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Priority claimed from JP7116641Aexternal-prioritypatent/JPH08290353A/en
Application filed by Komatsu Denshi Kinzoku KkfiledCriticalKomatsu Denshi Kinzoku Kk
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Publication of TW360573BpublicationCriticalpatent/TW360573B/en
Processing Of Stones Or Stones Resemblance Materials
(AREA)
Abstract
To avoid damage to a blade part of a band saw by adhering a jig to a crystalline ingot of a semi-conductor through the adhesive filled in the clearance between a top or a tail of the ingot and a recess to prevent the top or the tail from being overturned on a bed even when the ingot is cut by a band saw cutting machine. When a top 2a is cut, a cut piece is held by an ingot cutting jig 1 through the adhesive. The top 2a is detached from an ingot 2 without being overturned in a V-shaped groove for fixing a work. Thus, a blade part of a band saw 5 is not damaged. When a tail 2b of the ingot 2 is cut, the tail 2b is inserted into the cutting jig 1 in a similar manner to the cutting of the top 2a, and the ingot cutting jig 1 is connected to the ingot 2 using the adhesive to avoid the damage to the blade part of the band saw.
TW085108354A1995-04-191996-07-10Cutting jig for mono-crystal ingot of semiconductor
TW360573B
(en)