TW344877B - Method for simultaneously measuring the accuracy and critical dimension of overlay of wafer metrology pattern - Google Patents
Method for simultaneously measuring the accuracy and critical dimension of overlay of wafer metrology patternInfo
- Publication number
- TW344877B TW344877B TW085105294A TW85105294A TW344877B TW 344877 B TW344877 B TW 344877B TW 085105294 A TW085105294 A TW 085105294A TW 85105294 A TW85105294 A TW 85105294A TW 344877 B TW344877 B TW 344877B
- Authority
- TW
- Taiwan
- Prior art keywords
- critical dimension
- overlay
- accuracy
- wafer metrology
- metrology pattern
- Prior art date
Links
Landscapes
- Exposure And Positioning Against Photoresist Photosensitive Materials (AREA)
- Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Abstract
A measurement of the critical dimension and overlay alignment of wafer metrology pattern applied on a semiconductor process, the wafer metrology pattern comprising: a center body for testing the reference of alignment in the overlay; at least a linear structure formed on the periphery of the center body for testing the reference of the critical dimension; and at least an L-shape structure formed on both sides of the center body for measuring the reference of the critical dimension.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW085105294A TW344877B (en) | 1996-05-03 | 1996-05-03 | Method for simultaneously measuring the accuracy and critical dimension of overlay of wafer metrology pattern |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW085105294A TW344877B (en) | 1996-05-03 | 1996-05-03 | Method for simultaneously measuring the accuracy and critical dimension of overlay of wafer metrology pattern |
Publications (1)
Publication Number | Publication Date |
---|---|
TW344877B true TW344877B (en) | 1998-11-11 |
Family
ID=58263782
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW085105294A TW344877B (en) | 1996-05-03 | 1996-05-03 | Method for simultaneously measuring the accuracy and critical dimension of overlay of wafer metrology pattern |
Country Status (1)
Country | Link |
---|---|
TW (1) | TW344877B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11119414B2 (en) | 2013-12-17 | 2021-09-14 | Asml Netherlands B.V. | Yield estimation and control |
-
1996
- 1996-05-03 TW TW085105294A patent/TW344877B/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US11119414B2 (en) | 2013-12-17 | 2021-09-14 | Asml Netherlands B.V. | Yield estimation and control |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |