TW382004B - An on-site device, in a semiconductor device fabrication facility, for providing ultra-high-purity buffered ammonium fluoride or hydrofluoric acid to a semiconductor manufacturing operation - Google Patents

An on-site device, in a semiconductor device fabrication facility, for providing ultra-high-purity buffered ammonium fluoride or hydrofluoric acid to a semiconductor manufacturing operation Download PDF

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TW382004B
TW382004B TW85102564A TW85102564A TW382004B TW 382004 B TW382004 B TW 382004B TW 85102564 A TW85102564 A TW 85102564A TW 85102564 A TW85102564 A TW 85102564A TW 382004 B TW382004 B TW 382004B
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Taiwan
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hydrogen fluoride
ammonia
hydrofluoric acid
ultra
purifier
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TW85102564A
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Chinese (zh)
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Joe G Hoffman
R Scot Clark
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Startec Ventures Inc
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Abstract

A process for preparing ultra-high-purity buffered hydrofluoric acid on-site at a semiconductor manufacturing facility (front end). Anhydrous ammonia is purified by scrubbing in a high-pH liquor, and then combined with high-purity aqueous HF which has been purified by a similar process. The generation is monitored by a density measurement to produce an acid whose pH and buffering are accurately controlled.

Description

經濟部中央標準局員工消費合作社印製 A7 B7 , - 五、發明説明(1 ) 相關專利申請案之對照: 美國臨時性專利申請案08/499 ,562, 1995年7月7日 發明背景及提要: 本發明相關於供應超高純度缓衝氫氟酸及/或氟化銨 (NH4F)給半導體製造作業之条統及方法。 背景:積體電路製造方面之污染 一般而言,污染係積體電路製造方面極為關注之問題 。在現代積體電路製造過程中,大部分之工作步驟傺各種 不同之淨化步驟;該等淨化步驟可能需要清除有機污染物 ,金靥污染物,光致抗蝕劑(或其無機殘留物),刻蝕副産 品,天然氣化物等。 自1 9 95年起,一部新前端處运機(積體電路晶圓製造 設備)通常耗資10億(1,000 ,000,000)餘美元,且該等費用 之大部分係用在徹粒控制、淨化、及污染控制等量度儀器 方面。 污染之一値重要來源傜加工用化學品之雜質。因淨化 工作極為頻繁及重要,所以由淨化化學反應引起之污染非 常令人厭惡。 半導體製造所要求之極高純度層次傺工業加工程序中 稀有或獨持者。在如此高純度層次下,化學品之處理固然 厭煩(當然無法完全避免)。超純化學品對空氣(持別是亦 有工人在場之環境)之暴露必須降至最低。該項暴露具有 引進徹粒並形成污染之風險。因製造廠商或使用者之場所 原本對形成污染具有較高之風險,所以將超純化學品置入 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) ---------〇----^-I訂------ (請£'閲讀背面之注意事項再填寫本頁) A7 —__^_B7 _ , 五、發明説明(2 ) 密閉容器內蓮輸仍屬不夠理想。再者,未經偵檢出之污染 可能損害昂貴之大量晶圓〇 因半導體加工過程中通常使用許多腐蝕性及/或毒性 化學品,品劑供應場所通常與前端處理機工人工作場所發 開不在一起。供應超高純度氣體及液體之配管,其裝配及 保養均係半導體工業界所熟知者,所以絕大多數之氣體或 液體可從同一建築物內任何地方(或甚至同一現場)輸送虿 各晶圓製造站。 氨之純化 經濟部中央標準局員工消費合作社印製 (請先閲讀背面之注意事項再填寫本頁) 本案發明人曾發展出一種在一位於半導體晶圓生產現 場系统中製備超高纯度氨之方法,其中包括:從一液態氨 儲槽吸取氨蒸氣,使氨襄氣通過一微滹過滹器,用高酸鹼 度之纯化水(最好是曾與氨流動體實施過平衡作用之去離 子水)將經過濾之蒸氣加以洗滌。此項發現可將商業级之 氨轉變為高純度之氨,·足K供高精密製造業使用而無需傳 統之塔式蒸餾。從供應儲槽吸取氨蒸氣本身即羼單鈒蒸餾 .所K具有消除非揮發性及高沸點雜質(諸如鹼金靥及鹼 土金靥之氧化物、碳酸鹽及氫化物、過渡金羼之鹵化物及 氩化物、及高沸點烴類及鹵碳化合物)作用。商業级氨中 可能發現之活性揮發性雜質,例如:若干過渡金羼鹵化物 ,第BI族金属氫化物及鹵化物,若干第IV族元素之氫化物 及鹵化物,及鹵素,先前以為需要蒸餾才能除去者,經發 現藉洗滌亦可將其除去而達到適於髙精密作業之程度。此 係一極為驚奇之發現,因洗滌塔技術傳統上係用Μ除去大 -4 - 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) 87 7. ^ μ —、 五、發明説明(3 ) 尺度而非微尺度雜質者。 濕式加工與乾式加工 在半導體加工方面有許多技術上之更易,其中之一乃 濕式加工與乾式加工之變換(及試圖變換)。在乾式加工中 ,僅氣態或電漿相反應物與晶圓接觸。在濕式加工中,將 許多液體品劑應用在不同場合,例如:蝕刻二氧化矽或除 去天然氧化物層,除去有機物質或微量有機污染物,除去 各種金属或微量有機污染物,蝕刻氮化矽,蝕刻矽。 電槳蝕刻具有許多值得注意之能力,但並不適於淨化 作用。而且亦無現成之化學方法可除去若干最不受歡迎之 雜質,例如:黃金。因此濕式淨化法對現代半導體加工顯 得極為童要,並且在可見之未來亦將如此。 實施蝕刻時有光致抗蝕劑存在,而且隨後無需作高溫 處理。取而代之者,抗蝕劑需加以剝除,之後需要實施淨 化。 · 經濟部中央標隼局員工消費合作社印製 (請先聞讀背面之注意事項再填寫本頁) 淨化作用必須清除之物質可能包含:光致抗蝕劑殘留 物(有機聚合物);鈉;鹼土金属(例如:鈣或鎂);及重金 屬(例如:黃金)。該等物質大多不能形成揮發性鹵化物, 所以電漿蝕刻不能將其除去。需要濕式化學反應之淨化法。Printed by A7 B7, Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs,-V. Description of Invention (1) Comparison of related patent applications: US Provisional Patent Application 08 / 499,562, July 7, 1995 Background and Summary of Invention The invention relates to a system and method for supplying ultra-high purity buffered hydrofluoric acid and / or ammonium fluoride (NH4F) to semiconductor manufacturing operations. Background: Pollution in the manufacture of integrated circuits Generally speaking, pollution is a matter of great concern in the manufacture of integrated circuits. In the modern integrated circuit manufacturing process, most of the work steps are various purification steps; these purification steps may require the removal of organic pollutants, gold pollutants, photoresists (or their inorganic residues), Etching by-products, natural gas compounds, etc. Since 1999, a new front-end processor (integrated circuit wafer manufacturing equipment) usually costs more than 1 billion (1,000,000,000) US dollars, and most of these costs are used for chip control and purification. And pollution control instruments. One of the most important sources of pollution: impurities in processing chemicals. Because purification is extremely frequent and important, the pollution caused by purification chemical reactions is very disgusting. Extremely high purity levels required for semiconductor manufacturing. Rare or exclusive in industrial processes. At such a high level of purity, the handling of chemicals is tedious (of course, it cannot be completely avoided). The exposure of ultra-pure chemicals to air, particularly in environments where workers are present, must be minimized. This exposure has the risk of introducing cuts and forming pollution. Because the manufacturer's or user's premises originally had a higher risk of forming pollution, placing ultra-pure chemicals into this paper standard applies the Chinese National Standard (CNS) A4 specification (210X 297 mm) ------ --- 〇 ---- ^-I Order ------ (Please read the notes on the back and fill out this page) A7 —__ ^ _ B7 _, V. Description of the invention (2) Lotus in a closed container Losing is still not ideal. Furthermore, undetected contamination may damage a large number of expensive wafers. Because many corrosive and / or toxic chemicals are often used in semiconductor processing, the supply place of chemicals is usually away from the workplace of the front-end processor worker. together. The piping for supplying ultra-high purity gases and liquids is well-known in the semiconductor industry for assembly and maintenance, so most gases or liquids can be transported from anywhere in the same building (or even on the same site). Manufacturing station. Ammonia purification Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) The inventor of this case has developed a method for preparing ultra-high purity ammonia in a semiconductor wafer production site system , Which includes: sucking ammonia vapor from a liquid ammonia storage tank, passing ammonia gas through a micro-pumping device, and using purified water with high pH (preferably deionized water that has performed equilibrium with the ammonia fluid) The filtered steam was washed. This discovery can transform commercial-grade ammonia into high-purity ammonia, which is sufficient for high-precision manufacturing without the need for traditional tower distillation. The absorption of ammonia vapor from the supply storage tank itself is 羼 monofluorene distillation. It has the ability to eliminate non-volatile and high-boiling impurities (such as alkali metal and alkaline earth metal oxides, carbonates and hydrides, and transition metal halides). And argon, and high-boiling hydrocarbons and halocarbons). Active volatile impurities that may be found in commercial-grade ammonia, such as: some transition metal rhenium halides, Group BI metal hydrides and halides, some Group IV element hydrides and halides, and halogens, previously thought to require distillation Only those who can be removed can be removed by washing to a degree suitable for precision work. This is a very surprising discovery, because the washing tower technology is traditionally used to remove large -4-this paper size applies Chinese National Standard (CNS) A4 specifications (210 × 297 mm) 87 7. ^ μ —, 5. Description of the invention (3) Scale impurities rather than microscale impurities. Wet processing and dry processing There are many technical easiest aspects in semiconductor processing. One of them is the conversion (and attempt to change) of wet processing and dry processing. In dry processing, only gaseous or plasma-phase reactants come into contact with the wafer. In wet processing, many liquid agents are applied in different situations, such as: etching silicon dioxide or removing natural oxide layers, removing organic substances or trace organic pollutants, removing various metals or trace organic pollutants, etching nitride Silicon, etching silicon. Electro-paddle etching has many notable abilities, but is not suitable for purification. There are also no readily available chemical methods to remove some of the most undesirable impurities, such as gold. Therefore, the wet purification method is extremely important for modern semiconductor processing, and it will be so in the foreseeable future. The photoresist is present when the etching is performed and does not require subsequent high temperature processing. Instead, the resist needs to be stripped and then cleaned. · Printed by the Consumers' Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) The substances that must be removed for purification may include: photoresist residues (organic polymers); sodium; Alkaline earth metals (for example: calcium or magnesium); and heavy metals (for example: gold). Most of these materials cannot form volatile halides, so plasma etching cannot remove them. Purification by wet chemical reaction is required.

如此在電漿蝕刻時加工用化學品之純度將不重要,蓋 因在高溫步驟實施之前,該等步驟之後需要若干淨化步驟 ,並且在高溫步驟引進該等污染物之前,淨化步驟可將表 面上之危險性污染物除去。但因半導體表面之撞擊速率通 常較電漿蝕刻高出百萬倍,且因液體淨化步驟之後緊隨K -5 - 本紙張尺度適用中國國家摞準(CNS ) A4規格(210X297公釐) ~ 經濟部中央標準局員工消費合作社印製 A7 B7 . 五、發明説明(4 ) 高溫步驟,液體化學品之純度則非常重要。 無論如何,濕式加工具有一項重大缺點,亦即離子型 污染。積體電路之結構僅使用些許種摻質(硼、酢、磷、 及間或銻)以形成所需之P -型及η -型摻雜區。但許多其他 種摻質則靥具有電氣活性者,且傷極不受歡迎之污染物。 在濃度遠低於10 13 /立方公分之情況下,許多該等污染物 可能具有毒害效果,例如:接點漏電之增加。再者若干受 歡迎程度較差之污染物凝析入矽内,亦即當矽與一水溶液 接觸時,矽中污染物之平衡濃度將高於溶液中者。此外若 干受歡迎程度較差之污染物具有極高之擴散偽數,因此將 該等摻質引進矽晶圓内任何部分則可能容許該等污染物四 處擴散,包含接點部位,在該處該等污染物將導致漏電。 因此,半導體晶圓上所用之所有液體溶液,其所有金 屬離子含量最好維持在最低水準。所有金屬總濃度以低於 3 00値兆分點,任何一種金靥低於10値兆分點為佳,尤其 該等濃度愈低愈佳。此外,由陰、陽兩種離子形成之污染 亦必須加以控制。(若干陰離子可能具有傷害性效果,例如 :錯合之金屬離子可能在矽格子内還原成游動之金屬原·子 或離子)。 前端設施通常包含用以製備高純度水(去離子水)之現 場純化糸統。但欲獲得具有所需純度之加工用化學品則更 為困難。 用於半導體製造之缓衝氫氟酸及/或氣化銨現場産生之革 新条統及方法 本紙掁尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) (請先閲讀背面之注意事項再填寫本頁·) 1T------#-· 五、發明説明( A7 B7 經濟部中央標準局員工消費合作社印製 現學係 用 若約出 不染種原化造形低以 ,以 内化均I 可 ,在排 。污一佳合製所降予 段塔 施度統£ 統 中偽頂 得到有最聯氫格幅須 階化 近 設純条β。糸 其塔塔 製受。之國化降大必 發純 造高之 π作及 ,滌自 而氫題氫美氟之求物 蒸型 製等示i工法 法洗質。酸化問化傜由統需染 及子 體該掲築理方 段部雜酸硫氟大氟,係条業污 除離 導此經建處之 兩二J氟加得重度得質等工等 清一 半因等一蓮水 一第型氫添所一純購雑該體該 砷, 在,該同搬氨 用而輕度2)致傺高可他由導, 式質 以法。於去純 採,F 純aF導染超上其像半現 批雜 用方點位省超 ,内以高(C而污乃市,質較表 分他 傜及用可可備 中塔所得石因砷,,中雜在異 一其 者統使元此製。例滌,製氟,,低氫統等用優 含之 示条各單因於酸施洗作可對砷面極化条該係之 包數 掲之至等,似氣實部操塔傺有方量氟式。計體 發中多 所品送該機類氫體一下滌氫含化砷之統者設導 蒸程大 案學接,理:之具第況洗化石純含得傳生之半 及流絶 請化直元處現度組在情部氟氟氫η製在産統成 化工去 申度線單端發純一解之二水多化申料 C所条達 純加除 利純管之前曽高在溶度第無許氟 原品統等為 氫酸以 自 專高經巧一在超以傺和該常,在 ί 此出条該。 化氣塔 本備以輕為現備所質飽此通是以 α 由司理.,合。氣氫餾 製得常作 製 雜5¾因 地所料。公處者場除 分 場品.非内 以 干10。 幸。原料學及成之清 一 (請先閲讀背面之注意事項再填寫本頁·) 本紙張又度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作杜印製 A7 B7 五、發明説明(6 ) 消除未經分餾塔除去之污染物,及最後之氟化氫或氟化銨In this way, the purity of the processing chemicals during plasma etching will not be important. Before the high temperature steps are performed, the Gein requires several purification steps after these steps. Before the high temperature steps introduce these pollutants, the purification steps can Remove hazardous pollutants. However, the impact rate of the semiconductor surface is usually a million times higher than that of plasma etching, and it is followed by K -5 immediately after the liquid purification step.-This paper size applies to China National Standard (CNS) A4 (210X297 mm) ~ Economy Printed by A7 B7, Consumer Cooperatives of the Ministry of Standards, Ministry of Standards of the People's Republic of China. 5. Description of the invention (4) The high temperature step, the purity of liquid chemicals is very important. In any case, wet processing has a major disadvantage, namely ionic contamination. The structure of the integrated circuit uses only a few kinds of dopants (boron, hafnium, phosphorus, and meta or antimony) to form the required P-type and η-type doped regions. But many other kinds of adulterants are those that are electrically active and hurt extremely undesirable pollutants. At concentrations far below 10 13 / cm 3, many of these pollutants may have toxic effects, such as increased contact leakage. Furthermore, some of the less popular pollutants condense into the silicon, that is, when the silicon comes into contact with an aqueous solution, the equilibrium concentration of the pollutants in the silicon will be higher than that in the solution. In addition, some of the less popular pollutants have extremely high diffusion pseudo-numbers, so introducing these dopants into any part of the silicon wafer may allow these pollutants to diffuse around, including contact sites, where Contaminants will cause electrical leakage. Therefore, it is best to keep all metal ion contents of all liquid solutions used on semiconductor wafers at a minimum level. The total concentration of all metals is less than 300 値 trillion points, and any kind of gold 靥 is better than 10 値 trillion points, especially the lower the concentration, the better. In addition, pollution caused by cations of yin and yang must also be controlled. (Several anions may have a harmful effect, for example: a mismatched metal ion may be reduced to a mobile metal atom or ion in a silicon lattice). Front-end facilities often include on-site purification systems for the preparation of high-purity water (deionized water). But it is even more difficult to obtain processing chemicals with the required purity. Buffered hydrofluoric acid and / or ammonium gasification for semiconductor manufacturing. Innovative rules and methods generated on-site. The paper's dimensions apply to Chinese National Standard (CNS) A4 (210X 297 mm). (Please read the notes on the back first Fill in this page again.) 1T ------ #-· V. Description of the invention (A7 B7 Printed by the Department of Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economy The average I can be, in the row. Pollution by a good combination system was lowered to the Duan Tashi system. In the system, the pseudo-top was obtained with the most joint hydrogen grid and must be leveled. Nearly pure bars β were set. The chemical process of chemical reduction and catalysis is pure and high-quality, and the method of washing and purifying hydrogen and hydrogen and fluorine is required. The method of washing is shown below. The method of acidification is based on the need to dye and the body. The square section is mixed with acid, sulphur, fluorine, and fluorine. It is a decontamination of the industry. The two or two J fluorides added to the economic construction office have been severely upgraded. The body should be arsenic, and the same should be used for ammonia. Mildly 2) It can be used as a guide for alkaloids. In pure decontamination, F pure aF guide dyeing super-like its semi-presently approved mixed-use point saves the super, internally high (C and pollution is the city, the quality is better than others, and the cocoa can be used to prepare the middle tower. In addition, the miscellaneous materials are in different systems, such as the system. For example, cleaning, fluorine production, low-hydrogen systems, etc., the use of the included strips are due to acid washing, which can polarize the arsenic surface. The number of packages is equal to the equivalent. It seems that the operation tower of the gas department has a square amount of fluorine type. Many products in the meter body will send the machine's hydrogen gas to the hydrogen purifier containing arsenic. Reason: The first stage of washing the fossils is pure and contains half of the passed-through, and the current group must be in the Department of Chemistry. The fluorocarbon system is made in the Ministry of Commerce. Dihydrate hydration application material C before the addition of pure and profit-removing pure tube was high in the solubility of the original non-fluorinated product and so on. It is hydrogen acid. The gasification tower was originally designed to be light and fully prepared. This is based on α. The gas and hydrogen are distilled to make the common system 5¾ due to local conditions. The public place is divided into separate products. Non-internal to dry 10. Fortunately, raw materials and No. 1 (Please read the notes on the back before filling in this page.) This paper is again applicable to the Chinese National Standard (CNS) A4 (210X297 mm). The consumer cooperation of the Central Standards Bureau of the Ministry of Economic Affairs has been printed by A7 B7. 5. Description of the invention (6) Elimination of pollutants not removed by the fractionation column, and finally hydrogen fluoride or ammonium fluoride

V 供應器。 .... -- 藉添加一氧化劑[KMn〇4或(NH4)2S2〇8 ]及、一陽離子 (例如:KHF2)以形成®K2AsF7,神將變為正五價狀態且在 蒸餾過程中存留在蒸發器内。此將恪一分批'式方法,蓋因 此反應缓慢,在實施蒸餾之前,完成該反應需要足夠之時 間。在公稱溫度下,該程序需要之接觸時間約為1小時。 於一連續式程序中,完成反應將需要高溫及高壓(基於安 全考量不希望採用)或龐大容器及配管。在此程序中,於 不停攪拌以期反應時間適當之情況下,將氟化氫送入一分 批式蒸發器並以氣化劑處理之。V supply. ....-By adding an oxidant [KMn〇4 or (NH4) 2S2〇8] and a cation (for example: KHF2) to form ®K2AsF7, God will become a positive pentavalent state and remain during the distillation In the evaporator. This will be a batch-wise method, so the reaction is slow, and it takes sufficient time to complete the reaction before performing the distillation. At nominal temperatures, the contact time required for this procedure is approximately 1 hour. In a continuous process, the completion of the reaction will require high temperatures and pressures (not desirable for safety reasons) or large vessels and piping. In this procedure, hydrogen fluoride is sent to a batch evaporator and treated with a gasifying agent, with constant stirring and a desired reaction time.

C 之後,用一具有回流之分餾塔將氟化氫加以蒸餾,因 而除去整個金屬雜質。在此步驟内獲致大幅度減量者包括: 第1組(I ) 鈉 第 2組(I ) 鈣、缌、鋇 第 3至12組(HA至IA) 鉻、鎢、鉬、錳、鐵、銅、鋅 第1 3組(Μ ) 鎵 第14組(IV ) 錫,鉛,及 第15組(V0 ) 銻。 該分餾塔之作用相當於一条列許多簡單蒸餾;為達成此一 效果,塔内填充以高表面積之材料,並使液體作逆向流動 ,以確保下降液體與上升蒸氣間獲致完全平衡。在此塔内 僅安裝一部分冷凝器以提供回流,之後,將經純化之氣態 過氧化氫導入氟化氫離子型純化器内。除可能夾帶有砷處 本紙張尺度適用中國國家標準(CNS ) Α4規格(210Χ297公釐) (請先聞讀背面之注意事項再填寫本頁) ^------訂After C, hydrogen fluoride is distilled in a fractionating column having a reflux, thereby removing the entire metal impurities. Those who achieved significant reductions during this step include: Group 1 (I) Sodium Group 2 (I) Calcium, Samarium, and Barium Groups 3 to 12 (HA to IA) Chromium, tungsten, molybdenum, manganese, iron, copper Zinc Group 13 (M) Gallium Group 14 (IV) Tin, Lead, and Group 15 (V0) Antimony. The function of this fractionation column is equivalent to many simple distillations in a row. To achieve this effect, the column is filled with a material with a high surface area and the liquid is reversely flowed to ensure that a complete balance is achieved between the descending liquid and the rising vapor. Only a part of the condenser was installed in the column to provide reflux, and then the purified gaseous hydrogen peroxide was introduced into the hydrogen fluoride ion type purifier. Except for possible inclusion of arsenic, this paper size applies Chinese National Standard (CNS) Α4 specification (210 × 297 mm) (please read the precautions on the back before filling this page) ^ ------ Order

C 經濟部中央標準局員工消費合作社印製 A7 ___B7 五、發明説明(7 ) 理 化 學 品 或 需 用 驟 冷 操 作 以 除 去 該 等 化 學 品 之 外 i 依 照 正 常 標 準 t 該. 階 段 之 氣 化 氫 已 算 是 純 淨 〇 於 氣 化 氫 氣 體 導 入 供 應 条 統 之 •V 1- 刖 » 將 利 用 氟 化 氫 離 子 型 純 化 器 以 確 保 達 到 更 高 之 純 度 〇 若 干 元 素 可 能 存 在 於 處 理 液 内 或 引 進 離 子 型 純 化 器 内 以 吸 收 氣 化 氣 流 動 體 ΠΏΐ 内 之 硫 酸 鹽 夾 帶 物 〇 在 離 子 型 純 化 器 内 測 試 中 顯 示 : 下 列 元 素 在 氟 化 氫 氣 體 流 動 體 内 之 污 染 程 度 已 獲 致 大 幅 減 低 : 第 2組 (I ) 锶 及 鋇 * 第 6 至 12組 (VI A 至 I A) 鉻 鎢 及 銅 9 第 13組 (1 I ) 硼 9 第 14組 (IV ) 鉛 錫 * 及 第 15組 (V ) 銻 0 許 多 該 等 元 素 在 引 導 神 污 染 之 消 除 方 面 甚 為 有 用 0 由 於 碑 處 理 作 業 中 含 量 過 多 而 導 致 蒸 餾 塔 内 存 在 之 夾 帶 物 » 可 在 此 步 驟 内 用 精 餾 將 其 除 去 0 請 注 /¾¼ 的 是 * 假 若 砷 含 量 夠 低 之 氟 化 氫 可 以 製 得 9 則 分 批 式 之 除 碑 步 驟 可 以 省 去 0 白 1 9 9 5 年 起 聯 合 化 學 公 司 出 品 之 該 項 原 料 即 可 在 美 國 市 場 上 購 得 〇 超 純 缓 衝 氫 酸 及 氟 化 銨 之 現 場 製 備 如 以 上 所 述 i 氫 氣 酸 (HF) 偽 半 導 體 製 造 工 業 極 為 重 要 之 加 工 用 化 學 品 0 該 氫 氣 酸 在 使 用 時 常 呈 缓 衝 形 態 9 以 減 少 由 於 蝕 刻 副 産 品 增 加 酸 液 負 荷 所 引 起 之 酸 鹼 度 變 動 0 ( 氫 氣 酸 與 矽 反 應 可 産 生 氟 矽 酸 該 強 酸 將 變 動 該 溶 液 之 酸 鹼 度 » 進 而 變 動 蝕 刻 速 率 0 )為該等理由對若干酸所施加之 (請先聞讀背面之注意事項再填寫本頁) 本紙浪尺度適用中國國家標準(CNS ) A4規格(210X297公釐) B7 五、發明説明(8 ) 經濟部中央標準局員工消費合作社印製 緩衝作用 作用之需 來源,所 在緩 。依照所 氨氣吹入 該方 氨對氫氟 衝氫氟酸 不同的是 期之莫耳 圖式簡述 本案 等圖式曾 Μ供參考 圖式簡單 圖1示本 圖_ 2不一* 圖3Α為氟 圖3Β1為 圖3Β2為 圖3Β3為 圖4為一-/產 乃極為熟知者;但對 要郤會產生更多問題 Κ必須足夠純淨以兔 衝氫氟酸中,酸液之 揭示之若干革新具體 一酸液內而製得。 法包含媛衝氫氟酸及 酸之莫耳比。氟化銨 之HF莫耳較多。該兩 ,濃度儀器上之設定 比。 超高純度化學品而言,緩衝 ,蓋因緩衝劑亦係污染物之 降低該系統之成效。 鍰衝作用常由一銨成分提供 IU 實施例,緩衝氫氟酸可藉將 氟化銨,唯一之方法差異係 溶液之莫耳比為1.00,而緩 種溶液所用之裝備相同,所 點將作適當之設定Κ達成預 所揭示之諸發明.將參照所附圖式加以說明,該 顯示本發明之具體實施例且一併納入本說明書內 〇 ' 說明: 發明氨純化單元之流程, 半導體生產流程, 化氨產生器流程圖, 圖3Α流程一具體實施例, 圖3Α流程另一具體實施例, 圖3Α流程又一具體實施例, 代表性具體實_例:氟化氫蒸餾/離子型純化器 生器。 -10 - 本紙張尺度適用中國國家標準(CNS〉Α4規格(210Χ297公釐) 請 處 閱 讀 背 -之 注C Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 ___B7 V. Description of the invention (7) Chemicals may need to be quenched to remove these chemicals i In accordance with normal standards t This phase of hydrogen gas has been It is considered to be pure. In the introduction and supply system of hydrogenated gas, V 1- 刖 »will use hydrogen fluoride ion type purifier to ensure higher purity. Certain elements may be present in the treatment solution or introduced into the ion type purifier. Sulfate inclusions in the gaseous gas absorbing fluid ΠΏΐ. Tests in the ionic purifier show: The pollution levels of the following elements in the hydrogen fluoride gas flowing body have been greatly reduced: Group 2 (I) Strontium and Barium * Groups 6 to 12 (VI A to IA) Chromium tungsten and copper 9 Group 13 (1 I) Boron 9 Group 14 (IV) Lead-tin * and Group 15 (V) Antimony 0 Many of these elements are very useful in guiding the elimination of God's pollution. 0 Entrainment in the distillation column due to excessive content in the stele processing operation »It can be removed by rectification in this step. 0 Please note / ¾¼ is * If hydrogen fluoride with a low arsenic content can produce 9 batches, the step of removing the stele can be eliminated. 0 White 1995 This raw material produced by United Chemical Company can be purchased on the US market. On-site preparation of buffered hydrogen acid and ammonium fluoride as described above i Hydrogen acid (HF) is a very important processing chemical for the pseudo-semiconductor manufacturing industry. 0 The hydrogen acid is often in the form of a buffer 9 in use to reduce the increase in etching by-products. PH change caused by acid load 0 (Hydrogen acid reacts with silicon to produce fluorosilicic acid. The strong acid will change the pH of the solution » Dynamic etching rate 0) is applied to certain acids for these reasons (please read the precautions on the back before filling this page) The paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) B7 V. Invention Explanation (8) The source of the buffer effect of the printing of the consumer cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs is the source of the delay. According to the ammonia gas that is blown into the square ammonia, hydrofluoric acid and hydrofluoric acid are different. The Mohr diagram of the period is briefly described in this case. The diagram is for reference. The diagram is simple. Figure 1 shows this picture. _ 2 different * Figure 3A It is fluorine Figure 3B1 is Figure 3B2 is Figure 3B3 is Figure 4 is a well-known person; but to produce more problems, κ must be pure enough to extract some of the acid solution in hydrofluoric acid. It is made by reforming a specific acid solution. The method includes Yuan Chong hydrofluoric acid and acid mole ratio. Ammonium fluoride has more HF moles. The ratio of the two on the concentration instrument. For ultra-high-purity chemicals, buffers and gein buffers are also pollutants that reduce the effectiveness of the system. The shock effect is usually provided by an ammonium component in the IU embodiment. Buffered hydrofluoric acid can be obtained by using ammonium fluoride. The only difference is that the molar ratio of the solution is 1.00, and the equipment used in the slow solution is the same. The setting K achieves the inventions disclosed in advance. It will be described with reference to the attached drawings, which shows specific embodiments of the invention and is also incorporated in this specification. 0 'Description: The process of inventing the ammonia purification unit, the semiconductor production process, Flow chart of the ammonia generator, FIG. 3A, a specific embodiment of the process, FIG. 3A, another specific embodiment of the process, FIG. 3A, another specific embodiment, a representative specific example: hydrogen fluoride distillation / ion type purifier generator. -10-This paper size applies to Chinese national standard (CNS> Α4 specification (210 × 297 mm) Please read back-Note

I 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(9 ) 合意具體實施例之詳細說明: 本專利申請案之許多革新要點,將特別參照目前之合 意具體實施例(僅係舉例説明,但絶不以此為限)加以說明 ,其中: 氨之純化 依照本發明,氨首先自一液態氨供應儲槽之蒸氣空間 取出。以此方式取出蒸氣,如同一單级蒸餾作用,將若干 固體及高沸點雜質留在液相内。供應儲槽可能是任何傳統 式供應槽或其他適於盛裝氨之儲槽,且氨可能是無水者或 一水溶液。儲槽内可保持在大氣壓力下或必要時保持在高 於大氣壓力之壓力下以便氨可容易地流經該条統。最好儲 槽加以溫度控制,使溫度範圍介於約1 0 t:與5 Ο υ之間,但 以介於約15t:與35Ό之間較佳,尤以介於20t:與25C之間 最佳。 由於氨自蒸氣相取出而除去之雜質包含週期表内第I 族及第I族之金靥以及該等金颶因接觸氨所形成之胺化物 。另外除去者僳該等金屬之氧化物及磺酸鹽;以及氫化物 ,例如:氫化波及氫化IM ;第I族元素及其氧化物,以及 該等元素之氫化物及鹵化物之銨加成物;過渡金靥之氫化 物;及重烴類及鹵碩化合物,例如:泵油。 取自儲槽之氨,通過一過濾單元以除去蒸氣所夾帶之 任何固體物質。微濾及超濾單元之薄膜,市上均可購得, 且亦可使用。濾材等级及類型之選擇則因需要而定。目前 之合意具體實施例係使用一粗大過濾器,在離子型純化器 -11 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) (請先閲讀背面之注意事項再填寫本頁) 訂 Φ. A7 B7 經濟部中央標準局買工消費合作社印製 五、 發明説明(1 0 ) 1 I 之 刖 經 過 一 〇. 1 撒 米 過 濾 器 f 且 在 離 子 型 純 化 器 之 後 再 Jar 無 I 1 過 濾 作 用 〇 I 將 過 濾 過 之 蒸 氣 通 過 一 洗 滌 塔 » 在 該 洗 滌 塔 内 用 高 酸 請, 先 1 鹼 度 純 化 過 (最好去離子者)之水 將 蒸 氣 加 以 洗 滌 0 該 局 酸 閱 ft 背 1 鹼 度 之 水 最 好 係 一 氛 水 溶 液 > 藉 使 其 在 洗 滌 塔 中 實 施 再 循 面 之 注 意 事 1 | 環 作 用 而 將 濃 度 提 昇 至 飽 和 0 洗 滌 塔 可 依 照 傳 統 式 洗 滌 1 1 塔 之 對 流 方 式 方 便 地 操 作 0 雖 然 操 作 溫 度 並 不 重 要 9 但 洗 項 再 1 填 产' 滌 塔 之 操 作 溫 度 範 圍 以 約 1 0 v 至 約5〇r 為 佳 9 尤 以 約 15它 寫 本 ,! / '-*· — 至約3510 更 佳 〇 同 樣 地 9 操 作 壓 力 亦 不 重 要 9 但 合 意 之 操 頁 1 1 作 壓 力 範 圍 為 約 大 氣 壓 力 至 大 氣 壓 力 以 上 約 30 磅/平 方 时 I 0 通 常 該 塔 含 有 傳 統 式 洗 滌 塔 填 充 物 以 提 供 液 體 與 氣 體 間 1 1 之高度接觸 最 好 亦 含 有 除 霧 段 0 1 訂 在 一 百 >·Α. 刖 合 之 實 施 例 中 y 該 塔 之 填 充 高 度 約 為 3 呎 1 1 (0 .9公 尺 ) 及 内 徑 約 為 7 吋 (18公分) 贅 以 達 到 一 填 充 體 積 1 1 0 . 84立方 呎 (24公升) 9 其 操 作 之 壓 力 降 約 為 0 . 3 时 水 柱 ( 1 1 0 . 07 5仟帕斯卡), 其 溢 流 低 於 10¾. 且在溢流為20¾之 情 況 1 1 下 » 其 公 稱 再 循 環 流 量 約 為 2 . 5加命/分鐘 < (0 . 