TW377502B
(en )
1999-12-21
Method of dual damascene
WO2003017359A1
(en )
2003-02-27
Semiconductor device and production method therefor, and plating solution
SG126670A1
(en )
2006-11-29
A method to avoid copper contamination on the sidewall of a via or a dual damascene structure
EP0887849A3
(en )
1999-06-16
Method for fabricating capacitor for semiconductor device
GB2391388A
(en )
2004-02-04
Electronic structure
WO2002005298A3
(en )
2002-05-16
Semiconductor inductor and methods for making the same
TW200701397A
(en )
2007-01-01
Selective copper alloy interconnections in semiconductor devices and methods of forming the same
KR950034564A
(ko )
1995-12-28
반도체 장치의 기계화학적 연마방법
TW200512871A
(en )
2005-04-01
Method of selectively making copper using plating technology
TW200515568A
(en )
2005-05-01
Circuit barrier structure of semiconductor package substrate and method for fabricating the same
TWI256684B
(en )
2006-06-11
Method of fabricate interconnect structures
TW429599B
(en )
2001-04-11
Method for forming inductors on the semiconductor substrate
EP1130628A4
(en )
2007-07-04
SEMICONDUCTOR DEVICE AND METHOD FOR MANUFACTURING THE SAME
EP1077485A3
(en )
2003-03-26
Method to deposit a platinum seed layer for use in selective copper plating
WO2003100825A3
(en )
2004-04-15
Multiple thickness semiconductor interconnect and method therefor
TW200518265A
(en )
2005-06-01
Copper damascene structure and semiconductor device including the structure and method of fabricating the same
WO2003012860A3
(en )
2003-11-27
Boron-doped titanium nitride layer for high aspect ratio semiconductor devices
US5084414A
(en )
1992-01-28
Metal interconnection system with a planar surface
WO2003036711A3
(en )
2003-12-31
Fill pattern generation for spin-on glass and related self-planarization deposition
WO2001084627A3
(en )
2002-04-11
Electronic devices with diffusion barrier and process for making same
TW200518875A
(en )
2005-06-16
Method of reducing pattern effect in CMP process, method of eliminating dishing phenomena after CMP process, and method of CMP rework
TW351000B
(en )
1999-01-21
Method of manufacturing damascene interconnection in multi-layer dielectric
TW200512869A
(en )
2005-04-01
Tungsten-copper interconnect and method for fabricating the same
TW331018B
(en )
1998-05-01
Method of fabricating semiconductor devices
TW200509301A
(en )
2005-03-01
Structure of interconnects and fabricating method thereof