ can produce: ,, __, ⑴) :: is the partial load expression connecting the closed-electrode V 'and each molecule, VT = e 1 ε 1 defines the minimum gate voltage required to charge with a non-zero concentration in the molecular layer. If d = 015, it is considered a typical partial carrier (in copper acid) required to be properly in the N (subordinate) state. Based on the salt data), by using Equation (11) and Figure 5, and Equations (6) _ (10), the required 'ON1 gate voltage for various parameter sets can be determined. 25 electron volts ( e V) of the order of ε i 値 (approximately .10 ΙΒΤ) at the absolute temperature of 3,000 degrees to the reserve. These results for single and double gate configurations are shown in Tables I and II. Table I (distance is in Angstroms ) D Rmol 9 mol ε Art 〇 δ V Sa (V) VG (V) The Ministry of Economic Affairs k 20 5 10 4 20 0.15 0.428 0.678 The standard is 20 5 10 4 100 0.15 0.228 0.478 members X 20 5 15 4 10 0.15 0.271 0.521 Consumption 20 10 20 4 10 0.15 0.214 0.464 Cooperative 20 10 20 4 100 0.15 0.103 0.353 Printed 20 10 30 4 10 0.15 0.080 0.330 -19- This paper size applies the Chinese National Standard (CNS) Λ4 grid (2Ι0 × 21; 7 public筇).--I----I-II > ^ ϋ til--taxi X,: I | >--1-..-Tn ----. —R I · HI i- , ΤΛ ^, (Please read the notes on the back before filling this page) 5. Description of the invention (17 Table 11 (distance is in Angstroms) d ε δ ν_ Vg (V) 20 10 4 0.15 0.488 0.738 20 15 4 0.15 0.187 0.437 20 20 4 0.15 0.085 0.335

該等結果可摘要説明成爲顯示運作可使用介於〇 . 4及〇 s 伏特間之閘極電壓·。假設U是1 - 2 e V之數量級,此種範圍 是合理的,因爲如果閘極受到一源極·汲極電壓之驅動,則 方程式(3 )受到滿足,而此顯示藉由適當之設計,所建議之 裝置可如前所述運作。 爲了稍後之工程分析’而該分析依賴陣列之連續處理, 引進下列定義以便於使用(n =陣列之每一單位面積之分子濃 度), C7T = nC 'moi, (12) 經濟部中夾標隼局貝工消费合作社印製 Q’h = ne& (13) 同時’値得注意的是可供使用之最大數目之電洞受限於 J s 1 °換句話説,對於閘極電壓vG s vT+ne/c,T而言, 陣列之電洞密度將維持不變於η。爲更外顯地表示此項事實 ,V&疋走義成爲vT + ne/ c’T,且方程式(11)重新改寫成爲:These results can be summarized to show that a gate voltage between 0.4 and 0 s can be used for display operation. Assuming U is on the order of 1-2 e V, this range is reasonable because if the gate is driven by a source-drain voltage, then equation (3) is satisfied, and this display is by appropriate design, The proposed device can operate as previously described. For later engineering analysis 'and this analysis relies on continuous processing of the array, the following definitions are introduced for ease of use (n = molecular concentration per unit area of the array), C7T = nC' moi, (12) standard in the Ministry of Economic Affairs Q'h = ne & (13) At the same time it should be noted that the maximum number of holes available is limited to J s 1 ° In other words, for the gate voltage vG s For vT + ne / c, T, the hole density of the array will remain unchanged at η. In order to express this fact more explicitly, V & 疋 escapes to vT + ne / c’T, and equation (11) is rewritten as:

VG ~~ VT -20- ㈣尺度適用中關家蘇 ---------裝------訂--Γ-->.--^線 - - (請先閱讀背面之注意事項再填艿本頁) (14) 經濟部中央標隼局負工消费合作社印製 A' ΙΓ 五、發明説明(is ) — ~ 應注意的是臨限電壓Vt是在假設電洞均勾分佈於裝置之 广通道〈下受到推導。如果裝置具有—間隔層,且該間 h層在通這中自源極至没極具有可變之寬度。則前述之臨 限値電®是不正確的1施加—有限之m源極偏壓時, 電洞分佈也會變化。在此後面情形中,由於存在一流經導 $通道之電流而使情況進—步複雜化。同時,當寫下靜電 此表7F式,方%式(4),時,在二側之陣列-引線接點之邊 緣效應受到忽略,但是下文將對此詳細加以討論。 除了忽略邊緣效應以外,分子間跳躍常數t之效應在前述 方私式中也受到忽略。吾人預期就分子層而言t不太可能遠 大於大約lOOOmeV ,動能效應(大約等於t)就表推導之 月匕量量度而s是小的,且因此在莫特轉移F Ε τ之一階處理 中受到忽略是可接受的。 藉由施加適當之閘極電壓,陣列之相關電子系統可自 ’ Ο F F ’狀態切換至’ 〇 Ν ’狀態,且反之亦然。現在考慮,在 一汲極-源極電壓存在之下,金屬狀態之電流-電壓特性曲 線。 _ 就線性區而言,首先考慮裝置處於一低汲極-源極電壓 Vds之情形。在此種情形之下,閘極-陣列偏壓且因此電荷( 電洞)分佈沿整個導通通道自源極1 4至汲極1 6是幾乎均句 的。方程式(1 4)大約描述此系統之移動電荷密度。 一穩定電流’由V D s所駆動,沿著y抽(亦即沿著源極_没 極方向)流動。因此,歐姆定律可寫成: *DS = "Y" )C t(VG ~ Vt)VDS· (15) -21 - 尺度適用,17¾國家標準(CNS) Λ4^格(zioxm公犮) ' ~~--- nn —It ml I ί I -I 1-- -- - _ -- -n-ί I ...... 一aJt -- - I (請先閱讀背面之注意事項再填寫本頁) Η 五、發明説明(丨9 ) 經濟部中央標隼局員工消f合作社印製 其中"h = e r /mh是電洞遷移率,且假設是恆定不變的。因 ,,在一給定之閘極電壓之下,通道電導GL = aiDs/5VDs 疋$數。方程式(15)對於vG之相依性完全是由於陣列之 可用移動電洞之變化。現在電洞密度具有一上限(每一位置 具有一電洞),如前面導致方程式(14)之討論所提及,且在 該點陣列之能帶是空的,且其變爲—傳統(相對於莫特)之 絕緣體。最大之通道電導因此發生於^及㈣之間。 在非線性區,如果没極_源極電壓之値受到増加,直到相 較:閘極電壓%没極_源極電壓爲不可忽略爲止,則前述 之刀析不再適用。-有限之没極·源極電壓可用以改變沿導 通通道之電位分佈。因&,閘極及通道間之電壓,斑實際 之電荷密度將是自源極前進至没極之位gy的函數/尤其, 當没極相對於源極受到負向偏壓時,自限充電電位受到增 加而實際上降低可用之電洞密度。 爲獲得在任意VDS之下電流.電壓特性曲線之量化圖像, 在+導體裝置物理上廣泛受到使用之⑽胃漸次通道近似法 焚到採用。此種近似法假設電流方向之電場遠小於(且缓慢 =)垂直㈣列之電場。在此種近似法中,沿通道之遞增 %壓降與(穩態)通道電流之函數關係可表示成爲. lDS<5y = /ihWQ’h(y)3Vy. (16) 其中Q、(y)是在通道之位之電洞密度,且該電洞密度自 源極至没極會變動,且再一次假設 平'"h疋—常數,而 此可自銅1鹽資料推導而得。如果及極受到負向偏壓且 -22· 本紙張尺度適用 ( CNS ) Λ4^71Ϊ〇7^7α7Γ (請先閲讀背面之注意事項吞填寫本頁) .裝- 、-& l·级 ΙΓ 五、 發明説明(2〇 VDS = -V,而乂>0,則在漸次通道近似法 一 洞部份可藉由方程式(")來近似表示,其中:用m 取代VT,以做爲在通道位置丫之俨晉仿、& Τ〆 在(〇,V)之間變動。接著在通道。、限電I,且、 電荷載子密度可如下求得:、置y…單位長度的總Q h(y) = c’t(Vg ~ ντ — vy). (17) 結合万程式(17)及方程式(ls)則可利用均勻電流i 數來計算在通道之任何位置y之電位乂厂 D S之—函VG ~~ VT -20- ㈣ scale is suitable for Zhongguanjiasu ------------ install -------- order--Γ-> .-- ^ line--(Please read the back first (Notes for refilling this page) (14) Printed by A 'IΓ, Consumer Work Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 5. Description of the Invention (is) — It should be noted that the threshold voltage Vt The hooks are distributed over the wide channel of the device and are deduced. If the device has a -spacer layer, and the inter-h layer has a variable width from source to non-pole in the pass. Then the aforementioned threshold voltage is incorrectly applied. When a finite m source bias is applied, the hole distribution will also change. In this latter case, the situation is further complicated by the existence of a current in the first channel $ channel. At the same time, when the electrostatic type 7F and the formula (4) in this table are written, the edge effect of the array-lead contacts on both sides is ignored, but this will be discussed in detail below. In addition to ignoring edge effects, the effect of the intermolecular jump constant t is also ignored in the aforementioned formula. We expect that t is unlikely to be much larger than about 100OmeV in terms of molecular layer, and the kinetic energy effect (approximately equal to t) is measured in terms of the moon deduction of the table and s is small, and therefore it is a first-order treatment in the Mote transfer F E τ It is acceptable to be ignored. By applying an appropriate gate voltage, the relevant electronic system of the array can be switched from the state of '0 F F' to the state of '0 N' and vice versa. Now consider the current-voltage characteristic curve of a metal state in the presence of a drain-source voltage. _ As far as the linear region is concerned, first consider the situation where the device is at a low drain-source voltage Vds. In this case, the gate-array bias and therefore the charge (hole) distribution is almost uniform from the source 14 to the drain 16 along the entire conduction channel. Equation (1 4) roughly describes the moving charge density of this system. A stable current ′ is pulsated by V D s and flows along y (that is, along the source_dead direction). Therefore, Ohm's law can be written as: * DS = " Y ") C t (VG ~ Vt) VDS · (15) -21-Applicable scale, 17¾ National Standard (CNS) Λ4 ^ lattice (zioxm public 犮) '~~ --- nn —It ml I ί I -I 1----_--n-ί I ...... a aJt--I (Please read the notes on the back before filling this page ) 发明 V. Description of the invention (丨 9) Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs where “h = er / mh is the hole mobility and is assumed to be constant. Therefore, under a given gate voltage, the channel conductance GL = aiDs / 5VDs 数 $. The dependence of equation (15) on vG is entirely due to changes in the available mobile holes of the array. Now the hole density has an upper limit (one hole at each position), as mentioned in the discussion leading to equation (14) above, and the energy band of the array at this point is empty, and it becomes -traditional (relative) Yumot) insulators. The largest channel conductance therefore occurs between ^ and ㈣. In the non-linear region, if the non-polar source voltage is increased until the comparison: the gate voltage% non-polar source voltage is not negligible, the foregoing analysis is no longer applicable. -Finally infinite pole · source voltage can be used to change the potential distribution along the conduction channel. Because of &, the voltage between the gate and the channel, the spot's actual charge density will be a function of the gy from the source to the potential. The charging potential is increased while actually reducing the available hole density. In order to obtain a quantified image of the current-voltage characteristic curve under any VDS, the + conductor device is widely used in the physical method of the gradual channel approximation method. This approximation assumes that the electric field in the direction of the current is much smaller (and slowly =) the electric field in the vertical queue. In this approximation, the functional relationship between the incremental% voltage drop along the channel and the (steady-state) channel current can be expressed as lDS < 5y = / ihWQ'h (y) 3Vy. (16) where Q, (y) It is the hole density at the position of the channel, and the hole density will change from the source to the non-pole, and once again assume the flat "" h 疋 -constant, and this can be derived from the copper 1 salt data. If the and pole are negatively biased and -22 · This paper size is applicable (CNS) Λ4 ^ 71Ϊ〇7 ^ 7α7Γ (Please read the precautions on the back and fill in this page first). Install-、-& l · 级 ΙΓ V. Description of the invention (20VDS = -V, and 乂 > 0, the hole portion of the asymptotic channel approximation method can be approximated by the equation ("), where: VT is replaced by m as At the position of the channel, the imitation of 俨, and & T〆 varies between (0, V). Then in the channel., The current limit I, and the charge carrier density can be obtained as follows: The total Q h (y) = c't (Vg ~ ντ — vy). (17) Combined with the equation (17) and equation (ls), the uniform current i can be used to calculate the potential of y at any position in the channel. Letter from Factory DS

Vy - (vg - ντ) - / (VG - νγ)2 (18) 在中等及強大偏壓之下,沿源極-没極通道之v及Q, 之變化分別展示於圖6(A)BW。此外,也可藉由延= 分路徑至自源極至没極之整個通道來表示電流成爲旅加電 壓之函數如下: I c,t(vg ~ ντ - —- V)V. (19) 經濟部中央標準局員工消阶合作社印製 電流103現在是没極-源極電壓VDS( = _V)之非線性函數。電 没極受到負向偏壓時’隨著VDS値之增加,電流之增加會較= 慢’且最終在-V D S = V s a t = V G - V T電流會達到最太値,且 'satVy-(vg-ντ)-/ (VG-νγ) 2 (18) Variations of v and Q along the source-inverted channel under moderate and strong bias are shown in Figure 6 (A) BW . In addition, the current as a function of the travel voltage can also be expressed by extending = the branch path to the entire channel from the source to the pole as follows: I c, t (vg ~ ντ-—- V) V. (19) Economy The printed current 103 printed by the staff of the Ministry of Central Standards Bureau Cooperative Destruction Cooperative is now a non-linear function of the electrodeless-source voltage VDS (= _V). When the electric pole is negatively biased, as the VDS increases, the increase in current will be slower, and eventually at -V D S = V s a t = V G-V T the current will reach the maximum value, and 'sat

T (吾)〇Ά-ντ)2 (20) 如同傳統MOSFET之情形,且應可自方程式〇7)輕易屬^ ,當没極受到-Vsat之偏壓時,没極電壓正好抵消負開核^ .23 - 本紙張尺度適刑中國國家標準(CNS ) A4«L格(2丨OX297公兑) ---------批衣------ΐτ--r--.——'0 (請先閱讀背面之注意事項再填寫本頁) 五、 發明説明(21 經濟部中央標準局—工消费合作社印1i 壓對於接近没極端之相關電子的效應,結果沒有移動電荷( 電洞)變爲可供使用(Q,h(L) = 〇)。 當汲極受到進一步偏壓以致|VDy>Vsai時,則在接近汲 極之處可觀察到所謂之夾止區,其中沒有載子可供使用, 如圖6B所示。通道之電流是藉由沿夾止區注入帶電載子來 加以維持,而夾止區遭受強大之電場。電流之大小维持在 或稍鬲於Isat ,而非如方程式(19)所示之減少,由於在矽 M〇SFET領域爲眾所知之負回授現象,且如果夹止區變得 太寬,則電流會降低且夾止區本身會消失。圖7顯示在各種 閘極電壓之電流-電展特性曲線。在圖7中,β = 〇】〇 5 (自 底部至頂部之曲線)曲線之電流Ids與電壓Vds分別相對於 io^Tn^VQ及VQ = e/Cm。,來調整大小。增強模態裝置之問 極電壓是負的,且當自底曲線移動至頂部曲線時間極電^ 之値會遞增;而耗盡模態裝置之閘極電壓是正的,且當=底 部曲線移動至頂部曲線時閘極電壓之値會遞減。 一 如自方程式(2 )應可看出,飽和區之電洞電户, -匕 1 s a 丈, 間極電壓之平方成正比。當閘極電壓變得更 ^ '、(或V G增加) 時,汲極飽和電壓vsat與通道之可用帶電載 、’ Λ 丁「思考 V G線性 增加。GT = aisat/3VG所定義之跨導因此是間極 函教1 . gt = "〇t(vg —ντ)T (我) 〇Ά-ντ) 2 (20) As in the case of a traditional MOSFET, and should be easily from equation 07) ^, when the non-pole is biased by -Vsat, the non-pole voltage just offsets the negative open core ^ .23-This paper is punishable by the Chinese National Standard (CNS) A4 «L Grid (2 丨 OX297) --------- Approval ------------ τ--r--. —— '0 (Please read the notes on the back before filling out this page) 5. Explanation of the invention (21 Central Bureau of Standards of the Ministry of Economic Affairs-Industrial and Consumer Cooperative Press 1i) The effect of the pressure on the close-to-extreme related electrons, as a result there is no moving charge ( The hole) becomes available (Q, h (L) = 〇). When the drain is further biased so that | VDy> Vsai, the so-called pinch region can be observed near the drain, where There are no carriers available, as shown in Figure 6B. The current in the channel is maintained by injecting charged carriers along the pinch region, and the pinch region is subjected to a strong electric field. The magnitude of the current is maintained at or slightly below Isat Instead of the decrease as shown in equation (19), due to the negative feedback phenomenon that is well known in the field of silicon MOSFETs, and if the pinch region becomes too wide, then The current will decrease and the pinch region itself will disappear. Figure 7 shows the current-spreading characteristic curves at various gate voltages. In Figure 7, β = 〇] 〇5 (curve from bottom to top) curve current Ids And the voltage Vds are adjusted relative to io ^ Tn ^ VQ and VQ = e / Cm., Respectively, to adjust the size. The voltage of the questionnaire of the enhanced modal device is negative, and when the time from the bottom curve to the top curve moves to the time of the electrode ^^ Will increase; and the gate voltage of the depletion mode device is positive, and the gate voltage will decrease when the bottom curve moves to the top curve. As can be seen from equation (2), the voltage in the saturation region Hole electric households,-11sa ,, the square of the inter-electrode voltage is proportional. When the gate voltage becomes more ^ ', (or VG increases), the drain saturation voltage vsat and the available live load of the channel,' Λ ding "Thinking that VG increases linearly. The transconductance defined by GT = aisat / 3VG is therefore a pole-correspondence 1. gt = " 〇t (vg —ντ)

v(f)l ~2~ ), -24. 拉衣 訂 I H. '線 {請先閱讀背面之注'意事項4-填巧本頁} 電壓之線性 (21) (22) 本紙很尺度適用中國國家標隼(CNS )八4規格( (23) Λ ' Η — 五、發明説明(22 ) 其中I表示帶電載子之平均自由行程,nh = kf2/47r是該層之 電洞濃度,而k f是對應之波向量。對於具有一些分子間p 距離之數量級之I的系統而言,跨導G τ是許多量子之電導之 數量級。因爲一量子之電導e 2 /h對應於約2 6千歐姆之電阻 ’因此典型之飽和跨導對應於數千歐姆。 當處於線性區且汲極偏壓很小時,請再一次注意跨導無 法隨著V G增加而無限制增加,因爲,當載子密度j達到每 一分子一電洞時,此系統變爲傳統之帶絕緣體。因此G τ在 某一雜質化中間値〇 < j 〇 <:1將達到最大値。假設平均自由 行程是數分子間隔距離之數量級,則最大電導是下列數量 級: „ GTmax2^"!〜10) h (24) 經濟部中央梂準扃貝工消费合作社印裝 亦即數千歐姆。 最後,當施加一正偏壓至汲極(Vds>〇)時,預期不會 現夾止區,且在正汲極_源極偏壓之下電流-電壓曲線將 有飽和區。但是,電動密度可能在通道之没極端趨近於 限,當閘極及汲極電壓之結合效應變得太強時,當超過此 -上限時’電流迅速減少,且此系統最後將變成 絕緣體。 ^ V 在著重於P型增強模態之裝置特性曲線之後,n型译 態裝置之分析可利用相同方式來進行。但是,在後^ 中相車又A p型裝置,能量圖受到反轉,如可自圖4 B 換句居説上哈伯帶現在涉及金屬-絕緣體切換,且 出 沒 上 此 強模 情形 看 % 出 子 ---------I------ΪΤ--r--,-- - - (請先閱讀背面之注意事項再填寫本頁) -25 - 本紙张尺度適用中_家標隼(CNS ) Λ4現格 (210X297.:,,- ^; 經濟部中央標隼局員工消費合作社印製 本紙張尺度適用中丨ϋ國家標準(c、NiS)六4現格(21〇x2y7公兑) Λ*" ίΓ ~ ^111 ~"™· · -· - —— 五、發明説明(23 ) ' ,而非電洞,變爲帶電載子。同樣地,此裝置在零閘極電 壓之下是處於1 〇 F F '狀態,且當施加夠大之正閉極電壓時, 此裝置轉換至ΌΝ’狀態。 如果在低VDS之下可以導通,且vG偏壓通道成爲金屬區 ,則通過邊緣之隧道貫穿可限制整個裝置之導電性,而邊 緣可爲不導通。此效應之連續分析可如下進行。 在圖8中’當首先施加一典型閘極電壓,且通道仍然是絕 緣(<5 == 0 )時’通道之電位分佈受到描缯。在二端之電位變 化可近似描述如下: ,V(<5y) - VGV(2/n)<5y/d (25) 其中cJ1 y是自源極(或汲極)量起之距離,且d是分子層及閘 極間之間隔,即使當通道變成導通時,只要Θ y非常接近電 極’則方程式(2 5 )仍然正確。因此預期一小絕緣區會出現 於接近源極及極之分子層之邊緣。 圖9展示用以決定邊緣之絕緣區之寬度的相圖。在—给定 閘極電壓’ -VG,之下達成平衡,則分子層之導通部分會承 受一電位’ -VT。此相圖是描繪於ye/d-VG/VT參數空間, 其中ye是絕緣邊緣區之寬度。自圖9應可看出,首先,對於 中等及強大閘‘電壓而言,絕緣區傾向於只局限於—或二 分子直徑以内。另一方面,在低於臨限値V τ之閘極電壓v g 之下’該整層會變成絕緣,且當閘極電壓VG自VT以上趨近 於VT時’絕緣區迅速成長,而此明白顯示閘極電壓應較臨 限電壓大至足以避免絕緣邊緣區之負面效應。例如,在 -26- 一~---- ---------奸衣------1T-------m (請先閲讀背面之注意事項+填寫本頁) A ίΓ 五、發明説明(24 VG = 2VT之下,如果間隔層是2〇埃寬,則邊緣區是大約ι〇 埃。 因爲邊緣區通常是一或二分子直徑之數量級,而帶電載 子(電洞)之阻障是ε s〇.25eV,所以隧道貫穿可輕易發生 ’且預期邊緣區對於裝置之功能只有非常有限之影響。 假設帶電載子在邊緣區面對一具有數量級爲S sVG/yet 有效電場之三角形阻障時,其中ye是利用圖9之相圖所決定 之最大阻障寬度,則穿越阻障之隧道貫穿電導可輕易算出 且書寫如下:_e2 / 8kfW \ V^(eyG _h v 3π y" + £(v (f) l ~ 2 ~), -24. Pull-out staple I H. 'Line {Please read the note on the back first' Note 4-Fill this page} Linearity of voltage (21) (22) This paper is very standard Applicable to China National Standard 隼 (CNS) VIII (4) (23) Λ 'Η — V. Description of the invention (22) where I represents the average free travel of charged carriers, nh = kf2 / 47r is the hole concentration of this layer, And kf is the corresponding wave vector. For a system with I of some order of magnitude of the p-distance between molecules, the transconductance G τ is the order of conductance of many quantums, because the conductance e 2 / h of a quantum corresponds to about 2 6 Thousand ohms resistance 'therefore typical saturation transconductance corresponds to thousands of ohms. When in the linear region and the drain bias is small, please note once again that the transconductance cannot increase without limit as VG increases, because when the carrier When the density j reaches one hole per molecule, the system becomes a traditional band insulator. Therefore, G τ will reach the maximum value in the middle of a certain impurity. & ≪ j 〇 <: 1 will assume the average free path is a number The magnitude of the molecular separation distance, the maximum conductance is the following magnitude: „GTmax2 ^ "! ~ 10) h (2 4) Printed by the Central Ministry of Economic Affairs of the Zhuhai Mining Consumer Cooperative, that is, thousands of ohms. Finally, when a positive bias voltage is applied to the drain (Vds > 〇), it is not expected that the pinch zone will appear, and the The current-voltage curve will have a saturation region under the pole-source bias. However, the electromotive density may approach the limit at the extreme of the channel. When the combined effect of the gate and drain voltage becomes too strong, At this-upper limit, the current decreases rapidly, and the system will eventually become an insulator. ^ V After analyzing the device characteristic curve focusing on the P-type enhanced mode, the analysis of the n-type translation device can be performed in the same way. However, in After the ^ mid-phase car has an Ap device, the energy diagram is reversed. For example, from Figure 4B, the upper Hubble zone now involves metal-insulator switching, and the presence of this strong mode is seen in%. -------- I ------ ΪΤ--r-,---(Please read the notes on the back before filling out this page) -25-This paper is applicable in the standard _ house standard隼 (CNS) Λ4 is present (210X297.:,,- ^; printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs, printed on paper ϋNational standard (c, NiS) 6 4 grid (21〇x2y7 common conversion) Λ * " ίΓ ~ ^ 111 ~ " ™ · ·-·-—— V. Description of the invention (23) 'instead of electricity The hole becomes a charged carrier. Similarly, the device is in the 10 FF 'state under zero gate voltage, and when a sufficiently large positive closed-pole voltage is applied, the device switches to the ΌN' state. It can conduct under low VDS, and the vG bias channel becomes a metal region. The tunnel penetration through the edge can limit the conductivity of the entire device, and the edge can be non-conductive. A continuous analysis of this effect can be performed as follows. In FIG. 8 ', when a typical gate voltage is first applied and the channel is still insulated (< 5 == 0), the potential distribution of the channel is traced. The potential change at the two terminals can be approximated as follows:, V (< 5y)-VGV (2 / n) < 5y / d (25) where cJ1 y is the distance from the source (or drain), And d is the interval between the molecular layer and the gate. Even when the channel becomes conductive, as long as Θ y is very close to the electrode, the equation (2 5) is still correct. Therefore, a small insulating region is expected to appear at the edge of the molecular layer near the source and the electrode. FIG. 9 shows a phase diagram for determining the width of the insulating region at the edges. A balance is reached at a given gate voltage ′ -VG, and the conducting portion of the molecular layer will bear a potential ′ -VT. This phase diagram is depicted in the ye / d-VG / VT parameter space, where ye is the width of the insulating edge region. It should be seen from Figure 9 that, first of all, for medium and strong gate 'voltages, the insulation region tends to be limited to—or within two molecular diameters. On the other hand, below the threshold voltage vg of the threshold 値 V τ 'the entire layer will become insulated, and when the gate voltage VG approaches VT from above VT', the insulation region grows rapidly, and it is clear It should be shown that the gate voltage is greater than the threshold voltage enough to avoid the negative effects of the insulation edge region. For example, at -26- a ~ ---- --------- rape clothes ------ 1T ------- m (Please read the precautions on the back first + fill out this page ) A Ⅴ. Description of the invention (24 VG = 2VT, if the spacer layer is 20 Angstroms wide, the edge region is about ι0 Angstroms. Because the edge region is usually on the order of one or two molecular diameters, and the charged carriers The barrier of (holes) is ε s 0.25 eV, so tunnel penetration can easily occur 'and the marginal area is expected to have only a very limited impact on the function of the device. Assume that charged carriers face an order of magnitude S sVG in the marginal area. / yet For a triangular barrier with an effective electric field, where ye is the maximum barrier width determined using the phase diagram of Figure 9, the tunnel conductance through the barrier can be easily calculated and written as follows: _e2 / 8kfW \ V ^ (eyG _h v 3π y " + £ (

G .exp, Ύ 2meVG , ( ^ \ΊΓ 3/2' (26) {請先閱讀背面之注意事項再填寫本頁 .裝- 爲估計該電導之大小之數量級,假設下列値:ε f= 〇 _ 5 e V及 裝置寬度W = 1 〇 〇奈米。即使是對於不利之參數選擇· ε| -0.5eV,VG=l.〇V,(可自圖8中發現如果d = 40埃則ye 大約等於1 7埃),隧道貫穿電導可估計成爲大約等於3 e2 /h 。另一方面,藉由選定ει=〇25εν及VG = 〇.6V,則可發 現在d = 3 0埃之下阻障寬度ye大約等於丨丨埃,且電導達到大 約 25e2/h。 若要更準確地分析隧道貫穿電導,則邊緣區之實際電位 變化,如方程式(2 5 )所示,以及鏡像力之阻障降效應皆必 須列入考慮’而鏡像力之阻障降低效應可藉由V i m - e 2 / 2 π ε β y來描述。預期阻障高度將降低3(eVG)2/3(2e2/ ε d)l/3/27r,而此數量相較於£ 1之阻障高度而言是相當大的 。因此,對於一或二分子距離之阻障寬度而言,而阻障寬 -27- 本紙^^?^1^準(CNS)鐵格(210x2y7,M') -5 線 經濟部中央標率局員工消費合作社印製 五、發明説明(25 ) 度可利用圖8之相圖來加決定,鏡像力可進一步增加隧道貫 穿電流’且因而降低可能之邊緣效應。因此,可以做出下 列結論:邊緣效應對於本原創性裝置之正確運作只有極少影 響。 除了前述之單層跨導開關之增強模態版本以外,此装置 也存在一種耗盡模態版本,其中,但是,閘極電位位於源 極及没極電位之範園以外,而使該版本不適用於C Μ 0 S應 用。但是,因爲耗盡模態版本相容於各種D r A Μ記憶體細 胞設計,預期耗盡模態裝置將非常有用。 Ρ型耗盡模態裝置是藉由下列方式來實現:使得分子能階 S 1爲負,以致該等分子即使在無閘極電壓之下仍傾向於離 子化。零V G載子濃度是藉由方程式(1 1 )如下來加以控制, 其中Vc = 0: C| = — 5/Cmo, 對表ί-〇.15之’〇N’電洞濃度而言,所需之£ 1之值可自表 I之第7行取得。 藉由使得閘極電壓爲正,該裝置可切換成爲,〇 F F ,。所需 之黾壓幅相同於表I之最後一行之電壓擺幅。 經濟部中央標準局員工消资合作社印裝 因此’除了 St之不同調整與閘極電|之偏移(可藉由方 程式(1 1 )利用載子濃度來加以決定)以外,該装置是依照圖 7之特性曲線來運作。 耗盡模態裝置之優點是在通道邊緣不存在隧道貫穿阻抗 。因爲在無閘極電場之下通道是,ON,,所以位於邊緣之分 子永遠處於,〇N,狀態,且該等分子受到金屬電極之屏蔽。 -28- 本紙 用中 ) ------- 在記憶體 五、發明説明(26 因此,無論通道之其餘部份處於,〇 皆導通,且在,卿狀態之下只會稍爲二,邊緣分子 應用中,此種優點可能極爲關鍵。 在單-問極裝置之製造中,構思金屬電極與 存在的話)是制-加熱程序來構成。接 」1 =來—層。此氧化程序受限於二== 爲如果在沉積分予層以上之_層期間另_氧化㈣程序出 現,則分子層假設會受到,加熱,。 雙重問極裝置可藉由-全部有機程序❹有機絕緣體, 例如聚亞胺,來加以製造。上種程序可用以建立多層結構 。如果閘極長度爲1 〇 〇奈米(丨0 〇乘以i 〇 〇分子數量級之陣 列)且具有32層,則101】位元數量級之儲存容量是可行的 ,而此容量對於傳統之技術資源會造成挑戰。 構成裝置之導通通道之分子可爲單層之型態,或者在增 強模態裝置之情形中,可爲巨觀結晶或非結晶之三維分子 陣列之型悲,其中只有取接近閘極之該等分子層構成通道。 