1 6公升/秒) /也 V 或 5 加 m /分鐘(0 · 3 2公升/秒), 其 中 氣 體 傷 由 镇 充 物 下 方 1 I 進 入 > 而 液 體 則 由 填 充 物 之 上 方 及 除 蓀 段 之 下 方 進 入 0 本 I 1 案 所 述 洗 滌 塔 所 用 之 合 aSft 填 充 材 料 乃 公 稱 尺 寸 小 於 八 分 之 1 1 一 塔 直 徑 者 0 該 塔 之 除 霧 段 且 有 類 似 或 更 緻 密 之 填 充 物 1 1 1 且 偽 另 一 種 傳 統 式 之 結 構 〇 應 了 解 的 是 » 本 段 之 所 有 説 明 F 1 及 尺 寸 僅 偽 實 例 而 已 0 每 値 条 統 參 數 均 可 有 所 變 化 0 1 I 在 典 型 操 作 中 ) 開 始 時 首 先 用 氨 使 去 離 子 水 達 到 飽 和 1 1 - 12 - 1 1 1 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) A7 B7 五、發明説明(11) 凹 如氫鹵 式統發ο 開例含可用 底。例及之 缠条本20離舉包亦常 塔質,物屬 連化在為 ,。能轉, ,雜物化金 半純。約 同化中蓮中 間之發鹵族 或氨圍量 不純統之轉 期積揮之VI式。範流 型之条塔蓮 轉累性銻第 缠意化之 類步該餾式 運去活及及 連合變統 殊一 ,蒸批 塔除:砷族 、為之条 特進時。分 滌以含 、® 式較廣該 之作積利在 洗,包磷第 批轉寬過 序再沉有。 。放例·,及 分蓮有通 程地氣為式 質排實3)., 照式能氨。造意蒸更續 .介性之SH物 依镙可,時製隨學將連 滌期質(A化 可連且合小於可化元半 洗週雜氫鹵 元半要場?!-/用前於單或 始作之化羼 單或重數Μ應用用餾式 起則去砷金 諸式不多Ρ氨使應蒸缠 為體除及渡。之缅並大.Μ之在期 一連 作液塔4)過物及連率之㈣化,預及 、 液量滌iH般化述以理用Θ純氨氨元式 S 時 溶少洗ί 一氫此但處應、經之當單批 ί 之由烷.,及至。積期/<1因塔,水分 成内 砂物物 轉體預西 滌之脫用 形槽 .:化化 蓮之明西 洗言一採 (請先間讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 之操作壓力可能是300磅/平方吋絶對壓(2,068仟帕斯卡) ,分批量為100磅(45.4公斤)。此實例中之洗滌塔之直徑 為8吋(20公分),高度72吋(183公分),操作之溢流量為 30¾,蒸氣速度為0.00221呎/秒(0.00067公尺/秒),高度 相當於一1.5吋(3.8公分)之理論板,及48値相當板。本 實例中之鍋爐尺寸是:直徑約18吋(45.7公分),長度27时 (68.6公分),回流比為0.5,再循環冷水進入之溫度為60 下(1 5 . 61),離開時之溫度為90T(32.2t:)e再度強調 -13 _ 本紙張尺度適用中國國家榇準(CNS ) Α4規格(210X297公釐) A7 B7 經濟部中央標準局員工消費合作社印製 五、 發明説明(1 2) 1 1 之 一 點 是 此 僅 係 — 實 例 蒸 餾 塔 結 構 之 變 化 極 為 廣 泛 及 1 | 操 作 參 數 可 以 使 用 0 I 視 其 用 途 不 同 而 定 t 經 純 化 之 氨 » 無論是否經過蒸 餾 請 先 1 步 驟 9 可 用 作 - 經 純 化 之 氣 體 或 用 作 水 溶 液 C 在 該 案 例 閱 讀 1 背 1 中 t 該 經 純 化 之 氨 偽 溶 解 在 經 純 化 (以經去離子者為佳)之 之 1 注 | 水 中 ) Ο 意 I 事 I 圖 1 所 顯 示 者 係 本 發 明 氨 純 化 早 元 之 流 程 圖 0 液 態 氨 項 再 填 1 Λ 傺 儲 存 在 儲 槽 11内 〇 氨 蒸 氣 12僳取 白 儲 槽 之 蒸 氣 空 間 9 之 寫 ) 後 通 過 一 關 閉 閥 13 * 再 經 過 一 過濾器14 0 經 過 濾 之 氨 蒸 氣 頁 1 I 1 5 (其流量由- *壓力調整器1 6控制) t 將 其 導 入 一 洗 滌 塔 17 1 | 9 該 洗 滌 塔 含 有 一 填 充 段 18及 一 除 霧 墊 19 0 當 氨 蒸 氣 向 上 1 丨 流 動 時 » 飽 和 之 氨 水 溶 液20則 向 下 流 動 9 液 體 則 由 循 環 泵 1 訂 1 2 1予以循環 9 液 面 高 度 傺 由 一 液 面 傳 感 器2 2控制 0 廢 物 23 則 由 洗 滌 塔 底 所 積 存 之 液 體 内 作 週 期 性 之 排 除 0 去 離 子 水 1 1 24僳供給洗滌塔 17 其 高壓係藉泵25來 維 持 0 經 洗 滌 過 之 1 | 氨26偽導向 三 條 流 路 中 之 一 條 流 路 〇 該 等 流 路 是 1 1 (1) —* 蒸 餾 塔 27 9 在 該 塔 内 氨 得 以 進 一 步 純 化 0 所 得 蒸 餾 後 之 氨28再導 至 使 用 地 點 〇 1 I (2) 溶 解 C3B 早 元 29 9 在 該 處 氨 與 去 離 子 水 30結 合 形 成 一 水 1 1 溶 液 31 9 再 導 至 使 用 地 點 0 若 工 廠 作 業 具 有 多 個 使 用 1 I 地 點 t 該 水 溶 液 可 收 集 在 一 暫 存 槽 内 f 再 由 該 暫 存 槽 1 將 氨 送 至 通 往 同 一 工 廠 内 各 使 用 地 點 之 管 線 中 0 I 1 (3) 輸 送 管 線 32 * 該 輸 送 管 線 將 氣 態 氨 送 至 使 用 地 點 0 ί 1 上 述 第 二 及 第 三 條 流 路 > 其 中 不 利 用 蒸 餾 塔 27 9 適 宜 生 産 1 1 - 14 - 1 1 本紙張尺度適用中國國家標準(CNS〉A4規格(210X297公釐)I Printed by the Consumer Standards Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs A7 B7 V. Description of Invention (9) Detailed Description of the Specific Specific Embodiments: For many innovations of this patent application, special reference will be made to the current ideal specific embodiments (only examples) Description, but by no means limited to this), in which: Purification of ammonia According to the present invention, ammonia is first taken out of the vapor space of a liquid ammonia supply storage tank. Withdrawing the vapor in this way, several solids and high-boiling impurities are left in the liquid phase, as in the same single-stage distillation. The supply tank may be any conventional supply tank or other storage tank suitable for containing ammonia, and the ammonia may be anhydrous or an aqueous solution. The tank can be maintained at atmospheric pressure or, if necessary, at a pressure higher than atmospheric pressure so that ammonia can easily flow through the system. It is best to control the temperature of the storage tank so that the temperature range is between about 10 t: and 5 Ο υ, but preferably between about 15 t: and 35 ,, especially between 20 t: and 25 C. good. Impurities removed as a result of ammonia being taken out of the vapor phase include Group I and Group I gold moths in the periodic table and the amidates formed by these gold hurricanes upon contact with ammonia. In addition, the oxides and sulfonates of these metals; and hydrides such as: hydrogenation and hydrogenation IM; group I elements and their oxides, and hydrides and halide ammonium adducts of these elements ; Hydrides of transition metal; and heavy hydrocarbons and halogen compounds, such as: pump oil. The ammonia taken from the storage tank is passed through a filter unit to remove any solid matter entrained by the vapor. The membranes of the microfiltration and ultrafiltration units are commercially available and can also be used. The choice of filter material grade and type is determined according to needs. The current preferred embodiment is the use of a coarse filter in the ionic purifier-11-this paper size applies Chinese National Standard (CNS) A4 specifications (210X297 mm) (Please read the precautions on the back before filling this page ) Order Φ. A7 B7 Printed by the Central Consumers Bureau of the Ministry of Economic Affairs, Printed by Consumers ’Cooperatives. 5. Description of the invention (1 0) 1 I after passing through the 0.1 Sami filter f, and Jar without I after I 1 Filtration effect Ⅰ Pass the filtered steam through a washing tower »Use high acid in the washing tower, please wash the steam with 1 alkalinity purified (preferably deionized) water 0 The water with 1 alkalinity is best to be an aqueous solution of the atmosphere.> By using it in the washing tower to carry out the recurring attention 1 | ring effect to increase the concentration to saturation. 0 The washing tower can be washed in the traditional way. Convection mode for easy operation 0 Although the operating temperature is not Important 9 But the washing item is refilled and 1 'The operating temperature range of the polyester tower is preferably about 10 v to about 50 〇9, especially about 15 It is written,! /'-* · — To about 3510 is better Ground 9 The operating pressure is also not important 9 but the desired operation page 1 1 The operating pressure range is from atmospheric pressure to about 30 psi above atmospheric pressure I 0 Usually the tower contains traditional scrubbing tower packing to provide liquid and gas space The height contact of 1 1 preferably also includes a defogging section. 0 1 is set at one hundred > · Α. In the combined embodiment, the filling height of the tower is about 3 feet 1 1 (0.9 meters) and within. The diameter is about 7 inches (18 cm) to achieve a filling volume of 110.84 cubic feet (24 liters). 9 The pressure drop during operation is about 0.3 o'clock (1 1 0. 07 5 Pascals), Its overflow is less than 10¾. And in the case of an overflow of 20¾ 1 1 »its nominal recirculation flow is about 2.5 plus life / min. < (0. 16 liters / second) / also V or 5 plus m / minute (0 · 32 2 liters / second), in which the gas wound enters 1 I below the ballast > and the liquid flows from the filler The upper part and the lower part of the grate section enter 0. The aSft filling material used in the washing tower described in this I 1 case has a nominal size of less than one eighth. 1 One tower diameter. 0 The defogging section of the tower has a similar or denser structure. Filler 1 1 1 and pseudo another traditional structure. 0 should be understood »All descriptions in this paragraph F 1 and dimensions are only pseudo examples. 0 Each parameter of the system can be changed. 0 1 I In typical operation ) At the beginning, the deionized water is saturated with ammonia 1 1-12-1 1 1 This paper size is applicable to Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B7 V. Description of the invention (11) Concave like hydrogen halide Formulas issued ο open examples with available base. For example, the twirling strips of the 20-liter package are also often towering, and the property is Lianhuazai. It can be turned into semi-pure gold. About the assimilation Zhonglianzhong, the halogen or ammonia, the imperfect conversion of the period of accumulation of the VI type. Fanliu-type strips of lotus roots, distant antimony, enthusiasm, and other steps, the distillation process is deactivated and combined, and the system is special. The steaming batch tower is removed: arsenic, and the strip is special. The separation is based on the broader formula containing ®, which should be used for profit. The first batch of phosphorus-containing coatings is widened and then settled. . As an example, and Fen Lian has a regular ground gas quality formula 3)., According to the formula can ammonia. Intentional steaming is more continuous. Intermediate SH substances can be used, and the time system will continue to clean up the period of time (A chemical can be connected and the combination is less than the chemical element half-wash week heterohydrogen half semi-main field?!