MY127982A - Method for sawing a moulded lead frame package - Google Patents

Method for sawing a moulded lead frame package

Info

Publication number
MY127982A
MY127982A MYPI20002854A MY127982A MY 127982 A MY127982 A MY 127982A MY PI20002854 A MYPI20002854 A MY PI20002854A MY 127982 A MY127982 A MY 127982A
Authority
MY
Malaysia
Prior art keywords
sawing
lead frame
frame package
moulded
present
Prior art date
Application number
Inventor
Lee Kock Huat
Chan Boon Meng
Phuah Kian Keung
Lee Huan Sin
Cheong Mun Tuck
Original Assignee
Carsem M Sdn Bhd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Carsem M Sdn Bhd filed Critical Carsem M Sdn Bhd
Priority to MYPI20002854 priority Critical patent/MY127982A/en
Priority to US09/887,646 priority patent/US6544817B2/en
Priority to DE10154854A priority patent/DE10154854A1/en
Priority to GB0127532A priority patent/GB2382218A/en
Publication of MY127982A publication Critical patent/MY127982A/en

Links

Landscapes

  • Lead Frames For Integrated Circuits (AREA)
  • Dicing (AREA)

Abstract

THE PRESENT INVENTION RELATES TO A NEW METHOD FOR SAWING A MOULDED LEAD FRAME PACKAGE (I) INTO INDIVIDUAL INTEGRATED CIRCUITS (IX). IN THE PRESENT INVENTION SAWING OF THE RNOULDED LEAD FRAME PACKAGE (I) IS DONE ON THE LEADS (13) INSTEAD OF ON THE CONNECTING BAR (14) RESULTING IN LESS HEAT BEING GENERATED DURING CUTTING. THIS RESULTS IN HIGHER CUTTING SPEED AND LONGER DICING BLADE LIFE. (FIG 1)
MYPI20002854 2000-06-23 2000-06-23 Method for sawing a moulded lead frame package MY127982A (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
MYPI20002854 MY127982A (en) 2000-06-23 2000-06-23 Method for sawing a moulded lead frame package
US09/887,646 US6544817B2 (en) 2000-06-23 2001-06-22 Method for sawing a moulded leadframe package
DE10154854A DE10154854A1 (en) 2000-06-23 2001-11-08 Sawing method of molded lead frame package, involves sawing package attached to carrier, along a dicing line formed on leads
GB0127532A GB2382218A (en) 2000-06-23 2001-11-16 Method for sawing a moulded leadframe package

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
MYPI20002854 MY127982A (en) 2000-06-23 2000-06-23 Method for sawing a moulded lead frame package

Publications (1)

Publication Number Publication Date
MY127982A true MY127982A (en) 2007-01-31

Family

ID=47278561

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20002854 MY127982A (en) 2000-06-23 2000-06-23 Method for sawing a moulded lead frame package

Country Status (1)

Country Link
MY (1) MY127982A (en)

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