TW326055B - Polishing solutions for chemical mechanical polishing containing metal layers - Google Patents

Polishing solutions for chemical mechanical polishing containing metal layers

Info

Publication number
TW326055B
TW326055B TW086105185A TW86105185A TW326055B TW 326055 B TW326055 B TW 326055B TW 086105185 A TW086105185 A TW 086105185A TW 86105185 A TW86105185 A TW 86105185A TW 326055 B TW326055 B TW 326055B
Authority
TW
Taiwan
Prior art keywords
polishing
metal layers
containing metal
chemical mechanical
solutions
Prior art date
Application number
TW086105185A
Other languages
Chinese (zh)
Inventor
Ming-Shry Tsay
Woei-Jyh Tzeng
Original Assignee
Nat Science Council
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nat Science Council filed Critical Nat Science Council
Priority to TW086105185A priority Critical patent/TW326055B/en
Application granted granted Critical
Publication of TW326055B publication Critical patent/TW326055B/en

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  • Mechanical Treatment Of Semiconductor (AREA)

Abstract

A polishing solution composition for chemical mechanical polishing containing metal layers which comprises the following components: Solid abrasive material weight ratios by 2.5~10%. A proton acid selected from phosphorous acid acetic acid or their mixtures and chemical formula is M(OH)n. Oxidizing agents by volume ratios 0~10 selected from H2O2, Fe(NO)3 or their mixtures and M is alkali metals og alkaline earth metals. n is 1 or 2 and PH of solutions is 1~6.
TW086105185A 1997-04-22 1997-04-22 Polishing solutions for chemical mechanical polishing containing metal layers TW326055B (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
TW086105185A TW326055B (en) 1997-04-22 1997-04-22 Polishing solutions for chemical mechanical polishing containing metal layers

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
TW086105185A TW326055B (en) 1997-04-22 1997-04-22 Polishing solutions for chemical mechanical polishing containing metal layers

Publications (1)

Publication Number Publication Date
TW326055B true TW326055B (en) 1998-02-01

Family

ID=58262216

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086105185A TW326055B (en) 1997-04-22 1997-04-22 Polishing solutions for chemical mechanical polishing containing metal layers

Country Status (1)

Country Link
TW (1) TW326055B (en)

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Legal Events

Date Code Title Description
MM4A Annulment or lapse of patent due to non-payment of fees