TW362249B - Controller of polishing process termination point for semiconductor wafer - Google Patents

Controller of polishing process termination point for semiconductor wafer

Info

Publication number
TW362249B
TW362249B TW086119021A TW86119021A TW362249B TW 362249 B TW362249 B TW 362249B TW 086119021 A TW086119021 A TW 086119021A TW 86119021 A TW86119021 A TW 86119021A TW 362249 B TW362249 B TW 362249B
Authority
TW
Taiwan
Prior art keywords
polishing process
controller
semiconductor wafer
termination point
process termination
Prior art date
Application number
TW086119021A
Other languages
Chinese (zh)
Inventor
Lei Yue
Original Assignee
Asia Ic Mic Process Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asia Ic Mic Process Inc filed Critical Asia Ic Mic Process Inc
Priority to TW086119021A priority Critical patent/TW362249B/en
Application granted granted Critical
Publication of TW362249B publication Critical patent/TW362249B/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

The invention employs the Kalman filter of aerospace technology that used in the polishing process provided by chemical machinery and used to terminate the wafer polishing. In which the linear detector is used for the error correction of Kalman's location and apply the Preston's equation as the initial correction for termination detection. According to this method, the precision of polishing process can reach about 70 Å.
TW086119021A 1997-12-16 1997-12-16 Controller of polishing process termination point for semiconductor wafer TW362249B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086119021A TW362249B (en) 1997-12-16 1997-12-16 Controller of polishing process termination point for semiconductor wafer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086119021A TW362249B (en) 1997-12-16 1997-12-16 Controller of polishing process termination point for semiconductor wafer

Publications (1)

Publication Number Publication Date
TW362249B true TW362249B (en) 1999-06-21

Family

ID=57940799

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086119021A TW362249B (en) 1997-12-16 1997-12-16 Controller of polishing process termination point for semiconductor wafer

Country Status (1)

Country Link
TW (1) TW362249B (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101670541B (en) * 2009-09-15 2012-05-23 厦门大学 Fast polishing traversing processing method of heavy-calibre planar optical elements
TWI626121B (en) * 2013-11-27 2018-06-11 美商應用材料股份有限公司 Computer program product, computer-implemented method, and polishing system for adjusting polishing rates during substrate polishing with predictive filters

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101670541B (en) * 2009-09-15 2012-05-23 厦门大学 Fast polishing traversing processing method of heavy-calibre planar optical elements
TWI626121B (en) * 2013-11-27 2018-06-11 美商應用材料股份有限公司 Computer program product, computer-implemented method, and polishing system for adjusting polishing rates during substrate polishing with predictive filters

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