-/ Use The former or the first production of the single or multiple MW applications with distillation from the beginning to remove arsenic and gold, not much ammonia, should be entangled into the body to remove and cross. Burma and big. M's continuous crop (Liquid tower 4) The conversion of the passing object and the connection rate, the prediction and the liquid quantity are as follows. The reason is that when Θ pure ammonia is used, the formula S is less soluble. One hydrogen, but it should be treated as a single batch. ί by alkane, and to. Sekiji / < 1 due to tower, water is divided into inner sands and turned into pre-washing-shaped grooves for removal of western polyester .: Huahua Lianzhi Mingxi washes a word (please read the precautions on the back before filling this page) ) The operating pressure printed by the Consumer Standards Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs may be 300 psi (2,068 仟 pascals), with batch sizes of 100 lbs (45.4 kg). The diameter of the washing tower in this example is 8 inches (20 cm), the height is 72 inches (183 cm), the operating overflow is 30¾, the steam velocity is 0.00221 feet per second (0.00067 meters per second), and the height is equivalent to one 1.5 inch (3.8 cm) theoretical board and 48 値 equivalent board. The dimensions of the boiler in this example are: approximately 18 inches (45.7 cm) in diameter, 27 hours (68.6 cm) in length, a reflux ratio of 0.5, the temperature of the recirculated cold water entering is 60 degrees (1 5.61), and the temperature when leaving For the 90T (32.2t:) e again emphasized -13 _ This paper size applies to China National Standards (CNS) A4 specifications (210X297 mm) A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs 5. Description of the invention (1 2 ) 1 1 One point is that this is only an example — the structure of the distillation column is very extensive and 1 | the operating parameters can be used 0 I depending on its use t purified ammonia »whether or not distillation first 1 step 9 available Action-Purified gas or used as an aqueous solution C In this case reading 1 back 1 t The purified ammonia is pseudo-dissolved in 1 of purified (preferably deionized) Note | Water) 〇 I matter I Figure 1 The display is the flow chart of the early purification of the ammonia of the present invention. 0 Liquid ammonia items are refilled. 1 傺 傺 stored in the storage tank 11 〇 ammonia vapor 12 僳 take the vapor space 9 of the white storage tank) and then pass a shut-off valve 13 * Then pass through a filter 14 0 filtered ammonia vapor page 1 I 1 5 (the flow rate is controlled by-* pressure regulator 16) t is introduced into a washing column 17 1 | 9 This washing column contains a packed section 18 and A defogging pad 19 0 When the ammonia vapor flows upward 1 丨 The saturated ammonia solution 20 flows downward 9 The liquid is circulated by the circulating pump 1 Order 1 2 1 The liquid level is controlled by a liquid level sensor 2 2 0 Waste 23 is periodically excluded from the liquid accumulated in the bottom of the washing tower 0 Deionized water 1 1 24 僳 is supplied to the washing tower 17 The high pressure is maintained by the pump 25 0 Washed 1 | Ammonia 26 pseudo-oriented three One of the flow paths. The flow paths are 1 1 (1) — * distillation column 27 9 The internal ammonia can be further purified. 0 The distilled ammonia 28 is redirected to the place of use. 0 1 I (2) Dissolved C3B early 29 9 where ammonia is combined with deionized water 30 to form a water 1 1 solution 31 9 and then redirected to Use site 0 If the plant operation has multiple uses 1 I site t The aqueous solution can be collected in a temporary storage tank f and then the temporary storage tank 1 will send ammonia to the pipeline to each use site in the same factory 0 I 1 (3) Conveying line 32 * This conveying line sends gaseous ammonia to the place of use 0 ί 1 The above second and third flow paths > Among them, no distillation column 27 9 is suitable for production 1 1-14-1 1 Applicable to Chinese national standards (CNS> A4 specification (210X297 mm)

五、發明説明(13) 經濟部中央標準局員工消費合作社印製 金屬雜質低於100値兆分點之氨。但於若干應用場合(例如 :若干熔爐淨化之應用場合),以包含蒸餾塔27者可能有利 。其寘例是:熔爐或化學蒸氣沉積(CVD)之使用氨。擧例言 2,宥氨僳用於化學蒸氣沉積,蒸餾塔僳用以除去非冷凝 性物質,例如:氣及氮,因其可能干擾化學蒸氣沉積效果 。此外,因離閲洗滌塔17之氨業與水達成飽和狀態,視蒸 ^塔之特性及效率而定,可隨意地於該条統内洗滌塔17與 蒸餾塔2 7之間加裝一脱水單元。 無論在任何該等流路中,所得之流動體,氣態氨或水 ί容液,可能再分成兩個或更多個支流,每値支流導向不同 之.使用站,因此純化單元可同時供應經純化之氨給許多使 用站。 氣化氫之純化 ’ 圖4僳顯示依照所掲示諸項革新中一代表性具體實施 例之現場氟化氫純化器。 氣化氫之純化工作之完成僳首將砷氧化成正五價之氧 化態,再經分餾以除去該As+5及金羼雜質。請參閲美國專 利4,929,435,持將其一併提出供作參考。如文獻中所示, 為達成此項目的曾經使用過許多不同之氣化劑,請參閲下 列專利及專利申請案,玆將所有該等案件一併提出供作參 考: US#3 , 68 5 , 370 ; CA81-177347s ; EP#351,1 07 ; JP#61 -151 , 002 ; CA74-101216 ; CA78-23343 ; US»5,047,226 ;USSR# 3 7 9,533; CA8 1 - 1 77348 t ; US#4,954,33 0 ; UStt4 , 9 5 5 , 43 0 -15 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210X 297公釐) (請先鬩讀背面之注意事項I寫本頁.) IT------IP-· A7 B7 五、發明説明(14) ;EPff276,5 42 ; US#4,083,4 41 5 ¾ CA98-P200672f〇 經顯示氟氣(F2)具有效果(經由其他學者專家發表之 著作),且經公認乃目前之合意具體實施例。卩2需要昂貴 之配管作業及安全防護,但經顯示確實有效。 另一次要之合意具體實施例傺使用過硫酸銨 [(nh4) s2〇8],其超高純度者市上極易購得。 通常,合意之氧化劑傜不會引進金羼原子者。所以其 他可以選用者包含過氣化氫及臭氧。 另一不太合意之可用品偽凱羅氏酸(過硫酸,h2so5, 其水溶液中可産生過氧化氫)。另一選擇對象偽二氧化氯, 但其嚴重缺點是具有爆炸性。另外可以選用者包括硝酸及 氯氣,但兩者可引進陰離子,該等陰離子必須予以分離。 (降低非金靥離子含量不如降低金靥陽離子含量來得重要, 但仍希望陰離子之含量能達到1値十億分點或更少。初始 引進陰離子將增加離子型純化階段之負荷。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 聯合化學公司之席格納爾,與本案之發明人合作,在 其路易斯安納州,蓋斯瑪市之工廠内,利用一初始砷氣化 步驟,曾成功地製得超純氟化氫。本案之發明人並不熟悉 該程序全部步驟,但聯合化學公司在此方面之成就更進一 步確認所掲示諸發明之可行性。 高錳酸鉀傷最常用之氧化劑,若另外再加設所掲示之 離子型純化器並施以氫氟酸.脱餾,預知其亦可用於超純化 作用。但該品劑使純化器之陽離子負荷大為增加,所以不 含金靥之氧化劑較為合意。 -16 - 本紙張尺度適用中國國家標準(CNS ) A4規格( 210X297公釐) A7 B7 ' ' 五、發明説明(15) 在另一具體實施例中/高純度4 9¾之氫氟酸,實際上 不含砷,亦可使用。自1995年第三季開始,聯合化學公司 出品之低砷原料市上已可購得,且可以結合「不」含砷氧 化劑之現場離子式純化法,實施超純氫氟酸之現場生産。 氟化氫加工流程圖包含一分批式除砷及蒸發階段、一 分餾塔以除去絶大多數其他雜質,一離子型純化器以消除 未k分餾塔除去之污染物,及最後之氣化氫供應器。 藉添加一氧化劑[ΚΜη04或(NH4 )2 S2 08 ]及一氧離子源 (例如:KHF2)以形成鹽K2AsF7,砷將變為正五價狀態且在 蒸餾過程中存留在蒸發器内。此將傺一分批式方法,蓋因 此反應缓慢,在實施蒸餾之前,完成該反應需要足夠之時 間。在公稱溫度下,該程序需要之接觸時間約為1小時。 於一連續式程序中,完成反應將需要高溫及高壓(基於安 全考量不希望採用)或龐大容器及配管。在此程序中,於 不停攪拌以期反應時間適當之情況下,將氟化氫送入一分 批式蒸發器並以氣化劑處理之。 之後,用一具有回流之分餾塔將氣化氫加以蒸餾,因 而除去整個金屬雜質。在此步驟内獲致大幅度減量者包括: 第1組(I ) 鈉 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 第 2組(I ) 鈣、锶、I貝 第 3至12組(MA至HA) 鉻、鎢、鉬、錳、鐵、銅、鋅 第13組(I ) 鎵, 第14組(IV ) 錫,鉛,及 第15組(VH ) 銻。 -17 - 本紙浪尺度適用中國國家標準(CNS ) A4規格(210X297公釐) A7 B7 五、發明説明(1 6 ) 該 分 餾 塔 之 作 用 相 當 於 一 条 列 許 多 簡 tao 早 蒸 餾 5 為 達 成 此 —. 效 果 i 塔 内 镇 充 以 高 表 面 積 之 材 料 9 並 使 液 體 作 逆 向 流 動 9 以 確 保 下 降 液 體 與 上 升 蒸 氣 間 獲 致 完 全 平 衡 Ο 在 此 塔 内 僅 安 裝 — 部 分 冷 凝 器 以 提 供 回 流 9 之 後 » 將 經 純 化 之 氣 態 氟 化 氫 導 至 氣 化 氫 離 子 型 純 化 器 内 0 除 可 能 夾 帶 有 神 處 理 化 學 品 或 需 用 驟 冷 操 作 以 除 去 該 等 化 學 品 之 外 9 依 照 正 常 標 準 9 該 階 段 之 氣 化 氫 已 算 是 純 淨 0 於 氣 化 氫 氣 體 導 入 供 應 条 統 之 .Λ-Λ. 刖 > 將 利 用 氣 化 氫 離 子 型 純 化 器 以 確 保 達 到 更 高 之 純 度 Ο 若 干 元 素 可 能 存 在 於 處 理 液 内 或 引 進 離 子 型 純 化 器 内 以 吸 收 氣 化 氫 流 動 體 内 之 硫 酸 鹽 夾 帶 物 〇 在 離 子 型 純 化 器 内 測 試 中 曾 顯 示 : 下 列 元 素 在 氣 化 氫 氣 體 流 動 atm 體 内 之 污 染 程 度 已 獲 致 大 幅 減 低 : 第 2組 (I ) 缌 及 鋇 第 6 至 12組 (VI A 至 I A) 鉻 m 及 銅 9 第 13組 (I ) 硼 9 第 14組 (IV ) 鉛 > 錫 » 及 第 15組 (V ) 銻 Ο 許 多 該 等 元 素 在 引 導 砷 污 染 之 消 除 方 面 甚 為 有 用 0 由 於 神 處 理 作 業 中 含 量 過 多 而 導 致 蒸 餾 塔 内 存 在 之 夾 帶 物 > 可 在 經濟部中央標準局員工消費合作社印製 (請先聞讀背面之注意事項再填寫本頁) 此步驟内用精餾將其除去。 最終産品之氣化氩脱餾 如以下所述,許多元素在水溶液上方與氟化氫形成低 沸點之餾分: 第1組(I ) 鈉、鉀, **18- 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 五、發明説明(1 7 ) A7 B7 經濟部中央標準局員工消費合作社印製 元半先、餾經供中 等 使實 氨圖及 氣,偽 等在首分未氫液 度 可體 純及管 蒸法塔 該:。一除化溶 導 器具 超,配 自段滌 ,供统係消氟水 電 化此 中圖細I)階洗 、 鎮 液提条次以該品 用 純在(^凳詳 及兩二 溶可之其塔。産 使 場—— < 縱之 鐵一第 該例生,化器氫. ί 現料 程之式 :用一 入施産}純應化 改 ,原 流}模¾採而 通實及PFM型供氟 修 中始 工酸施 例以, 氫體化U子氫從 同 例起 加氣實 {所塔 及 化具純Η離化可 不 ,施藏 内氫程 質。滌 _ ,,。氟之場U 一氣, 以 實散 元衝流 雜慢洗9- 鈣鐵鋁量意現Π5Φ,像體.加 體為 單缓工 靥氫 一19 過合酸力質後動 可 具作 生産加 金化第 - 將前氟U雜最流 路 一酸 産生3Α干氣一 藉目氫地他,分。環 另氟。 一以画 若較在 ,,内1其物餾質制 之氫驟 係内係 :率解 理此施111數染頂雜控 新之步生者酸者 是速溶 ) 處如設£多污氫.之度 革原化産示氟示 點之偽 度。造段大之化厭濃)0示還氣之顯氫顯 特解質 (I(VD(I高除製階絶去氟討時速掲砷需酸所進所 要溶雜 組組組終脫置發去除費干要音所度無氟3A引B2。重中干 2813最以裝蒸除塔耗若必代在純中氫圖以M3圖其體若 第第第為得體一以餾器去 取 高例衝 得 1 器 動中 .作素導偽塔分應除 以 用施缓 氣3B儀 流其 (請先聞讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) A7 B7 " 五、發明説明(18) 在約105¾飽和之情況下蓮轉,因此該等「輕型」雜質於塔 頂逸出。如此該第二洗滌塔可生産高純度氫氣酸。 在目前合意之具體實施例中,該氨氣純化器之液體體 積是10公升,最大氣體流速約為10標準公升/分鐘。洗滌 液體偽經充分地沖洗(連缠式或增量式),侔24小時至少更 換一次。 産品濃度(在兩値産生步驟)係用音速量測裝備(麥薩 實驗室出品)量測濃度-但其他量測方式傺用電導度、密 度、折光率、或红外線光譜。 設置加工程序時必須決定氟化氫及氨在水中全部溶解 之濃度。舉例言之,1公斤40¾重量比氟化銨之溶液將含有 400公克氟化銨及600公克超純水。因純氟化銨中氟化氫與 氨之莫耳比為1: 1,所以400公克氟化銨將包含216公克無 水氟化氫及184公克無水氨。(氟化銨分子量=37,氟化氫 分子量=20,氨分子量=17)。 經濟部中央標準局員工消費合作社印製 (諳先閱讀背面之注意事項再填寫本頁) 在氫氣酸製備程序完成時,216公克之氟化氫溶解在 600公克之水中,或濃度為26.5¾重量比。機載儀器控制可 添加氟化氫以達到所需濃度。另一種方式是,將49¾濃度 之氫氟酸稀釋至該濃度。 於26.5¾濃度之氟化氫水溶液形成後,添加189公克之 氨,以製成40¾濃度之氣化銨水溶液。 對於藉調整濃度儀器控制之不同應用場合,其他濃度 及莫耳比可藉濃度儀器控制加以設定。 修改及變化 -20 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明(1 9 ) 如將為精於此項技術#所認知者,本專利申請案所述 之革新觀念,隨廣大應用場合之不同可加以修改或轉變, 所以獲准專利之技術内容,其應用範圍決不局限於所列舉 之若干實例。 舉例言之,所掲示之革新技術並非嚴格地局限於積體 電路之製造,亦可應用於製造離散半導體分件,例如:光 電子裝置及電源裝置。 再以另一實例言之,所掲示之革新技術亦可適用於曽 採用積體電路製造方法之其他技術方面之製造工作,例如 :薄膜磁頭及活動點陣液晶顯示器;但其主要用途偽積體 電路製造,所掲示之技術在其他方面之用途則屬次要者。 更就另一實例而言,使用一洗滌塔以實施液體-氣體 接觸並非嚴格地需要;可改用一發泡器,惟其氣體/液體 接觸效果較差,雖然非不得已以不用為佳。 另外可作選擇性採納的是:其他單獨過濾或多階段過 濾可結合所掲示之純化器具共同操作。 應注意的是,雖然目前合意之具體實施例並未如此作 ,必要時純化水内可加入若干添加劑。 如以上所述,主要之具體實施例係一現場純化条統。 另一種方式是,在另一組不太合意之具體實施例中,所掲 示之純化条統亦可適用於操作部分製造單元以生産準備蓮 輸之超高純度化學品,但 ’該變通方式具體實施例不能提供 以上所述現場純化之優點。