TW333685B - The method for adjusting adhesion between photoresist and bottom dielectric - Google Patents

The method for adjusting adhesion between photoresist and bottom dielectric

Info

Publication number
TW333685B
TW333685B TW086100148A TW86100148A TW333685B TW 333685 B TW333685 B TW 333685B TW 086100148 A TW086100148 A TW 086100148A TW 86100148 A TW86100148 A TW 86100148A TW 333685 B TW333685 B TW 333685B
Authority
TW
Taiwan
Prior art keywords
photoresist
dielectric
adhesion
bottom dielectric
adjust
Prior art date
Application number
TW086100148A
Other languages
Chinese (zh)
Inventor
Guang-Horng Lin
Dong-Shiuh Jeng
Original Assignee
Taiwan Semiconductor Mfg Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Taiwan Semiconductor Mfg Co Ltd filed Critical Taiwan Semiconductor Mfg Co Ltd
Priority to TW086100148A priority Critical patent/TW333685B/en
Application granted granted Critical
Publication of TW333685B publication Critical patent/TW333685B/en

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  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Formation Of Insulating Films (AREA)

Abstract

A method for adjusting adhesion between photoresist and bottom dielectric in semiconductor wafer process, it is used for dielectric with the surface composed by oxide, to adjust the adhesion with photoresist layers. It includes following steps: Before covering photoresist layer, proceeds plasma treatment for dielectric with oxide surface, to change the surface characteristic of dielectric and adjust the adhesion between succeeding covered photoresist layers.
TW086100148A 1997-01-08 1997-01-08 The method for adjusting adhesion between photoresist and bottom dielectric TW333685B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086100148A TW333685B (en) 1997-01-08 1997-01-08 The method for adjusting adhesion between photoresist and bottom dielectric

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086100148A TW333685B (en) 1997-01-08 1997-01-08 The method for adjusting adhesion between photoresist and bottom dielectric

Publications (1)

Publication Number Publication Date
TW333685B true TW333685B (en) 1998-06-11

Family

ID=58262917

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086100148A TW333685B (en) 1997-01-08 1997-01-08 The method for adjusting adhesion between photoresist and bottom dielectric

Country Status (1)

Country Link
TW (1) TW333685B (en)

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