TW354451B - Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent - Google Patents

Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent

Info

Publication number
TW354451B
TW354451B TW084109848A TW84109848A TW354451B TW 354451 B TW354451 B TW 354451B TW 084109848 A TW084109848 A TW 084109848A TW 84109848 A TW84109848 A TW 84109848A TW 354451 B TW354451 B TW 354451B
Authority
TW
Taiwan
Prior art keywords
cross
linked
polymer
mixture
forming
Prior art date
Application number
TW084109848A
Other languages
English (en)
Inventor
Ali Aicharlie
Jeffrey Donald Gelorme
Laura Louisek Kosbar
Original Assignee
Ibm
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ibm filed Critical Ibm
Application granted granted Critical
Publication of TW354451B publication Critical patent/TW354451B/zh

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L97/00—Compositions of lignin-containing materials
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08H—DERIVATIVES OF NATURAL MACROMOLECULAR COMPOUNDS
    • C08H6/00—Macromolecular compounds derived from lignin, e.g. tannins, humic acids
    • C—CHEMISTRY; METALLURGY
    • C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
    • C08L101/00—Compositions of unspecified macromolecular compounds
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/03—Use of materials for the substrate
    • H05K1/0313—Organic insulating material
    • H05K1/0353—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement
    • H05K1/0366—Organic insulating material consisting of two or more materials, e.g. two or more polymers, polymer + filler, + reinforcement reinforced, e.g. by fibres, fabrics
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0284—Paper, e.g. as reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/02—Fillers; Particles; Fibers; Reinforcement materials
    • H05K2201/0275—Fibers and reinforcement materials
    • H05K2201/0293—Non-woven fibrous reinforcement
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/17—Post-manufacturing processes
    • H05K2203/178—Demolishing, e.g. recycling, reverse engineering, destroying for security purposes; Using biodegradable materials

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Polymers & Plastics (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Organic Chemistry (AREA)
  • Materials Engineering (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Biochemistry (AREA)
  • Reinforced Plastic Materials (AREA)
  • Laminated Bodies (AREA)
  • Chemical And Physical Treatments For Wood And The Like (AREA)
  • Processes Of Treating Macromolecular Substances (AREA)
TW084109848A 1995-09-18 1995-09-18 Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent TW354451B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US52984995A 1995-09-18 1995-09-18

Publications (1)

Publication Number Publication Date
TW354451B true TW354451B (en) 1999-03-11

Family

ID=24111496

Family Applications (1)

Application Number Title Priority Date Filing Date
TW084109848A TW354451B (en) 1995-09-18 1995-09-18 Method of fabricating cross-linked biobased materials and structures fabricated therewith a method comprising the step of: forming the mixture of polymer and cross-linked agent

Country Status (4)

Country Link
US (1) US6339116B1 (zh)
KR (1) KR100228945B1 (zh)
MY (1) MY115836A (zh)
TW (1) TW354451B (zh)

Families Citing this family (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7060798B2 (en) * 2002-05-13 2006-06-13 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Modified protein adhesives and lignocellulosic composites made from the adhesives
US7252735B2 (en) * 2002-05-13 2007-08-07 State Of Oregon Acting By And Through The Oregon State Board Of Higher Education On Behalf Of Oregon State University Formaldehyde-free lignocellulosic adhesives and composites made from the adhesives
AU2003294258B2 (en) * 2003-01-16 2009-05-28 Cornell Research Foundation, Inc. Partially biodegradable temperature and pH sensitive hydrogel
US7265169B2 (en) * 2003-03-20 2007-09-04 State of Oregon Acting by and trhough the State Board of Higher Education on Behalf of Oregon State University Adhesive compositions and methods of using and making the same
CA2458159A1 (en) * 2004-01-22 2005-07-22 The State Of Oregon Acting By And Through The State Board Of Higher Educ Ation On Behalf Of Oregon State University Formaldehyde-free adhesives and lignocellulosic composites made from the adhesives
MXPA06012174A (es) * 2004-04-20 2007-04-19 Oregon State Adhesivos lignocelulosicos libres de formaldehido y materiales mixtos hechos a partir de los adhesivos.
WO2005112888A2 (en) * 2004-05-20 2005-12-01 Mentor Corporation Methods for making injectable polymer hydrogels
JP5315606B2 (ja) * 2006-12-01 2013-10-16 株式会社明電舎 絶縁性高分子材料組成物
JP5303840B2 (ja) * 2007-02-09 2013-10-02 株式会社明電舎 絶縁性高分子材料組成物
DE102010008393A1 (de) * 2010-02-10 2011-10-06 Technische Universität Dresden Substrat zur Bodenverbesserung mit Wasser speichernder Eigenschaft, Verfahren zur Herstellung und dessen Verwendung
EP2758568B1 (en) 2011-09-21 2020-01-15 Donaldson Company, Inc. Fine fibers made from polymer crosslinked with resinous aldehyde composition
MX369868B (es) * 2012-12-18 2019-11-25 Akzo Nobel Coatings Int Bv Composiciones de recubrimiento a base de lignina.
BR122022002492B1 (pt) 2013-03-09 2022-10-11 Donaldson Company, Inc Fibras finas feitas a partir de aditivos de reação
CN106573015B (zh) 2014-06-11 2021-11-26 麻省理工学院 肠溶弹性体
KR102034454B1 (ko) 2017-01-04 2019-10-21 주식회사 엘지화학 중합개시제 조성물, 이의 제조방법 및 이를 이용한 중합체의 제조방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3003978A (en) * 1958-06-06 1961-10-10 Du Pont A coating composition comprising a cellulose derivative, an epoxidized oil and an amine-aldehyde resin
US3149085A (en) * 1958-10-20 1964-09-15 West Virginia Pulp & Paper Co Method of making synthetic resin from lignin and an epoxide and resulting product
US3093604A (en) * 1960-06-30 1963-06-11 Agrashell Inc Composition comprising lignocellulosic extender and oxidized extracted lignin and adhesive solution containing same
US3984363A (en) * 1973-12-14 1976-10-05 Alelio Gaetano F D Polymerizable lignin derivatives
US4131573A (en) * 1977-02-04 1978-12-26 Westvaco Corporation Process for making lignin gels in bead form
US4657948A (en) * 1985-05-09 1987-04-14 Ethyl Corporation Fluid loss control in well cement slurries
US4769434A (en) * 1985-06-19 1988-09-06 South African Inventions Development Corporation Lignin derivative polymers
US4868059A (en) * 1987-11-16 1989-09-19 The Dow Chemical Company Curable composition containing a difunctional epoxy resin, a polyfunctional epoxy resin, a difunctional phenol and a polyfunctional phenol
US4931528A (en) * 1989-05-08 1990-06-05 Texaco Chemical Company 1-isopropyl-2-methyl imidazole as an epoxy resin curative
CN1035170C (zh) * 1992-09-19 1997-06-18 三星综合化学株式会社 用于高强度路面的透水性树脂混合物及该混合物制成的铺地砖和路面
GB2281709B (en) 1993-09-14 1998-04-08 Fujitsu Ltd Biodegradable resin moulded article

Also Published As

Publication number Publication date
MY115836A (en) 2003-09-30
US6339116B1 (en) 2002-01-15
KR970015671A (ko) 1997-04-28
KR100228945B1 (ko) 1999-11-01

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