絕緣體之表面需要受到處理以接收分子,而絕緣體之表 面可爲氧化物。該表面必須處於一種狀態,其中該表面是 平坦,且具有一低步階密度。該表面可受到清理,或者尤 其是在裝置之單層通道型態之情形中,可利用一活性化學 基來加以處理’而該活性化學基是選擇成爲相容於要受到 裝配之分子,且該活性化學基説明於A· Ulman所著之',An Introduction to Ultrathin Organic Films, from Langmiur-Blodgett to Self-Assembly", Academic Press, Boston (1991) » -29- 本紙張尺度適用中國國家標準(CNS ) Λ4悅格() ---------批衣------IT--„---r—— . . (請先閱讀背面之注意事項再填寫本頁) 趣濟部中央標準局員工消費合作社印裝 經濟部中央標準局負工消费合作社印繁 五、發明説明(27 ) 一 一… 與J. A. T讀等人所著之論文]Am Chem ^,117,仙, 1995,而在此提及該等書藉及論文以供參考。 裝配分子之程序可利用溶液,或藉由蒸發,或利用分子 束,或藉由其他程序來實施。 單看之自我«可藉由運用一融入於分子之化學基來使 分子附著於表面,或附著於預先附著於表面之一化學基來 實施。 該等分子可藉由Langmiur_m〇dgett程序,或藉由暴露該表 面於一可溶解該等分子之溶液,或藉由其他方法來附著。 一層緊密堆集,可能有序之分子因而變成以—高度且方向 性之方式來附著於表面。該等分子,除了黏著他們至表面 之該化學基以外,必須包含氧化還原核心,而氧化還原核 心在MTFET裝置之功能上擔任重要角色。 本案因此已説明一具有單層通道之三終端裝置,且該三 終端裝置是藉由莫特轉移來運作,而稱爲莫特轉移場效電 晶體。該裝置使用一陣列之分子來做爲導通通道,其中帶 電載予(電洞或電子)強烈相關。莫特轉移決定金屬_絕緣體 之切換,且已獲證實可利用一外部閘極來加以控制。否^ ,该裝置顯得似乎具有相當於傳統;5夕型F £ τ之電氣特性。 ΌΝ'狀態具有大約10e2/h之典型跨導。 選定分子層之可能候選分子之一關鍵準則是(現場)庫命 斥力U。MTFET在一邏輯環境之正確運作要求,對於半徑 範圍在0.5-1奈米之分子而言,該裝置環境之庫侖斥力卩分 別至少等於1 . 5 - 0.7 5 e V。 -30. 本紙悵尺度適用中國國衣標华(CNS ) Λ4現格(21〇κ297公兑) ---------I------ΪΤ——^---r——_.il -_ ΐ (請先閱讀背面之注意事項再填寫本頁) A ΙΓ 五、發明説明(28 ) 综而言之,莫特轉移場效電晶體具有下列特性及優點, 莫特轉移裝置之特徵是運用高載子密度以容許大約四晶格 間隔之相當短平均自由行程。不同於矽技術,該裝置無需 高純度,有序之材料,因而可簡化製造程序,該裝置可運 作於一載子平均自由行程之數量級之絕對最小尺寸,假設 存在多於一載子可供使用。因此,_4*4陣列之數量級之 最小尺寸(例如4奈米乘以4奈米,視格子間隔而定)應是可 行的。載子之數目,在一 4 * 4陣列中,是屬於在任何時間 皆有2載子之數量級,而此再一次接近於該裝置可運作之下 限。此最小尺寸可提供丨〇 〇倍之堆疊密度,相較於傳統之 最小尺寸FET。’ON1電阻是尺寸相依型,且是屬於數量子 電導之數量級’例如數千歐姆,而此據估計適合邏輯及記 憶體應用。工作電壓大約是〇 · 5伏特,且此電|不僅在室溫 時I下仍然大於雜訊,而且大幅降低欧姆發熱至低於目前 技術之歐姆發熱。該裝置可製造成爲類似η及p型之版本, 因而致能C Μ 0 S技術之建構。 此裝置之耗盡模態版本,雖然不適用於C μ 〇 S應用,但 是仍然適合DRAM環境。此裝置之優點是在,0Νι狀態無邊 緣效應;邊緣效應出現於· 〇 F F |狀態,而在· 〇 ρ F 1狀態中邊 經濟部中央標準局員工消资合作社印製 緣效應是無害的。如果存在嚴重之邊緣問題,則選擇耗盡 模態組態是一可行方案。 此裝置能夠藉由連續進行下列步驟來建造成爲一堆疊陣 列’如圖1 0所示’其中首先單層是藉由,例如,標準之自 我裝配技術利用溶液來施加,且隨後沉積絕緣體及電極於 -3卜 本紙邊用中ϋ標隼(^~一 A 7 _____— B7 一—— - - — - _ __ 五、發明説明(29 ) 單層之上。該裝置陣列是位於y_Z平面且該堆疊陣列是位於 X方向(如前所定義)。此種程序特別適合該裝置之雙重閘極 ’全郅有機之型態。利用堆疊陣列D R A Μ技術所能達到之 位元密度預期屬於1 0 1 1至1 0 12之範圍,視設計量度之侵略 性而定。堆疊陣列邏輯裝置也是可行的,此裝置之運作無 需跨越分子之最高佔用分子軌道與最低未受佔用分子軌道 (HOMO-LUMO)能隙之激勵(不同於有機LED),因而可 增加裝置之壽命。在圖1〇中,層22是平坦化絕緣體,且層 24是接地之遮蔽平面,而層24可防止該堆疊之諸裝置間之 干擾’堆疊陣列之單一閘極變型是藉由去除閘極2 〇及鄰接 之第二氧化物層18'來形成。 圖1 1展示一圖2所示之種類(亦即多層,單一閘桎)之原型 增強模,¾、莫特場效電晶體1 〇 〇,且該電晶體具有源極丨1 4, 汲極1 1 6 ’閘椏1 2 0,閘極絕緣體1 1 8,與通道1 1 〇。如前 所述,銅酸鹽構成一種展現莫特金屬-絕緣體轉移之材料。 此使得銅酸鹽適合做爲圖1 A,1 B,及2之該(等)分子層。 除此之外,銅酸鹽適合與高電介質氧化物整合,而該等高 電介質氧化物包含鈦酸翅(SrTi03)與Bai-xSrxTi03,且 该等咼電介質氧化物適合做爲圖丨A,丨B及2之閘極絕緣體 18。圖11所示之原型裝置1〇〇相對於其上之製造序列是上 下顚倒的,而下文將説明該製造序列。 裝置1 0 0長成於以极做爲雜質之鈦酸鳃基質(Nb_SrTi〇3) 120。以飯爲雜質使得基質120成爲導通。基質120是裝置 1 0 0之閘極。一大約1 8 0 0埃厚之電介質間隔層i丨8以外延 本紙&尺度家標牟U'NS ) Λ4规格(G .exp, Ύ 2meVG, (^ \ ΊΓ 3/2 '(26) {Please read the notes on the back before filling this page. Equipment-To estimate the magnitude of the conductance, assume the following 値: ε f = 〇 _ 5 e V and device width W = 〇〇〇nm. Even for unfavorable parameter selection ε | -0.5eV, VG = 1.〇V, (can be found from Figure 8 if d = 40 Angstroms ye (Approximately 17 Angstroms), the tunnel through-conductance can be estimated to be approximately equal to 3 e2 / h. On the other hand, by selecting ε = 〇25εν and VG = 0.6V, it can be found that the resistance is below d = 30 Angstroms. The barrier width ye is approximately equal to 丨 丨 and the conductance reaches about 25e2 / h. To more accurately analyze the tunnel through-conductance, the actual potential change in the fringe zone is shown in equation (25), and the barrier of the mirror force The drop effect must be taken into account, and the barrier reduction effect of the mirror force can be described by Vim-e 2/2 π ε β y. It is expected that the barrier height will be reduced by 3 (eVG) 2/3 (2e2 / ε d) l / 3 / 27r, and this amount is quite large compared to the barrier height of £ 1. Therefore, for the barrier width of one or two molecular distances, the barrier Width-27- Paper ^^? ^ 1 ^ Standard (CNS) Tiege (210x2y7, M ') -5 Printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of Invention (25) The phase diagram is used to determine that the mirror force can further increase the tunnel through current and thus reduce the possible edge effects. Therefore, the following conclusions can be made: the edge effects have little effect on the correct operation of the original device. In addition to the single layer described above In addition to the enhanced modal version of the transconductance switch, there is also a depletion modal version of this device. However, the gate potential is outside the range of the source and non-polar potentials, making this version not suitable for C Μ 0 S applications. However, since the depletion modal version is compatible with various D r AM memory cell designs, it is expected that the depletion modal device will be very useful. The P-type depletion modal device is achieved by: The molecular energy level S 1 is negative, so that these molecules tend to ionize even without a gate voltage. The zero VG carrier concentration is controlled by equation (1 1) as follows, where Vc = 0: C | = — 5 / Cmo, on the table ί-〇. For the '0N' hole concentration of 15, the required value of £ 1 can be obtained from line 7 of Table I. By making the gate voltage positive, the device can be switched to 0F, required The voltage amplitude is the same as the voltage swing in the last line of Table I. It is printed by the Consumers 'Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs, so' except for the different adjustments of St and the offset of the gate voltage | ) Is determined using the carrier concentration), and the device operates in accordance with the characteristic curve of FIG. 7. The advantage of a depletion mode device is that there is no tunnel through resistance at the edge of the channel. Because the channel is ON under the gateless electric field, the molecules on the edge are always in the ON state, and these molecules are shielded by the metal electrode. -28- In the paper) ------- In the memory V. Invention description (26 Therefore, 0 is on regardless of the rest of the channel, and it will only be slightly 2 under the state of Qing, In edge molecule applications, this advantage may be extremely critical. In the manufacture of single-interrogation devices, the idea of metal electrodes and the existence of them is made by a manufacturing-heating process. Connect "1 = come-layer. This oxidation procedure is limited to two == if the other erbium oxide procedure occurs during the deposition of layers above the sub-layer, the molecular layer is assumed to be heated. The dual interrogation device can be manufactured by an all-in-one process, organic insulator, such as polyimide. The above procedure can be used to build a multilayer structure. If the gate length is 100 nanometers (an array of the order of 1000 times the number of molecules of 1000) and has 32 layers, a storage capacity of the order of 101] bits is feasible, and this capacity is for traditional technical resources It creates challenges. The molecules constituting the conduction channel of the device may be of a single-layer type, or in the case of an enhanced modal device, it may be a macroscopic crystalline or amorphous three-dimensional molecular array, of which only those that are close to the gate The molecular layer constitutes a channel. The surface of the insulator needs to be treated to receive molecules, while the surface of the insulator can be an oxide. The surface must be in a state where the surface is flat and has a low step density. The surface can be cleaned, or especially in the case of a single-layer channel configuration of the device, it can be treated with an active chemical group ', and the active chemical group is selected to be compatible with the molecule to be assembled, and the The description of the active chemical group is given in A. Ulman's An Introduction to Ultrathin Organic Films, from Langmiur-Blodgett to Self-Assembly ", Academic Press, Boston (1991) »-29- ) Λ4 Yuege () --------- Approve clothes ------ IT-„--- r——.. (Please read the precautions on the back before filling this page) Printed by the Consumer Standards Cooperative of the Ministry of Standards of the People's Republic of China Printed by the Central Standards Bureau of the Ministry of Economic Affairs of the Ministry of Economic Affairs of the Consumers' Cooperatives of India Fan Fifth, Description of Inventions (27) -11 ... Papers by JA T Read et al.] Am Chem ^, 117, Xian, 1995 These books and papers are mentioned here for reference. The process of assembling molecules can be carried out using solutions, or by evaporation, or by using molecular beams, or by other procedures. The self-suffice «can be reached by Attach molecules using a chemical base incorporated into the molecule The surface, or a chemical group attached to the surface in advance, can be implemented. The molecules can be attached by the Langmiurmdget procedure, or by exposing the surface to a solution that can dissolve the molecules, or by other methods. A layer of tightly packed layers, which may cause ordered molecules to attach to the surface in a highly directional manner. These molecules, in addition to the chemical base that adheres them to the surface, must contain a redox core, and the redox core It plays an important role in the function of the MTFET device. Therefore, this case has explained a three-terminal device with a single-layer channel, and the three-terminal device is operated by Mote transfer, which is called Mote transfer field effect transistor. The device uses an array of molecules as a conduction channel, in which charged carriers (holes or electrons) are strongly related. Mote transfer determines the switching of metal-insulators and has been proven to be controlled by an external gate. No ^ The device appears to have the electrical characteristics equivalent to a conventional; 5 yoke type F £ τ. The ΌN 'state has a typical transconductance of about 10e2 / h One of the key criteria for the selection of possible candidate molecules for the molecular layer is the (live) library repulsion force U. MTFETs require the correct operation of a logical environment. For molecules with a radius in the range of 0.5-1 nanometers, the Coulomb repulsion force of the device environment卩 is at least equal to 1.5-0.7 5 e V. -30. The size of this paper is applicable to China National Standard Clothing (CNS) Λ4 (21〇κ297) --------- I-- ---- ΪΤ —— ^ --- r——_.il -_ ΐ (Please read the notes on the back before filling out this page) A ΙΓ V. Description of the invention (28) In short, Mote transfer The field-effect transistor has the following characteristics and advantages. The Mott transfer device is characterized by the use of a high carrier density to allow a relatively short average free path of approximately four lattice intervals. Unlike silicon technology, the device does not require high-purity, ordered materials, which can simplify the manufacturing process. The device can operate at the absolute minimum size of the order of one carrier's average free stroke, assuming that more than one carrier is available . Therefore, a minimum size of the order of _4 * 4 array (for example, 4nm by 4nm, depending on the grid interval) should be feasible. The number of carriers, in a 4 * 4 array, belongs to the order of 2 carriers at any time, and this is once again close to the lower limit of the device's operability. This minimum size can provide a stacking density that is 1000 times higher than that of a conventional minimum size FET. 'ON1 resistors are size dependent and belong to the order of quanta conductance', such as thousands of ohms, and this is estimated to be suitable for logic and memory applications. The working voltage is about 0.5 volts, and this electricity | is not only larger than the noise at room temperature, but also greatly reduces the ohmic heating to lower than the current technology. The device can be manufactured into versions similar to η and p, thus enabling the construction of C M 0 S technology. The depleted modal version of this device, although not suitable for C μS applications, is still suitable for DRAM environments. The advantage of this device is that, in the ON state, there is no edge effect; the edge effect appears in the · 〇 F F | state, and in the · 〇 ρ F 1 state, the edge effect printed by the staff consumer cooperative of the Central Standards Bureau of the Ministry of Economic Affairs is harmless. If there are serious edge problems, then select exhaustion Modal configuration is a feasible solution. This device can be built into a stacked array by successively performing the following steps 'as shown in Figure 10', where first a single layer is applied by, for example, standard self-assembly technology using a solution, and then depositing insulators and electrodes on -3 Use the Chinese standard mark on the side of the paper (^ ~ 一 A 7 _____— B7 One——--—-_ __ V. Description of the invention (29) on a single layer. The device array is on the y_Z plane and the stack The array is located in the X direction (as previously defined). This procedure is particularly suitable for the device's dual-gate 'fully organic' type. The bit density that can be achieved using the stacked array DRA M technology is expected to be 1 0 1 1 The range from 10 to 12 depends on the aggressiveness of the design measurement. Stacked array logic devices are also feasible, and the operation of this device does not need to cross the highest occupied molecular orbital and the lowest unoccupied molecular orbital (HOMO-LUMO) energy gap of the molecule. (Different from organic LEDs), which can increase the life of the device. In Figure 10, layer 22 is a planarized insulator, and layer 24 is a grounded shielding plane, and layer 24 prevents the stacked devices from interfering with each other. The single gate variant of the interference 'stacked array is formed by removing the gate 20 and the adjacent second oxide layer 18'. Fig. 1 1 shows a type shown in Fig. 2 (ie, multi-layer, single gate) Prototype enhancement mode, ¾, Mote field effect transistor 1 00, and the transistor has a source 丨 14, drain 1 1 6 'gate 桠 1 2 0, gate insulator 1 1 8 and channel 1 1 0. As mentioned earlier, the copper salt constitutes a material exhibiting Mott metal-insulator transfer. This makes the copper salt suitable as the (or equal) molecular layer of Figs. 1 A, 1 B, and 2. In addition, copper salts are suitable for integration with high-dielectric oxides, and these high-dielectric oxides include titanate fins (SrTi03) and Bai-xSrxTi03, and these 咼 dielectric oxides are suitable for use in Figures 丨 A, 丨 B, and 2 gate insulator 18. The prototype device 100 shown in FIG. 11 is upside-down with respect to the manufacturing sequence thereon, and the manufacturing sequence will be described below. The device 100 is grown with a pole as an impurity. Titanate gill substrate (Nb_SrTi〇3) 120. The rice 120 is used as an impurity to make the substrate 120 conductive. The substrate 120 is a device 1 0 Gate of 0. A dielectric layer with a thickness of about 1 8 0 Å, epitaxial epitaxial paper & standard house Mou U'NS) Λ4 specification (

