TW353227B - Lead frame for LOC - Google Patents

Lead frame for LOC

Info

Publication number
TW353227B
TW353227B TW086109256A TW86109256A TW353227B TW 353227 B TW353227 B TW 353227B TW 086109256 A TW086109256 A TW 086109256A TW 86109256 A TW86109256 A TW 86109256A TW 353227 B TW353227 B TW 353227B
Authority
TW
Taiwan
Prior art keywords
loc
lead frame
semiconductor chip
chip mounting
mounting region
Prior art date
Application number
TW086109256A
Other languages
English (en)
Chinese (zh)
Inventor
Hiroshi Sugimoto
Shigeo Hagitani
Noriaki Takeya
Takaharu Yonemoto
Osamu Yoshioka
Original Assignee
Hitachi Cable
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable filed Critical Hitachi Cable
Application granted granted Critical
Publication of TW353227B publication Critical patent/TW353227B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Die Bonding (AREA)
  • Lead Frames For Integrated Circuits (AREA)
TW086109256A 1996-07-05 1997-07-01 Lead frame for LOC TW353227B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8176114A JPH1022442A (ja) 1996-07-05 1996-07-05 Ｌｏｃ用リードフレーム

Publications (1)

Publication Number Publication Date
TW353227B true TW353227B (en) 1999-02-21

Family

ID=16007935

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086109256A TW353227B (en) 1996-07-05 1997-07-01 Lead frame for LOC

Country Status (3)

Country Link
JP (1) JPH1022442A (ja)
KR (1) KR100432348B1 (ja)
TW (1) TW353227B (ja)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3063847B2 (ja) 1998-05-01 2000-07-12 日本電気株式会社 リードフレーム及びそれを用いた半導体装置

Also Published As

Publication number Publication date
KR100432348B1 (ko) 2004-10-26
JPH1022442A (ja) 1998-01-23
KR980012374A (ko) 1998-04-30

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