如以上所述,該等應用場合將 遭遇到處理超高純度化學品之固有風險;但對需要經包裝 _ 21 , 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) —-----—ΙΓ;-------.玎------Φ, ' (請先聞讀背面之注意事項再填寫本頁〕 87 7. 3 Λ7 B7 五、發明説明(21) 經濟部中央標準局員工消費合作社印製 元件標號說明: 圖 1 : 11 儲槽 22 液面傳感器 12 氨蒸氣 23 廢物 13 關閉閥 24 去離子水 14 過濾器 25 泵 15 過濾之氨蒸氣 26 洗滌過之氨 16 壓力調整器 27 蒸餾塔 17 洗滌塔 28 蒸餾後之氨 18 填充段 29 溶解單元 19 除霧墊 30 去離子水 20 飽和之氨水溶液 31 水溶液 21 循環泵 32 輸送管線 圖 2 : - 31 氨水 52 晶圓支架 32 純氣態氨 54 酸淨化站 41 脫餾站 55 鹽酸水溶液 42 過氧化氫水溶液 56 過氧化氫水溶液 43 硫酸 57 沖洗站 44 沖洗站 58 乾燥站 45 淨化器 59 稀氫氟酸 46 過氧化氫水溶液 60 沖洗站 47 混合物 61 晶圓或晶圓批量 -22-1 - (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家樣準(CNS ) A4規格(210X297公釐) 經濟部中央標準局員工消費合作社印製 淠1·公 Λ7 B7 t 五、 發明説明(22) 48 過氧化氫水溶液 62 產生器 49 混合物 63 機器人 50 沖洗站 64 雛子型純化器 51 晶圓 65 氟化氫儲槽 圖3A : 14 過滹器 73 通風 30 去離子水 74 產品出口 71 來自離子型純化器之氨 75 音波傳感器 72 49%氟化氫供應器 76 熱交換器 圖 3B1 : 45 泵 86 程序控制器 .71 來自雛子型純化器之氨 87 氣動閥 81 纯淨乾燥空氣 ' 88 控制室沖洗 82 120伏特交流電源 89 氦氣 83 氮氣供應 90 供應室 84 排氣 91 系統排放口 85 去雛子水虿排放口 92 供應室凹槽 圖 3B2 : 11 儲槽 91 系統排放口 30 去離子水供應 92 供應室凹槽 59 49%氫氟酸 _ 22-2 ~ (請先閲讀背面之注意事項再填寫本頁) 訂 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐) 87 7 . 3 Λ7 B7 五、發明説明(23) 圖 3B3 : 76 熱交換器 94 冷卻水供應 92 供應室凹槽 95 冷卻水回流 93 氟化氨出口 圖 4 : 23 廢物 97 通風 62 產生器 98 無水氟化氫 74 產品 99 塔 75 傳感器 100 鈍化塔 76 熱交換器 101 鍋爐 96 回流冷凝器 (請先閲讀背面又注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 -22-3 - 本纸張尺度適用中國國家標率(CNS ) A4規格(2彳0X297公釐)V. Description of the invention (13) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs Ammonia with metal impurities below 100 値 trillion points. However, it may be advantageous to include a distillation column 27 in certain applications (for example, several furnace purification applications). Examples are: the use of ammonia in a furnace or chemical vapor deposition (CVD). For example, 2, ammonia is used for chemical vapor deposition, and distillation column is used to remove non-condensable substances, such as gas and nitrogen, because it may interfere with the chemical vapor deposition effect. In addition, because the ammonia industry and water in the washing tower 17 are saturated, depending on the characteristics and efficiency of the distillation tower, a dehydration can be added between the washing tower 17 and the distillation tower 27 in the system. unit. Regardless of any such flow path, the resulting fluid, gaseous ammonia or water, may be further divided into two or more substreams, each of which is directed to a different one. The use station, so the purification unit can simultaneously supply Purified ammonia is used by many stations. Purification of hydrogen gas' Fig. 4 (a) shows an on-site hydrogen fluoride purifier in accordance with a representative embodiment of the innovations shown. After the purification of hydrogen gas is completed, arsenic is first oxidized to a positive pentavalent oxidation state, and then fractionated to remove the As + 5 and gold osmium impurities. Please refer to U.S. Patent 4,929,435 for reference. As shown in the literature, many different gasifiers have been used to achieve this project, please refer to the following patents and patent applications, all of which are hereby incorporated by reference: US # 3, 68 5 , 370; CA81-177347s; EP # 351,1 07; JP # 61-151, 002; CA74-101216; CA78-23343; US »5,047,226; USSR # 3 7 9,533; CA8 1-1 77348 t; US # 4,954 , 33 0; UStt4, 9 5 5, 43 0 -15-This paper size is applicable to China National Standard (CNS) A4 (210X 297 mm) (Please read the precautions on the back first and write this page.) IT- ----- IP- · A7 B7 V. Description of the invention (14); EPff276,5 42; US # 4,083,4 41 5 ¾ CA98-P200672f〇 It has been shown that fluorine gas (F2) is effective (published by other scholars and experts Works), and is recognized as the current desirable embodiment.卩 2 requires expensive plumbing work and safety protection, but it has been shown to be effective. Another desirable specific embodiment is the use of ammonium persulfate [(nh4) s208], whose ultra-high purity is readily available on the market. Usually, the desired oxidant, 傜, does not introduce gold 羼 atoms. So other options include hydrogenated hydrogen and ozone. Another less desirable supply is pseudo-Keros acid (persulfuric acid, h2so5, which produces hydrogen peroxide in its aqueous solution). Another option is pseudo chlorine dioxide, but its serious disadvantage is its explosiveness. Other options include nitric acid and chlorine, but both can introduce anions, which must be separated. (It is not as important to reduce the content of non-gadolinium ions as it is to reduce the content of gold ions, but it is still hoped that the content of anions will reach 1 billion points or less. The initial introduction of anions will increase the load of the ionic purification stage. Central standard of the Ministry of Economic Affairs Printed by the Bureau ’s Consumer Cooperative (please read the notes on the back before filling out this page). Signar of United Chemicals, in cooperation with the inventor of this case, uses a The initial arsenic gasification step has successfully produced ultrapure hydrogen fluoride. The inventors of this case were not familiar with all the steps of the procedure, but the achievements of United Chemical Company in this area further confirmed the feasibility of the inventions shown. Permanganic acid The most commonly used oxidant for potassium injury, if another ionic purifier shown is added and hydrofluoric acid is applied. Destillation, it is predicted that it can also be used for ultra-purification. However, this product makes the cation load of the purifier greatly Increased, so the oxidant without gold tincture is more desirable. -16-This paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B 7 '' V. Description of the invention (15) In another specific embodiment / high purity 4 9¾ hydrofluoric acid, which does not actually contain arsenic, can also be used. Since the third quarter of 1995, Low arsenic raw materials are commercially available and can be combined with on-site ionic purification methods that do not contain arsenic oxidants to implement on-site production of ultra-pure hydrofluoric acid. The hydrogen fluoride processing flowchart includes a batch arsenic removal and evaporation stage A fractionating column to remove most of the other impurities, an ionic purifier to eliminate the pollutants removed by the non-k fractionating column, and the final hydrogen gas supplier. By adding an oxidant [KMη04 or (NH4) 2 S2 08] And an oxygen ion source (such as KHF2) to form the salt K2AsF7, arsenic will become a positive pentavalent state and remain in the evaporator during the distillation process. This will be a batch method, so the cover is slow to react. Sufficient time is required to complete the reaction before distillation. At nominal temperature, the contact time required for this procedure is about 1 hour. In a continuous procedure, high temperature and high pressure are required to complete the reaction. Use) or bulky containers and piping. In this procedure, under constant stirring with the hope that the reaction time is appropriate, hydrogen fluoride is sent to a batch evaporator and treated with a gasifier. After that, a The fractionation column distills hydrogenated gas, thus removing the entire metal impurities. Those who have achieved significant reductions during this step include: Group 1 (I) Printed by the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the note on the back first) Please fill in this page again) Group 2 (I) Calcium, Strontium, I Bay Groups 3 to 12 (MA to HA) Chromium, Tungsten, Molybdenum, Manganese, Iron, Copper, Zinc Group 13 (I) Gallium, Section Group 14 (IV) tin, lead, and group 15 (VH) antimony. -17-This paper applies the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B7 5. Description of the invention (1 6) The fractionation The function of the tower is equivalent to a series of early distillation5. To achieve this effect. I. The tower is filled with a high surface area material9 and the liquid flows in the reverse direction9 to ensure the completion of the falling liquid and the rising vapor. Fully balanced 〇 Installed in this column only-Partial condenser to provide reflux 9 After »Purified gaseous hydrogen fluoride is introduced into the hydrogenated ion-type purifier 0 Except for possible entrained chemicals or quenching operation In order to remove these chemicals 9 According to the normal standard 9 The hydrogenated gas at this stage has been regarded as pure. The gaseous hydrogen gas is introduced into the supply system. Λ-Λ. 刖 > The gasified hydrogen ion type purifier will be used In order to ensure a higher purity, 0 certain elements may be present in the treatment solution or introduced into the ionic purifier to absorb the sulphate inclusions in the body of the gasified hydrogen flowing. 〇 Tests in the ionic purifier have shown: The following elements The level of pollution in the gaseous hydrogen gas flowing atm has been greatly reduced: Group 2 (I) 缌 and Barium Groups 6 to 12 (VI A to IA) Chromium m and Copper 9 Group 13 (I) Boron 9 Group 14 (IV) Lead > Tin »and Group 15 (V) Antimony 0 Many of these elements are very useful in guiding the elimination of arsenic pollution The entrainment in the distillation column can be printed at the Consumer Cooperatives of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling this page). This step removes it by distillation. The gasification of argon in the final product is as described below. Many elements form low boiling fractions with hydrogen fluoride above the aqueous solution: Group 1 (I) Sodium and potassium, ** 18- This paper standard applies to Chinese National Standards (CNS) A4 specifications (210X297 mm) V. Description of the invention (1 7) A7 B7 Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs, printed in the first half of the year, distillate the supply of ammonia, gas, and so on. Degree can be pure and tube steaming method tower :. One removes the chemical dissolving guide device, it is equipped with Duan Dian, for the system of defluorinated hydroelectricity. In this picture, I) stage washing, ballast extract strips. Its tower. Production field-< The iron is the first example, the hydrogen of the carburetor. 现 The formula of the current material process: use one to enter the production process} pure chemical transformation, the original flow} mold ¾ to be practical The examples of the starting acid in the PFM type fluorine repair are: hydrogenated U-subsidiary hydrogen is aerated from the same example (all towers and chemical products can be purely ionized, and the hydrogen content in the reservoir is not good.) The field of fluorine U is washed at a slow speed with real scattered elements. 9- Calcium, iron and aluminum are measured Π5Φ, the image body. The addition body is a single retarder, hydrogen, 19, and it can be used for production after the action of super acid. Jinhuadi-will be the first fluoride U-channel acid to produce 3AA dry gas, dehydrogenated, divided into ring. Another fluorine. In the picture, if there is more, the hydrogen produced by the distillation Department of Department: The rate of cleavage of this method is 111. The acidity of the new step is controlled by the new step. The acidity is instant. The segmentation is large and the concentration is absent) 0 indicates that the gas is reversible and the hydrogen is significantly degraded (I (VD (I Remove Feigan Yaoyin fluorine-free 3A lead to B2. The heavy-duty 2813 is best installed in the steam removal tower if it must be replaced in the pure middle hydrogen chart. The M3 chart is the first one. For example, 1 device is in motion. The element of the pseudo guide tower should be divided by the slow gas 3B instrument (please read the precautions on the back before filling this page) The paper size applies to the Chinese National Standard (CNS) A4 Specification (210X297 mm) A7 B7 " V. Invention description (18) Lotus is turned under saturation of about 105¾, so these "light" impurities escape at the top of the tower. This second washing tower can produce high purity Hydrogen acid. In the presently preferred embodiment, the liquid volume of the ammonia gas purifier is 10 liters, and the maximum gas flow rate is about 10 standard liters / minute. The washing liquid is sufficiently rinsed (continuous or incremental) ), At least once every 24 hours. Product concentration (in the two production steps) is measured with sound velocity measurement equipment (Massa (Produced by the laboratory)-concentration measurement-but other measurement methods use conductivity, density, refractive index, or infrared spectrum. When setting the processing program, you must determine the concentration of hydrogen fluoride and ammonia dissolved in water. For example, 1 kg 40¾ weight A solution of ammonium fluoride will contain 400 grams of ammonium fluoride and 600 grams of ultrapure water. Because the molar ratio of hydrogen fluoride to ammonia in pure ammonium fluoride is 1: 1, 400 grams of ammonium fluoride will contain 216 grams of anhydrous hydrogen fluoride And 184 grams of anhydrous ammonia. (Ammonium fluoride molecular weight = 37, hydrogen fluoride molecular weight = 20, ammonia molecular weight = 17). Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs (谙 Read the precautions on the back before filling this page) Under Hydrogen When the acid preparation process is completed, 216 grams of hydrogen fluoride is dissolved in 600 grams of water, or a concentration of 26.5¾ by weight. On-board instrument control can add hydrogen fluoride to achieve the desired concentration. Another way is to use 49¾ concentration of hydrofluoric acid Dilute to this concentration. After the 26.5¾ concentration hydrogen fluoride aqueous solution is formed, add 189 grams of ammonia to make a 40¾ concentration aqueous ammoniated ammonium solution. For different applications, other concentrations and Morse ratios can be set by concentration instrument control. Modifications and Changes -20-This paper size applies to China National Standard (CNS) A4 (210X297 mm) Employees' Cooperatives, Central Standards Bureau, Ministry of Economic Affairs Print A7 B7 V. Description of Invention (1 9) If you are proficient in this technology #, the innovative concepts described in this patent application can be modified or changed according to the different applications, so the patent is granted The technical content of the application is by no means limited to the listed examples. For example, the innovative technologies shown are not strictly limited to the manufacture of integrated circuits, but can also be applied to the manufacture of discrete semiconductor components, such as optoelectronics Device and power supply unit. Taking another example, the innovative technology shown can also be applied to other technical aspects of manufacturing using integrated circuit manufacturing methods, such as: thin-film magnetic heads and movable dot-matrix liquid crystal displays; but their main uses are pseudo-integrals. For circuit manufacturing, other uses of the technology shown are secondary. For another example, the use of a scrubber for liquid-gas contact is not strictly required; a foamer can be used instead, but its gas / liquid contact is poor, although it is unavoidable. In addition, it is optional: other separate filtration or multi-stage filtration can be combined with the purification equipment shown. It should be noted that, although the currently desirable specific embodiments do not do so, several additives may be added to the purified water if necessary. As mentioned above, the main embodiment is a field purification system. Another way is that, in another group of less desirable embodiments, the purification system shown can also be applied to operate some manufacturing units to produce ultra-high-purity chemicals for preparation, but 'this workaround is specific The examples do not provide the advantages of on-site purification described above. As mentioned above, these applications will encounter the inherent risks of handling ultra-high purity chemicals; but for those that need to be packed _ 21, this paper size applies the Chinese National Standard (CNS) A4 specification (210X297 mm) --- ----- ΙΓ; -------. 玎 ------ Φ, '(Please read the notes on the back before filling in this page] 87 7. 3 Λ7 B7 V. Description of the invention (21 ) Description of the printed components of the Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs: Figure 1: 11 Storage tank 22 Liquid level sensor 12 Ammonia vapor 23 Waste 13 Close valve 24 Deionized water 14 Filter 25 Pump 15 Filtered ammonia vapor 26 Washed Ammonia 16 Pressure regulator 27 Distillation tower 17 Washing tower 28 Distilled ammonia 18 Filling section 29 Dissolving unit 19 Defog pad 30 Deionized water 20 Saturated ammonia solution 31 Aqueous solution 21 Circulating pump 32 Conveying pipeline Figure 2:-31 Ammonia water 52 Wafer holder 32 Pure gaseous ammonia 54 Acid purification station 41 Destillation station 55 Hydrochloric acid aqueous solution 42 Hydrogen peroxide aqueous solution 56 Hydrogen peroxide aqueous solution 43 Sulfuric acid 57 Rinse station 44 Rinse station 58 Drying station 45 Purifier 59 Dilute hydrogen fluoride Acid 46 Hydrogen peroxide solution 60 Rinse station 47 Mixture 61 Wafer or wafer batch-22-1-(Please read the precautions on the back before filling out this page) This paper size applies to China National Sample Standard (CNS) A4 specifications ( 210X297 mm) Printed by the Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 公 1 · Λ7 B7 t V. Description of the Invention (22) 48 Aqueous hydrogen peroxide solution 62 Generator 49 Mixture 63 Robot 50 Washing station 64 Chrysanthemum purifier 51 crystal Circle 65 Hydrogen Fluoride Tank Figure 3A: 14 Passager 73 Ventilation 30 Deionized Water 74 Product Outlet 71 Ammonia from Ion Purifier 75 Acoustic Sensor 72 49% Hydrogen Fluoride Supply 76 Heat Exchanger Figure 3B1: 45 Pump 86 Program Control .71 Ammonia from the young purifier 87 Pneumatic valve 81 Pure dry air '88 Control room flush 82 120 Volt AC power 89 Helium 83 Nitrogen supply 90 Supply chamber 84 Exhaust 91 System exhaust port 85 Port 92 supply chamber groove Figure 3B2: 11 storage tank 91 system discharge port 30 deionized water supply 92 supply chamber groove 59 49% hydrofluoric acid _ 22-2 ~ (Please read the notes on the back before filling out this page) The size of the paper used for the edition is applicable to the Chinese National Standard (CNS) A4 (210X297 mm) 87 7. 