TW357417B - Non-line coating method to high-viscosity photo resist coating - Google Patents

Non-line coating method to high-viscosity photo resist coating

Info

Publication number
TW357417B
TW357417B TW085112959A TW85112959A TW357417B TW 357417 B TW357417 B TW 357417B TW 085112959 A TW085112959 A TW 085112959A TW 85112959 A TW85112959 A TW 85112959A TW 357417 B TW357417 B TW 357417B
Authority
TW
Taiwan
Prior art keywords
wafer
spinning speed
clamp
photo resist
photo
Prior art date
Application number
TW085112959A
Other languages
Chinese (zh)
Inventor
Li-Ming Wang
guo-yu Xiao
Original Assignee
Vanguard Int Semiconduct Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Vanguard Int Semiconduct Corp filed Critical Vanguard Int Semiconduct Corp
Priority to TW085112959A priority Critical patent/TW357417B/en
Priority to JP09270768A priority patent/JP3109800B2/en
Application granted granted Critical
Publication of TW357417B publication Critical patent/TW357417B/en

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)

Abstract

A sort of photo-sensitive coating method for semiconductor wafers, including the following steps: providing a clamp; providing the core to the clamp; providing a photo-sensitive photo resist dispenser; installation of the wafer on the clamp; spinning of the vacuum clamp on the core to a first spinning speed; dispensing the pre-moist agent to the wafer on the clamp; stabilizing the first spinning speed; accelerating the wafer to the second spinning speed; stabilizing the second spinning speed; accelerating the wafer to the third spinning speed; dispensing photo-=sensitive photoresist to the pre-moist agent on the wafer; accelerating the wafer to the fourth spinning speed; stabilizing the fourth spinning speed.
TW085112959A 1996-10-22 1996-10-22 Non-line coating method to high-viscosity photo resist coating TW357417B (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
TW085112959A TW357417B (en) 1996-10-22 1996-10-22 Non-line coating method to high-viscosity photo resist coating
JP09270768A JP3109800B2 (en) 1996-10-22 1997-10-03 Non-striation coating method for high viscosity resist coating film

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW085112959A TW357417B (en) 1996-10-22 1996-10-22 Non-line coating method to high-viscosity photo resist coating

Publications (1)

Publication Number Publication Date
TW357417B true TW357417B (en) 1999-05-01

Family

ID=21625513

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085112959A TW357417B (en) 1996-10-22 1996-10-22 Non-line coating method to high-viscosity photo resist coating

Country Status (2)

Country Link
JP (1) JP3109800B2 (en)
TW (1) TW357417B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711101B (en) * 2019-11-18 2020-11-21 錼創顯示科技股份有限公司 Wafter, wafer testing system, and method thereof

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2000082647A (en) * 1998-09-04 2000-03-21 Nec Corp Method and device for applying resist film
US20070128355A1 (en) * 2005-12-06 2007-06-07 Hynix Semiconductor, Inc. Method for coating photoresist material

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TWI711101B (en) * 2019-11-18 2020-11-21 錼創顯示科技股份有限公司 Wafter, wafer testing system, and method thereof

Also Published As

Publication number Publication date
JPH10135131A (en) 1998-05-22
JP3109800B2 (en) 2000-11-20

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