TW302376B - - Google Patents

Description

3〇2376 A7 B7 Printed by the Consumer Cooperative of the Central Bureau of Economics of the Ministry of Economic Affairs j. Description of the invention () The 邋 1 · 邕 11 [: This invention relates to an electronic multilayer packaging, which includes poly (aryl ether benzimidazole) , Polyimide and copper, and its preparation method. In addition, the present invention relates to chopped poly (aryl ether benzimidazole), which is used to form multilayer electronic packaging. 2. The first skill _JT_i mold packaging technology is usually used in electrical and electronic devices, combination, Yajiehe system and the like. Generally, electronic packaging contains multiple layers, and each layer contains one or more circuits. The most common is that copper wires or gold deposits are deposited on the Satoshi polyimide, which is then placed on the substrate to form a mold or multiple circuits. When forming a multi-layer electronic package, the first polyimide precursor is placed on the * sheet. This layer is then cured onto the polyimide. A patterned copper layer defining the circuit is embedded in the polyetherimide cured layer. The copper layer may be raised above the polyimide or at the height of the polyimide, which is considered to be raised or planar, respectively. Repeat the procedure to form the multilayer package. Although the use of these materials is most suitable for this application, there are problems with their use. One of the problems is the poor adhesion between the feed and the polyimide. Another problem is that the net will react with the polyimide precursor to form a fine precipitate of copper oxide particles in the polyimide layer. These two problems can cause damage to electronic applications and render the circuit ineffective. That is, based on the movement of all or part of the feeding conductor path, poor adhesion will cause discontinuity in the feeding circuit. In the same way, the addition of free copper oxide particles will increase the Juto -4- This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (210X297mm) (please read the precautions on the back before filling this page)

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, 1T% Printed by the employee consumer cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs A7 s______ V. Description of the invention (2) The conductivity of the imine can also cause malfunctions. Many suggested solutions have been proposed to overcome these well-known problems. One solution proposed to overcome the problem of reactivity and poor adhesion between copper and polyimide is to contact these substances with Ming. When a complex is used in the copper-polyimide planar layer, the chromium layer disposed thereon prevents the mesh above the first layer from contacting the polyimide of the second layer. This produces a chromium-polyimide interface, and because of the good adhesion between chromium and polyimide (as known to those skilled in the art), this adhesion problem can be mitigated. Moreover, Ming will not react with polyimide. Therefore, the reaction product of the complex-containing compound that disturbs the electrical insulation between the layer and the thorium is not formed. Although this expedient method is effective, it is time-consuming and expensive. When the raised feed layer is included, it is even more time-consuming and expensive. In order to cover the feed-polyimide layer ', it is necessary to plate the path only to provide a thickness of 200A to 500A, and then coat the next layer of polyimide on it. As is known to those skilled in the art, this involves the laying of a polyamic acid film, which can therefore cure M to form the polyimide. Another type of square that can replace the M-chrome coating is a group coating. However, this change only means that one type of gold is replaced by another. The time, complexity and cost of this operation have not changed. Yet another solution is to introduce an electroless gold plaster, usually nickel, W-coated steel and provide a barrier to its contact with the polyimide layer. This coating operation is technically very difficult and therefore expensive. Furthermore, the use of non-Xiao gold-plated flooding coatings is often accompanied by an additional coating step, which means the coating of a silane coupling agent | this will increase the complexity and cost of this alternative method. -5- This paper scale uses the Chinese National Standard (CNS) Α4 specification (210X297mm) ----.-- Ί 叫.: 'Clothes (please read the precautions on the back and fill in this page) A7 3〇2376 ^ ___ B7_ V. Description of the invention (3) Other methods to overcome the contact problem of copper _ polyimide on multi-layer zhongzi packaging are granted by US Patent No. 3, 7 7 0, 5 7 3 (issued Lindsey (Lindsey) & US Threshold Patent No. 3, 36 1, 589 (issued to Du mphy (Du mphy) et al.) Provide some patents (and are referenced here) for chemical treatment The method of the amide imide film layer (which can improve their adhesion). Other suggested solutions have been proposed. Needless to say, these methods include the use of adhesion promotion (because the accelerator is in contact with it The incompatibility between the thermal, mechanical and / or electrical properties of the poly-imide layer is very unclear. For example, US Patent No. 4,408,005 (issued to Ka Guomei (ie 31 ^ 38〇 1116) et al. Describe a method of manufacturing a heat-resistant laminated metal sheet in which the metal H $ is disposed in a heat-resistant heterocyclic polymer The inner adhesive layer is insulated from each other and is made of gold foil or foil, and a large amount of volatile substances can be removed from it. The hybrid polymer can be polyimide, polyimide-oximide, Polystyrene. Pyridoxine, Polyethylene Glandular Gland * Polyethylenediamine Gland, Polythiazole or Polyimine Tetrahydropyrrole. Not only the generality of polyimide in the scope of Nakagomi et al. Shao does not specifically mention the special polyarylene ether benzimidazole of the present invention * and does not show the use of the polymer of this patent as a bonding agent layer disposed between the Mo circuit and the adjacent polyimide layer. Zarnoch's US Patent No. 5,180,639 describes a method for improving the surface of an aromatic polymer K to improve the adhesion of the surface to the gold calendar on it. Therefore, this method is similar to It is proposed to overcome the problems related to the poor adhesion between the copper and polyimide layers. This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (21 ΟΧ297 mm) ί "Ι (please read first (Notes on the back and then fill in this page), 1T Central Bureau of Economic Affairs Printed by the industrial and consumer cooperatives A7 B7 printed by the Beigong Consumer Cooperative of the Central Standards Bureau of the Ministry of Economy V. Description of the invention (4) _- Ranzanok patent contains an improved aromatic polymer surface M improves the adhesion of the stomach golden gull layer Method, but the aromatic polymerization% mentioned by Zanoke is mainly polycarbonate that is susceptible to nitrification. The chemical reaction involved in forming this improvement, the complexity of the nitrification step makes the patented method Unsatisfactory. US Patent No. 4,022,649 issued to Neckargoe et al. Discloses a method of manufacturing a gold mule laminate including a polybenzimidazole layer. Although this patent mentions the types of heterocyclic polymers utilized in the present invention, the polymer used in the '649 patent did not cover the copper layer K with M to prevent the reaction of steel and polyamic acid. Therefore, the K, 649 patent does not provide a description of the enhanced adhesion of polyimide to polyoximide. U.S. Patent No. 5, 120,819 issued to Lubrizol 1 | 1) 〇 ^ 12) et al. Describes a crosslinkable oligomer (which includes hydrazole, thiazole, or imidazole). However, it must be emphasized that the 819 patent does not disclose or suggest the use of oligomers described in copper coatings. U.S. Patent No. 3,533,879 issued to Levine describes a method in which fusible polybenzimidazole impregnated suspects can form woven laminates and the like. The patent does not provide disclosure on electrical multilayer articles. U.S. Patent No. 3,957,726 to Gordan et al. Discloses novel polyetherimines whose polymers are described as useful for the formation of prepregs and laminates. As described in the Gordon et al. Patent, polymers, prepregs, membranes, and laminates that have been disclosed to be used to form prepregs and laminates have not been used to cover feed (the essence of The upper part is used to form multi-layer electronic packaging-7- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X 297mm) (Please read the precautions on the back before filling this page) Exhibition · Order 302376 Λ 竹 03677 号The patent application is amended by the document description (January 8ft) 5. The description of the invention (public) A7 B7 The above-mentioned reduction of the shape and shape of the cubes is confirmed by the review method, which has a deconstructive effect. The problem of the connection is minimized. One can be used for the new multi-adhesion, thus making the need for layered packaging and it also eliminates the dielectric with the copper-containing precipitation multi-layer package package has been found to form the package Precipitate K and feed have also been found to be a new copper-polydimide interface related to root ash too invented, insulting to provide a multi-beep huzi package containing at least two base cages and squinting beer) and copper. Further according to the present invention, the new poly (aryl ether cage pyrazol) includes methods of the following formulators, which can reduce the undesirable use of oxygen on the surface of the polymer can be multi-layered. Eye η) ○ can be used in the layer * each insult to illustrate the new multi-layer packaging that can be used in 3 bad packaging and the precipitation of copper and other problems with network adhesion. Moreover, these problems (multilayer packaging with the previous technology microbreads. Including polyimide, poly (aryl • ♦-. Used to make the aforementioned multiple 1 structure (hypoaryl bond benzimidazole) package-II --- -In-Jl-* I (please read the note on the back to fill in this page first), where Β is an integer of at least about 2. where X is at least about 0.1; y is at least about 〇 "; its condition is χ and The sum of y is at least about !; 2 integers of at least 15; the scale of this paper is applicable to the Chinese National Standard (CNS) A4 specification (210 X2 ^^ Description (6 A7 B7

© 〇_ < gH〇: _) < § > where X is — (〇) ~ c (CHjz ~ co ·

/ Or ~~ ^ q); Printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economy and p is an integer of at least about 15. Further according to the present invention, there is provided a method of packaging, the multilayer electronic package comprising disposing a solution layer in a polyprotic solvent on a base H for proton dissolution. Secondly, the polyamide coating is added with a layer of imidazole. The poly (aryl ether benzimidazole) The polyether amine acid is chemically converted into its cured product to form a pathway and will form a feed layer. At least one additional layer (from the deposition of the polymer solution on top of the first layer is used to prepare a multi-layer electronic package (aryl ether benzimidazole) in the non-. The layer is heated to remove the non-addition to the poly C. The aryl ether benzo is cured like the polyether amine group, corresponding to the polyimide. Here deposited in which M completes the dissolution of the first (aryl ether) benzimidazole) is included in this method. (Please read the notes on the back before filling this page)

This paper scale is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ297mm). Printed by the Ministry of Standards and Staff of the Ministry of Consumer Affairs Cooperative A7 B7. 5. Description of the invention (7) SJg-No.1 The characteristics of the multilayer packaging of the present invention are There is good adhesion between the dielectric and copper, and there will be no problems related to the free state compound of copper (especially copper oxide) formed by the multi-layer electronic packaging of the prior art. In addition to polysaccharide imine, this package includes copper conductor and poly (aryl ether benzimidazole). Many of these poly (aryl ether benzimidazoles) are novel in themselves. However, the use of any poly (aryl ether carbamazepine) is new in a multi-layer mine package with polyimide and copper. In this application, through the use of poly (aryl ether benzimidazole) and feeding, the advantages offered by polyimide are in its adhesion to both polyimide and feeding. Known poor adhesion between polyimides. Moreover, poly (aryl ether benzimidazole) can provide a barrier between the polyimide precursor (polyamide) and copper to prevent the formation of copper oxide when forming a multi-layer package. The existence of the poly (aryl ether benzimidazole) can overcome two major problems related to the prior art Leizi multilayer packaging. In detail, the above comments explain the problem of the bonding between polyimide and copper, as well as the problem of the reaction of polyamic acid and copper, through the use of poly (aryl ether benzimidazole) in the manufacture of multilayer packaging ) The layers are arranged in between to overcome. That is, in the second and subsequent layers, the multilayer packaging manufacturing method can eliminate the contact between copper and polyamide. The present invention provides a multi-layer electronic package, wherein each layer includes poly (aryl ether benzimidazole), polyimide and feed. Examples of multi-layer packages include multi-chip modules, printed circuit boards, integrated circuit crystal H and crystal H back-end boards. When preparing the multi-layer package of the present invention, a new method is provided, which includes -10- the paper size is applicable to the Chinese National Standard (CNS) A4 specification (210 X 297 mm) (please read the precautions on the back before filling this page )

, TT 313Q2 m j03677 Patent application tired k Ming mail revision page January U6 A7 B7

5. Description of the invention ($). The first step of disposing the coating of poly (aryl ether benzoxazole) (PAEBI) on the substrate. The PAEBI is provided in the form of an M solution, which is usually in an aprotic solvent, such as N-methyltetrahydropyrrole (NMP), dimethyl propyl urea (DMPU), and hexyltetrahydropyrrole (CHP) , Mixtures thereof and the like. Although any PAEBI may be used when preparing the package of the present invention, it is preferably some specific PAEBI polymers. Many of these better polymers are new in this technique. -A preferred ΡΑΕΒΙ is a polymer having the following structural formula ΡΑΕΒΙ of structural formula I in Smith (Smith) et al .; P_q 1 ya. P..rf! J > r,., H (3), 193 (Indicated in 199U. The preferred type of ΡΑΕΒΙ is in the presence of anhydrous potassium carbonate in dimethyl acetate (preferably 18% solids), resulting in a stoichiometric excess of 1,3-pyrene (4-fluorobenzyl (A)) benzene and 5,5'-bis- (4-hydroxyl-benzimidazole) formed by the reaction. In addition to the above reactants, use 2- (4-hydroxycagel) ¾-imidazole to make the polymer Ended. And added at the beginning of the reaction. • Another type of PAEBI to be covered in the present invention is a paper with a structural formula under the general Chinese national standard (CNS) Α4 specification (2 丨 0X297 Mm) IIIII Pack II Order I i I-line (read first to read the face-free notes and then (彡 私 本 育) (printed by Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs

Where * is at least about 2 canes. A better β is between about 5 and about 15 '-; Ά i _ JU103B77 patent application, Chinese description of the amendment page (January 86) A7 ^ 一 ~ — * ___B7_ V. Description of the invention (i 'Is an integer. PAEBI with structural formula II is in the temperature range between about 140 = 0 and about 15010' under inert nitrogen pressure in a solution of dimethyl acetate (DMAC) and a cage in 4- In the presence of hydroxyphenylacetylene, it is made by reacting 3, bis (4-di-cagecarboxyl) benzene with 5,5-bis (2- (4-hydroxyphenyl) benzazole). The The reaction takes place in the presence of a mild base (preferably amorphous potassium carbonate). The novel PAEBI of structural formula II, although similar to the PAEBI of structural formula I, enjoys thermal stability and low residual coercion ( After thermal cycling ^ ^ * high erbium number * elongation and special adhesion to both polyimide and feed), the polymer of structural formula II has the improved properties provided by its end-capping groups. Also, the acetylene bond can be easily cross-linked and cured by thermal method. This easy cross-linking can enhance the mechanical properties of the cured polymer. K Used in the multilayer Leizi package of the invention in a further problem, the following is a copolymer PAEBI repeated structure units

Printed by the Staff Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs

Where X is at least about 0.1; y is at least about 0.1, and its condition is X

The sum of y and y is at least 1; z is an integer of at least about 15. Preferably, X is from about 0.8 to about 0.8; y is between about 0.2 and about 0.4; z is between about 20 and about 30. The PAEBI polymer with this structural formula III is contained in H-methyltetrahydropyridine (MMP) and anhydrous K2C03, making 1,3-bis (4-gasbenzyl) ¾ and -12- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) A7 B7 --------- 5. Description of the invention (10) 5, fj -_- 2- (4-hydroxybenzyl) Benzimidazole is prepared by reaction (similar to the method used to polymerize the structure I WpAEBI) ° However, these polymerization reactants are compounds containing bisbromo-6 · 7 and 4,4'-difluorobenzophenone To supplement 0 The polymer of structural formula III may provide better improvements than the PAEBI of formula I. That is, the copolymer of formula III has a lower water absorption than the ΡΕΕΒΓ of formula I. Although the PAEBI of formula I has a water absorption of about 4% by weight, the water absorption of the p AEB I copolymer having the structural formula 111 is only about 0.4% by weight. As those skilled in the art know, water has an adverse effect on the properties attempted to be provided by the electronic multiple packaging of the present invention. In detail, the water in PAEBI polymer will reduce the adhesion of the polymer to other polymers and gold and reduce its wall properties, which can make copper and polyimide interact. Used in the present invention, it is another novel ΡΑΕΒΙ polymer in the multi-electronic structure itself, which is a polymer with the following knot type (please read the precautions on the back before filling in this education)-Yi. The paper printed by the Central Bureau of Standards and Staff's Consumer Cooperative applies to the Chinese National Standard (CNS) Α4 specification (210 X 2W mm) A7 B7 5. Description of the invention (11)

丨 丨 ίη-wave! (Please read the notes on the back before filling in this page), 1TP is an integer of at least about 15. The PAEBI polymer of structural formula IV is more soluble in aprotic solvents (such as NMP, DMPU, and CHP) than previous PAEBI polymers to help its application in multilayer electronic packaging. The polymer defined by the junction IV is via the appropriate reactants of 2,2'-bis (fluorobenzyl) -6,6'-dibenzimidazole and repeating structural units (the meaning of which defines X) Made by reaction. Therefore, bisphenols such as bisphenol A, bisphenol AF, bis (6-hydroxyphenyl) diphenylmethane, and 9,9'-bis (hydroxyphenyl) guanidine can be used. In addition, other reactants such as hydroquinone, resorcinol, dihydroxydiphenyl and dihydroxybenzophenone can also be used in place of the above bisphenols. This reaction-14- This paper scale is applicable to China National Standard (CNS) Α4 specification (210X297 mm) Γ Printed by the Ministry of Economy Central Standards Bureau employee consumer cooperatives Printed by the Ministry of Economic Affairs Central Standards Bureau employee consumer cooperatives A7 ___B7_ V. Description of invention ( l2) occurs in the presence of anhydrous potassium hydroxide (as imitated whale) in an aprotic solvent. The product polymer of formula IV is a high molecular weight polymer (which has an inherent property of about 0.4 deciliters per gram Viscosity and have a glass transition temperature in the range between about 2 3 OP and about 2601 C. However, these polymers are soluble in NMP up to a solid content of about 15% to about 25% (weight ratio). The K solution The form of PAEBI is based on the base H, so it is easy to accept high temperature K to remove the solvent (usually containing aprotic solvents). Preferably, the ΡΕΕΒΙ solution is exposed to about 70 t: and about 200 TC under atmospheric pressure More preferably, the temperature is between about 85 ° C and about 150 ° C. The formed PA Ε Β I layer is thus covered by the M polyacrylic acid layer. The polyacetamides are M dianhydride and Condensation reaction between diamines Polyamide can be prepared by the condensation reaction between diester-diacid or diester-diacid dihydride and diamine. In addition, polyamide can be prepared via the reaction between dianhydride and diisocyanate. Condensation reaction is formed. Other methods for preparing polyglutamic acid (which is a precursor of polysaccharides) (see below) include the reaction of bis (ethoxycarbonyl) diimine and diamine and the chemical properties of amino acid Reaction. Other methods for preparing polyimide precursors are given in Kirk-Otherraer, "Encyclopedia of Chemical Technology, Third Edition," Volume 18, pages 704-719 and above. Provided by Lin Xiao, U.S. Patent No. 3, 3 * ^ 1,589 and U.S. Patent No. 3,770,573 issued to Damfee et al. (The above information is hereby incorporated by reference). Polyglycosamine is cured at high temperature and converted into The corresponding polyimide. Generally, under the air scraping, the polyamic acid is exposed to between about 300 ° C and about 400 ° C -15- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 Ali) ----; --Ί 「t clothing! (Please read the notes on the back before filling this page)

* tT A7 3G £ 376 B7 V. Description of the invention (13) > The temperature range of Ά can affect its curing # to polysaccharide imine. This temperature range can also affect the curing of the PAEBI polymer. Therefore, the polyamic acid and PAEBI disposed on the base H are easily heated at this temperature to cause curing of these polymers. However, it ’s important to emphasize that the polymer is arbitrarily cured, so that it cannot be said to form an obvious layer as in conventional laminates. Of course, it does not rule out the possibility of a small amount. The resulting cured product secondly receives the step of forming a desired circuit thereon. This step is accomplished by a lithographic method well known in the art, where the desired circuit is etched, cut, or provided in the form of M vias by different methods on the surface of the cured polyimide-PAEBI. Finally, through a method well known in the art, copper is deposited into the via to complete the first calendar 0 of the multilayer package and then the second layer is prepared by repeating the above method. Once again, the first layer of ΡΑΕΒΙ in solution initiates the preparation process. Since the protective layer of ΡΑΕΒΙ is placed on the exposed copper before coating with a new layer of polyamidoamine, the method can be sure that the first layer is used when the net and polyglycine are reacted. The copper present is not exposed to polyglycan. Moreover, the presence of PAEBI throughout this layer ensures good adhesion to the feed. As demonstrated for both copper and h in this example, PAEBI also has good adhesion to feeding and glycan imines. The following example K is provided to illustrate the invention. Since these examples are presented for illustrative purposes only, the present invention should not be limited by them. Tube example 1 Containing feed .. 丄 ._poly._imine, poly (芳 某 詞義 # 眯 azole) 's material preparation-

K diluted acetic acid cleans the surface of the thin copper foil. PAEBI -16 with structural formula I- This paper scale is applicable to the Chinese National Standard (CNS) Μ specification (210Χ297 mm); ι — Ί "(Please read the precautions on the back before filling this page)-Packing and ordering economy Printed by the Ministry of Standards and Staff Employee Consumer Cooperative of the Ministry of Economic Affairs, Central Standards Bureau, Beigong Consumer Cooperative, A7 B7 V. Description of the invention (14) Dissolved in the triamcinone-NMP solvent (exists in a weight ratio of 60:40) The solution is coated on the surface of the cleaned molybdenum. After the uniform 0.1 micron thick PAEBT is placed on the copper foil and 150 t: lightly baked, poly (biphenyl di) is coated on the PARBT layer Anhydride-p-Phenylenediamine) (BPDA-PDA). The PAEBI and polyglycine amino acid (BPDA-PDA) were exposed to 8 5 t: temperature for 30 minutes, followed by heating at 50 t for 30 Cure in minutes. Then heat the polymer at 2 301 for 30 minutes, then heat at 300¾ for 30 minutes, and finally heat at 4001C for 1 hour. G Example 2 Adhesion of PAF.RT to lying __

Place the 0 micron layer on the substrate. In turn, a solution of PAF.BI with structural formula I dissolved in a 60:40 cyclopentanone-HMP solvent mixture was applied to the calendar and lightly baked at 150 ° C for 1 hour. As in Example 1, the B P D A-P D A calendar is placed on the PAEBI layer • The two polymers are then cured simultaneously according to the procedure described in Example 1. The result is that the cured polymer layer (20 microns thick) is placed on top of the 10 microns thick copper layer. Since the PAEBI layer was applied separately before the polyamide, two layers were formed on the 20-micron thick polymer layer. Because PAEBI was originally placed on the copper layer, so it is the bottom layer (in contact with the feed layer). A 5 mm wide specimen strip was cut from the structure thus formed. Known by art. An Instron machine was used to strip the polymer layer from the copper layer. Based on several tests of the samples, the peel strength required to separate the PAEBI layer (ranging from 80 to 90 g / mm) from the copper calendar was determined. That is, the analysis of the gun gauge confirms that the range indicates the quantitative adhesion between PAEBI and steel -17- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm) (please read the precautions on the back before filling in this Page) Binding · Order A7 B7 V. Description of the invention (15) Printed sm of the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 3. According to the procedure mentioned in the text 'The cured 1 used in Examples 1 and 2 is thermally cured The .0 micron polyimide layer was formed on the substrate. Thereafter, the cured polyimide layer was modified with ΚΠΗ 'and then modified with acid, and then M was washed with water and isopropyl fermentation to produce a 10 μm thick cured polyimide layer. The same 20 micro-thick cured PARIU and polyimide compound as Φ6 placed on the 10-micron-thick copper layer of Example 2 were prepared in the same manner as the preparation of this layer of Example 2. As in Example 2, the fact that ΡΑΕΒΙ is the first polymer to be applied on top of the cured polyimide, thus resulting in the ΡΑΕΒΙ layer being disposed on top of the 10-micrometer polyimide layer. Therefore, the adhesion of ΡΑΕΒΙ to polyimide is again determined by measuring the peel strength required to separate this wide range. That is, using the Instron [trademark] machine in the same manner as in Example 2 • K measures the force required to peel a 5 mm sample piece from the adjacent polymer layer. The peel strength of ΡΑΕΒΙ to polyimide was found to be 98 g / mm (average of several samples). Tube Example 4 ε i The cross-section of the copper-polymer interface of the cured sample of Example 2 was examined using a transmission microscope (TEM). The polymer was found to be free of copper-containing precipitates. Therefore, it is concluded that PAEBI disposed between the copper and polyimide layers can be used as a barrier against contact between the separated layers. This paper scale is applicable to China National Standards (CNS) Μ said grid (210 to 297 mm)-1 "(please read the precautions on the back before filling this page) i installed · booked by the Employee Consumer Cooperative of the Central Standards Bureau of the Ministry of Economic Affairs System A7 ^ ----- 1 'Description of the invention (ι〇SL in red in the presence of 4-hydroxybenzyl acetylene, make〗, 3_ bis (4_ indanyl acetyl group) cage and 5, 5, -Bis (2- (4-hydroxyphenyl) benzo snorting) reaction. The polymerization reaction takes place in the presence of DMAC-toluene mixed solvent and carbonic acid bell at spoon mobility. The resulting product PAEBI has the formula The structural formula of II. SL red with straight _ 结 —lULUJUAOX in the presence of 4,4, -difluorobenzyl, so that 3-, (4-fluorobenzyl) benzene and bisphenol AF reaction The reaction takes place in an NMP solution at an atmospheric pressure of 175C. The product of this reaction is a polymer of structural formula III. The characteristic of this polymer is an intrinsic viscosity of 0.45 deciliters per gram (at 25Ϊ: measured in NMP ) 〇 Example 7. Preparation of PARBI polymer with tandem TV 2,2'-bis (fluorophenyl) -6,6 bibenzimidazole in bisphenol AF, bis (6-hydroxyphenyl) -Diphenylmethane, 9,9 · -bis (hydroxybenzyl) fluoride and bisphenol A. Each of these reactions takes place in the dimethylpropene gland and / or the mixed N-methyltetrafluoropyrrole-ring Hexyl tetrahydropyrrole solution. The polymerization products of these reactions have structural formula IV, where X has the meaning shown in Table 1 below. Table 1 also includes the physical properties of PAEBI product specialization. Glass transition temperature and intrinsic viscosity (at 2 5 ° C is measured in N MP.) -19- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297mm) ----.-- installed! (Please read the precautions on the back before filling this page ) Order Γ A7 B7 5. Description of the invention (π) 8e · 〇tvo η · ο 9ε · 〇9'ο ςπ-0 υα -σ ^ οοΐζ 8304 ΟΙΛζ (please read the precautions on the back before filling this page)-taxi -Cloth- 0 χ

Ordered plaques in the country < n embedded ΥEastern Ministry of Economic Affairs Central Standards Bureau employee consumption cooperation du printing dHa / ΛΣZΛχυ / αιεζ iHsad5 / dwN swa < JXU / CUS2 swa dv ^ ® ssfr »Lin • ιί ηιέ» Fat (w Qin) ^ .-. 6.6 V Qiu ». -20- This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (2ΙΟΧ 297mm) 302376 V. Description of the invention (18) All are familiar with the examples and examples With the implementation of the reality and the limitations of the implementation of the implementation of the implementation, only the entity should be aware of the fact that it issued its own, and so on. Cause solution. «It's Zhongyi and Yiming. Rong Rongfa's fence is very basic ^ lFT is in the tool and M Specialist invites t to apply to this desire -------- ^ Attack ------ order ----- Dong. · F ^ (please read the notes on the back before filling in this page) The paper standard printed by the Employee Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs is applicable to the Chinese National Standard (CNS) A4 (210X 297 mm)

Claims (1)

