TW353227B - Lead frame for LOC - Google Patents
Lead frame for LOCInfo
- Publication number
- TW353227B TW353227B TW086109256A TW86109256A TW353227B TW 353227 B TW353227 B TW 353227B TW 086109256 A TW086109256 A TW 086109256A TW 86109256 A TW86109256 A TW 86109256A TW 353227 B TW353227 B TW 353227B
- Authority
- TW
- Taiwan
- Prior art keywords
- loc
- lead frame
- semiconductor chip
- chip mounting
- mounting region
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Die Bonding (AREA)
- Lead Frames For Integrated Circuits (AREA)
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP8176114A JPH1022442A (ja) | 1996-07-05 | 1996-07-05 | Loc用リードフレーム |
Publications (1)
Publication Number | Publication Date |
---|---|
TW353227B true TW353227B (en) | 1999-02-21 |
Family
ID=16007935
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW086109256A TW353227B (en) | 1996-07-05 | 1997-07-01 | Lead frame for LOC |
Country Status (3)
Country | Link |
---|---|
JP (1) | JPH1022442A (ja) |
KR (1) | KR100432348B1 (ja) |
TW (1) | TW353227B (ja) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3063847B2 (ja) | 1998-05-01 | 2000-07-12 | 日本電気株式会社 | リードフレーム及びそれを用いた半導体装置 |
-
1996
- 1996-07-05 JP JP8176114A patent/JPH1022442A/ja active Pending
-
1997
- 1997-07-01 TW TW086109256A patent/TW353227B/zh active
- 1997-07-02 KR KR1019970030676A patent/KR100432348B1/ko not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR100432348B1 (ko) | 2004-10-26 |
JPH1022442A (ja) | 1998-01-23 |
KR980012374A (ko) | 1998-04-30 |
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