3ϋϋ^〇β Α7 Β7___ 五、發明説明（/ ) <發明技術領域 > 利用傾斜角度光線以檢測積體電路插腳 之方法與尧統 (請先閲讀背面之注意事項再填寫本頁) 本發明係關於一種利用傾斜角度光線以檢測積體電路 插腳之方法與系統，t尤指一種利用傾斜角度紅外光線線照 射積體電路後之明暗對比強烈之效果，，以檢測出積體電路 插腳（I C P I N)是否有左右彎及内外彎之方法與系 <發明背景>按，習知檢測積體電路装置丨系如第—圖所示 ,在座體（5 Ο )上放置待測積體電路（5 3 ),，積體電 路（5 3)左右有兩排插腳，.座體（.5 0)兩側上放置發 光二極體(51) ( 5 2 ),，兩孭ί!發光二極體（5 1 ) ( 5 2 )發光後Μ大約水平方向照射在積體電路插腳之上端 面上而由上方鏡頭（5 5)往下看，，可看到光線照射在插 腳上端面之亮點（4 1),,若積體電路插腳上下在同一條 直線上且左右對稱每2條相鄰插腳之間隔相等，，則為良品 ，否則，、如第二圖所示，.為一不良品，，亮點（41 1)之 有外臂，、故共線性（、tweez; ing)不佳，/亮點（4 1 2 )與 相鄰兩亮點不等距，，而有彎腳（ twist)之現象，，上述不 良共線性與彎腳現象導致不良品的積體電路，，而習知之檢 經濟部中央揉率局貝工消費合作杜印製 測積體電路的方法遭遇到兩偭問題： * (A)上述檢測積體電路插腳是否有左右彎與内外彎時，，因 插腳係用刀具切斷，，正常的插腳（J5 4 1〕係如第三圖所 示，·上端面係為純的端面，，所產生之亮點為第二圖所示之 小圓圈，•當刀具不利時，，截斷後之插腳（541)係如第 本紙張尺度適用中國國家標準（CNS ) A4规格（210X 297公董） 經濟部中央糂準局身工消费合作社印¾.3ϋϋ ^ 〇β Α7 Β7 ___ V. Description of the invention (/) < Technical field of the invention > Method and method for detecting integrated circuit pins using oblique angle light (please read the precautions on the back before filling out this page) It relates to a method and system for detecting integrated circuit pins using oblique angle light, in particular, it refers to the effect of using the oblique angle infrared rays to illuminate the integrated circuit with strong contrast between light and dark to detect the integrated circuit pins (ICPIN ) Is there any method and system for left and right and inside and outside bending? <Background> Press, the conventional detection integrated circuit device is as shown in the figure-, the integrated circuit to be tested is placed on the seat body (5 Ο) 5 3) ,, there are two rows of pins on the left and right sides of the integrated circuit (5 3), and the light-emitting diodes (51) (5 2) are placed on both sides of the base body (.5 0), two light-emitting diodes After the body (5 1) (5 2) emits light, M illuminates the upper end surface of the integrated circuit pin in a horizontal direction and looking down from the upper lens (5 5), you can see the bright spot of the light shining on the upper end surface of the pin ( 4 1), if the pins of the integrated circuit are on the same straight line and left Symmetrical The interval between every two adjacent pins is equal, it is a good product, otherwise, as shown in the second figure, it is a bad product, and the bright spot (41 1) has an outer arm, so it is collinear (, tweez ; ing) is not good, / bright spots (4 1 2) are not equidistant from the adjacent two bright spots, and there is a phenomenon of twist, the above-mentioned poor collinearity and the phenomenon of bent legs lead to an integrated circuit of defective products, However, the conventional method of inspecting and testing the integrated circuit of the Belgian Consumer Cooperation Department of the Ministry of Economic Affairs of the Ministry of Economic Affairs has encountered two problems: * (A) The above detection of the integrated circuit pin has left and right bends and inside and outside bends, Because the pin is cut with a knife, the normal pin (J5 4 1) is shown in the third picture, the upper end face is a pure end face, and the bright spot generated is the small circle shown in the second picture, • When the tool is unfavorable, the pin (541) after truncation is printed according to the Chinese paper standard (CNS) A4 specification (210X 297 public directors) as printed on the paper.
A7 B7 五、發明説明（> ) 四圖所示，.插腳上端會被截的很尖很小，，用發光二極體照 射所產生之亮點很小，，自動光學檢測糸統會檢測不出如此 小之亮點，《而被自動光學檢測系統判定為不良品，，由於第 四圖所示之插腳雖被不利之刀具截斷成很尖的上端，.只要 所有插腳不發生不良共線性與彎腳之現象，，仍蹰於良品，， 是自動光學檢測系統會將良品誤判為不良品，.此種情狀 嚴重，.每1 Ο ◦顆積體電路會有3 ◦ — 4 Ο顆誤判成不良 iS 〇 j (B)請看第八圖，、虛線之函數圖形中，，x軸為自亮點中心 算起之距離，t y軸為光強度之數值，.由於虛線之函數圖形 很平滑，，光強度對比不很明顯，，故用習知的檢測方法不能 很快速精確地檢測出亮點P 是Μ,、由上可知，、上述傳統的檢測積體電路插腳之方 - 法與糸統在實際使用上，，顯然具有諸多不便與缺失ν而有 待加改善者。 I 緣是，.本發明人有感於上述傳統的檢測積體電路插腳 之方法之缺失極待改善，，乃特潛心研究並配合最新電腦影 像處理之學理，，終於研創出一種設計合理且能改菩上述缺 失之本發明。> <發明概要>本發明主要Μ傾斜角度之紅外線光線照射在 積體電路的插腳上，.所產生之窗影，，利用紅外線C C D將 影像訊號轉成像素（PIXEL)訊號輸入電腦計算出每一條 插腳之位置，，Μ判定積體電路是否為良品，所使用之檢测 裝置係利用兩片反射鏡將背影影像反射至同一紅外線C C (請先閱讀背面之注意事項再填寫本頁) 裝. 訂 絲 本紙張尺度適用中國國家標準（CNS ) A4規格（210X 297公釐） 3〇ϋϋ〇〇 Α7 Β7 五、發明説明（孑） D〇 本發明之主要目的係提供·-種利用傾斜角度光線以檢 測積體電路插腳之系統，，括：·.一檢測座台、、一紅外線C C D及一错影影丨象處理裝置，，結構簡單而能精確地檢測積 體電路之插腳是否為良品，、不會因刀具不利銳而將插腳端 面很尖很小之積體電路誤判為不良品，.檢測準確性大賴提A7 B7 V. Description of the invention (>) As shown in the four pictures, the upper end of the pin will be cut very sharply, and the bright spot generated by the illumination of the light-emitting diode is very small, and the automatic optical detection system will not detect it. With such a small bright spot, "It was judged as a defective product by the automatic optical detection system. Although the pins shown in the fourth figure were cut off by the unfavorable tool into a very sharp upper end, as long as all pins do not have bad collinearity and bending The phenomenon of the foot is still inferior to the good product. The automatic optical detection system will misjudge the good product as a bad product. This situation is serious. Every 1 Ο ◦ integrated circuit will have 3 ◦ — 4 Ο wrongly judged as bad iS 〇j (B) Please see the eighth figure. In the function graph of the dotted line, the x-axis is the distance from the center of the bright spot, and the ty axis is the value of the light intensity. Since the function graph of the dotted line is very smooth, the light The intensity contrast is not very obvious, so the conventional detection method can not quickly and accurately detect that the bright spot P is Μ, from the above, the above traditional method of detecting the pin of the integrated circuit-the method and the system are actually used On, obviously has many inconveniences Ν missing persons and have to be added to improve. The reason is that the inventor feels that the above-mentioned traditional method of detecting the pins of the integrated circuit needs to be improved very much. It is especially dedicated to research and cooperate with the latest computer image processing theory, and finally developed a reasonable design and can Change the present invention which is missing above. > < Summary of the Invention > The present invention mainly irradiates the pins of the integrated circuit with infrared light at an oblique angle. The generated window shadow uses an infrared CCD to convert the image signal into a pixel (PIXEL) signal and input it to the computer for calculation According to the position of each pin, Μ determines whether the integrated circuit is good. The detection device used uses two mirrors to reflect the back image to the same infrared CC (please read the precautions on the back before filling this page) Binding. The size of the silk paper is applicable to the Chinese National Standard (CNS) A4 specification (210X 297 mm) 3〇ϋϋ〇〇Α7 Β7 5. Description of the invention (孑) D〇 The main purpose of the present invention is to provide Angle light is used to detect the pins of the integrated circuit, including: a detection base, an infrared CCD and a false image processing device, the structure is simple and can accurately detect whether the pins of the integrated circuit are Good product, will not misinterpret the integrated circuit with a very sharp pin end surface as a defective product due to the unfavorable sharpness of the tool.
經濟部中央標隼局貝工消费合作社印裝 本發明之次一目的提供一種檢測座台 <包括有兩個紅 外線燈，.兩個反射鏡，，兩個紅外線燈光以傾斜之角度將紅 外線光線照射在插腳上，，再將背影影像利用兩個反射鏡射 入紅外線C C D内，，能利用一個C C D鏡頭同時處理積體 電路兩側之插腳背影資料1 本發明之又一目的係在提供一種货影影像處理装置， 將紅外線C C D所產生之背影訊號利用像素訊號處理法藉 電腦計算出每一插腳之位置，，來快速精確地判定積體霄路 是否為良品，省人力工時。| 本發明之再一目的係在於提供一種利用傾斜角度光線 Μ檢測積體電路插腳之方法，，包括下列步驟： (A)提供上述利用傾斜角度光線Μ檢測積體電路插腳之糸 統；， (Β)利用該糸統產生之紅外線光線Μ傾斜之角度照射在積 體電路插腳之上，； (C)將積體電路兩側插腳之背影利用兩個反射鏡反射至同 —個C C D鏡顔，； • _ b — 本紙浪尺度逋用中國國家標準（CNS ) A4规格（210X 297公釐） (請先聞讀背面之注意事項再填寫本頁) λ. 訂 4. 經濟部中央橾準局負工消費合作.社印製 Α7 Β7 五、發明説明（4) (D)利用該C C D鏡頭將背影訊號轉換成像素訊號、； (Έ )將像素訊號輸入電腦利用影像處理技術計算出插腳之 正確位置，判定積體電路是否為良品 <圖式之簡要說明> 第一圖為傳統的檢測積體電路插腳装置之示意圖。 第二圖為使用第一圖之裝置所獲得插腳亮點之示意圖 Ο 第三A圖及第三B圖為正常積體電路插腳之正視圖及 側視圖。 第四A圖及第四B圖為使用不銳利刀具截斷插腳後戶Λ 製得插腳之正視圖及側視圃。 第五圖為本發明的檢測積體電路插腳装置之示意圖。 第六圖顯示本發明所採用電腦監視器之正視圖。 第七圖說明為何由傾斜方向之紅外線燈光照射能下檢 測出插腳之位置。 第八圖說明為何本發明之货影法較傳統亮點法更能精 確快速檢測出插腳之正確位置。 第九圖為本發明之檢測座台之立體圖。 第十圖為本發明之電腦之檢測出插腳是否有左右臀及 內外·彎之流程圖。 <詳细說明> 請參閱第五圖至第十圖，[本發明檢測積體電路插腳之 系統包括有：一檢測座台（1 〇 )、一紅外線C C D ( 1 5)及一错影影像處理装置先將積體電路（53)放置 於座台（1 2 )上，，利两紅外線燈（1 1 1 ) (112) 本紙張尺度適用中國國家橾準（CNS ) Α4规格（) (讀先閣讀背面之注意Ϋ項再填寫本頁) 裝 訂 經濟部中央樣準局負工消费合作杜印製 A7 B7 五、發明説明（f) 及^反^ 纟竟（j_4l) (142)將腳之萄1裂^暴彡像射入糸工 外線C C D (: 1 5 )内，、其次，.货影Si像經由C C D ( 1 5 )轉換成像素訊號，•再_入背影丨象{象處1里裝置自動分析 背影訊號來判定積蒼豊電路為良品或不良品^ · 本發明之檢測座台（1 ◦)包括有_-基座（1 2 ).， 基座（12)的中央上表面可放置待測積體電路（5 3) 4 ，基座（1 2 )側設有紅外線燈（1 1 1 )及（1 1 2 ) ，基座（1 2 )的上方兩側設置有兩反射鏡（1 4 1 )( 1 4 2 ),、經由紅外線燈所射出之光線係與積體電路（5 3)之插腳Μ傾斜之方向照射在插腳上而呈現出货影.；反 射鏡（1 4 1 ) ( 1 4 2 )反射背影影像射入一個紅外線 C C D ( 1 5 )内。. 本發明之货影影像處理装置係為—台電腦，.货影訊號 糸以像素之方式輸入電腦。.電腦内 '之影像處理軟體之流程 圖如第+圖所示，4電腦銀幕上所呈現出之赞影訊號如第六 圖所示，、插腳（3 2)的货影可清晰可見 第七圖說明如何由本發明之積體電路辩影看出插腳是 否有内外彎，，如有内外彎則在第六圖之插腳（3 2)影像 會長短不一。， 第八圖中之實線為本發明之插腳背影影像在背景光線 之下之光強度函數圖形，.：x軸為距離插腳中心之距離，y 軸為在某一距離值下光強度之數值，> 從第八圖可看出，，本 發明之插腳赞影在货景光線之下之明暗對比較習知之亮黑占 法更明顯。 本紙張尺度逋用中國國家梯準（CNS ) A4規格（210X 297公釐） (請先閲讀背面之注意事項再填寫本頁) 裝. 訂Printed and printed by Beigong Consumer Cooperative of Central Standard Falcon Bureau of the Ministry of Economic Affairs The second objective of the present invention is to provide a detection stand < including two infrared lamps, two reflectors, and two infrared lamps to irradiate infrared rays at an oblique angle Irradiate on the pins, and then shoot the back image into the infrared CCD using two mirrors, and use one CCD lens to process the back data of the pins on both sides of the integrated circuit at the same time 1 Another object of the invention is to provide a product The shadow image processing device uses the pixel signal processing method to calculate the position of each pin by using the pixel signal processing method of the infrared CCD to quickly and accurately determine whether the integrated road is a good product, saving manpower and labor time. Another object of the present invention is to provide a method for detecting an integrated circuit pin using an oblique angle light