TW353210B - Method of integrated circuit burn-in and wafer structure of performing burn-in - Google Patents

Method of integrated circuit burn-in and wafer structure of performing burn-in

Info

Publication number
TW353210B
TW353210B TW086114277A TW86114277A TW353210B TW 353210 B TW353210 B TW 353210B TW 086114277 A TW086114277 A TW 086114277A TW 86114277 A TW86114277 A TW 86114277A TW 353210 B TW353210 B TW 353210B
Authority
TW
Taiwan
Prior art keywords
wafer
burn
chips
wafer structure
integrated circuit
Prior art date
Application number
TW086114277A
Other languages
English (en)
Inventor
Wen-Chian Huang
Guo-Liang Wen
Original Assignee
Winbond Electronics Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Winbond Electronics Corp filed Critical Winbond Electronics Corp
Priority to TW086114277A priority Critical patent/TW353210B/zh
Application granted granted Critical
Publication of TW353210B publication Critical patent/TW353210B/zh

Links

Landscapes

  • Testing Or Measuring Of Semiconductors Or The Like (AREA)
TW086114277A 1997-10-01 1997-10-01 Method of integrated circuit burn-in and wafer structure of performing burn-in TW353210B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086114277A TW353210B (en) 1997-10-01 1997-10-01 Method of integrated circuit burn-in and wafer structure of performing burn-in

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086114277A TW353210B (en) 1997-10-01 1997-10-01 Method of integrated circuit burn-in and wafer structure of performing burn-in

Publications (1)

Publication Number Publication Date
TW353210B true TW353210B (en) 1999-02-21

Family

ID=57940116

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086114277A TW353210B (en) 1997-10-01 1997-10-01 Method of integrated circuit burn-in and wafer structure of performing burn-in

Country Status (1)

Country Link
TW (1) TW353210B (zh)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees