TW367575B - Wafer suppressing means for semiconductor wafer packaging container - Google Patents

Wafer suppressing means for semiconductor wafer packaging container

Info

Publication number
TW367575B
TW367575B TW086117472A TW86117472A TW367575B TW 367575 B TW367575 B TW 367575B TW 086117472 A TW086117472 A TW 086117472A TW 86117472 A TW86117472 A TW 86117472A TW 367575 B TW367575 B TW 367575B
Authority
TW
Taiwan
Prior art keywords
semiconductor wafer
flexible flake
wafer
flake
packaging container
Prior art date
Application number
TW086117472A
Other languages
English (en)
Inventor
Yoichi Sakurai
Akira Miyahara
Yoshikiyo Ichino
Akira Nakai
Original Assignee
Komatsu Denshi Kinzoku Kk
Komatsu Kasei Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Denshi Kinzoku Kk, Komatsu Kasei Kk filed Critical Komatsu Denshi Kinzoku Kk
Application granted granted Critical
Publication of TW367575B publication Critical patent/TW367575B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/673—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere using specially adapted carriers or holders; Fixing the workpieces on such carriers or holders
    • H01L21/6735—Closed carriers
    • H01L21/67383—Closed carriers characterised by substrate supports

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Packaging Frangible Articles (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Packaging Of Annular Or Rod-Shaped Articles, Wearing Apparel, Cassettes, Or The Like (AREA)
TW086117472A 1996-11-28 1997-11-21 Wafer suppressing means for semiconductor wafer packaging container TW367575B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP35384796A JPH10163310A (ja) 1996-11-28 1996-11-28 半導体ウェハ包装容器のウェハ押さえ構造

Publications (1)

Publication Number Publication Date
TW367575B true TW367575B (en) 1999-08-21

Family

ID=18433628

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086117472A TW367575B (en) 1996-11-28 1997-11-21 Wafer suppressing means for semiconductor wafer packaging container

Country Status (3)

Country Link
US (1) US6168025B1 (zh)
JP (1) JPH10163310A (zh)
TW (1) TW367575B (zh)

Families Citing this family (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE20106909U1 (de) * 2001-04-21 2002-08-29 ACR Automation in Cleanroom GmbH, 78078 Niedereschach Transportbox für optische Masken
DE20106908U1 (de) * 2001-04-21 2002-08-29 ACR Automation in Cleanroom GmbH, 78078 Niedereschach Transportkassette für Halbleitersubstrat-Masken
US7017758B2 (en) * 2003-07-09 2006-03-28 Chartered Semiconductor Manufacturing Ltd. Wafer protective cassette
US7395933B2 (en) * 2005-06-14 2008-07-08 Intel Corporation Carrier to hold semiconductor device using opposed rollers
TW200933799A (en) * 2008-01-21 2009-08-01 Visera Technologies Co Ltd Wafer cassette
US7971722B2 (en) * 2008-08-08 2011-07-05 Gudeng Precision Industral Co, Ltd Wafer container with restrainer
CN102956527A (zh) * 2012-11-19 2013-03-06 无锡九条龙汽车设备有限公司 一种用于半导体器件封装的复合式加热轨
TWM453240U (zh) * 2013-01-10 2013-05-11 Gudeng Prec Ind Co Ltd 具有保護套的限制件

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3934733A (en) * 1974-10-10 1976-01-27 Worden Raymond D Transfer device
US4061228A (en) * 1976-12-20 1977-12-06 Fluoroware, Inc. Shipping container for substrates
US4248346A (en) * 1979-01-29 1981-02-03 Fluoroware, Inc. Shipping container for semiconductor substrate wafers
US4630732A (en) * 1984-09-06 1986-12-23 Robert Snyman Storage device for storing disc-shaped articles
AU5983986A (en) * 1985-07-09 1987-01-15 Basf Aktiengesellschaft Container for discs
US4817799A (en) * 1986-10-06 1989-04-04 Empak, Inc. Disk package
US4718552A (en) * 1986-12-11 1988-01-12 Fluoroware, Inc. Disk shipper and transfer tray
US4752007A (en) * 1986-12-11 1988-06-21 Fluoroware, Inc. Disk shipper
US5025924A (en) * 1988-11-16 1991-06-25 Toppan Printing Co., Ltd. Container
US5046615A (en) * 1989-04-03 1991-09-10 Fluoroware, Inc. Disk shipper
US5253755A (en) * 1991-03-20 1993-10-19 Fluoroware, Inc. Cushioned cover for disk container

Also Published As

Publication number Publication date
US6168025B1 (en) 2001-01-02
JPH10163310A (ja) 1998-06-19

Similar Documents

Publication Publication Date Title
TW200509286A (en) Susceptor apparatus for inverted type mocvd reactor
TW367575B (en) Wafer suppressing means for semiconductor wafer packaging container
SG98382A1 (en) Device and process for liquid treatment of wafer-shaped articles
EP1055486A3 (en) Dressing apparatus and polishing apparatus
SG97858A1 (en) Chip scale surface mount package for semiconductor device and process of fabricating the same
SG106568A1 (en) Chip scale surface mount package for semiconductor device and process of fabricating the same
MY128556A (en) Use of a wafer edge polishing composition
SG92671A1 (en) Chip scale surface mount packages for semiconductor device and process of fabricating the same
TW328294U (en) Container for semiconductor wafers with unique wafer cushioning means
FR2768135B1 (fr) Support pour le transport de tranches de semi-conducteur
WO1999025904A8 (en) Electric potential shaping apparatus for holding a semiconductor wafer during electroplating
IL123235A (en) Semiconductor wafer polishing apparatus
IL148872A (en) Module containing controlled minienvironment for atmospheric wafer transport
GB2342060B (en) Wafer edge polishing method and apparatus
EP1170088A3 (en) Semiconductor wafer grinding method and machine
SG75876A1 (en) Process and device for polishing semiconductor wafers
GB9906029D0 (en) Method and apparatus for lapping or polishing semiconductor silicon single crystal wafer
HK1015952A1 (en) Group iii-v compound semiconductor wafer
SG100709A1 (en) Semiconductor wafer assembly and machining apparatus having chuck tables for holding the same
AU3101600A (en) Single station cutting apparatus for separating semiconductor packages
EP0768706A3 (en) Clamping structure in air-tightly sealable container
SG67503A1 (en) Process for etching semiconductor wafers
EP1313573A4 (en) APPARATUS FOR CLEANING CONTAINERS FOR SEMICONDUCTOR WAFERS
GB0028820D0 (en) Non-planar surface for semiconductor chips
EP1418135A3 (de) Portionspackung und Vorrichtung zur Herstellung eines Aromagetränkes