M, which includes the following steps: (A) Provide the above-mentioned system for detecting an integrated circuit pin using an oblique angle light M; Β) Use the infrared rays Μ produced by the system to illuminate the pins of the integrated circuit at an oblique angle; (C) Reflect the back of the pins on both sides of the integrated circuit to the same CCD mirror face using two mirrors, ; _ B — This paper uses the Chinese National Standard (CNS) A4 specification (210X 297 mm) (please read the precautions on the back and then fill out this page) λ. Book 4. The Central Bureau of Economic Affairs of the Ministry of Economic Affairs Industrial and consumer cooperation. The company prints Α7 Β7 V. Description of the invention (4) (D) Use the CCD lens to convert the back signal into a pixel signal; (Έ) Input the pixel signal into the computer and use image processing technology to calculate the correct position of the pin , Determine whether the integrated circuit is good. ≪ Brief description of the drawings > The first figure is a schematic diagram of a conventional detection integrated circuit pin device. The second picture is a schematic view of the pin bright points obtained by using the device of the first picture. Ο The third picture A and the third picture B are the front view and the side view of the normal integrated circuit pin. The fourth picture A and the fourth picture B are the front view and side view garden of the prongs after cutting the prongs with an unsharp cutter. The fifth figure is a schematic diagram of the pin device of the detection integrated circuit of the present invention. The sixth figure shows the front view of the computer monitor used in the present invention. The seventh figure shows why the position of the pin can be detected by the infrared light in the oblique direction. The eighth figure illustrates why the cargo shadow method of the present invention can detect the correct position of the pin more accurately and faster than the traditional bright spot method. The ninth figure is a perspective view of the detection base of the present invention. Figure 10 is a flow chart of the computer of the present invention for detecting whether the pin has left and right buttocks, inside and outside, and bending. < Details > Please refer to the fifth to tenth figures, [The system for detecting the pin of the integrated circuit of the present invention includes: a detection base (10), an infrared CCD (15) and a false image The image processing device first places the integrated circuit (53) on the base (1 2), and the two infrared lamps (1 1 1) (112) The paper size is applicable to the Chinese National Standard (CNS) Α4 specification () ( Read the first note, read the notes on the back, and then fill out this page) Bookbinding A7 B7 by the Central Prototype Bureau of the Ministry of Economic Affairs and Consumer Cooperation. 