TW362249B - Controller of polishing process termination point for semiconductor wafer - Google Patents
Controller of polishing process termination point for semiconductor waferInfo
- Publication number
- TW362249B TW362249B TW086119021A TW86119021A TW362249B TW 362249 B TW362249 B TW 362249B TW 086119021 A TW086119021 A TW 086119021A TW 86119021 A TW86119021 A TW 86119021A TW 362249 B TW362249 B TW 362249B
- Authority
- TW
- Taiwan
- Prior art keywords
- polishing process
- controller
- semiconductor wafer
- termination point
- process termination
- Prior art date
Links
Landscapes
- Mechanical Treatment Of Semiconductor (AREA)
Abstract
The invention employs the Kalman filter of aerospace technology that used in the polishing process provided by chemical machinery and used to terminate the wafer polishing. In which the linear detector is used for the error correction of Kalman's location and apply the Preston's equation as the initial correction for termination detection. According to this method, the precision of polishing process can reach about 70 Å.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086119021A TW362249B (en) | 1997-12-16 | 1997-12-16 | Controller of polishing process termination point for semiconductor wafer |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW086119021A TW362249B (en) | 1997-12-16 | 1997-12-16 | Controller of polishing process termination point for semiconductor wafer |
Publications (1)
Publication Number | Publication Date |
---|---|
TW362249B true TW362249B (en) | 1999-06-21 |
Family
ID=57940799
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086119021A TW362249B (en) | 1997-12-16 | 1997-12-16 | Controller of polishing process termination point for semiconductor wafer |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW362249B (en) |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101670541B (en) * | 2009-09-15 | 2012-05-23 | 厦门大学 | Fast polishing traversing processing method of heavy-calibre planar optical elements |
TWI626121B (en) * | 2013-11-27 | 2018-06-11 | 美商應用材料股份有限公司 | Computer program product, computer-implemented method, and polishing system for adjusting polishing rates during substrate polishing with predictive filters |
-
1997
- 1997-12-16 TW TW086119021A patent/TW362249B/en active
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN101670541B (en) * | 2009-09-15 | 2012-05-23 | 厦门大学 | Fast polishing traversing processing method of heavy-calibre planar optical elements |
TWI626121B (en) * | 2013-11-27 | 2018-06-11 | 美商應用材料股份有限公司 | Computer program product, computer-implemented method, and polishing system for adjusting polishing rates during substrate polishing with predictive filters |
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