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Publication of TW364022BpublicationCriticalpatent/TW364022B/en
A composition for microetching of copper and copper alloy which comprises: (1) 1 to 15% by weight of a copper complex of diazole, diazole substituted with a C1-C3 alkyl group, triazole, triazole substituted with a C1-C3 alkyl group or tetrazole, (2) 1 to 30% by weight of a water soluble saturated or unsaturated aliphatic monocarboxylic acid, a water soluble saturated or unsaturated aliphatic dicarboxylic acid, a water soluble hydroxycarboxylic acid, aminosulfonic acid or chloropropionic acid, and (3) 0.5 to 10% by weight of a chloride or bromide ion. The composition can exhibit excellent adhesiveness to solder resists and provide roughened surfaces of copper alloys with adequate irregularities with deep convexes and concaves and superior solderability.
TW083103223A1994-03-041994-04-12Composition for microetching copper or copper alloys
TW364022B
(en)
Process for the preparation of substituted triazoles useful for combating phytopathogenic fungi through mechanical dissemination for improving the commercial value of agronomic crop plants including mechanical methods for preparing the fungicidal compositions