5. Description of the Invention (f) and ^ Reverse ^ Jing Jing (j_4l) (142) will The image of the foot is cracked ^ The violent image is shot into the Shitou outside CCD (: 1 5), and secondly, the cargo shadow Si image is converted into a pixel signal by the CCD (1 5), and then _ 入 背影 丨 象 {象The device in Section 1 automatically analyzes the back signal to determine whether the Cangyu circuit is good or bad ^ · The detection base (1 ◦) of the present invention includes a _-base (1 2)., The center of the base (12) The integrated circuit (5 3) 4 to be tested can be placed on the upper surface, the infrared lamps (1 1 1) and (1 1 2) are provided on the side of the base (1 2), and the upper sides of the base (1 2) are provided Two anti Mirror (1 4 1) (1 4 2), the light emitted by the infrared lamp is irradiated with the pin M of the integrated circuit (5 3) on the pin to illuminate the pin to show the shipping shadow. 1 4 1) (1 4 2) The reflected back image is shot into an infrared CCD (1 5). The cargo shadow image processing device of the present invention is a computer, and the cargo shadow signal is input to the computer in the form of pixels. .The flow chart of the image processing software in the computer is shown in Figure +4, the praise video signal presented on the screen of the computer is shown in Figure 6, and the image of the pin (3 2) can be clearly seen in the seventh The figure illustrates how the integrated circuit of the present invention discerns whether the pins have inside or outside bends. If there are inside and outside bends, the image of the pin (32) in the sixth figure will have different lengths. , The solid line in the eighth figure is the light intensity function graph of the back image of the pin under the background light of the present invention, the x axis is the distance from the center of the pin, and the y axis is the value of the light intensity at a certain distance , ≫ As can be seen from the eighth figure, the brightness and darkness of the pin-shadow of the present invention under the light of the cargo scene is more obvious to the more conventional bright black occupation method. The size of this paper is based on China National Standard (CNS) A4 (210X 297mm) (please read the precautions on the back before filling this page). Order
SOO^joQ A7 B7 五、發明説明（声） 本發明之利用傾斜角度光線以檢測積體電路插腳之方法 ,包括下列步驟 (A)提供本發明利用傾斜角度光線Μ檢測積體電路插腳之 系‘统 (Β)利用該糸統產生之紅外線光線以傾斜之角度照射在積 體電路插腳（5 4 1 ) (: 5 4 2 )之上； (C) 將積體電路兩側插腳之货影利用兩個反射鏡反射至同 —個C C D鏡頭（1 5 ); \ (D) 利用該C C D鏡頭將背影訊號轉換成像素訊號 (Ε)將像素訊號輸入電腦利用影像處理技術計算出插腳之 正確位置，Μ判定積體電路是否為良品。 » « ----------裝--------玎------^ (請先閲讀背面之注意事項再填寫本頁) 經濟部中央埭準局負工消費合作杜印製 本紙張尺度適用中國國家標準（CNS ) Α4規格（210Χ 297公釐）SOO ^ joQ A7 B7 V. Description of the invention (acoustic) The method of using tilt angle light to detect pins of an integrated circuit of the present invention includes the following steps (A) to provide the system of detecting the pin of integrated circuits using tilt angle light M of the present invention. System (B) Use the infrared light generated by the system to illuminate the integrated circuit pins (5 4 1) (: 5 4 2) at an oblique angle; (C) Use the image of the pins on both sides of the integrated circuit Two mirrors reflect to the same CCD lens (1 5); \ (D) Use the CCD lens to convert the back signal into a pixel signal (E) Input the pixel signal to the computer and use image processing technology to calculate the correct position of the pin, Μ Determine whether the integrated circuit is good. »« ---------- 装 -------- 玎 ------ ^ (Please read the precautions on the back before filling out this page) The size of the paper printed by the consumer cooperation duo is applicable to the Chinese National Standard (CNS) Α4 specification (210Χ 297 mm)