TW360901B - Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device - Google Patents
Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display deviceInfo
- Publication number
- TW360901B TW360901B TW086112252A TW86112252A TW360901B TW 360901 B TW360901 B TW 360901B TW 086112252 A TW086112252 A TW 086112252A TW 86112252 A TW86112252 A TW 86112252A TW 360901 B TW360901 B TW 360901B
- Authority
- TW
- Taiwan
- Prior art keywords
- thin
- film
- peeling
- film device
- thin film
- Prior art date
Links
Landscapes
- Thin Film Transistor (AREA)
Applications Claiming Priority (5)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP22564396 | 1996-08-27 | ||
JP30037396A JP4619461B2 (ja) | 1996-08-27 | 1996-11-12 | 薄膜デバイスの転写方法、及びデバイスの製造方法 |
JP31559096A JP4619462B2 (ja) | 1996-08-27 | 1996-11-12 | 薄膜素子の転写方法 |
JP30037196A JP3809681B2 (ja) | 1996-08-27 | 1996-11-12 | 剥離方法 |
JP19308197A JP3809710B2 (ja) | 1997-07-03 | 1997-07-03 | 薄膜素子の転写方法 |
Publications (1)
Publication Number | Publication Date |
---|---|
TW360901B true TW360901B (en) | 1999-06-11 |
Family
ID=57940711
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086112252A TW360901B (en) | 1996-08-27 | 1997-08-26 | Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW360901B (zh) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US7074644B2 (en) | 2003-01-28 | 2006-07-11 | Seiko Epson Corporation | Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus |
TWI561387B (en) * | 2012-11-14 | 2016-12-11 | Ind Tech Res Inst | Film debonding apparatus |
US10586816B2 (en) | 2001-07-16 | 2020-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
US10763322B2 (en) | 2013-12-02 | 2020-09-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
TWI808663B (zh) * | 2021-06-17 | 2023-07-11 | 台灣積體電路製造股份有限公司 | 半導體結構及其形成方法 |
-
1997
- 1997-08-26 TW TW086112252A patent/TW360901B/zh not_active IP Right Cessation
Cited By (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10586816B2 (en) | 2001-07-16 | 2020-03-10 | Semiconductor Energy Laboratory Co., Ltd. | Semiconductor device and peeling off method and method of manufacturing semiconductor device |
US7074644B2 (en) | 2003-01-28 | 2006-07-11 | Seiko Epson Corporation | Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus |
TWI561387B (en) * | 2012-11-14 | 2016-12-11 | Ind Tech Res Inst | Film debonding apparatus |
US10763322B2 (en) | 2013-12-02 | 2020-09-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10854697B2 (en) | 2013-12-02 | 2020-12-01 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10872947B2 (en) | 2013-12-02 | 2020-12-22 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US10879331B2 (en) | 2013-12-02 | 2020-12-29 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US11004925B2 (en) | 2013-12-02 | 2021-05-11 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US11672148B2 (en) | 2013-12-02 | 2023-06-06 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
US12048207B2 (en) | 2013-12-02 | 2024-07-23 | Semiconductor Energy Laboratory Co., Ltd. | Display device and method for manufacturing the same |
TWI808663B (zh) * | 2021-06-17 | 2023-07-11 | 台灣積體電路製造股份有限公司 | 半導體結構及其形成方法 |
US11908708B2 (en) | 2021-06-17 | 2024-02-20 | Taiwan Semiconductor Manufacturing Co., Ltd. | Laser de-bonding carriers and composite carriers thereof |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |