AU2001265386A1 - Saw blade for cutting integrated circuit package boards - Google Patents

Saw blade for cutting integrated circuit package boards

Info

Publication number
AU2001265386A1
AU2001265386A1 AU2001265386A AU6538601A AU2001265386A1 AU 2001265386 A1 AU2001265386 A1 AU 2001265386A1 AU 2001265386 A AU2001265386 A AU 2001265386A AU 6538601 A AU6538601 A AU 6538601A AU 2001265386 A1 AU2001265386 A1 AU 2001265386A1
Authority
AU
Australia
Prior art keywords
integrated circuit
saw blade
circuit package
cutting integrated
package boards
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
AU2001265386A
Inventor
Adi Anuar Basarudin
Edgardo Padrinao
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Advanced Micro Devices Inc
Original Assignee
Advanced Micro Devices Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Advanced Micro Devices Inc filed Critical Advanced Micro Devices Inc
Publication of AU2001265386A1 publication Critical patent/AU2001265386A1/en
Abandoned legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23D—PLANING; SLOTTING; SHEARING; BROACHING; SAWING; FILING; SCRAPING; LIKE OPERATIONS FOR WORKING METAL BY REMOVING MATERIAL, NOT OTHERWISE PROVIDED FOR
    • B23D61/00—Tools for sawing machines or sawing devices; Clamping devices for these tools
    • B23D61/02—Circular saw blades
    • B23D61/021—Types of set; Variable teeth, e.g. variable in height or gullet depth; Varying pitch; Details of gullet
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B28—WORKING CEMENT, CLAY, OR STONE
    • B28D—WORKING STONE OR STONE-LIKE MATERIALS
    • B28D1/00—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor
    • B28D1/02—Working stone or stone-like materials, e.g. brick, concrete or glass, not provided for elsewhere; Machines, devices, tools therefor by sawing
    • B28D1/12—Saw-blades or saw-discs specially adapted for working stone
    • B28D1/121—Circular saw blades
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T83/00—Cutting
    • Y10T83/929—Tool or tool with support
    • Y10T83/9319—Toothed blade or tooth therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mining & Mineral Resources (AREA)
  • Sawing (AREA)
AU2001265386A 2000-06-29 2001-06-05 Saw blade for cutting integrated circuit package boards Abandoned AU2001265386A1 (en)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US09/605,856 US6422229B1 (en) 2000-06-29 2000-06-29 Saw blade for cutting integrated circuit package boards
US09605856 2000-06-29
PCT/US2001/018407 WO2002002265A1 (en) 2000-06-29 2001-06-05 Saw blade for cutting integrated circuit package boards

Publications (1)

Publication Number Publication Date
AU2001265386A1 true AU2001265386A1 (en) 2002-01-14

Family

ID=24425478

Family Applications (1)

Application Number Title Priority Date Filing Date
AU2001265386A Abandoned AU2001265386A1 (en) 2000-06-29 2001-06-05 Saw blade for cutting integrated circuit package boards

Country Status (4)

Country Link
US (1) US6422229B1 (en)
AU (1) AU2001265386A1 (en)
TW (1) TW544355B (en)
WO (1) WO2002002265A1 (en)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6422229B1 (en) 2000-06-29 2002-07-23 Advanced Micro Devices, Inc. Saw blade for cutting integrated circuit package boards
WO2004069768A1 (en) 2003-02-03 2004-08-19 Eidgenössische Technische Hochschule Zürich Method for production of a b/n/c/si ceramic from a borazine precursor, ceramics made by said method and use of the ceramic made by said method
US6903304B1 (en) 2003-09-12 2005-06-07 Asat Ltd. Process for dressing molded array package saw blade
KR20050095733A (en) * 2004-03-27 2005-09-30 엘지.필립스 엘시디 주식회사 Cutting wheel of glass and method for fabricating liquid crystal display device using the same
US7210474B2 (en) * 2005-03-23 2007-05-01 Saint-Gobain Abrasives Technology Company Saw blade with cutting depth gauge
US10582933B2 (en) * 2018-03-22 2020-03-10 Capstone Surgical Techologies, LLC Oscillating surgical cutting tool

Family Cites Families (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
BE614239A (en) * 1962-02-22 1962-06-18 Diamant Boart Sa Cutting disc with diamond segments.
US3291583A (en) * 1963-02-19 1966-12-13 Frederick W Lindblad Method of making a saw
BE705527A (en) 1967-10-24 1968-03-01
DE2853650A1 (en) * 1978-12-13 1980-06-19 Tusch Kg Diamant CUTTING DISC
DE3024850A1 (en) 1980-07-01 1982-01-28 Heliotronic Forschungs- und Entwicklungsgesellschaft für Solarzellen-Grundstoffe mbH, 8263 Burghausen SEGMENTED CUTTING DISC
DE3524301A1 (en) * 1985-07-06 1987-01-15 Semikron Gleichrichterbau METHOD FOR PRODUCING SEMICONDUCTOR ELEMENTS
US4854295A (en) 1988-06-01 1989-08-08 Federal-Mogul Corporation Wear resistant abrasive cutting wheel
JPH02298421A (en) 1989-05-09 1990-12-10 Kaken:Kk Structure of tooth part of rotational saw and manufacture thereof
US5272114A (en) * 1990-12-10 1993-12-21 Amoco Corporation Method for cleaving a semiconductor crystal body
JPH1058329A (en) 1996-08-23 1998-03-03 Noritake Dia Kk Segment chip structure of diamond cutting grinding wheel
US5839423A (en) * 1997-03-13 1998-11-24 Jones; Leon D. Cutting disc
US6304792B1 (en) * 1998-11-17 2001-10-16 Advanced Micro Devices, Inc. Separation of a multi-layer integrated circuit device and package
US6422229B1 (en) 2000-06-29 2002-07-23 Advanced Micro Devices, Inc. Saw blade for cutting integrated circuit package boards

Also Published As

Publication number Publication date
WO2002002265A1 (en) 2002-01-10
TW544355B (en) 2003-08-01
US6422229B1 (en) 2002-07-23

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