TW367572B - Surface defect detection method for transparent film - Google Patents

Surface defect detection method for transparent film

Info

Publication number
TW367572B
TW367572B TW087103007A TW87103007A TW367572B TW 367572 B TW367572 B TW 367572B TW 087103007 A TW087103007 A TW 087103007A TW 87103007 A TW87103007 A TW 87103007A TW 367572 B TW367572 B TW 367572B
Authority
TW
Taiwan
Prior art keywords
wafer
detection
transparent film
detection method
defect detection
Prior art date
Application number
TW087103007A
Other languages
English (en)
Inventor
li-zhe Chen
Original Assignee
United Semiconductor Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by United Semiconductor Corp filed Critical United Semiconductor Corp
Priority to TW087103007A priority Critical patent/TW367572B/zh
Application granted granted Critical
Publication of TW367572B publication Critical patent/TW367572B/zh

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  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
TW087103007A 1998-03-02 1998-03-02 Surface defect detection method for transparent film TW367572B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW087103007A TW367572B (en) 1998-03-02 1998-03-02 Surface defect detection method for transparent film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW087103007A TW367572B (en) 1998-03-02 1998-03-02 Surface defect detection method for transparent film

Publications (1)

Publication Number Publication Date
TW367572B true TW367572B (en) 1999-08-21

Family

ID=57941250

Family Applications (1)

Application Number Title Priority Date Filing Date
TW087103007A TW367572B (en) 1998-03-02 1998-03-02 Surface defect detection method for transparent film

Country Status (1)

Country Link
TW (1) TW367572B (zh)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103377960A (zh) * 2012-04-26 2013-10-30 无锡华润上华科技有限公司 晶圆缺陷检测方法
CN110828294A (zh) * 2018-08-14 2020-02-21 合肥晶合集成电路有限公司 化学机械研磨设备的研磨性能检测方法

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN103377960A (zh) * 2012-04-26 2013-10-30 无锡华润上华科技有限公司 晶圆缺陷检测方法
CN103377960B (zh) * 2012-04-26 2016-08-24 无锡华润上华科技有限公司 晶圆缺陷检测方法
CN110828294A (zh) * 2018-08-14 2020-02-21 合肥晶合集成电路有限公司 化学机械研磨设备的研磨性能检测方法

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