TW335523B - Apparatus and method of manufacturing semicondctor, semiconductor carrier - Google Patents

Apparatus and method of manufacturing semicondctor, semiconductor carrier

Info

Publication number
TW335523B
TW335523B TW086100369A TW86100369A TW335523B TW 335523 B TW335523 B TW 335523B TW 086100369 A TW086100369 A TW 086100369A TW 86100369 A TW86100369 A TW 86100369A TW 335523 B TW335523 B TW 335523B
Authority
TW
Taiwan
Prior art keywords
lead
semicondctor
leads
manufacturing
semiconductor carrier
Prior art date
Application number
TW086100369A
Other languages
Chinese (zh)
Inventor
Kenshi Itou
Toshio Sutou
Original Assignee
Toshiba Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Co Ltd filed Critical Toshiba Co Ltd
Application granted granted Critical
Publication of TW335523B publication Critical patent/TW335523B/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads
    • H01L23/49572—Lead-frames or other flat leads consisting of thin flexible metallic tape with or without a film carrier
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/50—Tape automated bonding [TAB] connectors, i.e. film carriers; Manufacturing methods related thereto

Abstract

A semicondctor device, having: semiconductor elements, and connection electrode formed on said semiconductor element by connection of the block-shaped inner lead, outer lead and the inside lead, the plurality of leads formed continuously and in between, the resin tape supporting between the leads, and metal plate led from said plurality of leads as rated lead of which at least 2 protruding block-shaped electrodes connected on said inner lead and outer lead, said metal plate in opposite disposition with said resin band, said middle lead, part of said inner lead and part of said outer lead.
TW086100369A 1996-01-15 1997-01-15 Apparatus and method of manufacturing semicondctor, semiconductor carrier TW335523B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP8021899A JPH09199534A (en) 1996-01-15 1996-01-15 Semiconductor device and manufacture thereof, tape carrier for semiconductor device

Publications (1)

Publication Number Publication Date
TW335523B true TW335523B (en) 1998-07-01

Family

ID=12067962

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100369A TW335523B (en) 1996-01-15 1997-01-15 Apparatus and method of manufacturing semicondctor, semiconductor carrier

Country Status (3)

Country Link
JP (1) JPH09199534A (en)
KR (1) KR100241199B1 (en)
TW (1) TW335523B (en)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS63302543A (en) * 1987-06-02 1988-12-09 Seiko Epson Corp Semiconductor device
JP3028875B2 (en) * 1992-01-18 2000-04-04 ソニー株式会社 Lead frame manufacturing method

Also Published As

Publication number Publication date
KR100241199B1 (en) 2000-02-01
JPH09199534A (en) 1997-07-31
KR970060462A (en) 1997-08-12

Similar Documents

Publication Publication Date Title
TW358992B (en) Semiconductor device and method of fabricating the same
TW329533B (en) The manufacturing method for semiconductor device
TW328156B (en) Resin-sealing type semiconductor and method of manufacture thereof
HK1020393A1 (en) Film carrier tape, semiconductor assembly, semiconductor device, and method of manufacturing the same, mounted board
TW350106B (en) Semiconductor elements and the manufacturing method
EP1120818A4 (en) Semiconductor substrate and its production method, semiconductor device comprising the same and its production method
AU6178186A (en) Semiconductor device free from the current leakage through a semiconductor layer and method for manufacturing same
TW342572B (en) Electroluminescent lamp designs
TW340973B (en) Mono-chip mixed carrier semiconductor and the checking method
TW242697B (en) Prefabricated semiconductor chip carrier
MY131127A (en) Press-contact type semiconductor devices
GB9503419D0 (en) Semiconductor device,production method therefor,method for testing semiconductor elements,test substrate for the method and method for producing the test
EP0676796A3 (en) Semiconductor substrate and a method for manufacturing the same.
TW371358B (en) Semiconductor device
EP0713250A3 (en) Material for semiconductor substrate, process for producing the same, and semiconductor device with such substrate
EP0631309A3 (en) Semiconductor device with contact structure and method of manufacturing the same.
EP0693778A3 (en) Semiconductor device with integral heatsink
EP0645811A3 (en) Semiconductor device having semiconductor chip with backside electrode.
MY123937A (en) Process for manufacturing semiconductor package and circuit board assembly
AU583423B2 (en) Semiconductor device free from the electrical shortage through a semiconductor layer and method for manufacturing same
TW375816B (en) Semiconductor device
EP0658933A3 (en) Semiconductor devices and method for manufacturing the same.
TW358990B (en) Lead frame, semiconductor package having the same and method for manufacturing the same
EP0070737A3 (en) Semiconductor device having an electrode, and method for producing the same
MY114386A (en) Lead frame and semiconductor device encapsulated by resin

Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees