TW350967B - Device for coating of a substrate - Google Patents
Device for coating of a substrateInfo
- Publication number
- TW350967B TW350967B TW085109947A TW85109947A TW350967B TW 350967 B TW350967 B TW 350967B TW 085109947 A TW085109947 A TW 085109947A TW 85109947 A TW85109947 A TW 85109947A TW 350967 B TW350967 B TW 350967B
- Authority
- TW
- Taiwan
- Prior art keywords
- divisions
- connection
- substrate
- cathodes
- cathode
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/32431—Constructional details of the reactor
- H01J37/32458—Vessel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J37/00—Discharge tubes with provision for introducing objects or material to be exposed to the discharge, e.g. for the purpose of examination or processing thereof
- H01J37/32—Gas-filled discharge tubes
- H01J37/34—Gas-filled discharge tubes operating with cathodic sputtering
- H01J37/3402—Gas-filled discharge tubes operating with cathodic sputtering using supplementary magnetic fields
- H01J37/3405—Magnetron sputtering
- H01J37/3408—Planar magnetron sputtering
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
- H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
- H01J2237/02—Details
- H01J2237/0203—Protection arrangements
- H01J2237/0206—Extinguishing, preventing or controlling unwanted discharges
Landscapes
- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Physical Vapour Deposition (AREA)
Abstract
A sort of device for coating of a substrate (2), in particular, a non-conductive layer having conductive target in activated atmosphere (such as oxidized atmosphere), including the device an AC power supply (15) with 2 cathodes (11, 12) containing magnets in connection, for common use of the cathode and the target, which is atomized by the target splash, leading to particles settled on the substrate (2), where one of the AC (15) goes in connection through the power supply wiring (13, 14) for connection to one cathode (11) and the other connected to another cathode (12), being each of the cathodes within the division (4, 8) and the divisions (32^, 40) forming the vacuum chamber (3) before going through a path (9) for connection with a part of the divisions (4, 8), where 2 divisions (4, 8) of two cathodes (11, 12) going to connect and for division by one or more divisions (5, 6, 7).
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
DE19540053A DE19540053A1 (en) | 1995-10-27 | 1995-10-27 | Substrate coating device for application of non-conductive layers using magnetron sputtering |
Publications (1)
Publication Number | Publication Date |
---|---|
TW350967B true TW350967B (en) | 1999-01-21 |
Family
ID=7775951
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085109947A TW350967B (en) | 1995-10-27 | 1996-08-15 | Device for coating of a substrate |
Country Status (2)
Country | Link |
---|---|
DE (1) | DE19540053A1 (en) |
TW (1) | TW350967B (en) |
Families Citing this family (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE19733940C2 (en) * | 1997-08-06 | 2001-03-01 | Leybold Systems Gmbh | Device for coating plate-shaped substrates with thin layers by means of cathode sputtering |
DE19834592A1 (en) * | 1998-07-31 | 2000-02-03 | Leybold Systems Gmbh | Device for coating plate-shaped substrates |
DE102005001334C5 (en) * | 2005-01-11 | 2011-07-14 | VON ARDENNE Anlagentechnik GmbH, 01324 | Compartment system of a longitudinal vacuum coating system |
Family Cites Families (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58120860A (en) * | 1982-01-06 | 1983-07-18 | 株式会社山東鉄工所 | Low temperature plasma treating apparatus of sheet-like substance |
US4608943A (en) * | 1984-10-24 | 1986-09-02 | Sovonics Solar Systems | Cathode assembly with localized profiling capabilities |
US4920917A (en) * | 1987-03-18 | 1990-05-01 | Teijin Limited | Reactor for depositing a layer on a moving substrate |
DE3912295C2 (en) * | 1989-04-14 | 1997-05-28 | Leybold Ag | Cathode sputtering system |
DE4324683C1 (en) * | 1993-07-22 | 1994-11-17 | Fraunhofer Ges Forschung | Procedure for adapting the generator in bipolar low-pressure glow processes |
DE4333825C1 (en) * | 1993-09-28 | 1995-02-23 | Mat Gmbh | Apparatus for coating elongated flexible products |
-
1995
- 1995-10-27 DE DE19540053A patent/DE19540053A1/en not_active Withdrawn
-
1996
- 1996-08-15 TW TW085109947A patent/TW350967B/en active
Also Published As
Publication number | Publication date |
---|---|
DE19540053A1 (en) | 1997-04-30 |
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