TW357417B - Non-line coating method to high-viscosity photo resist coating - Google Patents
Non-line coating method to high-viscosity photo resist coatingInfo
- Publication number
- TW357417B TW357417B TW085112959A TW85112959A TW357417B TW 357417 B TW357417 B TW 357417B TW 085112959 A TW085112959 A TW 085112959A TW 85112959 A TW85112959 A TW 85112959A TW 357417 B TW357417 B TW 357417B
- Authority
- TW
- Taiwan
- Prior art keywords
- wafer
- spinning speed
- clamp
- photo resist
- photo
- Prior art date
Links
Landscapes
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
Abstract
A sort of photo-sensitive coating method for semiconductor wafers, including the following steps: providing a clamp; providing the core to the clamp; providing a photo-sensitive photo resist dispenser; installation of the wafer on the clamp; spinning of the vacuum clamp on the core to a first spinning speed; dispensing the pre-moist agent to the wafer on the clamp; stabilizing the first spinning speed; accelerating the wafer to the second spinning speed; stabilizing the second spinning speed; accelerating the wafer to the third spinning speed; dispensing photo-=sensitive photoresist to the pre-moist agent on the wafer; accelerating the wafer to the fourth spinning speed; stabilizing the fourth spinning speed.
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW085112959A TW357417B (en) | 1996-10-22 | 1996-10-22 | Non-line coating method to high-viscosity photo resist coating |
JP09270768A JP3109800B2 (en) | 1996-10-22 | 1997-10-03 | Non-striation coating method for high viscosity resist coating film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW085112959A TW357417B (en) | 1996-10-22 | 1996-10-22 | Non-line coating method to high-viscosity photo resist coating |
Publications (1)
Publication Number | Publication Date |
---|---|
TW357417B true TW357417B (en) | 1999-05-01 |
Family
ID=21625513
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085112959A TW357417B (en) | 1996-10-22 | 1996-10-22 | Non-line coating method to high-viscosity photo resist coating |
Country Status (2)
Country | Link |
---|---|
JP (1) | JP3109800B2 (en) |
TW (1) | TW357417B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI711101B (en) * | 2019-11-18 | 2020-11-21 | 錼創顯示科技股份有限公司 | Wafter, wafer testing system, and method thereof |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2000082647A (en) * | 1998-09-04 | 2000-03-21 | Nec Corp | Method and device for applying resist film |
US20070128355A1 (en) * | 2005-12-06 | 2007-06-07 | Hynix Semiconductor, Inc. | Method for coating photoresist material |
-
1996
- 1996-10-22 TW TW085112959A patent/TW357417B/en active
-
1997
- 1997-10-03 JP JP09270768A patent/JP3109800B2/en not_active Expired - Fee Related
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI711101B (en) * | 2019-11-18 | 2020-11-21 | 錼創顯示科技股份有限公司 | Wafter, wafer testing system, and method thereof |
Also Published As
Publication number | Publication date |
---|---|
JPH10135131A (en) | 1998-05-22 |
JP3109800B2 (en) | 2000-11-20 |
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