Xiong M〗 03P &77; Patent No. 77 Case of Chinese Patent Requests _Cheng Zhengtai (January 86) A8 B8 C8 D8 Month Day J Throw. 31 Supplement 丨 6. The scope of the patent application is a multi-dimensional packaging, which contains at least two layers, each layer includes polyimide, poly (aryl ether benzimidazole) and tungsten, wherein the poly (aryl ether benzine beer) Has the following structural formula: where η is an integer of at least 15; where m is an integer from 2 to 5; where X is an integer of at least 0.1; y is at least 0.1, with the proviso that the sum of X is at least 1; Z is an integer of at least 15; or ·-^-Y loaded ------;-order ------ (· (please read the precautions on the back before filling this page) Ministry of Economic Affairs The standard paper size of the printed copy of the Central Standards Bureau's Consumer Labor Cooperative is applicable to China's National Standard Rate (CNS) Six 4 Regulations (210X297mm). Its 6X is (Please read the notes on the back before filling this page) Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Economic Affairs 〇 is an integer of at least 15. 2. A kind of poly (aryl ether benzoxazole), which is selected from the group consisting of polymers having the following structural formula: Weng Qichun Pan · where m is an integer from 2 to 15; Η Η 1 where X is at least 0.1; y is at least 0.1, and its condition is 3 {and the total of y is at least 1: and z is an integer of at least 15 and the paper wave scale is based on the Chinese National Standard (CNS) A4 wash grid (210X297 mm) ABCD economy Printed by the Beigong Consumer Cooperative of the Central Bureau of Standards of the Ministry of Education ι> is an integer of at least 15. 3. Poly (aryl ether benzimidazole) according to the second item of the patent scope of Genzai, where-.--«The polymer has the following K structural formula Where 1 * is an integer between 5 and 丨 5. 4. According to poly (aryl ether benzoxazole) of item 2 of the patent application, where the polymer has the structural formula- This paper uses the Chinese National Standard (CNS) A4 standard (210X297mm) 1m ^ ^----0 β ^ ϋϋ — ^ v ^ tl ^ — ^ ί-· -_ ϊ mu 11-- -^ I -1 n ^ ni 1—-«I ....... (, (please read the precautions on the back before filling in this page) 302376 Λ8 B8 C8 D8 VI. Patent application scope where X is between 0.6 to 0.8; y is between 0.2 and 0.4; z is an integer between 20 and 30. 5. The method of manufacturing a multi-layered dumpling package includes the following steps: ( a) In the form of K solution, deposit a layer of poly (aryl ether benzimidazole) on the base Ni :; where the poly (aryl ether benzimidazole) has the following structural formula: (Please read the notes on the back before writing This page) Where nt is an integer from 2 to 15;-♦ where X is an integer of at least 0.1; y is at least 0.1, with the proviso that the entangled sum of X and y is at least 1; z is at least 15 of the entire satin; or Printed by the Ministry of Economic Affairs, Central Bureau of Accreditation and Consumer Cooperatives ¾-on paper for the quasi-home country junior high school 4 I company 7 9 2 X 302376 々, patent application scope 8 88 8 ABCD n ^^^ 1 nn msl-i n ^ i ^ n ^ in (please read the precautions on the back before filling in this page) ◎ / x @-{〇) -or- (〇); · P is at least An integer of 1 to 5; (b) heating the poly (aryl benzobenzoxazole) layer to remove the solvent; (c) adding a poly-amino acid coating to the poly (aryl ether benzoxazole) Layer; (d) curing the product of step (c); U) forming a path in the cured product of step (d); (f) depositing a layer in the path, K completing the first layer; and U) repeating the step (A) to (f). This paper scale is applicable to the Chinese National Standard (CNS) A4 specification (210X297 mm). Printed by the Central Standards Bureau of the Ministry of Economic Affairs. Printed by 302376 A8 B8 C8 D8 々, Patent application scope 6 · Root application patent scope item No. 5 Method, wherein the step (d) of curing the poly (aryl ether cage oxazole) and the polyamic acid M to form polyimidic acid comprises a temperature between 300 10 and 4001: The product of step (c) is heated. 7. The method of item 6 of Genzao's patent application, wherein the solvent of the poly (aryl ether cage and squint beer) solution in the step (a) includes aprotic solvent-8 The method of item 7, wherein the heating step (b) occurs within a temperature range between 701 C and 2 0 10. (Please read the note Ϋ on the back before filling in this page)-Installed • 1T Line Ministry of Economic Affairs Central Standards Bureau Beigong Consumer Cooperative printed this paper standard using the Chinese National Standard (CNS) eight shirts see the grid (210X297 public daughter )