3 Λ7 B7 V. Description of the invention (23) Figure 3B3 : 76 heat exchanger 94 cooling water supply 92 supply chamber recess 95 cooling water return 93 ammonia fluoride outlet Figure 4: 23 waste 97 ventilation 62 generator 98 anhydrous hydrogen fluoride 74 product 99 tower 75 sensor 100 passivation tower 76 heat exchanger 101 Boiler 96 reflux condenser (please read the back and pay attention to the matter before filling out this page) Printed by the Consumer Cooperatives of the Central Standards Bureau of the Ministry of Economic Affairs -22-3-This paper size applies to China National Standard (CNS) A4 specifications (2 彳0X297 mm)

Claims (1)

經濟部智慧財產局員工消費合作社印製· A8 B8 C8 D8^、申請專利範圍 i. 一種在一半導體裝置製造設施內提供超高純度緩衝氟 化鞍或氫氟酸給一半導體製造作業之規場裝置,其中包括: 一第一蒸發源,經連接K接受一氟化氫源並自該處提供 一氟化氫蒸氣流動體; 一第二蒸發源,經連接K接受一液態氨源並自該處提供 一氨蒸氣流動體; 該氟化氫蒸氣流動體經連接以通過一第一離子型純化器 單元,該單元提供大量再循環高純度水(其中含有 高濃度氫化氟),與該氟化氫蒸氣流動體接觸,其 中該第一純化器使經純化之氟化氫氣體通過;及 該氨蒸氣流動體經連接K通過一第二離子型纯化器單元 ,該簞元提供大量再循環高純度水(其中含有高濃 度氫氧化銨),與該氨蒸氣流動體接觸,其中該第 二純化器使經鈍化之氨氣通過; 一第一產生器單元,經連接Μ接受來自該第一純化器之 該氟化氫蒸氣流動體並使其與高纯度酸性去離子水 相結合以生產超純氫氟酸,該第一產生器單元亦使 受輕微雜質污染之不純氟化氫氣體頂餾分流體通過; 該超純氫氟酸及該氨蒸氣流動體經連接Μ通入一第二產 生器,該產生器使該氨蒸氣併入該超鈍氫氟酸內,. 以生產全部金属之濃度低於300兆分點及任何一種 金屬之濃度低於10兆分點之超純緩衝氫氟酸;及 一配管連接組,該連接組將該水溶液分送至半導體裝置 製造設施內各使用點。 -23 - 本紙張;^度適用+國國家標準(CNS )八4^格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) l· 裝. 訂 經濟部智慧財產局員工消費合作社印製· A8 B8 C8 D8^、申請專利範圍 i. 一種在一半導體裝置製造設施內提供超高純度緩衝氟 化鞍或氫氟酸給一半導體製造作業之規場裝置,其中包括: 一第一蒸發源,經連接K接受一氟化氫源並自該處提供 一氟化氫蒸氣流動體; 一第二蒸發源,經連接K接受一液態氨源並自該處提供 一氨蒸氣流動體; 該氟化氫蒸氣流動體經連接以通過一第一離子型純化器 單元,該單元提供大量再循環高純度水(其中含有 高濃度氫化氟),與該氟化氫蒸氣流動體接觸,其 中該第一純化器使經純化之氟化氫氣體通過;及 該氨蒸氣流動體經連接K通過一第二離子型纯化器單元 ,該簞元提供大量再循環高純度水(其中含有高濃 度氫氧化銨),與該氨蒸氣流動體接觸,其中該第 二純化器使經鈍化之氨氣通過; 一第一產生器單元,經連接Μ接受來自該第一純化器之 該氟化氫蒸氣流動體並使其與高纯度酸性去離子水 相結合以生產超純氫氟酸,該第一產生器單元亦使 受輕微雜質污染之不純氟化氫氣體頂餾分流體通過; 該超純氫氟酸及該氨蒸氣流動體經連接Μ通入一第二產 生器,該產生器使該氨蒸氣併入該超鈍氫氟酸內,. 以生產全部金属之濃度低於300兆分點及任何一種 金屬之濃度低於10兆分點之超純緩衝氫氟酸;及 一配管連接組,該連接組將該水溶液分送至半導體裝置 製造設施內各使用點。 -23 - 本紙張;^度適用+國國家標準(CNS )八4^格(210X297公釐) (請先閱讀背面之注意事項再填寫本頁) l· 裝. 訂 A8 B8 C8 D8 六、申請專利範圍 2. 如申請專利範園第1項之琨場裝置,其中該氟化氫源 包括無水氟化氫。 3. 如申請專利範園第1項之規場裝置,其中所有該等大 量再循環高純度水均不含任何添加劑。 4. 如申請專利範圍第1項之現場裝置,其中該氟化氫源 實質上不含砷。 5. 如申請專利範圍第1項之現場裝置,其中該氟化氫源 使用超純無砷氟化氫水溶液。 (請先閱讀背面之注意事項再填寫本頁) 經濟部智慧財產局員工消費合作社印製 -24 - 本紙張尺度適用中國國家標準(CNS ) A4規格(210X297公釐)Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs · A8 B8 C8 D8 ^, patent application scope i. A gauge for providing ultra-high-purity buffered saddle fluoride or hydrofluoric acid to a semiconductor manufacturing operation in a semiconductor device manufacturing facility The device includes: a first evaporation source, which receives a hydrogen fluoride source via connection K and provides a hydrogen fluoride vapor stream there; a second evaporation source, which receives a liquid ammonia source via connection K, and provides ammonia from there A vapor flow body; the hydrogen fluoride vapor flow body is connected to pass through a first ionic purifier unit, which provides a large amount of recycled high-purity water (containing a high concentration of hydrogen fluoride) in contact with the hydrogen fluoride vapor flow body, wherein the The first purifier passes the purified hydrogen fluoride gas; and the ammonia vapour stream passes through a second ionic purifier unit through K, which provides a large amount of recycled high-purity water (containing a high concentration of ammonium hydroxide) In contact with the ammonia vapor flowing body, wherein the second purifier passes the passivated ammonia gas; a first generator unit is connected through the M The hydrogen fluoride vapor stream from the first purifier is combined with high-purity acidic deionized water to produce ultra-pure hydrofluoric acid, and the first generator unit also tops off the impure hydrogen fluoride gas contaminated by slight impurities. The fluid passes; the ultra-pure hydrofluoric acid and the ammonia vapor flowing body are connected to a second generator through the connection M, the generator causes the ammonia vapor to be incorporated into the ultra-blunt hydrofluoric acid to produce a concentration of all metals Ultra-pure buffered hydrofluoric acid with a concentration of less than 300 trillion points and a concentration of any metal below 10 trillion points; and a piping connection group that distributes the aqueous solution to each use point in a semiconductor device manufacturing facility. -23-This paper; ^ degree applicable + national national standard (CNS) 8 4 ^ (210X297 mm) (Please read the precautions on the back before filling out this page) l. Packing. Orders for consumption by the Intellectual Property Bureau of the Ministry of Economic Affairs Printed by a cooperative · A8 B8 C8 D8 ^, patent application scope i. A gauge device that provides ultra-high-purity buffered saddle fluoride or hydrofluoric acid to a semiconductor manufacturing operation in a semiconductor device manufacturing facility, including: a first An evaporation source receives a hydrogen fluoride source via connection K and provides a hydrogen fluoride vapor stream from there; a second evaporation source receives a liquid ammonia source via connection K and provides an ammonia vapor stream from there; the hydrogen fluoride vapor The fluid is connected to pass through a first ionic purifier unit, which provides a large amount of recycled high-purity water (containing a high concentration of hydrogen fluoride) in contact with the hydrogen fluoride vapor flow, wherein the first purifier enables purification Hydrogen fluoride gas passes through; and the ammonia vapour stream passes through a second ionic purifier unit through K, which provides a large amount of recycled high-purity water (containing high concentration Ammonium oxide), which is in contact with the ammonia vapor stream, wherein the second purifier passes the passivated ammonia gas; a first generator unit, which is connected to receive the hydrogen fluoride vapor stream from the first purifier and It is combined with high-purity acidic deionized water to produce ultra-pure hydrofluoric acid, and the first generator unit also passes the top fraction fluid of impure hydrogen fluoride gas contaminated with slight impurities; the ultra-pure hydrofluoric acid and the ammonia vapor The mobile body is connected to a second generator through the connection M, which causes the ammonia vapor to be incorporated into the super-blunt hydrofluoric acid, so that the concentration of all metals produced is lower than 300 trillion points and the concentration of any one metal is low Ultra-pure buffered hydrofluoric acid at 10 trillion points; and a piping connection group that distributes the aqueous solution to each use point in a semiconductor device manufacturing facility. -23-This paper; ^ degree applies + national national standard (CNS) 8 4 ^ grid (210X297 mm) (Please read the precautions on the back before filling in this page) l · Packing. Order A8 B8 C8 D8 VI. Application Scope of patent 2. For example, the Horiba device of the first patent application park, wherein the hydrogen fluoride source includes anhydrous hydrogen fluoride. 3. For the field device of the patent application No. 1 of the patent field, all of these large quantities of recycled high-purity water do not contain any additives. 4. The on-site device of item 1 in the scope of patent application, wherein the hydrogen fluoride source is substantially free of arsenic. 5. The field device as claimed in item 1 of the patent application, wherein the hydrogen fluoride source uses an ultra-pure arsenic-free hydrogen fluoride aqueous solution. (Please read the precautions on the back before filling this page) Printed by the Consumer Cooperatives of the Intellectual Property Bureau of the Ministry of Economic Affairs -24-This paper size applies to China National Standard (CNS) A4 (210X297 mm)
TW85102564A 1995-07-07 1996-03-05 An on-site device, in a semiconductor device fabrication facility, for providing ultra-high-purity buffered ammonium fluoride or hydrofluoric acid to a semiconductor manufacturing operation TW382004B (en)

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