TW348366B - Method of removably mounting electronic components to a circuit board, and sockets formed by the methods - Google Patents

Method of removably mounting electronic components to a circuit board, and sockets formed by the methods

Info

Publication number
TW348366B
TW348366B TW085105624A TW85105624A TW348366B TW 348366 B TW348366 B TW 348366B TW 085105624 A TW085105624 A TW 085105624A TW 85105624 A TW85105624 A TW 85105624A TW 348366 B TW348366 B TW 348366B
Authority
TW
Taiwan
Prior art keywords
circuit board
support substrate
selected ones
contact structures
electronic component
Prior art date
Application number
TW085105624A
Other languages
Chinese (zh)
Inventor
H Dozier Thomas
N Eldridge Benjamin
W Grube Gary
Y Khandros Igor
L Mathieu Gaetan
Original Assignee
Formfactor Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from US08/533,584 external-priority patent/US5772451A/en
Application filed by Formfactor Inc filed Critical Formfactor Inc
Application granted granted Critical
Publication of TW348366B publication Critical patent/TW348366B/en

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
  • Coupling Device And Connection With Printed Circuit (AREA)

Abstract

Method of removably connecting an electronic component to a circuit board, the circuit board having a plurality of contact areas on a surface thereof, the electronic component having a plurality of terminals, comprising: disposing a support substrate between the electronic component and the circuit board, the support substrate having a top surface and a bottom surface opposite the top surface; mounting a plurality of resilient contact structures to the top surface of the support substrate; mounting a plurality of contact structures to the bottom surface of the support substrate; mounting the support substrate to the circuit board so as to make permanent electrical connections between selected ones of the contact structures and selected ones of the contact areas; urging the electronic component against the resilient contact structure so that a removable connection is made between selected ones of the terminals and selected ones of the resilient contact structures; and within the support substrate, interconnecting selected ones of the resilient contact structures with selected ones of the contact structures.
TW085105624A 1995-10-18 1996-05-13 Method of removably mounting electronic components to a circuit board, and sockets formed by the methods TW348366B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US08/533,584 US5772451A (en) 1993-11-16 1995-10-18 Sockets for electronic components and methods of connecting to electronic components

Publications (1)

Publication Number Publication Date
TW348366B true TW348366B (en) 1998-12-21

Family

ID=58264084

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085105624A TW348366B (en) 1995-10-18 1996-05-13 Method of removably mounting electronic components to a circuit board, and sockets formed by the methods

Country Status (1)

Country Link
TW (1) TW348366B (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9609749B2 (en) 2014-11-14 2017-03-28 Mediatek Inc. Printed circuit board having power/ground ball pad array

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9609749B2 (en) 2014-11-14 2017-03-28 Mediatek Inc. Printed circuit board having power/ground ball pad array
US9883591B2 (en) 2014-11-14 2018-01-30 Mediatek Inc. Microelectronic system including printed circuit board having improved power/ground ball pad array
US10194530B2 (en) 2014-11-14 2019-01-29 Mediatek Inc. Microelectronic system including printed circuit board having improved power/ground ball pad array

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees