TW291455B - - Google Patents
Info
- Publication number
- TW291455B TW291455B TW083110447A TW83110447A TW291455B TW 291455 B TW291455 B TW 291455B TW 083110447 A TW083110447 A TW 083110447A TW 83110447 A TW83110447 A TW 83110447A TW 291455 B TW291455 B TW 291455B
- Authority
- TW
- Taiwan
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/268—Pb as the principal constituent
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K35/00—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting
- B23K35/22—Rods, electrodes, materials, or media, for use in soldering, welding, or cutting characterised by the composition or nature of the material
- B23K35/24—Selection of soldering or welding materials proper
- B23K35/26—Selection of soldering or welding materials proper with the principal constituent melting at less than 400 degrees C
- B23K35/262—Sn as the principal constituent
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Paper (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP27938193 | 1993-11-09 | ||
| JP6053489A JP2677760B2 (ja) | 1993-11-09 | 1994-03-24 | はんだ |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| TW291455B true TW291455B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1996-11-21 |
Family
ID=17610354
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW083110447A TW291455B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-11-09 | 1994-11-11 | |
| TW084110970A TW305899B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-11-09 | 1995-10-18 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| TW084110970A TW305899B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-11-09 | 1995-10-18 |
Country Status (4)
Families Citing this family (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR100230269B1 (ko) * | 1996-12-31 | 1999-11-15 | 윤종용 | 납땜용 솔더 합금 |
| US6033488A (en) * | 1996-11-05 | 2000-03-07 | Samsung Electronics Co., Ltd. | Solder alloy |
| JP2002153990A (ja) | 2000-11-21 | 2002-05-28 | Senju Metal Ind Co Ltd | はんだボール用合金 |
| JP3599101B2 (ja) * | 2000-12-11 | 2004-12-08 | 株式会社トッパンＮｅｃサーキットソリューションズ | はんだ、それを使用したプリント配線基板の表面処理方法及びそれを使用した電子部品の実装方法 |
| CN100413633C (zh) * | 2003-09-05 | 2008-08-27 | 中国科学院金属研究所 | 一种抗氧化的锡铅系合金焊料 |
| US8493746B2 (en) | 2009-02-12 | 2013-07-23 | International Business Machines Corporation | Additives for grain fragmentation in Pb-free Sn-based solder |
| US8128868B2 (en) | 2009-02-12 | 2012-03-06 | International Business Machines Corporation | Grain refinement by precipitate formation in PB-free alloys of tin |
| CN101920405B (zh) * | 2010-08-23 | 2013-07-31 | 中国电力科学研究院 | 一种镀锌钢接地网用锡铅基复合钎料及其制备方法 |
| CN115781100B (zh) * | 2023-01-29 | 2023-05-02 | 河北钢研德凯科技有限公司 | 一种镁合金焊丝及其制备方法和应用 |
Family Cites Families (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59153857A (ja) * | 1983-02-21 | 1984-09-01 | Taruchin Kk | 接合部形成用合金 |
| JPS61273296A (ja) * | 1985-05-29 | 1986-12-03 | Taruchin Kk | 耐食性はんだ合金 |
| JPH02101132A (ja) * | 1988-10-11 | 1990-04-12 | Ichiro Kawakatsu | 低融点ハンダ合金 |
| JP2731277B2 (ja) * | 1990-02-28 | 1998-03-25 | 株式会社東芝 | ダイボンディング用半田 |
-
1994
- 1994-03-24 JP JP6053489A patent/JP2677760B2/ja not_active Expired - Lifetime
- 1994-11-08 KR KR1019940029134A patent/KR100259311B1/ko not_active Expired - Fee Related
- 1994-11-09 MY MYPI94002985A patent/MY115159A/en unknown
- 1994-11-11 TW TW083110447A patent/TW291455B/zh active
-
1995
- 1995-10-18 TW TW084110970A patent/TW305899B/zh active
Also Published As
| Publication number | Publication date |
|---|---|
| JP2677760B2 (ja) | 1997-11-17 |
| MY115159A (en) | 2003-04-30 |
| KR100259311B1 (ko) | 2000-06-15 |
| JPH07178587A (ja) | 1995-07-18 |
| TW305899B (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1997-05-21 |
| KR950014341A (ko) | 1995-06-15 |