TW360901B - Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device - Google Patents

Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device

Info

Publication number
TW360901B
TW360901B TW086112252A TW86112252A TW360901B TW 360901 B TW360901 B TW 360901B TW 086112252 A TW086112252 A TW 086112252A TW 86112252 A TW86112252 A TW 86112252A TW 360901 B TW360901 B TW 360901B
Authority
TW
Taiwan
Prior art keywords
thin
film
peeling
film device
thin film
Prior art date
Application number
TW086112252A
Other languages
English (en)
Inventor
Tatsuya Shimoda
Satoshi Inoue
Wakao Miyazawa
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP30037396A external-priority patent/JP4619461B2/ja
Priority claimed from JP31559096A external-priority patent/JP4619462B2/ja
Priority claimed from JP30037196A external-priority patent/JP3809681B2/ja
Priority claimed from JP19308197A external-priority patent/JP3809710B2/ja
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Application granted granted Critical
Publication of TW360901B publication Critical patent/TW360901B/zh

Links

Landscapes

  • Thin Film Transistor (AREA)
TW086112252A 1996-08-27 1997-08-26 Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device TW360901B (en)

Applications Claiming Priority (5)

Application Number Priority Date Filing Date Title
JP22564396 1996-08-27
JP30037396A JP4619461B2 (ja) 1996-08-27 1996-11-12 薄膜デバイスの転写方法、及びデバイスの製造方法
JP31559096A JP4619462B2 (ja) 1996-08-27 1996-11-12 薄膜素子の転写方法
JP30037196A JP3809681B2 (ja) 1996-08-27 1996-11-12 剥離方法
JP19308197A JP3809710B2 (ja) 1997-07-03 1997-07-03 薄膜素子の転写方法

Publications (1)

Publication Number Publication Date
TW360901B true TW360901B (en) 1999-06-11

Family

ID=57940711

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086112252A TW360901B (en) 1996-08-27 1997-08-26 Method of peeling thin-film device, method of transferring thin-film device, thin-film device thereby, thin-film IC circuit device, and liquid crystal display device

Country Status (1)

Country Link
TW (1) TW360901B (zh)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7074644B2 (en) 2003-01-28 2006-07-11 Seiko Epson Corporation Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus
TWI561387B (en) * 2012-11-14 2016-12-11 Ind Tech Res Inst Film debonding apparatus
US10586816B2 (en) 2001-07-16 2020-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
US10763322B2 (en) 2013-12-02 2020-09-01 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
TWI808663B (zh) * 2021-06-17 2023-07-11 台灣積體電路製造股份有限公司 半導體結構及其形成方法

Cited By (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US10586816B2 (en) 2001-07-16 2020-03-10 Semiconductor Energy Laboratory Co., Ltd. Semiconductor device and peeling off method and method of manufacturing semiconductor device
US7074644B2 (en) 2003-01-28 2006-07-11 Seiko Epson Corporation Method of manufacturing thin film element, thin film transistor circuit substrate, active matrix display device, electro-optical device, and electronic apparatus
TWI561387B (en) * 2012-11-14 2016-12-11 Ind Tech Res Inst Film debonding apparatus
US10763322B2 (en) 2013-12-02 2020-09-01 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US10854697B2 (en) 2013-12-02 2020-12-01 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US10872947B2 (en) 2013-12-02 2020-12-22 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US10879331B2 (en) 2013-12-02 2020-12-29 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US11004925B2 (en) 2013-12-02 2021-05-11 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US11672148B2 (en) 2013-12-02 2023-06-06 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
US12048207B2 (en) 2013-12-02 2024-07-23 Semiconductor Energy Laboratory Co., Ltd. Display device and method for manufacturing the same
TWI808663B (zh) * 2021-06-17 2023-07-11 台灣積體電路製造股份有限公司 半導體結構及其形成方法
US11908708B2 (en) 2021-06-17 2024-02-20 Taiwan Semiconductor Manufacturing Co., Ltd. Laser de-bonding carriers and composite carriers thereof

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees