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Application filed by Feng-Ming LiifiledCriticalFeng-Ming Lii
Priority to TW086116169ApriorityCriticalpatent/TW343382B/en
Application grantedgrantedCritical
Publication of TW343382BpublicationCriticalpatent/TW343382B/en
A uniaxial thermal/electrical conductive component comprising a plurality of metal members and a layer of non-metallic insulation mold, in which the non-metallic insulation mold has plural openings for fixing the metal members, and the metal members are fixed in the openings of the non-metallic insulation mold and protrude on both sides of the non-metallic insulation mold.
A PROCEDURE FOR ELECTROPOSING A HIGHLY LEVEL, DUCTILE, GLOSSY ENGINEERING COPPER PLATE, SUBSTANTIALLY UNIFORM HARDNESS AND NOT PICKABLE, ON A CONDUCTIVE SUBSTRATE