TW349239B - Device for removal of attachment on semiconductor wafer adhesion plate - Google Patents

Device for removal of attachment on semiconductor wafer adhesion plate

Info

Publication number
TW349239B
TW349239B TW086103790A TW86103790A TW349239B TW 349239 B TW349239 B TW 349239B TW 086103790 A TW086103790 A TW 086103790A TW 86103790 A TW86103790 A TW 86103790A TW 349239 B TW349239 B TW 349239B
Authority
TW
Taiwan
Prior art keywords
adhesion plate
removal
semiconductor wafer
attachment
brush head
Prior art date
Application number
TW086103790A
Other languages
English (en)
Inventor
Osamu Morikawa
Kiyoharu Miyakawa
Original Assignee
Komatsu Denshi Kinzoku Kk
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Komatsu Denshi Kinzoku Kk filed Critical Komatsu Denshi Kinzoku Kk
Application granted granted Critical
Publication of TW349239B publication Critical patent/TW349239B/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02041—Cleaning
    • H01L21/02043—Cleaning before device manufacture, i.e. Begin-Of-Line process
    • H01L21/02052—Wet cleaning only
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B08—CLEANING
    • B08B—CLEANING IN GENERAL; PREVENTION OF FOULING IN GENERAL
    • B08B1/00—Cleaning by methods involving the use of tools
    • B08B1/30—Cleaning by methods involving the use of tools by movement of cleaning members over a surface
    • B08B1/32—Cleaning by methods involving the use of tools by movement of cleaning members over a surface using rotary cleaning members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H01L21/2003—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy characterised by the substrate
    • H01L21/2007—Bonding of semiconductor wafers to insulating substrates or to semiconducting substrates using an intermediate insulating layer
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67017—Apparatus for fluid treatment
    • H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T279/00—Chucks or sockets
    • Y10T279/18—Pivoted jaw

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Grinding-Machine Dressing And Accessory Apparatuses (AREA)
TW086103790A 1996-05-31 1997-03-25 Device for removal of attachment on semiconductor wafer adhesion plate TW349239B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8175344A JPH09320999A (ja) 1996-05-31 1996-05-31 半導体ウェハ貼付プレートの付着物除去装置

Publications (1)

Publication Number Publication Date
TW349239B true TW349239B (en) 1999-01-01

Family

ID=15994431

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086103790A TW349239B (en) 1996-05-31 1997-03-25 Device for removal of attachment on semiconductor wafer adhesion plate

Country Status (3)

Country Link
US (1) US5911257A (zh)
JP (1) JPH09320999A (zh)
TW (1) TW349239B (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
TW392241B (en) * 1998-09-15 2000-06-01 Worldwild Semiconductor Mfg Co Wafer cleaning device
JP4079205B2 (ja) * 2000-08-29 2008-04-23 東京エレクトロン株式会社 基板洗浄装置及び基板洗浄方法
US6334230B1 (en) * 2001-01-12 2002-01-01 International Business Machines Corporation Wafer cleaning apparatus
JP2004223696A (ja) * 2002-11-26 2004-08-12 Musashi Seimitsu Ind Co Ltd 研削方法及びその装置
US7726540B2 (en) * 2005-12-12 2010-06-01 Asm Assembly Automation Ltd. Apparatus and method for arranging devices for processing
JP2014124626A (ja) * 2012-12-27 2014-07-07 3M Innovative Properties Co 被膜形成方法、被膜形成装置及び半導体チップの作製方法
KR102707579B1 (ko) * 2022-08-19 2024-09-19 세메스 주식회사 반도체 패키지 버 제거 장치 및 방법

Family Cites Families (11)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US2613943A (en) * 1950-07-20 1952-10-14 Morey Machinery Co Inc Chucking device for lathes
US3700250A (en) * 1970-12-01 1972-10-24 Continental Can Co Gripping type compound applying chuck assembly
JPH06103687B2 (ja) * 1988-08-12 1994-12-14 大日本スクリーン製造株式会社 回転式表面処理方法および回転式表面処理における処理終点検出方法、ならびに回転式表面処理装置
DE3919611A1 (de) * 1989-06-15 1990-12-20 Wacker Chemitronic Haltevorrichtung zur aufnahme von scheibenfoermigen gegenstaenden, insbesondere halbleiterscheiben, und verfahren zu deren behandlung
JPH04150027A (ja) * 1990-10-12 1992-05-22 Nippon Steel Corp ウエハ洗浄装置
JPH04363022A (ja) * 1991-06-06 1992-12-15 Enya Syst:Kk 貼付板洗浄装置
US5375291A (en) * 1992-05-18 1994-12-27 Tokyo Electron Limited Device having brush for scrubbing substrate
JP2862754B2 (ja) * 1993-04-19 1999-03-03 東京エレクトロン株式会社 処理装置及び回転部材
TW316995B (zh) * 1995-01-19 1997-10-01 Tokyo Electron Co Ltd
US5675856A (en) * 1996-06-14 1997-10-14 Solid State Equipment Corp. Wafer scrubbing device
US5725414A (en) * 1996-12-30 1998-03-10 Intel Corporation Apparatus for cleaning the side-edge and top-edge of a semiconductor wafer

Also Published As

Publication number Publication date
JPH09320999A (ja) 1997-12-12
US5911257A (en) 1999-06-15

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Legal Events

Date Code Title Description
MK4A Expiration of patent term of an invention patent