TW374345U - Grinding platform for the chemical machine - Google Patents

Grinding platform for the chemical machine

Info

Publication number
TW374345U
TW374345U TW085207885U TW85207885U TW374345U TW 374345 U TW374345 U TW 374345U TW 085207885 U TW085207885 U TW 085207885U TW 85207885 U TW85207885 U TW 85207885U TW 374345 U TW374345 U TW 374345U
Authority
TW
Taiwan
Prior art keywords
grinding platform
chemical machine
chemical
machine
grinding
Prior art date
Application number
TW085207885U
Other languages
Chinese (zh)
Inventor
Jun-Yuan Wu
xu-wen Yang
Huo-Tie Lu
Original Assignee
United Microelectronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Microelectronics Corp filed Critical United Microelectronics Corp
Priority to TW085207885U priority Critical patent/TW374345U/en
Publication of TW374345U publication Critical patent/TW374345U/en

Links

TW085207885U 1996-05-27 1996-05-27 Grinding platform for the chemical machine TW374345U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW085207885U TW374345U (en) 1996-05-27 1996-05-27 Grinding platform for the chemical machine

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085207885U TW374345U (en) 1996-05-27 1996-05-27 Grinding platform for the chemical machine

Publications (1)

Publication Number Publication Date
TW374345U true TW374345U (en) 1999-11-11

Family

ID=54650428

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085207885U TW374345U (en) 1996-05-27 1996-05-27 Grinding platform for the chemical machine

Country Status (1)

Country Link
TW (1) TW374345U (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645936B (en) * 2012-05-14 2019-01-01 日商荏原製作所股份有限公司 Polishing pad for grinding a workpiece, chemical mechanical polishing device and method for polishing the same using the chemical mechanical polishing device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI645936B (en) * 2012-05-14 2019-01-01 日商荏原製作所股份有限公司 Polishing pad for grinding a workpiece, chemical mechanical polishing device and method for polishing the same using the chemical mechanical polishing device

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