311266 A7 B7______ 五、發明説明（I ) 發明領域 本發明廣氾地說，係關於一種不具備內建式晶粒附著腳座的導線架’更 仔細地說，係關於一種組裝了晶粒附著腳座的導線架，可以提胃 電性功能，並能更方便地對安裝在晶粒附著腳座的積體電路晶片進行已知良 好晶粒測試。 發明背景 在積體電路晶片的製造過程中，很重要的一個步驟是用一個裝’ 將這些晶片包裝起來，保護它們免受外在環境的影響。過去大都使用金屬和 陶磁材料來包裝1C晶片，因爲它們的散熱特性奇佳。但是，金屬和陶磁包裝 是造價昂貴、勞力密集的包裝技術。因此近幾年來，在1C包裝上大都使用塑 膠封裝製程。這種塑膠包裝技術經濟實惠，其中有一種稱爲塑膠四方扁平封 裝(PQFP)。塑膠鑄模包裝的缺點是它不具有金屬或陶磁原有理想的散熱特 性。 現代的1C元件密度越來越高，塑膠鑄模包裝散熱不良的問題更形嚴重。 因爲晶片愈來愈小，代表晶片上的元件愈來愈靠近。爲了要維持1C元件的合 理服務壽命，必須使晶片有足夠的散熱，小心地控制元件的操作溫度。最近 的1C元件中開始使用高功率銷耗的電路，更需要良好的散熱特性。舉例來 說，傳統208腳的PQFP元件只需1瓦特的功率耗散。對現代需要2至3瓦特能力 的CPU或ASIC晶片而言，功率耗散就越發重要，因爲功率耗散與散熱特性有 密切的關係。所以塑膠鑄模包裝的散熱特性必須予以提高，才能容納高密度 和高功率銷耗的1C元件。 在塑膠鑄模包裝中，常常使用吸熱器(heat sink)來促進散熱。吸熱器 通常是用導熱性很高的材料作成的。如果吸熱器的表面沒有暴露在外圍環 境，就稱爲散熱片(heat spreader) ’如果吸熱器的表面露在外圍環境中， 就稱爲散熱塊(heat slug)。吸熱器合用的典型材料有銅、銅合金、紹、銘 〇奶）八4規格（210/297公釐） -2- ------ ----良| I I I 丁 3 、τ (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 經濟部中央標準局員工消費合作社印製 311266 A7 B7 五、發明説明（>) 合金或任何其他高導熱的材料。若在1C元件中使用吸熱器來促進散熱，必胃 將吸熱器附著在半導體晶片(或晶粒)的附近。 傳統上，當使用吸熱器來提高塑膠鑄模包裝的散熱時，可以將吸熱器固 定在導線架內的一個晶粒附著腳座上。晶粒附著腳座是一個金屬的平台，位 在導線架的中央，由連至導線架的連接桿所支撐。傳統方法中的一個例子 是，在晶粒附著腳座與吸熱器之間使用聚乙醯按捲帶之類的黏性捲帶。這種 作法請參考圖1。聚乙醯按捲帶10將附著晶粒腳座12緊緊地連接到吸熱器14 上。這種黏性連結的吸熱器中，即使在晶粒附著腳座與吸熱器之間可以緊密 地接觸’但是捲帶本身並不導熱，還是會妨礙晶粒附著腳座與吸熱器之間的 熱傳導。而且要使用這種黏性捲帶，還需要額外的製程步驟，使得製造成本 大爲提高。如果吸熱器大到覆蓋了引腳打線區將使得打線接合的製程中引導 無法夾持用線’甚至覆蓋了引線，打線接合的製程就遭遇問題。這就表示在 傳統的方法中，吸熱器一般不能大於晶粒附著腳座。 爲要提高封裝在塑膠內積體電路晶片的冷卻效率，也有人使用接鄰在晶 粒附著腳座旁的外接附加吸熱器。圖2a至2c中就說明了這種吸熱器。製造這 種外接附加的吸熱器時，首先使具有附著晶粒之腳座部位22的導線架20緊靠 積體電路晶粒26和吸熱器24，並放在一個鑄模夾具內。然後在導線架20週 圍，以射出成型的方式形成一個塑膠鑄模包裝28，將所有的組件都封裝起 來。這種製程的一個缺點是，在射出成型的過程中，晶粒附著腳座22常會彎 折偏離吸熱器24.’使得射出的塑膠滲進晶粒附著腳座22與吸熱器24之間。結 果，跑進來的塑膠材料成了絕熱體，降低了吸熱器24的散熱效率。 另一種提高附著晶粒之腳座與吸熱器之間散熱效率的傳統方法，是在鑄 模裝置中加上眞空通路的設計。圖3的設計中，首先要將積體電路晶粒42放 在晶粒附著腳座上，再將鑄模裝置40封起來。然後經由晶粒附著腳座44底下 的眞空通路46抽眞空，使腳座緊緊地壓緊在吸熱器48上。然後再進行塑膠射 出的製程，將元件封裝起來。這種方法通常可以有效地使晶粒附著腳座與吸 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210Χ297公釐） —3— I _衣-- (請先閱讀背面之注意事項再填寫本頁) 、-=β 311266 at B7 五、發明説明（3 ) 熱器有很好的接觸’但卻必須在鑄模裝置內加上眞空通路，提高工具造價和 製造時間。 我們在一份同屬本案申請人的申請案中，提出在塑膠鑄模包裝中，將吸 熱器接合到晶粒附著腳座的另一種方法。這個方法是在晶粒附著腳座上設計 —個開口，足以在晶粒接合的製程中將積體電路晶粒與吸熱器接合在一起。 在這種設計中，是利用吸熱器中一個凸出的部位與附著晶粒之腳座中的開孔 彼此之間藉磨擦力啣接，而使吸熱器得以組裝在晶粒附著腳座上。在這種吸 熱器的頂面上有一凹陷區域，周邊略爲凸起，可以容納一個積體電路晶片。 這種方法需要精確地控制附著晶粒之腳座的開口大小和吸熱器的外緣周邊， 才能卻使兩個組件藉磨擦彼此啣接。此外，因爲打線接合的製程中，不可能 夾持住引線，所以吸熱器的大小也因此受到限制。 大部份傳統的作法中，都需要晶粒附著腳座，才能使吸熱器永久地固定 在晶粒附著腳座上。製作晶粒附著腳座時，必須利用微影製程和蝕刻製程， 使尺寸十分精確。而且晶粒附著腳座也成了另一層的絕熱層，阻礙了 1C晶粒 與吸熱器之間的熱傳導。此外，所有使吸熱器永久固定在導線架的傳統作法 中，吸熱器的面積都受到限制，不但限制了吸熱器的散熱效率，在1C晶片固 定在吸熱器後，也無法測試1C晶片。而在KGD(已知良好晶粒)測試中，是非 常需要在一顆1C晶片固定在吸熱器後，對此1C晶片進行測試。 經濟部中央標準局員工消費合作社印製 I — i I I —I 1 - I Μ衣 ----- - n (請先閱讀背面之注意事項再填寫本頁) 傳統1C晶片製造技術中，晶片是從一片晶圓切割成晶粒而形成的。這些 晶片稱爲裸晶，因爲它們尙未封裝(或保護)在塑膠包裝中，所以環境中的灰 塵、7太氣、輻射和溫差都很容易傷害到這些裸晶。而且這些裸晶很脆，也很 小，更是容易受損。爲了避免損害晶片上的電路’裸晶在處理時不能堆疊， 必須小心地拿取。因此幾乎無法在裸晶上進行KGD測試。 . 在傳統的製造過程中’在切割晶粒之前，會在晶圓背面貼上一層黏性捲 帶，一直到晶粒切割之後，裸晶仍然黏著在黏性捲帶上。這樣就可以避免切 割之後，晶片遠離晶圓可能發生的任何潛在傷害。分割之後，就用眞空裝置 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 一 ¢- A7 ___________B7_ 五、發明説明（+ ) 將裸晶傳送至導線架上的附著晶粒之腳座。所以，裸晶需要的任何測試都要 在分割之前，晶片還固定在晶圓上時進行(通稱爲晶圓測試)。有問題的晶片 會打上墨印，在送往晶片接合製程之前再從其他的晶片篩選出來。這種測試 方法的缺點是無法保證裸晶在晶粒切割分離之後仍然良好。因此，最好能找 出一種測試方法，可以在裸晶剛剛自晶圓分離，以及傳送至附著晶粒之腳座 時，進行測試。當然，這需要使晶粒附著腳座自導線架中獨立出來。 傳統的導線架中，承載功率、接地和信號的引線位在同一個平面，而且 非常靠近。它們之間常常會發生干擾，造成雜訊與串音。有人設法要解決這 個問題，在導線架上加上兩層額外的金屬層，之間還加上絕緣層，並將功率 與接地連接到金屬層上。這種三層的導線架結構不但改善了電子特性，也提 供多餘的引線，可用作信號引線。但是這種結構的缺點是造價太高。 本發明另一個目的是提出一種方法與裝置，提供引自導線架之連接桿的 附著裝置和附著晶粒之腳座的插座裝置，使晶粒附著腳座可以安裝在導線架 上，但仍可拆卸。 本發明另一個目的是提出一種方法與裝置，將一個具有良好散熱功能的 晶粒附著腳座安裝在導線架上。 本發明尙有一個目的是提出一種方法與裝置’將一個具有雙層金屬片的 晶粒附著腳座安裝在導線架上。 本發明尙有一個目的是提出一種方法與裝置，可供安裝具有雙層金屬片 和高導熱性之晶粒附著腳座，以提高導線架的電子功能和熱功能。 經濟部中央標準局負工消費合作社印製 1' n I I I I n « n I n I I n T 3, 、T (請先閲讀背面之注意事項再填寫本頁) 本發明還有另一個更進一步的目的是提出一種方法與裝置，使晶粒附著 腳座成爲裸晶的保護機捧以便於進行KGD測試。 本發明還有另一個更進一步的目的是提出一種方法與裝置，可將1C晶粒 先黏著在使用吸熱器使熱功能十分良好之晶粒附著腳座，再安裝在導線架 上。 CNS ) A4規格（210x297公釐） -r- 511266 A7 B7 經濟部中央標準局員工消費合作社印製 五、發明説明（f ) 本發明還有帛-MHst-频闕是提巾-種力自與裝置，棚導線架 上的附著裝置鄕错晶粒之腳座上的插座裝置__胃， 以安裝在導線架上，但仍可拆卸。 本翻還有另一讎進—步的目的是提出一種方法與裝置，在導線架上 製作一v型金屬飽’以便閂鎖在晶粒附著腳座的插座裝置上，使晶粒附著腳 ®可以安裝在導線架上，但仍可拆卸。 本發明還有另一個更進一步的目的是提出一種方法與裝置，將導線架上 的連接桿以黏劑接合在晶粒附著腳座上，使吸熱器安裝在導線架上。 發明的簡要說明 本發明提出一種方法與裝置，可將吸熱器安裝在導線架上，但仍可拆 卸’使1C晶粒可在稍後固著在吸熱器上。本發明的方法與裝置中，並不需要 藉由附著晶粒之腳座來安裝吸熱器。 本發明所提出的具體實施例中，在導線架上有許多引腳，而且從導線架 向內並延伸出許多的連接桿。每一個連接桿都有一個位在導線架上的固定端 與一個其上具有固著裝置的自由端。另外，在吸熱器上設計了許多的插座裝 置，可用來接受連接桿自由端上的固著裝置。最後，使連接桿上的固著裝置 與吸熱器上的插座裝置彼此啣接，必要時再予拆卸。 另一個實施例中，導線架上許多的連接桿可以藉由黏劑與吸熱器周圍的 凹陷區域接合。如果所用的黏劑可以再予鬆脫，吸熱器就可以自導線架上拆 卸下來。 本發明進一步也包贪了導線架與吸熱器的組裝，其中導線架上有引線， 而且從導線架向內並延伸出數個連接桿。每一個連接桿都有一個位在導線架 上的固定端與一個其上具有固著裝置的自由端。這個組裝中另外還包含了一 個具有許多插座裝置的吸熱器，可用來接受連接桿自由端上的固著裝置。當 吸熱器組裝到導線架上時’連接桿上的固著裝置與吸熱器上的插座裝置會彼 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210X297公釐） -I I - n I - n I \^—I---- I T 3 %T (請先閲讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作杜印製 A7 B7 五、發明説明（纟） 此啣接，待必要時再予拆卸。最後當黏著1C晶粒時，可以在吸熱器啣接到導 線架上之前黏著，也可以待吸熱器啣接到導線架上之後再黏著。 附圖的簡要說明 參照底下說明與附圖之後，會更明顯地看出本發明其他的目的、內容與 優點，所附附圖分別是： 圖1是傳統上使用黏性捲帶之塑膠鑄模包裝的橫剖面放大圖。 圖2a至2c是傳統上第一種使用具有凹陷區之吸熱器的橫剖面放大圖。 圖3是傳統上第三種具有眞空通路之鑄模裝置的橫剖面放大圖。 圖4是本發明吸熱器與接合組件下部容板的透視圖。 圖5是一顆1C晶粒與位在接合組件空腔內之吸熱器的透視圖。 圖6是導線架之連接桿的透視圖，連接桿在吸熱器上方具有固著裝置》 圖7是接合組件之上部容板的透視圖，接合組件具有推壓針(push Pin)，位在導線架與吸熱器上方。 圖7A是導線架捲帶的透視圖，圖中包括了許多導線架，在具有許多空腔 之接合組件中，依次組裝至許多的散熱器上。 圖8a至8d是具體實施例中，連接桿上之固著裝置啣接至吸熱器上之插座 裝置的橫剖面放大圖。 圖8e是連接桿上之固著裝置與吸熱器上之插座裝置在啣接位置的透視 圖。 圖9a至9d是連接桿上之固著裝置啣接至散熱器上之插座裝置的另一個具 體實施例的橫剖面放大·圖。 圖9e是連接桿上之固著裝置與吸熱器上之插座裝置在啣接位置的透視 圖。 圖10a至10d是連接桿上之固著裝置啣接至散熱塊上之插座裝置的另一個 具體實施例的橫剖面放大圖。 本紙張尺度適用中國國家標準（CNS ) Λ4规格（2!0X 297公廣） —?一 (請先閲讀背面之注意事項再填寫本頁) 、^ A7 B7 ~·· - _ _______ _ 五、發明説明（7 ) 圖10e是連接桿上之固著裝置與散熱塊上之插座裝置在啣接位置的透視 圖。 圖1.1是1C晶粒與導線架上弓圓之間打線接合的透視圖。 圖12是吸熱器的透視圖，吸熱器位在具有定位針之接合組件的下部容板 的上方。 圖13是位在吸熱器上方之基板的透視圖。 