TW317964U - Specimen holder with a retaining ring - Google Patents

Specimen holder with a retaining ring

Info

Publication number
TW317964U
TW317964U TW085214353U TW85214353U TW317964U TW 317964 U TW317964 U TW 317964U TW 085214353 U TW085214353 U TW 085214353U TW 85214353 U TW85214353 U TW 85214353U TW 317964 U TW317964 U TW 317964U
Authority
TW
Taiwan
Prior art keywords
retaining ring
specimen holder
specimen
holder
retaining
Prior art date
Application number
TW085214353U
Other languages
English (en)
Inventor
Uwe Seidel
Raine Braun
Original Assignee
Siemens Ag Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Siemens Ag Co Ltd filed Critical Siemens Ag Co Ltd
Publication of TW317964U publication Critical patent/TW317964U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
    • H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
    • H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
    • H01L21/68721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by edge clamping, e.g. clamping ring
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having at least one potential-jump barrier or surface barrier, e.g. PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic System or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/30—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26
    • H01L21/31—Treatment of semiconductor bodies using processes or apparatus not provided for in groups H01L21/20 - H01L21/26 to form insulating layers thereon, e.g. for masking or by using photolithographic techniques; After treatment of these layers; Selection of materials for these layers
    • H01L21/3205—Deposition of non-insulating-, e.g. conductive- or resistive-, layers on insulating layers; After-treatment of these layers
    • H01L21/321—After treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01J—ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS
    • H01J2237/00—Discharge tubes exposing object to beam, e.g. for analysis treatment, etching, imaging
    • H01J2237/02—Details
    • H01J2237/022—Avoiding or removing foreign or contaminating particles, debris or deposits on sample or tube
TW085214353U 1994-09-20 1995-08-12 Specimen holder with a retaining ring TW317964U (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
DE4433538A DE4433538A1 (de) 1994-09-20 1994-09-20 Verfahren zur Vermeidung der Re-Deposition von Ätzprodukten auf Substratoberflächen während des Wolfram-Rückätzprozesses bei der Herstellung hochintegrierter Schaltungen

Publications (1)

Publication Number Publication Date
TW317964U true TW317964U (en) 1997-10-11

Family

ID=6528717

Family Applications (1)

Application Number Title Priority Date Filing Date
TW085214353U TW317964U (en) 1994-09-20 1995-08-12 Specimen holder with a retaining ring

Country Status (5)

Country Link
US (1) US6380094B1 (zh)
EP (1) EP0703606A3 (zh)
JP (1) JPH08111406A (zh)
DE (1) DE4433538A1 (zh)
TW (1) TW317964U (zh)

Families Citing this family (7)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1117127A1 (en) * 2000-01-17 2001-07-18 Infineon Technologies AG Arrangement for supporting disklike objects in a processing system
US7074298B2 (en) * 2002-05-17 2006-07-11 Applied Materials High density plasma CVD chamber
KR101141577B1 (ko) * 2010-07-07 2012-06-08 (주)세미머티리얼즈 태양전지의 플라즈마 텍스처링 장치 및 방법
US9040432B2 (en) 2013-02-22 2015-05-26 International Business Machines Corporation Method for facilitating crack initiation during controlled substrate spalling
CN104051293A (zh) * 2013-03-13 2014-09-17 稳懋半导体股份有限公司 晶圆边缘保护装置
US9502278B2 (en) 2013-04-22 2016-11-22 International Business Machines Corporation Substrate holder assembly for controlled layer transfer
GB201419210D0 (en) * 2014-10-29 2014-12-10 Spts Technologies Ltd Clamp assembly

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4306731A (en) * 1979-12-21 1981-12-22 Varian Associates, Inc. Wafer support assembly
US5024747A (en) * 1979-12-21 1991-06-18 Varian Associates, Inc. Wafer coating system
US5215619A (en) * 1986-12-19 1993-06-01 Applied Materials, Inc. Magnetic field-enhanced plasma etch reactor
EP0312986A1 (de) 1987-10-22 1989-04-26 Siemens Aktiengesellschaft Verfahren zum Rückätzen von Wolfram mit Titannitrid als Unterlage in Kontaktlöchern von höchstintegrierten Halbleiterschaltungen
JPH0231420A (ja) 1988-05-20 1990-02-01 Tegal Corp プラズマリアクタ用ウエハークランプ装置
US4898639A (en) * 1989-04-14 1990-02-06 Bjorne Enterprises, Inc. Wafer retention device
US5292399A (en) 1990-04-19 1994-03-08 Applied Materials, Inc. Plasma etching apparatus with conductive means for inhibiting arcing
US5292558A (en) * 1991-08-08 1994-03-08 University Of Texas At Austin, Texas Process for metal deposition for microelectronic interconnections

Also Published As

Publication number Publication date
US6380094B1 (en) 2002-04-30
EP0703606A3 (de) 1998-03-11
DE4433538A1 (de) 1996-03-21
EP0703606A2 (de) 1996-03-27
JPH08111406A (ja) 1996-04-30

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