TW314223U - Cooling radiator - Google Patents

Cooling radiator

Info

Publication number
TW314223U
TW314223U TW086203510U TW86203510U TW314223U TW 314223 U TW314223 U TW 314223U TW 086203510 U TW086203510 U TW 086203510U TW 86203510 U TW86203510 U TW 86203510U TW 314223 U TW314223 U TW 314223U
Authority
TW
Taiwan
Prior art keywords
cooling radiator
radiator
cooling
Prior art date
Application number
TW086203510U
Other languages
English (en)
Inventor
Yutaka Kamekawa
Kiyoshi Nakayama
Satoshi Nakamura
Original Assignee
Nippon Keiki Works Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP31161195A external-priority patent/JP3225342B2/ja
Priority claimed from JP7313559A external-priority patent/JPH09134233A/ja
Application filed by Nippon Keiki Works Co Ltd filed Critical Nippon Keiki Works Co Ltd
Publication of TW314223U publication Critical patent/TW314223U/zh

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
    • H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D25/00—Pumping installations or systems
    • F04D25/02—Units comprising pumps and their driving means
    • F04D25/06—Units comprising pumps and their driving means the pump being electrically driven
    • F04D25/0606—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump
    • F04D25/0613—Units comprising pumps and their driving means the pump being electrically driven the electric motor being specially adapted for integration in the pump the electric motor being of the inside-out type, i.e. the rotor is arranged radially outside a central stator
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/40—Casings; Connections of working fluid
    • F04D29/42—Casings; Connections of working fluid for radial or helico-centrifugal pumps
    • F04D29/4206—Casings; Connections of working fluid for radial or helico-centrifugal pumps especially adapted for elastic fluid pumps
    • F04D29/4226—Fan casings
    • F04D29/424—Double entry casings
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F04—POSITIVE - DISPLACEMENT MACHINES FOR LIQUIDS; PUMPS FOR LIQUIDS OR ELASTIC FLUIDS
    • F04D—NON-POSITIVE-DISPLACEMENT PUMPS
    • F04D29/00—Details, component parts, or accessories
    • F04D29/58—Cooling; Heating; Diminishing heat transfer
    • F04D29/582—Cooling; Heating; Diminishing heat transfer specially adapted for elastic fluid pumps
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/40—Mountings or securing means for detachable cooling or heating arrangements ; fixed by friction, plugs or springs
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • General Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thermal Sciences (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
TW086203510U 1995-11-06 1996-08-06 Cooling radiator TW314223U (en)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31161195A JP3225342B2 (ja) 1995-11-06 1995-11-06 冷却用放熱器
JP7313559A JPH09134233A (ja) 1995-11-07 1995-11-07 冷却用放熱器

Publications (1)

Publication Number Publication Date
TW314223U true TW314223U (en) 1997-08-21

Family

ID=26566819

Family Applications (1)

Application Number Title Priority Date Filing Date
TW086203510U TW314223U (en) 1995-11-06 1996-08-06 Cooling radiator

Country Status (2)

Country Link
US (1) US5816319A (zh)
TW (1) TW314223U (zh)

Families Citing this family (29)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3942248B2 (ja) 1997-02-24 2007-07-11 富士通株式会社 ヒートシンクおよびそれを搭載した情報処理装置
US6111748A (en) * 1997-05-15 2000-08-29 Intel Corporation Flat fan heat exchanger and use thereof in a computing device
US5978219A (en) * 1998-03-09 1999-11-02 Lin; Liken Heat dissipating device
US6179561B1 (en) * 1998-12-02 2001-01-30 Sunonwealth Electric Machine Industry Co., Ltd. Fan wheel structures
US6181556B1 (en) 1999-07-21 2001-01-30 Richard K. Allman Thermally-coupled heat dissipation apparatus for electronic devices
US20020067596A1 (en) * 2000-12-05 2002-06-06 Searls Damion T. Conduited heat dissipation device
AU2002316430A1 (en) * 2001-06-27 2003-03-03 Advanced Rotary Systems, Llc Cooler for electronic devices
JP2003023281A (ja) * 2001-07-05 2003-01-24 Toshiba Corp 発熱体を内蔵する電子機器および空冷式の冷却装置
KR100555806B1 (ko) * 2001-08-10 2006-03-03 김휘철 반도체 소자용 공냉식 냉각장치
US7252139B2 (en) * 2001-08-29 2007-08-07 Sun Microsystems, Inc. Method and system for cooling electronic components
EP1343362A1 (en) * 2002-03-07 2003-09-10 Hewlett-Packard Company (a Delaware corporation) Cooling system for elecronic devices
US6736192B2 (en) * 2002-03-08 2004-05-18 Ting-Fei Wang CPU cooler
US6578625B1 (en) * 2002-03-08 2003-06-17 Raytheon Company Method and apparatus for removing heat from a plate
US7046515B1 (en) * 2002-06-06 2006-05-16 Raytheon Company Method and apparatus for cooling a circuit component
US6972950B1 (en) 2002-06-06 2005-12-06 Raytheon Company Method and apparatus for cooling a portable computer
US20040163795A1 (en) * 2003-02-25 2004-08-26 Yi-Yung Lin Heat sink
US20040233633A1 (en) * 2003-05-23 2004-11-25 Mei-Ying Lay Structures for coolers with two-way air convection functionality
US7237599B2 (en) * 2003-08-30 2007-07-03 Rotys Inc. Cooler with blower comprising heat-exchanging elements
TWI257837B (en) * 2004-06-11 2006-07-01 Quanta Comp Inc Dissipation module with noise reduction function
US6948555B1 (en) * 2004-06-22 2005-09-27 Hewlett-Packard Development Company, L.P. Heat dissipating system and method
US20060078423A1 (en) * 2004-10-08 2006-04-13 Nonlinear Tech, Inc. Bi-directional Blowers for Cooling Laptop Computers
CN100351737C (zh) * 2005-06-15 2007-11-28 娄晓洲 集中散热式热管机箱装置
US20100157522A1 (en) * 2008-12-19 2010-06-24 Gamal Refai-Ahmed Alternative Form Factor Computing Device with Cycling Air Flow
TW201028638A (en) * 2009-01-21 2010-08-01 Young Green Energy Co Heat sink module
US8405997B2 (en) * 2009-06-30 2013-03-26 Kabushiki Kaisha Toshiba Electronic apparatus
TWI439608B (zh) * 2010-12-16 2014-06-01 Sunonwealth Electr Mach Ind Co 風扇模組
TWI453346B (zh) * 2011-04-25 2014-09-21 Sunonwealth Electr Mach Ind Co 散熱扇
CN112752483B (zh) * 2020-12-22 2023-07-28 广东科敏智能工程有限公司 具有温度控制功能的县域历史教学数据中心服务器机柜
EP4096376A1 (en) * 2021-05-24 2022-11-30 Aptiv Technologies Limited Cooling device and heatsink assembly incorporating the same

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2765801B2 (ja) * 1993-08-20 1998-06-18 山洋電気株式会社 電子部品冷却装置
US5597034A (en) * 1994-07-01 1997-01-28 Digital Equipment Corporation High performance fan heatsink assembly
US5535094A (en) * 1995-04-26 1996-07-09 Intel Corporation Integrated circuit package with an integral heat sink and fan
US5630469A (en) * 1995-07-11 1997-05-20 International Business Machines Corporation Cooling apparatus for electronic chips
US5661638A (en) * 1995-11-03 1997-08-26 Silicon Graphics, Inc. High performance spiral heat sink

Also Published As

Publication number Publication date
US5816319A (en) 1998-10-06

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