圖14是許多1C晶粒在黏著至基板之前，位在基板上方的透視圖β 圖15的是具有連接桿之導線架，位在具有插座裝置與許多已接合之1C晶 粒的吸熱器上方。 圖16是接合組件之上部容板的透視圖，接合組件具有推壓針，位在導線 架與吸熱器的上方。 圖17是導線架上之與基板之間，以及1C晶粒與基板之間的接合線。 圖18是吸熱器的透視圖’吸熱器具有可接合至導線架之凹陷端角的插座 裝置。 圖19是接合至導線架與吸熱器之1C晶粒的橫剖面放大圖。 圖20是在各連接桿上具有接合墊之導線架的平面圖。 具體實施例的詳細說明 經濟中央標準局員工消費合作社印裳 本發明提出一種不具內建式附著晶粒之腳座的導線架的製造方法。如果 半導體元件需要力卩強某特定的功能，也就是加強熱功能或電性功能 '測試裸 晶'或組裝多晶片模組時，可以修改晶粒附著腳座，以滿足特定的目的。舉 例來說，晶粒附著腳座·可以修改爲加強熱功能的吸熱器、可以改爲加強電性 功能的雙層金屬片(其中一片是功率平面、一片是接定平面）、_或者可以改爲 測試裸晶之測試插座的組合。如果要進一步地加強吸熱器/導線架之組合的 電性功能，可以使用一種三層導線架的結構，包含了一層頂面信號層、一層 中間功率層、和一層底部的接地層。 -— (請先閱讀背面之注意事項再填寫本頁) 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210X297公着） 311266 A7 ____ B7 五、發明説明（y ) 本發明的方法’可以製造不具有內建式附著晶粒之腳座的導線架，可以 用來安裝單一的1C晶粒’也可用來安裝許多的IC晶粒。如果要安裝許多的1C 晶粒時，首先要將一面基板接合至吸熱器上(同時也作爲晶粒附著腳座），然 後再將1C晶粒接合至基板上。底下將說明本發明的具體實施例和數個不同的 實施例。 本發明所提出的具體實施例中，在導線架上有引線，而且從導線架向內 並延伸出許多的連接桿。每一個連接桿都有一個位在導線架上的固定端'與 —個通常短於引腳並具有固著裝置的自由端。另外，在吸熱器上設計了許多 的插座裝置，可用來接受連接桿自由端上的固著裝置。吸熱器上插座裝置的 數目通常等於連接桿上固著裝置的數目。位在連接桿頂端上的固著裝置可以 壓製成V型金屬鉤，以便透過機械的方式，閂鎖在吸熱器上的插座裝置。如 果吸熱器是用薄薄的金屬片作成，吸熱器上的插座裝置可以是一個槽口，使 V型金屬鉤可以透過機械的方式閂鎖在吸熱器上。 經濟部中央標準局員工消費合作社印製 H- - ! u - II I -*^-- I. - - 1 - - _ 丁 3 、τ (請先閱讀背面之注意事項再填寫本頁) 另一個實施例中，吸熱器比金屬薄片還厚，通常稱爲散熱片，可以在它 的頂面形成一個金屬長槽作爲插座裝置，以便容納連接桿上的V型金屬鉤。 另一個不同的實施例中，吸熱器更厚，也就是散熱塊，在塑膠封裝製程之 後，表面會暴露在周圍的環境中，對這種吸熱器而言，可以在它的頂面形成 一個金屬長槽作爲插座裝置，以便容納連接桿上的V型金屬鉤。又另一個實 施例中，吸熱器上的插座裝置是位在吸熱器之表面上的凹陷區域。導線架的 每一個連接桿都具有腳座的部位，可以藉由黏性裝置連接至吸熱器表面之凹 陷區域。 首先請參考圖4，其中說明了在每個角落都具有插座裝置12的吸熱器 10(散熱器）。作成金屬長槽的插座裝置12，具有一個部份開放的頂部14。吸 熱器10上有許多的開孔16，穿通整個吸熱器的厚度’有助於使吸熱器1〇固定 在接合組件的下部容板2D ’而凹陷的區域22則可容納吸熱器10。凹陷區域22 本紙張尺度適用中國國家標準（CNS ) Λ4規格（210 X 297公釐） 一 1 經濟部中央標準局員工消費合作杜印製 Α7 Β7 五、發明説明（7 ) 內的定位塊24，可以進一步協助吸熱器10的定位。在隨後進行的打線接合步 驟中，定位塊24也能用來支撐弓丨腳。 吸熱器10中的開孔16是本發明的一個優點。有了這些開孔，就可以利用 定位塊24來支撐引腳，對一個充當晶粒附著腳座的吸熱器而言，再大的面積 都不會妨礙打線接合製程。不像傳統上不用附著晶粒之腳座的吸熱器，本發 明之吸熱器的大小並不受到引線大小的限制。我們發現，開孔16對吸熱器10 的散熱能力只有很小的影響。開孔16的另一項優點是，在晶片的封過程中， 封裝的化合物會流到開孔內，可以使吸熱器與化合物之間接合的效果更好。 接合效果提高之後，可以消除吸熱器與封裝化合物之間熱膨脹的行爲差異所 帶來的脫落(delamination)的問題。 將1C晶粒28安裝在吸熱器10上時，可以利用黏性裝置(未畫出）。圖5 中，1C晶粒28位在空腔30的上方。定位塊24通常稍稍厚於吸熱器的厚度，所 以定位塊24的表面會突出於吸熱器10的頂面之上。突出的表面在稍後進行的 打線接合操作中，可以支撐引腳。要利用黏著劑將1C晶粒28接合到位在吸熱 器10之定位塊24之間的空腔30時，可以利用高度導電的黏著劑。其中一種合 用的黏著劑是熱固性的高分子，並且摻有銀一類的導電金屬粉末。 圖6的透視圖中，導線架36位在吸熱器10與接合組件20之下部容板的上 方。導線架36有許多的弓圓38與弓丨腳尖端40。在導線架36的各個角落上都有 一個連接桿42。連接桿42的尖端壓製成V型金屬鉤44。圖8a至8d說明了 V型金 屬鉤放大後的詳細結構。 吸熱器10/晶粒28組合固著在導線架36之前，可以先對晶粒28進行 KGD(已知良好晶粒)的_試。吸熱器10在測試的過程中可以保護晶粒28免受 傷害。一直到晶粒通過了KGD測試之後，才將吸熱器10/晶粒28組合固著在 導線架36上。 圖7中，接合組件的上部容板上具有許多的推壓桿(Push rod)52。圖7A 中，導線架捲帶53具有許多的導線架36，可以在具有許多空腔30的接合組件 本紙張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） 丨 .策— (請先閱讀背面之注意事項再填寫本頁) 訂 311266 at B7 五、發明説明（丨σ ) 55中，同時與許多的吸熱器10接合。在眞正的製造過程中，這是一種比較實 際的設計。很顯然地，如果需要，也可以將吸熱器個別地接合到各個導線架 上。如果將(圖7)上部容板48放在導線架36和吸熱器10的上方，並往下用力 緊壓，推壓桿52會迫使V型金屬鉤44啣接到開孔54內（圖8a至8d)，使它們藉 由吸熱器之插座裝置56的開孔54，以機械的方式鎖緊。閂鎖的過程可以參考 圖8a至8d。在此應特別注意，當選擇金屬壓製V型金屬鉤44與吸熱器的插座 裝置56時，其硬度、或彈性常數的選擇範圍很寬，使得吸熱器上的固著裝置 與導線架上的插座裝置都有多種的設計方式。如果吸熱器與導線架之間的閂 鎖是透過機械的方式，那麼在每一種設計下，就需要決定個別的參數，如金 屬厚度、金屬種類、和金屬的彈性常數等等。圖8e畫出吸熱器56啣接到導線 架36後的部份情形。 圖9a至9e和圖l〇a至l〇e中，分別說明了本發明連接桿上之V型金屬鉤的 兩種實施例，這些金屬鉤作爲固著裝置，啣接至吸熱器上的插座裝置。圖9a 至9d放大後的橫剖面圖，說明了V型金屬鉤42啣接至散熱器60角落上的開口 槽62的情形。金屬槽62頂部上的開口64，可以容讓V型金屬鉤42穿過。在圖 9a與9b中，首先將金屬鉤42放在吸熱器60的開口64內。而圖9a至9e中的吸熱 器60是散熱器。在圖9c與9d中，則將V型金屬鉤42推入吸熱器60的開口64 內。從圖9e可知，V型金屬鉤42的尖端會啣接到開口槽62的底部66，而將吸 熱器60鎖緊於導線架70上。 經濟部中央標準局員工消費合作社印製 (請先閱讀背面之注意事項再填寫本頁) 圖10a至10e中說明了本發明另一個實施例。這個實施例中的吸熱器72是 一個吸熱塊。圖10a至10d所說明的各步驟與圖9a至9d類似，只是吸熱塊72大 大厚於圖9a至9d中的散熱器60。圖10e也說明了散熱器72與導線架76的透視 圖。 . 圖11的透視圖中，導線架36已組裝到接合組件之下部容板中的吸熱器10 上。接著進行打線接合，用銲錫線82連接引線尖端40和1C晶粒28。定位塊24 突出的表面，即可用作打線接合的支撐物。 本紙張尺度適用中國國家標準（CNS ) Λ4規格（2丨0'乂297公釐） 經濟部中央標準局員工消費合作社印製 A7 B7 五、發明説明（"） 請注意，當吸熱器照圖8a至8e、9a至9e ' l〇a至10e中的方式閂鎖到導線 架後，V型的機械鉤子仍然可以利用合適的工具從閂鎖的位置上解開，使得 吸熱器、連帶其上黏著的1C都能從導線架上解開。 圖12至圖17說明了將吸熱器安裝到導線架上的過程，以後仍可拆卸，其 中並有許多個1C晶粒接合到吸熱器上。舉例來說，首先照圖12的說明，將角 落上具有定位孔92的吸熱器90，放在具有定位針96之接合組件的下部容板94 內。安置吸熱器90於下部容板94內時，定位針96與定位孔92會使定位更爲精 確。 下一步如圖13，先將基板98以導電黏著劑(未畫出)黏著到吸熱器90上。 然後以導電黏著劑(未畫出)或以反轉式晶片或TAB等其他技術，將許多的1C 晶粒102黏著到基板98上。圖14中，1C晶粒102位在基板98的上方，所以在吸 熱器90組裝到導線架106上之前，可以對基板98與其上的晶粒102進行KGS(已 知良好基板)的測試。這樣一來，就可以選擇功能正常的晶粒與基板組裝到 導線架106上。接下來的步驟中，將V型金屬鉤110閂鎖到吸熱器90上的插座 裝置112，使具有連接桿108的導線架106可以組裝到吸熱器90上。組裝的情 形可以參考圖15。要使V型金屬鉤110啣接到吸熱器90上的插座裝置112時， 需照圖16利用具有推壓桿122之上部容板120加以緊壓。最後，進行打線接合 製程，使導線架106上的引線尖端126得以電性連接至基板98上，結果即如圖 17。然後再以接續的打線接合製程，將許多的1C晶粒102連接到基板98上。 1C晶粒1G2與基板98之間的打線接合製程，也可以在引線尖端126與基板98的 打線接合製程之前進行。 本發明另一個實施例，是利用黏著劑將吸熱器安裝在導線架上，圖18至 20即說明了這個實施例。這個實施例中，在吸熱器13G的頂面132上設計了許 多類似圖18中的凹陷區域134。從圖19與20可以看到，在導線架142之連接桿 136的端點上，設計了接合腳座138，以便接合至吸熱器130上。吸熱器30組 裝到導線架142之前，可以先對1C晶粒140進行KGD測試。只有當晶粒140通過 本紙張尺度適用中國國家標準（CNS ) Λ4規格（2丨〇χ297公釐） -P 一 (請先閱讀背面之注意事項再填寫本頁) *?τ A7 B7 五、發明説明（丨>) 了KGD測試之後，才將吸熱器30組裝到導線架14G上。在測試的過程中，吸熱 器30也有保護晶粒140的功能。 以上的說明雖然透過舉例加以說明，但應可瞭解，所用的字彙都是爲著 敘述的目的，而不是爲著限制本發明的範圍。 此外，以上的說明雖然是藉著最佳實施例加以仔細闡述，但可瞭解熟習 本技藝的人士都能利用這些原理得到本發明的其他變化。 底下將以申請專利範圍來聲明本發明之具體實施例，及其專屬之財產權 和專有權。 n HI m - n - n I 丈^^— 丁 3 、τ (請先閱讀背面之注意事項再填寫本頁) 經濟部中央標準局員工消費合作社印製 Μ氏張尺度適用中國國家標準（CNS ) A4規格（210X297公釐） ~ί3-311266 A7 B7______ V. Description of the Invention (I) Field of the Invention The present invention broadly refers to a lead frame that does not have a built-in die attach foot. More specifically, it relates to a die attach foot assembled The lead frame of the socket can improve the electrical function of the stomach, and can more easily perform the known good die test on the integrated circuit chip installed on the die attachment foot. Background of the Invention In the manufacturing process of integrated circuit wafers, a very important step is to package these wafers in a package to protect them from the external environment. In the past, metal and ceramic materials were mostly used to package 1C chips because of their excellent heat dissipation characteristics. However, metal and ceramic packaging are expensive and labor-intensive packaging technologies. Therefore, in recent years, plastic packaging processes have been used for 1C packaging. This plastic packaging technology is economical and one of them is called Plastic Quad Flat Pack (PQFP). The disadvantage of plastic mold packaging is that it does not have the ideal heat dissipation characteristics of metal or ceramics. The density of modern 1C components is getting higher and higher, and the problem of poor heat dissipation in plastic mold packaging is more serious. Because the wafer is getting smaller and smaller, it means that the components on the wafer are getting closer and closer. In order to maintain the reasonable service life of the 1C device, the chip must have sufficient heat dissipation and the operating temperature of the device must be carefully controlled. Recently, high power consumption circuits have been used in 1C components, and good heat dissipation characteristics are needed. For example, a conventional 208-pin PQFP component requires only 1 watt of power dissipation. For modern CPU or ASIC chips that require 2 to 3 watts of power, power dissipation becomes more important because power dissipation is closely related to heat dissipation characteristics. Therefore, the heat dissipation characteristics of plastic mold packaging must be improved to accommodate high-density and high power consumption 1C components. In plastic mold packaging, heat sinks are often used to promote heat dissipation. Heat sinks are usually made of materials with high thermal conductivity. If the surface of the heat sink is not exposed to the surrounding environment, it is called a heat spreader. If the surface of the heat sink is exposed to the surrounding environment, it is called a heat slug. The typical materials used for the heat sink are copper, copper alloy, Shao, Ming 〇 milk) 84 specifications (210/297 mm) -2- ------ ---- Liang | III D 3, τ (please Read the precautions on the back before filling out this page) Printed by the Ministry of Economy Central Standards Bureau Employee Consumer Cooperative Printed by the Ministry of Economic Affairs Central Standards Bureau Employee Consumer Cooperative 311266 A7 B7 V. Invention Description (>) Alloy or any other high thermal conductivity material . If a heat sink is used in the 1C device to promote heat dissipation, the heat sink must be attached to the vicinity of the semiconductor wafer (or die). Traditionally, when a heat sink is used to increase the heat dissipation of a plastic mold package, the heat sink can be fixed to a die attaching foot in the lead frame. The die attachment foot is a metal platform, located in the center of the lead frame, supported by the connecting rod connected to the lead frame. An example of the traditional method is the use of adhesive tapes such as polyethylene press tapes between the die attachment feet and the heat sink. Please refer to Figure 1 for this approach. The polyethylene presses the tape 10 to tightly connect the attached die base 12 to the heat sink 14. In this viscously connected heat sink, even if the die attaching foot can be closely contacted with the heat sink, but the tape itself does not conduct heat, it will hinder the heat conduction between the die attaching foot and the heat sink . Moreover, to use this adhesive tape, additional process steps are required, which greatly increases the manufacturing cost. If the heat sink is large enough to cover the lead wire bonding area, the wire bonding process will not be able to hold the wire and even cover the lead wire, and the wire bonding process will encounter problems. This means that in the traditional method, the heat sink should not be larger than the die attaching feet. In order to improve the cooling efficiency of the integrated circuit chip packaged in the plastic, some people also use an external additional heat sink adjacent to the foot where the crystal is attached. Such a heat sink is illustrated in Figures 2a to 2c. When manufacturing such an externally attached heat sink, first, the lead frame 20 having the die-attached foot portion 22 is brought close to the integrated circuit die 26 and the heat sink 24 and placed in a mold fixture. Then, around the lead frame 20, a plastic mold package 28 is formed by injection molding to encapsulate all the components. One disadvantage of this process is that during injection molding, the die attaching feet 22 often bend away from the heat sink 24. 'so that the injected plastic penetrates between the die attaching feet 22 and the heat sink 24. As a result, the plastic material running in becomes an insulator, reducing the heat dissipation efficiency of the heat sink 24. Another traditional method to improve the heat dissipation efficiency between the die-attached foot and the heat sink is to add a hollow channel design to the mold device. In the design of FIG. 3, the integrated circuit die 42 is first placed on the die attaching foot, and then the mold device 40 is sealed. Then, the hollow passage 46 under the foot 44 of the die attaching portion is emptied, so that the foot is pressed tightly on the heat sink 48. Then the plastic injection process is carried out to encapsulate the components. This method can usually effectively make the die attach to the foot and the paper size of the paper to comply with the Chinese National Standard (CNS) Λ4 specification (210Χ297mm) —3—I _ 衣-(Please read the precautions on the back before filling in This page),-= β 311266 at B7 V. Description of the invention (3) The heater has good contact ', but it must be added with empty channels in the mold device to increase tool cost and manufacturing time. In an application belonging to the applicant of this case, we proposed another method of joining the heat sink to the die attaching foot in the plastic mold package. This method is to design an opening in the die attachment foot, which is enough to join the integrated circuit die and the heat sink during the die bonding process. In this design, a protruding part of the heat sink and the opening in the die-attached foot are connected to each other by friction, so that the heat sink can be assembled on the die-attached foot. There is a recessed area on the top surface of this heat sink, and the periphery is slightly convex, which can accommodate an integrated circuit chip. This method requires precise control of the size of the opening of the foot to which the die is attached and the periphery of the outer edge of the heat sink, so that the two components can be connected to each other by friction. In addition, because it is impossible to hold the lead during the wire bonding process, the size of the heat sink is therefore limited. In most of the traditional methods, the die attaching feet are required to make the heat sink permanently fixed on the die attaching feet. When making the die attach foot, the lithography process and the etching process must be used to make the size very accurate. Moreover, the die attaching foot also becomes another layer of heat insulation layer, which hinders the heat conduction between the 1C die and the heat sink. In addition, in all traditional methods of permanently fixing the heat sink to the lead frame, the area of the heat sink is limited, which not only limits the heat dissipation efficiency of the heat sink, but also cannot test the 1C chip after the 1C chip is fixed to the heat sink. In the KGD (known good die) test, it is very necessary to test the 1C wafer after fixing it to the heat sink. I-i II —I 1-I Μ 衣 ------n printed by the Staff Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs (please read the precautions on the back before filling out this page) In traditional 1C chip manufacturing technology, the chip is It is formed by cutting a wafer into grains. These wafers are called die, because they are not encapsulated (or protected) in plastic packaging, so the dust, 7 atmosphere, radiation and temperature difference in the environment can easily damage these die. Moreover, these bare crystals are very brittle, small, and easily damaged. In order to avoid damaging the circuits on the wafer, the bare die cannot be stacked during processing, and must be handled carefully. Therefore, it is almost impossible to perform KGD test on the die. In the traditional manufacturing process, before cutting the die, a layer of adhesive tape is attached to the back of the wafer. After the die is cut, the bare crystal is still adhered to the adhesive tape. This avoids any potential damage that may occur when the wafer is away from the wafer after dicing. After splitting, use the empty device. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm). A ¢-A7 ___________B7_ V. Description of the invention (+) Transfer the bare crystal to the attached die on the lead frame Feet. Therefore, any test required by the die must be performed before the singulation and the wafer is still fixed on the wafer (commonly referred to as wafer test). The problematic wafers will be ink-printed and screened from other wafers before being sent to the wafer bonding process. The disadvantage of this test method is that there is no guarantee that the bare crystal will remain good after the die is cut and separated. Therefore, it is best to find a test method that can be tested when the bare die is just separated from the wafer and transferred to the die-attached foot. Of course, this requires that the die attach feet be independent from the lead frame. In a traditional lead frame, the leads carrying power, ground, and signal are on the same plane and are very close. Interference often occurs between them, causing noise and crosstalk. Someone tried to solve this problem by adding two additional metal layers on the lead frame with an insulating layer in between, and connecting the power and ground to the metal layer. This three-layer lead frame structure not only improves the electronic characteristics, but also provides extra leads that can be used as signal leads. But the disadvantage of this structure is that the cost is too high. Another object of the present invention is to provide a method and a device to provide an attachment device that is drawn from a connecting rod of a lead frame and a socket device that attaches a die base, so that the die attach foot can be installed on the lead frame, but still Disassemble. Another object of the present invention is to propose a method and device for mounting a die attach foot with good heat dissipation function on a lead frame. It is an object of the present invention to provide a method and apparatus for mounting a die attach foot with a double metal sheet on a lead frame. An object of the present invention is to propose a method and a device for installing a double-layer metal sheet and a die attach foot with high thermal conductivity to improve the electronic and thermal functions of the lead frame. 1 'n IIII n «n I n II n T 3,, T (please read the precautions on the back before filling out this page) printed by the Central Bureau of Standards of the Ministry of Economic Affairs Negative Work Consumer Cooperative It is to propose a method and device to make the die attaching feet become bare crystal protection machine to facilitate KGD test. Another further object of the present invention is to propose a method and device for attaching 1C die to a die with a heat absorber that has a very good thermal function and then attaching it to a lead frame. CNS) A4 specification (210x297 mm) -r- 511266 A7 B7 Printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs V. Description of the invention (f) The invention also has a silk-MHst-frequency threshold is a kind of towel-free Device, the attachment device on the wire rack of the shed, the socket device on the foot of the wrong die, the stomach device, to be installed on the wire rack, but it can still be detached. There is another step forward in this flip-up. The purpose is to propose a method and device to make a V-shaped metal fill on the lead frame so as to be latched on the socket device of the die attachment foot, so that the die attach foot Can be installed on the lead frame, but still detachable. Still another object of the present invention is to provide a method and device for bonding the connecting rod on the lead frame to the die attaching foot with an adhesive, so that the heat sink is installed on the lead frame. Brief Description of the Invention The present invention proposes a method and apparatus that can mount a heat sink on a lead frame, but can still be detached so that the 1C die can be fixed on the heat sink later. In the method and apparatus of the present invention, it is not necessary to install the heat sink by attaching the die base. In the specific embodiment proposed by the present invention, there are many pins on the lead frame, and many connecting rods extend inward from the lead frame. Each connecting rod has a fixed end on the lead frame and a free end with a fixing device on it. In addition, many socket devices are designed on the heat sink, which can be used to accept the fixing device on the free end of the connecting rod. Finally, the fixing device on the connecting rod and the socket device on the heat sink are engaged with each other, and then disassembled if necessary. In another embodiment, many connecting rods on the lead frame can be joined to the recessed area around the heat sink by adhesive. If the adhesive used can be released again, the heat sink can be removed from the lead frame. The invention further includes the assembly of the lead frame and the heat sink, wherein the lead frame has leads, and several connecting rods extend inward from the lead frame. Each connecting rod has a fixed end on the lead frame and a free end with a fixing device on it. This assembly also contains a heat sink with a number of socket devices that can be used to accept the fixing device on the free end of the connecting rod. When the heat absorber is assembled on the lead frame, the fixing device on the connecting rod and the socket device on the heat absorber are compatible with the paper standard of China National Standard (CNS) Λ4 specification (210X297mm) -II-n I-n I \ ^ — I ---- IT 3% T (please read the precautions on the back before filling in this page) Employee consumption cooperation of the Central Bureau of Standards of the Ministry of Economic Affairs Du Printed A7 B7 V. Description of invention (纟) This connection, Disassemble when necessary. Finally, when the 1C die is attached, it can be attached before the heat sink is attached to the wire frame, or it can be adhered after the heat sink is attached to the wire frame. BRIEF DESCRIPTION OF THE DRAWINGS With reference to the following description and the accompanying drawings, other objects, contents, and advantages of the present invention will be more clearly seen. The accompanying drawings are as follows: FIG. 1 is a traditional plastic mold package using adhesive tape Enlarged view of the cross section. FIGS. 2a to 2c are enlarged cross-sectional views of a conventional first heat sink having a recessed area. FIG. 3 is an enlarged cross-sectional view of a traditional third type of mold apparatus having hollow channels. 4 is a perspective view of the lower container of the heat sink and joint assembly of the present invention. Fig. 5 is a perspective view of a 1C die and a heat sink located in the cavity of the joint assembly. Figure 6 is a perspective view of the connecting rod of the lead frame, the connecting rod has a fixing device above the heat sink. Figure 7 is a perspective view of the upper container plate of the joint assembly, the joint assembly has a push pin, located on the wire Above the rack and heat sink. 7A is a perspective view of a lead frame reel, which includes many lead frames, which are assembled to many heat sinks in sequence in a joint assembly having many cavities. Figures 8a to 8d are enlarged cross-sectional views of the socket device on the connecting rod connected to the heat sink in the specific embodiment. Fig. 8e is a perspective view of the fixing device on the connecting rod and the socket device on the heat sink in the engaged position. Figures 9a to 9d are enlarged cross-sectional views of another specific embodiment of the socket device on which the fixing device on the connecting rod is connected to the heat sink. Fig. 9e is a perspective view of the fixing device on the connecting rod and the socket device on the heat sink in the engaged position. 10a to 10d are enlarged cross-sectional views of another specific embodiment of the socket device where the fixing device on the connecting rod is connected to the heat sink block. This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (2! 0X 297 Public Broadcasting) —? One (please read the precautions on the back before filling out this page), ^ A7 B7 ~ ··-_ _______ _ V. Invention Description (7) Figure 10e is a perspective view of the fixing device on the connecting rod and the socket device on the heat sink in the connected position. Figure 1.1 is a perspective view of the wire bonding between the 1C die and the arch circle on the lead frame. Fig. 12 is a perspective view of a heat sink located above a lower container plate of a joint assembly having positioning pins. Figure 13 is a perspective view of the substrate above the heat sink. Fig. 14 is a perspective view β of many 1C grains above the substrate before being adhered to the substrate. Fig. 15 is a lead frame with connecting rods above the heat sink having a socket device and many 1C grains that have been joined. Fig. 16 is a perspective view of the upper container plate of the joint assembly, which has a push pin and is located above the lead frame and the heat sink. 17 is a bonding wire between the lead frame and the substrate, and between the 1C die and the substrate. Fig. 18 is a perspective view of a heat sink. The heat sink has a socket device engageable with a recessed corner of a lead frame. 19 is an enlarged cross-sectional view of a 1C die bonded to a lead frame and a heat sink. Fig. 20 is a plan view of a lead frame having bonding pads on each connecting rod. Detailed Description of the Specific Embodiments The Central Committee of Economics and Staff Employee Cooperative Printing Co., Ltd. The present invention provides a method for manufacturing a lead frame without built-in die-attached feet. If a semiconductor device needs to strengthen a specific function, that is, enhance the thermal function or electrical function 'testing the bare crystal' or when assembling a multi-chip module, the die attach pad can be modified to meet a specific purpose. For example, the die attach foot can be modified to a heat absorber that enhances the thermal function, can be changed to a double-layer metal sheet that enhances the electrical function (one of which is the power plane, and the other is the connection plane), or can be changed It is a combination of test sockets for testing die. If you want to further enhance the electrical function of the heat sink / lead frame combination, you can use a three-layer lead frame structure that includes a top signal layer, a middle power layer, and a bottom ground layer. -— (Please read the precautions on the back before filling in this page) This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210X297 public) 311266 A7 ____ B7 V. Description of the invention (y) The method of the present invention can be manufactured The lead frame without built-in die-attached feet can be used to install a single 1C die 'or many IC die. If a large number of 1C die are to be installed, first attach one side of the substrate to the heat sink (also serving as a die attach foot), and then attach the 1C die to the substrate. The specific embodiments and several different embodiments of the present invention will be described below. In the specific embodiment proposed by the present invention, there are leads on the lead frame, and many connecting rods extend inward from the lead frame. Each connecting rod has a fixed end on the lead frame and a free end that is usually shorter than the pin and has a fixing device. In addition, many socket devices are designed on the heat sink, which can be used to accept the fixing device on the free end of the connecting rod. The number of socket devices on the heat sink is usually equal to the number of fixing devices on the connecting rod. The fixing device on the top of the connecting rod can be pressed into a V-shaped metal hook to mechanically latch the socket device on the heat sink. If the heat sink is made of thin metal sheet, the socket device on the heat sink can be a notch so that the V-shaped metal hook can be mechanically latched on the heat sink. Printed by H--! U-II I-* ^-I.--1--_ D 3, τ (Please read the precautions on the back before filling in this page) In the embodiment, the heat sink is thicker than the metal foil, which is generally called a heat sink. A long metal slot can be formed on the top surface of the heat sink as a socket device to accommodate the V-shaped metal hook on the connecting rod. In another different embodiment, the heat sink is thicker, that is, the heat sink. After the plastic packaging process, the surface will be exposed to the surrounding environment. For this heat sink, a metal can be formed on its top surface The long slot serves as a socket device to accommodate the V-shaped metal hook on the connecting rod. In yet another embodiment, the socket device on the heat sink is a recessed area on the surface of the heat sink. Each connecting rod of the lead frame has a foot part, which can be connected to a concave area on the surface of the heat sink by an adhesive device. First, please refer to FIG. 4, which illustrates a heat sink 10 (radiator) having a socket device 12 at each corner. The socket device 12 formed as a long metal slot has a top 14 that is partially open. The heat sink 10 has a number of openings 16, through which the thickness of the whole heat sink "helps fix the heat sink 10 to the lower container 2D of the joint assembly" and the recessed area 22 can accommodate the heat sink 10. Recessed area 22 This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (210 X 297 mm) 1-1 The printing and printing of A7 Β7 by the consumer cooperation of the Central Standards Bureau of the Ministry of Economic Affairs 5. The positioning block 24 in the description of invention (7), The positioning of the heat sink 10 can be further assisted. In the subsequent wire bonding step, the positioning block 24 can also be used to support the arch. The opening 16 in the heat sink 10 is an advantage of the present invention. With these openings, the positioning block 24 can be used to support the pins. For a heat sink that serves as a die attachment foot, no large area will hinder the wire bonding process. Unlike traditional heat sinks that do not require die-attached feet, the size of the heat sink of the present invention is not limited by the size of the leads. We have found that the opening 16 has only a small effect on the heat dissipation capacity of the heat sink 10. Another advantage of the opening 16 is that during the sealing process of the wafer, the encapsulated compound will flow into the opening, which can make the joint between the heat sink and the compound better. After the bonding effect is improved, the problem of delamination caused by the difference in thermal expansion behavior between the heat sink and the encapsulating compound can be eliminated. When the 1C die 28 is mounted on the heat sink 10, a viscous device (not shown) can be used. In FIG. 5, the 1C die 28 is located above the cavity 30. The positioning block 24 is generally slightly thicker than the thickness of the heat sink, so the surface of the positioning block 24 will protrude above the top surface of the heat sink 10. The protruding surface can support the pins in the later wire bonding operation. To bond the 1C die 28 to the cavity 30 between the positioning blocks 24 of the heat sink 10 with an adhesive, a highly conductive adhesive can be used. One of the combined adhesives is a thermosetting polymer, and is mixed with conductive metal powder such as silver. In the perspective view of FIG. 6, the lead frame 36 is located above the lower container plate of the heat sink 10 and the joint assembly 20. The lead frame 36 has many arch circles 38 and arch tips 40. At each corner of the lead frame 36, there is a connecting rod 42. The tip of the connecting rod 42 is pressed into a V-shaped metal hook 44. Figures 8a to 8d illustrate the enlarged detailed structure of the V-shaped metal hook. Before the heat sink 10 / die 28 combination is fixed on the lead frame 36, the die 28 may be subjected to a KGD (known good die) test. The heat sink 10 can protect the die 28 from damage during the test. It was not until the die passed the KGD test that the heat sink 10 / die 28 combination was fixed to the lead frame 36. In FIG. 7, there are many push rods 52 on the upper container plate of the joint assembly. In FIG. 7A, the lead frame reel 53 has many lead frames 36, which can be used in the joint assembly with many cavities 30. The paper size is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). Read the precautions on the back and then fill out this page) Order 311266 at B7 5. In the description of invention (丨 σ) 55, it is joined with many heat absorbers 10 at the same time. This is a more realistic design in the manufacturing process. Obviously, if necessary, the heat sink can also be individually joined to each lead frame. If the upper container 48 (Figure 7) is placed above the lead frame 36 and the heat sink 10 and pressed down firmly, the push rod 52 will force the V-shaped metal hook 44 to engage into the opening 54 (Figure 8a To 8d), they are mechanically locked through the opening 54 of the socket device 56 of the heat sink. The latching process can be referred to Figures 8a to 8d. It should be particularly noted here that when the metal pressing V-shaped metal hook 44 and the socket device 56 of the heat sink are selected, the range of hardness or elastic constant is very wide, so that the fixing device on the heat sink and the socket on the lead frame The device has various design methods. If the latch between the heat sink and the lead frame is mechanical, then for each design, individual parameters need to be determined, such as metal thickness, metal type, and metal elastic constants. Fig. 8e shows a part of the condition after the heat sink 56 is connected to the lead frame 36. FIGS. 9a to 9e and FIGS. 10a to 10e respectively illustrate two embodiments of V-shaped metal hooks on the connecting rod of the present invention. These metal hooks serve as fixing devices and are connected to sockets on the heat sink Device. 9a to 9d are enlarged cross-sectional views illustrating the state where the V-shaped metal hook 42 is engaged with the opening groove 62 at the corner of the heat sink 60. FIG. The opening 64 on the top of the metal slot 62 can allow the V-shaped metal hook 42 to pass through. In Figs. 9a and 9b, the metal hook 42 is first placed in the opening 64 of the heat sink 60. The heat sink 60 in Figs. 9a to 9e is a heat sink. In FIGS. 9c and 9d, the V-shaped metal hook 42 is pushed into the opening 64 of the heat sink 60. As can be seen from FIG. 9e, the tip of the V-shaped metal hook 42 will be engaged with the bottom 66 of the opening groove 62, and the heat sink 60 is locked to the lead frame 70. Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs (please read the precautions on the back before filling in this page) Figures 10a to 10e illustrate another embodiment of the present invention. The heat sink 72 in this embodiment is a heat absorbing block. The steps illustrated in Figs. 10a to 10d are similar to those of Figs. 9a to 9d, except that the heat-absorbing block 72 is substantially thicker than the heat sink 60 in Figs. 9a to 9d. Fig. 10e also illustrates a perspective view of the heat sink 72 and the lead frame 76. In the perspective view of FIG. 11, the lead frame 36 has been assembled to the heat sink 10 in the lower container plate of the joint assembly. Next, wire bonding is performed, and the lead tip 40 and the 1C die 28 are connected by the solder wire 82. The protruding surface of the positioning block 24 can be used as a support for wire bonding. This paper scale is applicable to the Chinese National Standard (CNS) Λ4 specification (2 丨 0 '~ 297mm) A7 B7 printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs V. Invention description (") Please note that when the heat absorber is photographed After latching to the lead frame in the way of 8a to 8e, 9a to 9e 'l〇a to 10e, the V-shaped mechanical hook can still be unlocked from the position of the latch with a suitable tool, so that the heat absorber, with it The attached 1C can be detached from the lead frame. Figures 12 to 17 illustrate the process of installing the heat sink on the lead frame, which can still be detached in the future, in which many 1C die are bonded to the heat sink. For example, first, according to the description of FIG. 12, the heat sink 90 having the positioning holes 92 at the corners is placed in the lower container 94 of the engaging assembly having the positioning pins 96. When the heat sink 90 is placed in the lower container 94, the positioning pin 96 and the positioning hole 92 will make the positioning more precise. Next, as shown in FIG. 13, the substrate 98 is first adhered to the heat sink 90 with a conductive adhesive (not shown). Then, many conductive 1C dies 102 are adhered to the substrate 98 using conductive adhesive (not shown) or other techniques such as flip chip or TAB. In Fig. 14, the 1C die 102 is located above the substrate 98, so before the heat sink 90 is assembled on the lead frame 106, the KGS (known good substrate) test can be performed on the substrate 98 and the die 102 thereon. In this way, it is possible to select the die and the substrate with normal functions to be assembled on the lead frame 106. In the next step, the V-shaped metal hook 110 is latched to the socket device 112 on the heat sink 90 so that the lead frame 106 with the connecting rod 108 can be assembled to the heat sink 90. Refer to Figure 15 for the assembly situation. To connect the V-shaped metal hook 110 to the socket device 112 on the heat sink 90, it is necessary to press the upper receiving plate 120 with the push rod 122 according to FIG. Finally, a wire bonding process is performed to allow the lead tips 126 on the lead frame 106 to be electrically connected to the substrate 98. The result is shown in FIG. Then, in a continuous wire bonding process, many 1C dies 102 are connected to the substrate 98. The wire bonding process between the 1C die 1G2 and the substrate 98 may be performed before the wire bonding process of the lead tip 126 and the substrate 98. Another embodiment of the invention uses an adhesive to mount the heat sink on the lead frame. Figures 18 to 20 illustrate this embodiment. In this embodiment, many recessed regions 134 similar to those in Fig. 18 are designed on the top surface 132 of the heat sink 13G. As can be seen from FIGS. 19 and 20, at the end points of the connecting rods 136 of the lead frame 142, the bonding feet 138 are designed to be bonded to the heat sink 130. Before assembling the heat sink 30 to the lead frame 142, the 1CD die 140 may be KGD tested. Only when the die 140 passes this paper standard is the Chinese National Standard (CNS) Λ4 specification (2 丨 〇χ297mm) -P one (please read the precautions on the back before filling this page) *? Τ A7 B7 V. Invention Explanation (丨>) After the KGD test, the heat sink 30 is assembled to the lead frame 14G. During the test, the heat sink 30 also has the function of protecting the die 140. Although the above description is illustrated by examples, it should be understood that the vocabulary used is for the purpose of description, not for limiting the scope of the present invention. In addition, although the above description has been elaborated through the preferred embodiment, those skilled in the art can use these principles to obtain other variations of the present invention. In the following, the specific embodiments of the present invention, as well as its exclusive property rights and exclusive rights, will be declared in the scope of patent application. n HI m-n-n I ^^^ — D 3, τ (please read the notes on the back before filling in this page) The MM Zhang scale printed by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs is applicable to the Chinese National Standard (CNS) A4 size (210X297mm) ~ ί3-