TW335507B - A substrate coating device for manufacturing of semiconductor - Google Patents
A substrate coating device for manufacturing of semiconductorInfo
- Publication number
- TW335507B TW335507B TW082107765A TW82107765A TW335507B TW 335507 B TW335507 B TW 335507B TW 082107765 A TW082107765 A TW 082107765A TW 82107765 A TW82107765 A TW 82107765A TW 335507 B TW335507 B TW 335507B
- Authority
- TW
- Taiwan
- Prior art keywords
- substrate
- semiconductor
- manufacturing
- coating
- coating device
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/6715—Apparatus for applying a liquid, a resin, an ink or the like
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/02—Apparatus for spreading or distributing liquids or other fluent materials already applied to a surface ; Controlling means therefor; Control of the thickness of a coating by spreading or distributing liquids or other fluent materials already applied to the coated surface
- B05C11/08—Spreading liquid or other fluent material by manipulating the work, e.g. tilting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C11/00—Component parts, details or accessories not specifically provided for in groups B05C1/00 - B05C9/00
- B05C11/10—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material
- B05C11/105—Storage, supply or control of liquid or other fluent material; Recovery of excess liquid or other fluent material by capillary action, e.g. using wicks
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B05—SPRAYING OR ATOMISING IN GENERAL; APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C—APPARATUS FOR APPLYING FLUENT MATERIALS TO SURFACES, IN GENERAL
- B05C9/00—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important
- B05C9/08—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation
- B05C9/12—Apparatus or plant for applying liquid or other fluent material to surfaces by means not covered by any preceding group, or in which the means of applying the liquid or other fluent material is not important for applying liquid or other fluent material and performing an auxiliary operation the auxiliary operation being performed after the application
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Coating Apparatus (AREA)
- Application Of Or Painting With Fluid Materials (AREA)
- Manufacturing Optical Record Carriers (AREA)
Abstract
A substrate coating device, having a capillary gap (21) for coating of a layer on the downward face of the substrate (20); and a centrifugal device (17, 18, 19), for rotation of the substrate, with the substrate coating face downward, for even coating on the substrate (20) by means of capillary (21), while reducing the coating thickness.
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
PCT/DE1993/000778 WO1995005901A1 (en) | 1993-08-26 | 1993-08-26 | Device for coating substrates in semiconductor manufacture |
Publications (1)
Publication Number | Publication Date |
---|---|
TW335507B true TW335507B (en) | 1998-07-01 |
Family
ID=6888393
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW082107765A TW335507B (en) | 1993-08-26 | 1993-09-21 | A substrate coating device for manufacturing of semiconductor |
Country Status (3)
Country | Link |
---|---|
KR (1) | KR0159247B1 (en) |
CA (1) | CA2165069C (en) |
TW (1) | TW335507B (en) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN114472090B (en) * | 2022-02-10 | 2023-06-02 | 华能新能源股份有限公司 | Film growth equipment and film growth method |
-
1993
- 1993-08-26 KR KR1019960700938A patent/KR0159247B1/en not_active IP Right Cessation
- 1993-08-26 CA CA002165069A patent/CA2165069C/en not_active Expired - Lifetime
- 1993-09-21 TW TW082107765A patent/TW335507B/en not_active IP Right Cessation
Also Published As
Publication number | Publication date |
---|---|
KR0159247B1 (en) | 1998-11-16 |
CA2165069C (en) | 1999-06-01 |
CA2165069A1 (en) | 1995-03-02 |
KR960703684A (en) | 1996-08-31 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
EP0185767A4 (en) | Film for machining wafers. | |
EP1179842A3 (en) | Semiconductor substrate and method for preparing same | |
TW350135B (en) | Semiconductor device and method of manufacturing the same the invention relates to a semiconductor device and method of manufacturing the same | |
TW345710B (en) | Chip supporting substrate for semiconductor package, semiconductor package and process for manufacturing semiconductor package | |
AU654838B2 (en) | Waterproofing membrane | |
TW338847B (en) | Semiconductor device with isolation insulating film tapered and method of manufacturing the same | |
TW344892B (en) | Method of forming a semiconductor metallization system and structure therefor | |
CA2058513A1 (en) | Soi-type thin film transistor and manufacturing method therefor | |
MY141640A (en) | Polytetrafluoroethylene thin film chip carrier | |
AU5844698A (en) | Semiconductor substrate having compound semiconductor layer, process for its production, and electronic device fabricated on semiconductor substrate | |
MY103125A (en) | Cover tape for sealing chip-holding parts of carrier tape | |
TW335503B (en) | Semiconductor thin film and manufacturing method and semiconductor device and its manufacturing method | |
TW339473B (en) | Electronic package with multilevel connections | |
HK1020391A1 (en) | Semiconductor device, film carrier tape, and method for manufacturing them. | |
MY119325A (en) | Method of manufacturing bi-layered ferroelectric thin film | |
TW368685B (en) | Method of fabricating bump electrode | |
TW337590B (en) | Manufacture of semiconductor device having reliable and fine connection hole | |
DK0411690T3 (en) | Foreground metal substrate for mold metal applications | |
TW346653B (en) | Silicon wafer and method of manufacturing the same | |
TW357405B (en) | Method for pre-shaping a semiconductor substrate for polishing and structure | |
TW335507B (en) | A substrate coating device for manufacturing of semiconductor | |
TW259890B (en) | Semiconductor device and process thereof | |
TW353157B (en) | Double faced mask | |
AU2001258732A1 (en) | Magnetic strip with adhesive layer | |
AU3389689A (en) | Semiconductor substrate having a superconducting thin film, and a process for producing the same |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MK4A | Expiration of patent term of an invention patent |