In I. n^i -- ϊ 1 I. : I— · I— - » I 1 I- I I ! m I. ..... ---、 I - - - I ----* - n^i (请先閲讀背面ilii-意事項本ίίο 發明説明(3〇 Λ 7 Β7 :Α 部 中 il 而 消 f /- if 卬 方式長成於基質120,藉由在眞空沉積室進行鈦酸鳃之雷 射熔散單θ日沉積之標準自我裝配程序。吾人發現若要使得 =極,,.彖間隔層丨〗8獲得良好之電介質特性,例如高崩 β %壓,低洩漏電流,與高電介質常數,必須在有氧之下 進仃’几積。對於原型裝置1〇〇而言,氧壓力是大約3〇〇毫托 在不自雷射熔散眞空沉積室移除該裝置之下,一大約 2@〇〇埃厚之莫特轉移層通道u〇可藉由雷射熔散單晶沉積之 ‘準一自我裝配程序,在高於該裝置之部份氧壓力(在此是大 、.勺4笔托)之下,以外延方式長成於閘極絕緣體層丄1 8,而 通道110包含銅酸鹽Y〇 5Pr〇 5Ba2Cu3〇7 i。此使得莫特 T#和層通道1 1 0之化學計量可受到控制以產生所要之特性 # c括層表面%阻。源極i丨4及汲極i〗6接著利用接觸遮罩 精由電子束蒸發來沉積於銅酸鹽莫特轉移層ιι〇之上。源 極114及汲極116是鉑,且厚度爲2〇〇〇埃,而面積爲讪微 f乘以5〇微米。原型裝置100具有5微米之通道長度及5〇 微米(通運寬纟。源極及;及極之面積相車交於銅⑫鹽層之厚 度的比値很大使得可電氣導通至最受閘極電場影;之銅酸 f莫特轉移層,而該銅酸鹽莫特轉移層是位料酸鹽/鈥酸 物介面之層。 原型莫特轉移FET之效能測試是在源極114接地之下進 行。汲極電流是決定成爲汲極電壓之函數,在各種問極電 廢(下。⑤型莫特轉移FET之效能展示於圖12。在圖12中 ,汲極電流與汲極電壓之關係受到描繪。圖1 2之每一曲線 表示-不同之閘極電壓。圖12之效能資料清楚展示該裝置 33- 本紙张尺政適/Π十阄阎家標苹(cisjS )八4规格(2丨0κ2()7公 (誚先閱讀背面之注意事項再"艿本頁) 、y3 —線 Λ" Β7 五、發明説明(3丨) 自正閘接電壓之〇 F F狀態(高電阻)切換至負閘極電壓之〇 N 狀態(低電阻)。 雖然該原型裝置之物理參數據信並非最佳,但是該原型 裝置清楚展示莫特轉移裝置是可行的,且能夠達成優越之 切換效能。 由於展現於該原型裝置之外延長成,現在可建造圖1 〇所 不之種類之三維堆疊陣列之裝置。在此種架構之下,源極 ’设極及閘極可藉由,例如,熟悉本i術領域者所知之技 街以進行絕緣間隔層之選擇性離子植入來構成。此種陣列 未出現於傳統之矽技術,因爲外延長成高品質之矽通道於 氧化物料之上非常困難。 本案也展示LaaCuC»4及Y〇 6PrG.4Ba2Cu3〇7_,是做爲莫特轉移 通道110之適當材料。因此,極廣範圍之鋼酸鹽可做爲通 道100之材料,其中包含具有下列通用公式之铜酸鹽:Υβ PrxBa2Cu3〇7,,,La2-xSrxCu04 及 La2.xBaxCu〇4(其中 0 S χ s 1)。 以上所有因素促成所述之FET技術之多層(亦即低成本) ,低功率,及小尺寸製造。該等需求係未來技術所指定, 且現有之矽技術之延伸最終將無法滿足該等需求。 -34· 本吼張尺玟砘]丨丨屮网因,♦:牡次_; eNS) Λ4规格(210/ 297公尨〉 ---------"------ίτ--.---_---Γ 線 -- ("先閱讀背面.";ί意事項存螭荇本寅)In I. n ^ i-ϊ 1 I.: I— · I—-»I 1 I- II! M I. ..... ---, I---I ---- *-n ^ i (please read the iili-Issue of the back of the book first) (3〇Λ 7 Β7: Α in the part il and eliminate f /-if 卬 way to grow into the matrix 120, by gallium titanate gill in the empty deposition chamber The standard self-assembly procedure of laser fusible single θ-day deposition. We have found that if you want to make the = pole ,,. 彖 spacer 丨〗 8 to obtain good dielectric characteristics, such as high avalanche β% pressure, low leakage current, and high The dielectric constant must be accumulated in the presence of oxygen. For the prototype device 100, the oxygen pressure is about 300 mTorr without removing the device from the laser melting deposition chamber, A Mot transfer layer channel u of about 2 @ 〇〇angstrom thickness can be deposited by laser fusible single crystal self-assembly procedure at a pressure higher than part of the oxygen pressure (here, .4 pen holders), epitaxially grown in the gate insulator layer 丄 18, and the channel 110 contains copper salt Y0Pr〇5Ba2Cu3〇i. This makes Mote T # and layer channel 1 1 0 stoichiometric Is controlled to produce the desired characteristics. The surface resistance of the layer is c. The source i 4 and the drain i 6 are then deposited on the cuprate mote transfer layer by electron beam evaporation using a contact mask. The source 114 and the drain 116 are platinum and have a thickness of 2000 angstroms and an area of 讪 f multiplied by 50 μm. The prototype device 100 has a channel length of 5 μm and a transport width of 50 μm. The thickness of the source electrode and the thickness of the electrode layer in the copper layer is very large, so that it can be electrically conducted to the most affected by the gate electric field; the copper acid f moth transfer layer, and the copper salt molybdenum The special transfer layer is the layer of the acid salt / acid interface. The performance test of the prototype Mote transfer FET is performed under the source 114 ground. The drain current is determined to be a function of the drain voltage at various questions. Electrical waste (bottom.) The performance of a ⑤-type Mott transfer FET is shown in Figure 12. In Figure 12, the relationship between the drain current and the drain voltage is depicted. Each curve in Figure 12 represents a different gate voltage. The performance data of Figure 12 clearly shows the device. 33- This paper ruler Zheng Shi / ΠShi Yan Yan Jiabiao Ping (cisjS) 8 4 Specifications (2 丨 0κ2 () 7mm (诮 Read the precautions on the back before quoting this page), y3 —line Λ " Β7 V. Description of the invention (3 丨) 0FF state of the positive gate voltage (high (Resistance) to 0N state of the negative gate voltage (low resistance). Although the physical parameters of the prototype device are not optimal, the prototype device clearly shows that the Mote transfer device is feasible and can achieve superior switching Performance. As it is extended beyond the prototype device, it is now possible to build a three-dimensional stacked array device of a type not shown in Figure 10. Under such a structure, the source electrode and the gate electrode can be formed by, for example, being familiar with a technique known in the art to perform selective ion implantation of the insulating spacer layer. This type of array does not appear in traditional silicon technology, because it is very difficult to extend into high-quality silicon channels on the oxide material. This case also shows that LaaCuC »4 and Yo6PrG.4Ba2Cu307_ are suitable materials for the Mott transfer channel 110. Therefore, a very wide range of steel salts can be used as the material of channel 100, including copper salts with the following general formula: ββ PrxBa2Cu3〇7, La2-xSrxCu04 and La2.xBaxCu〇4 (where 0 S χ s 1). All of the above factors contribute to the multilayer (ie, low cost), low power, and small size manufacturing of the FET technology described. These needs are specified by future technologies, and the extension of existing silicon technologies will eventually fail to meet these needs. -34 · This roar Zhang Jian 玟 砘] 丨 丨 屮, ♦: 次 次 _; eNS) Λ4 specifications (210/297 public 尨〉 --------- " ------ ίτ --.---_--- Γ line-- (" Read the back first. " ί Italian matter is stored in this book)

Claims (1)

經濟.邓中央標準局員工消費合作社印装 —..土-.… '~~~~ ”種%效電晶體,且該種場效電晶體包含—源極,—没 極及一閘椏,且在該源極及汲極之間具有—導通通道, 而該導通通道包含—2 -維陣列之至少一層之分子,且該 道藉由一絕緣間隔層來與該間極分離,其中該等分子 負匕夠經歷一莫特金屬_絕緣體轉移。 2·如申請專利範圍第1項之電晶體,其中該等分子是包含 —不安定電子之氧化還原核心。 .如申請專利範圍第2項之電晶體,其中該等分子是d + Y _ 之型毖,其中D +是一有機施體,而γ-是一鹵離子。 4.如申请專利範圍第2項之電晶體,其中該等分子是〇 +厂 &lt;型虑,其中D +是一有機施體,而Α-是一有機受體。 5·如申请專利範圍第3項之電晶體,其中該d +是丁丁 F,而 該是溴(Β〇。 6. 如申請專利範圍第4項之電晶體,其中該D +是B E D Τ -TTF,而該Α -是TCNQ。 7. 如申請專利範圍第丨項之電晶體,其中該等分子是包含 一不安定電洞之氧化還原核心。 8·如申請專利範圍第7項之電晶體,其中該等分子是χ + Α-之型怨’其中Χ +是一鹼金屬,而Α -是一有機受體。 9. 如申請專利範園第7項之電晶體,其中該等分子是〇 + Α· 之型態,其中D +是一有機施體,而Α-是一有機受體。 10. 如申請專利範園第8項之電晶體,其中該Χ +是一鹼金屬 ’而該Α'是鈷六十(Co6Q)。 11. 如申請專利範圍第8項之電晶體,其中該χ+是一鹼金屬 -35- 本纸張尺度逋用_國國家標準(CNS ) A4現格(210X297公A ) ---------裝------訂丨----„—t線 * (請先閣讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印裝 IV -'Λ ________ [);、 六、申請專利範園 — ,而該A·是TCNQ。 12. 如申请專利範圍第9項之電晶體,其中該D +是T M p D, 而該Α·是TCNQ。 13. 如申请專利範園第1項之電晶體,其中該絕緣間隔層是 一氧化物。 14. 一種%政電晶體,且該種場效電晶體包含一源極,一汲 極,第一閘極及第二閘椏,且在該源極及汲極之間具有 一導通通道,而該導通通道包含一2_維陣列之至少一層 1分子,且孩通道藉由第一絕緣間隔層來與該第一閘極 分離’並藉由第二絕緣間隔層來與該第二閘極分離,其 中该等分子能夠經歷—莫特金屬_絕緣體轉移。 15. 如申請專利範圍第14項之電晶體,其中該等分子是包含 一不安定電子之氧化還原核心。 16. 如申請專利範圍第15項之電晶體,其中該等分子是 D Y I型態,其中D +是—有機施體,而丫.是—_離子。 π·如申請專利範園第14項之電晶體,其中該等分予3 D A之型,¾,其中;[)+是—有機施體,而A -是—有a 體。 文 18. 如申*青專利範圍第1 5項之電晶體,其中該d +是τ τ f, 而該Y —是溴(B r ;)。 ’ 19. 如申請專利範園第17項之電晶體,其中該D+是丁 TTF,而該 A—是 TCNQ。 _ 20. 如申请專利範圍第1 4項之電晶體,其中該等分予是 一不安定電洞之氧化還原核心。 。 本纸張尺度適用中國國家標準(CNS ) ---------裝------訂i ---L--丨線 1 - (請先閱讀背面之注意事項再填寫本頁) -36 - I Yrr^ 經濟部中央標準局員工消費合作社印裝 六、申請專利範圍 21. 如申請專利範圍第2 0項之電晶體,其中該等分子是 XTA_之型態,其中X+是一鹼金屬,而A —是一有機受體。 22. 如申請專利範圍第2 0項之電晶體,其中該等分子是 D + A—之型態,其中D +是一有機施體,而A·是一有機受 體。 23. 如申請專利範圍第2 1項之電晶體,其中該X+是一鹼金 屬,而該A -是始六十(Co6〇)。 24. 如申請專利範園第2 1項之電晶體,其中該X+是一鹼金 屬,而該A—是TCNQ。 25. 如申請專利範圍第2 2項之電晶體,其中該D +是Τ Μ P D ,而該A.是TCNQ。 26. 如申請專利範圍第14項之電晶體,其中該等分子是多發 色團。 27. 如申請專利範圍第2 6項之電晶體,其中該等分子是雙發 色團。 28. 如申請專利範圍第1 4項之電晶體,其中該第一絕緣層是 一氧化物’且該第二絕緣層是一氧化物。 29. 如申請專利範園第2 8項之電晶體,其中該等第一及第二 絕緣層之該等氧化物是相同的。 30. 如申請專利範圍第2 9項之電晶體,其中該等第一及第二 絕緣層之該等氧化物是不同的。 31. —陣列之堆疊電晶體,且該等電晶體是如申請專利範 圍第1 4項之電晶體。 32. 如申請專利範圍第31項之陣列,且該陣列是一邏輯裝置。 -37- 本紙浪尺度適用中國國家標準(CNS〉A4規格(210X297公釐) ---------裝------訂丨·——.——Γ線 (請先閱讀背面之注意事項再填寫本頁) 六、申請專利範圍 33. 如申請專利範園第3 1項之陣列,且該陣列是一記憶體裝 置。 34. —陣列之堆疊電晶體,且該等電晶體是如申請專利範圍 第1項之電晶體。 35. 如申請專利範圍第3 4項之陣列,且該陣列是一邏輯裝置。 36. 如申請專利範圍第3 4項之陣列,且該陣列是一記憶體裝 置。 37. 如申請專利範圍第2項之電晶體,其中該材料是一銅酸 鹽。 38. 如申請專利範圍第1 5項之電晶體,其中該材料是一銅酸 鹽。 39. 如申請專利範圍第3 7項之電晶體’其中該銅酸鹽是Y : PrxBasCusO?-·3·,其中 。 40. 如申請專利範圍第3 8項之電晶體,其中該銅酸鹽是Y 1 PrxBa2Cu3〇7-&lt;y,其中 Ο^χ各 1。 41. 如申請專利範圍第3 7項之電晶體,其中該銅酸鹽是L a 2 SrxCu〇4,其中 〇$χ$1 0 42. 如申請專利範圍第3 8項之電晶體,其中該銅酸鹽是L a 2 -χ SrxCu〇4,其中 OSxSl。 經濟部中央標隼局員工消費合作社印裝 (請先閱讀背面之注意事項再填寫本頁) 43. 如申請專利範圍第3 7項之電晶體,其中該銅酸鹽是L a 2 _χ BaxCu04,其中 〇Sx各 1。 44. 如申請專利範圍第3 8項之電晶體^其中該銅酸鹽是L a 2 _χ BaxCu04,其中 OSxSl。 45. 如申請專利範園第3 9項之電晶體,其中該銅酸鹽是 -38- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作社印裝 B.: C;v 六、申請專利範圍 Y〇.5Pr〇 5Ba2Cu3〇7 — j 0 46. 如申請專利範園第4 〇項之電晶體,其中該銅酸鹽是 Υ〇. 5 Ρ Γ 〇. 5 B a2 Cu3 Ο7 -J 0 47. 如申請專利範圍第4 1項之電晶體,其中該銅酸鹽是 La2Cu〇4 〇 48. 如申請專利範圍第4 2項之電晶體,其中該銅酸鹽是 L a2 C u 04。 49. 如申請專利範圍第i 3項之電晶體,其中該氧化物是 SrTi03 ° 50. 如申請專利範圍第1 3項之電晶體,其中該氧化物是 Bai-xSrxTi〇3 〇 51·如申印專利範圍第2 8項之電晶體,其中該氧化物是 SrTi03 0 52. 如申請專利範圍第28項之電晶體,其中該氧化物是 Bai-xSrxTi〇3 〇 53. —種場效電晶體,且該種場效電晶體包含一基質,—源 極,一汲極及一閘極,且在該源極及汲極之間具有—道 通通道’而該導通通道包含一陣列之至少一層之—材料 ,且該材料能夠經歷莫特金屬-絕緣層轉移,且該通道 是藉由絕緣間隔層來與該閘極分離,且其中該等電極 該絕緣間隔層及該通道是以外延方式來長成。 54. 如申請專利範圍第5 3項之電晶體,其中該至少— 料包含氧化還原核心,且每一該等氧化^原核心包 不安定電子。 ^ • 39- 本紙張尺度適用中國國家標隼(CNS ) A4現格(210X297公釐) ---------裝------訂丨^————l·線 (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 々、申請專利範圍 55. 如申請專利範圍第53項之電晶體,其中該至少—層之材 料是一銅酸鹽。 56. 如申凊專利範圍第5 5項之電晶體’其中該酮酸鹽是γ ^ X PrxBa2Cu3〇7j,其中 〇 含 xSl。 57. 如申请專利範圍第5 5項之電晶體,其中該酿]酸鹽是 La2_xSrxCu04,其中 〇Sx客 1。 58. 如申请專利範圍第5 5項之電晶體,其中該輞酸鹽是 La2-xBaxCu04,其中 〇 各 1。 59_如申請專利範圍第5 6項之電晶體,其中該銅酸鹽是 Y〇.5Pr〇.5Ba2Cu3〇7-tf。 60. 如申請專利範圍第5 7項之電晶體,其中該鋼酸鹽是 L a2 C u 〇 4 0 61. 如申請專利範圍第5 3項之電晶體,其中該氧化物是 SrTi03 。 62. 如申請專利範圍第5 3項之電晶體,其中該氧化物是Baij SrxTi03。 63 · —陣列之堆登電晶體,且該等電晶體是如申請專利範園 第5 3項之電晶體。 64. —種場效電晶體,且該種場效電晶體包含一基質,一源 極,一汲極,第一閘極及第二閘極,且在該源極及汲極 之間具有一導通通道,而該導通通道包含一陣列之至少 一層之一材料,且該材料能夠經歷莫特金屬-絕緣層轉 移,且該通道是藉由第一絕緣間隔層來與該第一閘極分 離,並藉由第二絕緣間隔層來與該第二閘極分離,且其 -40- 本尺度適用_國國家榇準(CNS ) A4規格(210X297公着) '~~-- ---------裝------訂丨-^---„--線 (請先閱讀背面之注意事項再填寫本頁) Λ:', Cis D8 -X 六、申請專利範圍 中該等電極,該絕緣間隔層及該通道是以外延方式來長成 ❹申請專利範固第64项之電晶體,其中 料包:氧化還原核心,且每-該等氧化還原核;:材 不安定電子。 66·如申請專利範圍第Μ項 只&lt; %曰3體,其中孩至少一層夕 料是—銅酸鹽。 增&lt;材 67.如申請專利範圍第6 6項 g 晶體’其中琢酮酸鹽是γ PrxBasCusOhi,其中 1 队如申請專利範圍第㈣之電晶體,其中該鲷酸鹽是 La2.xSrxCu04,其中 〇§χδ1。 69. 如申請專利範園第66项之電晶體,其中該酮酸鹽是 La2-xBaxCu04,其中 〇SxS1。 70. 如申請專利範圍第67项之電晶體,其中該銅酸鹽是 Y〇.5Pr0.5Ba2Cu3 07 j。 71. 如申請專利範圍第6 8項之電晶體,其中該铜酸鹽是 L a2 C u Ο 4。 72. 如申凊專利範圍第6 4項之電晶體,其中該氧化物是 SrTi03 。 73. 如申請專利範圍第6 4項之電晶體,其中該氧化物是Ba SrxT1〇3。 74. —陣列之堆疊電晶體,且該等電晶體是如申請專利範園 第6 4項之電晶體。 -41 - 本紙張尺度適用令國國家標準(CNS ) A4規格(210X297公庚) II 壯衣— I I訂I— I i線 , i (請先閱讀背面之注意事項再填寫本頁} 經濟部中央標準局負工消費合作社印製Economic. Deng Central Standards Bureau employee consumer cooperatives printed — .. soil-... '~~~~ "% efficiency transistors, and this field effect transistor contains-source,-pole and a gate, And there is a conduction channel between the source and the drain, and the conduction channel includes molecules of at least one layer of a 2-dimensional array, and the channel is separated from the intervening electrode by an insulating spacer layer, wherein The molecular negative electrode is enough to undergo a Mott metal-insulator transfer. 2. If the transistor of the scope of the patent application, the molecules are redox cores containing-unstable electrons. Transistor, where these molecules are of type d + Y _, where D + is an organic donor, and γ- is a halide ion. 4. As for the transistor of item 2 of the patent application, where these molecules It is 0+ plant type, in which D + is an organic donor, and A- is an organic acceptor. 5. If the transistor of the patent application No. 3 item, wherein d + is tintin F, and the Is bromine (B〇. 6. For example, the transistor of the scope of patent application No. 4 wherein D + is BED T -TTF, and The A- is TCNQ. 7. If the transistor of the scope of the patent application is applied for, the molecules are redox cores containing an unstable hole. 8. If the transistor of the scope of the patent application is applied for, the Isomolecules are of the type χ + Α-, where X + is an alkali metal and Α- is an organic acceptor. 9. For example, the transistor of the patent application No. 7 in which these molecules are 〇 + Α · Type, where D + is an organic donor and A- is an organic acceptor. 10. For example, the transistor of patent application No. 8 in which the X + is an alkali metal and the A ' It is cobalt sixty (Co6Q). 11. For example, the transistor in the eighth scope of the patent application, where χ + is an alkali metal -35- This paper is used _ National Standard (CNS) A4 (210X297) Public A) --------- Installation ------ Order 丨 ---- „-t-line * (Please read the precautions on the back before filling out this page) Staff of Central Bureau of Standards, Ministry of Economic Affairs Consumption cooperative printing IV-'Λ ________ [) ;, 6. Patent application park — and A · is TCNQ. 12. The transistor as claimed in claim 9 wherein the D + is T M p D and the A · is TCNQ. 13. The transistor of claim 1, wherein the insulating spacer is an oxide. 14. A% government electric crystal, and the field effect transistor includes a source, a drain, a first gate, and a second gate, and there is a conduction channel between the source and the drain, and The conduction channel includes at least one layer of one molecule of a 2-dimensional array, and the child channel is separated from the first gate by a first insulating spacer layer, and is separated from the second gate by a second insulating spacer layer. , Where these molecules are able to undergo-Mott metal-insulator transfer. 15. In the case of the transistor in the scope of application for patent No. 14, the molecules are redox cores containing a unstable electron. 16. For example, the transistor of the scope of application for patent No. 15, wherein the molecules are of the D Y I type, where D + is an organic donor, and y is an ion. π. If the transistor of the patent application No. 14 of the patent application, where the portion is divided into 3 D A type, ¾, where; [) + is-organic donor, and A-is-has a body. Text 18. The transistor of item 15 of the Rushen patent, where d + is τ τ f and Y — is bromine (B r;). 19. For example, if the transistor of the patent application No. 17 is used, the D + is TTF and the A— is TCNQ. _ 20. If the transistor of patent application No. 14 is applied, the share is the redox core of an unstable hole. . This paper size applies to Chinese National Standards (CNS) --------- Installation ------ Order i --- L-- 丨 Line 1-(Please read the precautions on the back before filling in this Page) -36-I Yrr ^ Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs 6. Application for Patent Scope 21. For the transistor with the scope of patent application No. 20, where these molecules are of type XTA_, where X + Is an alkali metal, and A — is an organic acceptor. 22. For example, the transistor in the scope of application for patent No. 20, wherein the molecules are in the form of D + A—, where D + is an organic donor, and A · is an organic acceptor. 23. For example, the transistor of the 21st scope of the patent application, wherein X + is an alkali metal and A- is the first sixty (Co6O). 24. For example, the transistor of item 21 of the patent application park, wherein X + is an alkali metal and A— is TCNQ. 25. The transistor according to item 22 of the patent application scope, wherein the D + is T MP P and the A. is TCNQ. 26. For the transistor in the scope of application No. 14, the molecules are polychromophores. 27. For the transistor in the 26th scope of the patent application, the molecules are dual chromophores. 28. The transistor according to item 14 of the patent application scope, wherein the first insulating layer is an oxide 'and the second insulating layer is an oxide. 29. If the transistor of the patent application No. 28 is applied, the oxides of the first and second insulating layers are the same. 30. If the transistor of the scope of patent application No. 29 is applied, the oxides of the first and second insulating layers are different. 31. —The stacked transistors of the array, and the transistors are transistors as described in the patent application No. 14 range. 32. The array of the 31st scope of the application for a patent, and the array is a logic device. -37- The scale of this paper applies Chinese national standard (CNS> A4 specification (210X297mm) --------- installation ------ order 丨 · ——.—— Γ line (please read first Note on the back, please fill out this page again.) 6. Scope of patent application 33. For example, the array of item 31 of the patent application park, and the array is a memory device. 34. —stacked transistors of the array, and The crystal is a transistor as in the scope of patent application item 1. 35. The array as in the scope of patent application item 34, and the array is a logic device. 36. The array as in the scope of patent application item 34, and the array It is a memory device. 37. For example, the transistor of the second scope of the patent application, wherein the material is a copper salt. 38. For example, the transistor of the 15th scope of the patent application, the material is a copper salt 39. For example, the transistor of the 37th scope of the patent application 'wherein the copper salt is Y: PrxBasCusO?-· 3 ·, where 40. For example, the transistor of the 38th scope of the patent application, where the copper acid The salt is Y 1 PrxBa2Cu3〇7- &lt; y, where 0 ^ χ each 1. 41. For example, the transistor of the 37th scope of the patent application Wherein, the copper salt is La 2 SrxCu〇4, of which 〇 $ χ $ 1 0 42. For the transistor of item 38 in the patent application scope, wherein the copper salt is La 2 -χ SrxCu〇4, where OSxSl. Printed by the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) 43. For the transistor with the scope of patent application No. 37, the copper salt is L a 2 _χ BaxCu04, of which 0Sx each 1. 44. For example, the transistor of the 38th scope of the patent application ^ where the copper salt is La 2_χ BaxCu04, of which OSxS1. 45. For the 39th patent of the patent application park Crystal, where the copper salt is -38- This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs B .: C; v Sixth, the scope of patent application Y 〇.5Pr〇5Ba2Cu3〇7 — j 0 46. For example, the transistor of the patent application No. 4 〇, wherein the copper salt is Υ0.5 P Γ 〇 0.5 B a2 Cu3 〇7 -J 0 47. Such as The transistor of the scope of patent application No. 41, wherein the copper salt is La2Cu〇4 〇48. As the scope of patent application No. 4 The transistor of 2 items, in which the copper salt is La 2 C u 04. 49. The transistor of item 3 in the patent application range, wherein the oxide is SrTi03 ° 50. As in the application of item 13 of the patent range, Transistor, in which the oxide is Bai-xSrxTi〇3 〇51. Such as the transistor in the scope of the patent application No. 28, wherein the oxide is SrTi03 0 52. As in the patent application scope of the 28th transistor, where The oxide is Bai-xSrxTi〇3 〇53.-A field-effect transistor, and the field-effect transistor includes a matrix,-a source, a drain and a gate, and at the source and the drain There is a "passage channel" between them, and the conduction channel contains at least one layer of an array of material, and the material can undergo Mott metal-insulating layer transfer, and the channel is separated from the gate by an insulating spacer layer The insulating spacer layer and the channel of the electrodes are grown by epitaxial method. 54. The transistor according to item 53 of the scope of patent application, wherein the at least one material includes a redox core, and each of the redox cores includes a unstable electron. ^ • 39- This paper size is applicable to China National Standard (CNS) A4 (210X297 mm) --------- Installation ------ Order 丨 ^ ———— l·Line ( Please read the notes on the back before filling out this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs and applying for a patent scope 55. For the transistor with the scope of patent application No. 53 in which the material of at least one layer is a copper Acid salt. 56. The transistor according to claim 55 of the patent scope, wherein the keto acid salt is γ ^ X PrxBa2Cu307j, where 〇 contains xSl. 57. The transistor as claimed in claim 55, wherein the acid salt is La2xSrxCu04, and 0Sx guest 1. 58. For example, the transistor of claim 55, wherein the salt is La2-xBaxCu04, where 0 is 1 each. 59_ The transistor according to item 56 of the patent application range, wherein the copper salt is Y0.5Pr0.5Ba2Cu307-tf. 60. The transistor as claimed in item 57 of the patent application, wherein the steel salt is L a2 C u 〇 4 0 61. The transistor as claimed in item 53 of the patent application, wherein the oxide is SrTi03. 62. The transistor as claimed in claim 53, wherein the oxide is Baij SrxTi03. 63 · — An array of stacked transistors is provided, and the transistors are transistors as described in Item 53 of the patent application park. 64. A field-effect transistor, and the field-effect transistor includes a substrate, a source, a drain, a first gate, and a second gate, and there is a gap between the source and the drain. A conduction channel, and the conduction channel comprises at least one layer of a material of an array, and the material is capable of undergoing Mott metal-insulating layer transfer, and the channel is separated from the first gate by a first insulating spacer layer, It is separated from the second gate by a second insulating spacer layer, and its -40- This standard is applicable _ National Standard (CNS) A4 specifications (210X297) by '~~------ ---- Install ------ Order 丨-^ --- „-line (please read the precautions on the back before filling this page) Λ: ', Cis D8 -X The equal electrode, the insulating spacer layer and the channel are grown in an epitaxial manner to form a transistor in the patent application No. 64, in which the package includes: a redox core, and each of these redox cores; Electronics. 66. If the scope of the patent application for the item M is only <% body 3, of which at least one layer is-copper salt. Zinc &lt; wood 67. If applied The scope of the patent No. 6g crystal 'where the ketonic acid salt is γ PrxBasCusOhi, of which one team is applying for the patent scope No. 电 of the crystal, where the snapperate is La2.xSrxCu04, where 〇§χδ1. 69. No. 66 transistor of the patent range, where the keto salt is La2-xBaxCu04, of which 0SxS1. 70. For example, the transistor of the 67th scope of the application for patent, wherein the copper salt is Y0.5Pr0.5Ba2Cu3 07 j. 71. For example, the transistor of scope 68 of the patent application, wherein the copper salt is L a2 C u 〇 4. 72. For example, the transistor of scope 64 of the patent application, wherein the oxide is SrTi03 73. For example, the transistor in the scope of the application for patent No. 64, wherein the oxide is Ba SrxT103. 74.-The stacked transistors of the array, and these transistors are in the scope of the patent application for No. 64 Transistor. -41-This paper size applies the national standard (CNS) A4 specification (210X297 hectares) II Zhuang Yi — II order I — I i line, i (Please read the notes on the back before filling this page} Printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs
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US6890766B2 (en) 1999-03-17 2005-05-10 International Business Machines Corporation Dual-type thin-film field-effect transistors and applications
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WO2005109542A1 (en) 2004-05-11 2005-11-17 Lg Chem. Ltd. Organic electronic device
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